WO2002049096A1

WO2002049096A1 - Tilting fluid cutout device

Info

Publication number: WO2002049096A1
Application number: PCT/JP2001/010764
Authority: WO
Inventors: Kyoji Shimoda; Hitoshi Tauchi
Original assignee: Sumitomo Precision Products Co., Ltd
Priority date: 2000-12-11
Filing date: 2001-12-07
Publication date: 2002-06-20
Also published as: JP2002184832A; TWI254341B; CN1398428A; JP3579348B2

Abstract

A tilting fluid cutout device capable of eliminating treating fluid from a substrate (10) by the inclination of the substrate (10), comprising a fluid cutout promoting means (43) installed above one side of a fluid cutout device body (42) for tilting the substrate (10) on a feed roller (41) to the side of the feeding direction, the fluid cutout promoting means (43) further comprising a large number of contact members (43a) disposed at specified intervals in the feeding direction of the substrate (10), wherein, when the substrate (10) is tilted sideways to a specified angle, the contact members (43a) are brought into contact with the treatment fluid accumulated at the side edge part of the substrate (10) on the downstream side in the tilting direction to remove the treatment fluid from the side edge part, whereby the treatment fluid can be eliminated efficiently from the surface of the substrate without increasing the inclination angle of the substrate (10) even when the viscosity of the treatment fluid is high.

Description

Description Tilt-type drainer Technical field

The present invention relates to a transport type substrate processing apparatus used for manufacturing a glass substrate for a liquid crystal display device and the like. In particular, in the substrate processing apparatus, a processing liquid is supplied from the surface of the substrate by inclining the substrate. It relates to an inclined drainage device to be eliminated. Background art

A glass substrate used for a liquid crystal display device is manufactured by repeatedly performing chemical treatments such as etching and separation on the surface of a glass substrate as a material. The processing equipment is roughly divided into dry type and batch type, and the batch type is further divided into batch type and single wafer type. Furthermore, the single-wafer type is subdivided into a rotary type and a transport type such as a pallet transport.

Of these substrate processing equipment, the transport type has a basic configuration that supplies a processing liquid to the surface of the substrate while transporting the substrate in the horizontal direction. Due to its high efficiency, etching processing and separation processing are performed. Etc. are used. In a transfer type substrate processing apparatus used for the etching process, a large number of spray nozzles arranged in a matrix form above the substrate transfer line inject the etching liquid and pass the substrate through the etching liquid. Thus, the etchant is supplied to the entire surface of the substrate. By this shower treatment, the surface of the substrate is selectively etched except for the portion where the masking material is applied.

After etching, the cleaning water sprayed from the same spray nozzle The surface of the board is cleaned, but the surface of the board is cleaned before cleaning, for the purpose of quickly stopping the etching process, suppressing the contamination of the cleaning water in the initial cleaning, and reducing the waste of the initial cleaning water. The etchant remaining on top is physically removed. As one of the liquid draining devices, there is a tilting type in which the substrate is temporarily stopped in the middle of the transfer and is tilted to the side so that the etching solution is removed from the surface to the side. In a substrate processing apparatus for separation processing, chemical treatment, drainage, and washing are performed in the same manner.

By the way, in glass substrates for liquid crystal display devices, the circuit size has been increasing and the definition of circuits has been increasing. In the past, r was often used as the wiring material used for the substrate, but with the recent trend toward higher definition, conversion to A 1 or A 1 / Mo with lower specific resistance values has been attempted. I have. For this reason, it has been found that the following problems occur with the use of the etching liquid in the transfer type substrate processing apparatus for etching even when the etching liquid for A1 has begun to be used.

The etching solution for A1 has a higher viscosity than the etching solution for Cr. Therefore, when the substrate is tilted by the tilting type liquid draining device after the etching, the liquid draining property is deteriorated. That is, since the surface tension of the etching solution for A1 is large, a large amount of the etching solution on the surface accumulates on the side edges even due to the inclination of the substrate, and when the substrate is returned to the horizontal posture, the etching solution reappears. It spreads on the surface.

Increasing the angle of inclination of the substrate will help solve this problem.However, under the current situation where the size of the substrate is large, it is difficult to increase the angle of inclination of the substrate due to interference with equipment. Increasing the tilt angle takes a longer time to tilt, and the substrate stopping time for draining the liquid becomes longer, so there is a restriction that the tilt angle of the substrate cannot be increased. Due to this restriction, the deterioration of drainage when using the A1 etching solution is inevitable. As a result, problems such as the rapid replacement of the etchant with purified water and the increase in the amount of initial cleaning water waste occur.

SUMMARY OF THE INVENTION An object of the present invention is to provide a tilting type liquid draining device capable of efficiently removing a processing liquid from its surface without increasing the tilt angle of a substrate even when the viscosity of the processing liquid is high. . Disclosure of the invention

In order to achieve the above object, an inclined type liquid draining apparatus of the present invention supplies a treatment liquid to a surface of a substrate while transporting the substrate in a horizontal direction, and treats the surface of the substrate. And a liquid removal device main body that removes the processing liquid from above the substrate by tilting the substrate, and is disposed downstream of the substrate in the tilt direction, and flows downstream in the tilt direction as the substrate tilts. A large number of liquid contact members that abut or approach the side edges of the substrate at predetermined intervals over its entire length so as to come into contact with the remaining processing liquid, thereby promoting the removal of the processing liquid from the substrate. Cutting promoting means.

In the inclined type liquid draining device of the present invention, the processing liquid accumulated on the side edge portion due to the inclination of the substrate travels through a number of liquid contact members that abut or approach the side edge portion at a predetermined interval over the entire length thereof. Efficiently removed from the edges.

It is preferable that the liquid contact member makes line contact or point contact with the processing liquid staying at the side edge of the inclined substrate from the viewpoint of drainage, and specifically, a substantially vertical pin-shaped member is preferable. When the liquid contact member comes into contact with the side edge of the inclined substrate, there is a possibility that foreign matter may be generated by cutting the side edge. Therefore, a non-contact type in which the liquid contact member approaches the side of the inclined substrate is preferable.

The inclined type liquid draining apparatus of the present invention can be used with other etching liquids, and even with processing liquids other than etching, although there is a difference in the effect of the force which is particularly suitable for the highly viscous A1 etching liquid. It is valid. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a plan view of a transfer type substrate processing apparatus using an inclined liquid draining device according to one embodiment of the present invention, FIG. 2 is a plan view of the inclined liquid draining device, and FIG. -It is an X-ray arrow diagram. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

The transport type substrate processing apparatus using the inclined liquid draining apparatus according to the present embodiment performs an A1 etching process on a glass substrate 10 for a liquid crystal display device (hereinafter simply referred to as a substrate 10). As shown in FIG. 1, the substrate processing apparatus includes a first linear line A, a second line B connected to the first line A at right angles, and a first line A connected to the second line B at right angles. A U-turn type layout that combines a third line C that is in parallel with the other is adopted. The first line A is configured by linearly connecting a receiving section 1, a liquid blocking section 2, an etching section 3, and a liquid removing section 4. The etching unit 3 includes a shower unit 31 for spraying A1 etching water on the surface of the substrate 10 from above. Further, the liquid draining unit 4 is equipped with the inclined liquid draining device 40 according to the present embodiment, and the configuration thereof will be described later in detail. The second line B is a water washing unit 5, and the substrate 10 A shower unit 51 for spraying washing water from above is provided. The third line C is configured by connecting the transfer device 6, the spin dryer 7, the transfer device 8, and the take-out section 9 in a straight line.

The first line A and the second line B are provided with a large number of transport rollers arranged at predetermined intervals in the transport direction to transport the substrate 10 in the longitudinal direction of the line. Each transport roller is a horizontal roll perpendicular to the transport direction. 2nd la A turning mechanism 52 for changing the traveling direction of the substrate 10 by 90 degrees is provided at the inlet B, that is, at the entrance of the washing unit 5.

A 1 The substrate 10 that has undergone the etching process is carried into the receiving unit 1 by the transfer device 11. The substrate 10 is moved from the liquid blocking part 2 to the etching part 3 by the roller transport, and undergoes an etching process while passing therethrough. The substrate 10 that has passed through the etching unit 3 is moved to the washing unit 5 through the inclined liquid draining device 40 in the liquid draining unit 4 by roller conveyance, and the traveling direction is changed by 90 degrees. Then, it is subjected to a water washing process while moving in the water washing unit 5.

The substrate 10 that has moved to the outlet of the rinsing section 5 is transferred from the rinsing section 5 to the spin dryer 7 by the transfer device 6. The substrate 10, which has been dried by the spin dryer 7, is transported from the spin dryer 7 to the take-out unit 9 by the transfer device 8, and further carried out of the device by the transport device 11.

As shown in FIGS. 2 and 3, the inclined liquid draining device 40 according to the present embodiment includes a plurality of transport rollers 41 for transporting the substrate 10 in a horizontal direction, and a transport port—a roller 41. The apparatus includes a liquid draining device main body 42 for tilting the upper substrate 10 to the side in the transport direction, and a liquid draining promoting means 43 provided on one side of the liquid draining device main body 42.

The transport rollers 41 are horizontal drive rollers arranged at predetermined intervals in the transport direction, and the substrate 10 is point-supported by large-diameter portions 41b provided at a plurality of positions on the drive shaft 41a. The positioning of the substrate 10 in the width direction is performed by the flanges 41c on both sides. When the plurality of transport rollers 41 are driven synchronously, the substrate 10 advances at a predetermined speed and stops at an arbitrary position.

The liquid removal device main body 42 includes a plurality of substrate support beams 42 a supporting the substrate 10 at a plurality of positions in the transport direction, and a plurality of substrate support beams 42 a laterally in the transport direction of the substrate 10. A pair of lifting and lowering devices 4 2 b and 4 2 c have. The plurality of substrate support beams 42a are beams perpendicular to the transport direction arranged in parallel between the transport ports 41, and include a plurality of connecting members 42d parallel to the transport direction of the substrate 10. It is integrated. In a horizontal state without inclination, the plurality of substrate support beams 42a are located slightly below the substrate transfer surface.

The pair of lifting devices 4 2b and 4 2c on both sides are motor type jacks here. By tilting the central substrate support beam 42a, the plurality of substrate support beams 42a are synchronized and tilted. Let it. That is, the lifting / lowering device 42 a located on the downstream side in the tilt direction raises and lowers the support member 42 e that rotatably supports one end of the plurality of substrate support beams 42 a. The upper surface of one end of the substrate support beam 42a is positioned slightly above the substrate transfer surface. The lifting / lowering device 42c, which is located on the upstream side in the tilt direction, moves the other end of the plurality of substrate support beams 42a through the lever 42f so that the upper surface of the other end is slightly above the substrate transfer surface. The plurality of substrate support beams 42a are tilted toward one end side about a rotation fulcrum at one end by moving the substrate support beam 42a up to a predetermined position and then performing a predetermined upward stroke.

As a result, the substrate 10 on the transport roller 42a is transferred onto the substrate support beam 42a, and is inclined at a predetermined angle to the side in the transport direction. The connecting member 42c is sufficiently below the conveying roller 41 so that the substrate supporting beam 42a does not interfere with the conveying roller 41 due to the inclination of the substrate supporting beam 42a. Are linked. A stopper 42 g is provided at one end of the substrate support beam 42 a to prevent lateral displacement due to the inclination of the substrate 10.

The liquid drainage promoting means 43 has a large number of contact members 43 a arranged at predetermined intervals in the direction of transport of the substrate 10. A large number of contact members 4 3a are vertical round rod-shaped thin metal pins, each upper end of which is an upper horizontal support member 4 3a. 3b and each lower end is open as a free end. When the substrate 10 is inclined to the side at a predetermined angle, the side edge of the substrate 10 on the downstream side in the inclination direction is opposed to the many contact members 43 a with a slight gap. However, the drainage promoting means 43 is provided.

The contact members 43a are basically arranged at an equal pitch. The pitch will be described in detail later, but a stopper provided on the substrate support beam 42a is provided.

The contact member 43a is omitted at the position where it interferes with 42g.

Next, the function of the inclined liquid drainage device 4Q according to the present embodiment will be described.

The substrate 10 having been subjected to the etching process in the etching unit 3 enters the liquid draining unit 4 and stops at a predetermined position on the liquid draining device main body 42. At this time, the substrate support beam 42a of the draining device main body 42 is waiting in a horizontal posture below the substrate transfer surface. When the substrate 10 stops at a predetermined position on the liquid removal device main body 42, one end of the substrate support beam 42a rises slightly, and the other end rises significantly. As a result, the substrate 10 is transferred onto the substrate support beam 42a from above the transport roller 41, and further tilts laterally at a predetermined angle.

Due to the inclination of the substrate 10, the etchant remaining on the surface of the substrate 10 flows to the side, and the force removed from the surface of the substrate 10 .Since the etchant has a high viscosity for A 1, With only a predetermined angle of inclination, a relatively large amount of etchant remains on the side edge on the downstream side in the inclination direction due to surface tension. However, in the inclined liquid drainage device 40 according to the present embodiment, the side edge of the substrate 10 on the downstream side in the inclination direction approaches the many contact members 4 3 a of the liquid drainage promotion means 43, The etching solution staying at the side edge comes into contact with many contact members 43a. As a result, the etchant is efficiently removed from the side edge on the downstream side in the inclined direction along each contact member 43a. Therefore, the amount of the etching liquid remaining on the side edge is small. When the liquid draining by tilting is completed, the substrate supporting beam 42a returns to the original horizontal state. As a result, the substrate 10 is transferred from the substrate supporting beam 42 a to the transport opening 41, and is transported from the liquid draining unit 4 to the washing unit 5 by driving the transport roller 41 again. .

In the liquid draining unit 4, since the liquid is efficiently drained by the tilting type liquid draining device 40 without increasing the tilt angle of the substrate 1Q, the extension of the liquid draining time is avoided. In addition, the increase in size of the equipment is avoided. In the rinsing section 5, the initial cleaning is performed on the substrate 10 and the initial rinsing water is discarded because the dirt is conspicuous. However, since the amount of the etchant brought into the rinsing section 5 decreases, the initial cleaning water is discarded. Decrease.

The inclination angle of the substrate 10 by the inclined liquid drainage device 40 is preferably 5 to 20 degrees, particularly preferably 8 to 15 degrees. If the angle of inclination is too small, the liquid will not be drained sufficiently. The arrangement pitch of the contact members 43a is preferably 2 to 15 mm, particularly preferably 3 to 8 mm. If the pitch force is too small, it will cause liquid pooling, and if it is too large, it will be difficult for the liquid to be drained between adjacent contact members, and in any case, the drainage property will decrease. The dimension of the contact member 43a is preferably 1 to 8 mm, particularly preferably 2 to 4 mm, in the outer diameter of the round bar. If the outer diameter is too small, machining becomes difficult. If the outer diameter is too large, the drainage property decreases due to an increase in the arrangement pitch. Industrial applicability

As described above, the inclined type liquid draining device of the present invention is arranged such that the side edge portion of the inclined substrate on the downstream side in the inclination direction is brought into contact with or approaching a large number of contact members arranged along the side edge portion. In this way, even when the viscosity of the processing liquid is high, the processing liquid can be efficiently drained from the surface without increasing the inclination angle of the substrate. Can be removed. As a result, the load in the water washing following the drainage is reduced, and the water cost is reduced. In addition, it is possible to avoid an increase in the time required for liquid drainage, and to avoid an increase in equipment length.

Claims

The scope of the claims

1. While transporting the substrate in the horizontal direction, the processing liquid is supplied to the surface of the substrate, and the substrate is disposed in a transport-type substrate processing line that processes the surface. The liquid draining device main body for removing the liquid and the substrate are disposed downstream of the substrate in the direction of inclination and flow to the direction downstream of the inclination along with the inclination of the substrate so as to come into contact with the processing liquid on the retained substrate. A liquid draining device characterized by having a liquid drain promoting means for promoting the removal of the processing liquid from the substrate by means of a large number of liquid contact members abutting or approaching the edge at predetermined intervals over the entire length. .

2. The inclined liquid drainer according to claim 1, wherein the liquid contact member is a substantially vertical pin-shaped member.

3. The tilting type liquid draining device according to claim 1, wherein the processing liquid is an etching liquid for A1.