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WO2001069640A3 - Verfahren zum aufbringen von metallischen leiterbahnen als elektroden auf eine kanalplatte aus glas für grossflächige flachbildschirme - Google Patents

Verfahren zum aufbringen von metallischen leiterbahnen als elektroden auf eine kanalplatte aus glas für grossflächige flachbildschirme Download PDF

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Publication number
WO2001069640A3
WO2001069640A3 PCT/EP2001/001474 EP0101474W WO0169640A3 WO 2001069640 A3 WO2001069640 A3 WO 2001069640A3 EP 0101474 W EP0101474 W EP 0101474W WO 0169640 A3 WO0169640 A3 WO 0169640A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrodes
metallic strip
strip conductors
flat screens
surface flat
Prior art date
Application number
PCT/EP2001/001474
Other languages
English (en)
French (fr)
Other versions
WO2001069640A2 (de
Inventor
Marten Walther
Andreas Weber
Tobias Kaelber
Burkhart Danielzik
Dirk Schlatterbeck
Original Assignee
Schott Glas
Zeiss Stiftung
Marten Walther
Andreas Weber
Tobias Kaelber
Burkhart Danielzik
Dirk Schlatterbeck
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Glas, Zeiss Stiftung, Marten Walther, Andreas Weber, Tobias Kaelber, Burkhart Danielzik, Dirk Schlatterbeck filed Critical Schott Glas
Priority to AU81471/01A priority Critical patent/AU8147101A/en
Publication of WO2001069640A2 publication Critical patent/WO2001069640A2/de
Publication of WO2001069640A3 publication Critical patent/WO2001069640A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

Moderne großflächige Flachbildschirme, bekannt als PDPs und PALCs, besitzen eine Glasplatte mit einer Mikro-Kanalstruktur und typischerweise zwei Elektroden in jedem Kanal. Bislang wurden die Elektroden mittels drucktechnischer Verfahren oder durch Sputtern direkt selektiv entsprechend der Kanalstruktur oder indirekt durch ein selektives Wegätzen von großflächig außenstromlos und/oder galvanisch abgeschiedenen Metallschichten unter Belassung der Leiterbahnstrukturen aufgebracht. Zur Vermeidung der Nachteile dieser bekannten Verfahren sieht die Erfindung vor, die metallischen Leiterbahnen der Elektroden nur in den Elektrodenbereichen selektiv mittels der aßenstromlosen und/oder galvanischen Abscheideverfahren aufzubringen, wobei diese Bereiche zuvor durch eine Kombination einer mechanischen und chemischen Vorbehandlung, vorzugsweise in Verbindung mit dem Einsatz eines benetzungsfördernden Mittels, zur Verbesserung der Haftung aufgerauht werden.
PCT/EP2001/001474 2000-03-10 2001-02-10 Verfahren zum aufbringen von metallischen leiterbahnen als elektroden auf eine kanalplatte aus glas für grossflächige flachbildschirme WO2001069640A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU81471/01A AU8147101A (en) 2000-03-10 2001-02-10 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10011455A DE10011455B4 (de) 2000-03-10 2000-03-10 Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme
DE10011455.5 2000-03-10

Publications (2)

Publication Number Publication Date
WO2001069640A2 WO2001069640A2 (de) 2001-09-20
WO2001069640A3 true WO2001069640A3 (de) 2002-03-28

Family

ID=7634074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/001474 WO2001069640A2 (de) 2000-03-10 2001-02-10 Verfahren zum aufbringen von metallischen leiterbahnen als elektroden auf eine kanalplatte aus glas für grossflächige flachbildschirme

Country Status (3)

Country Link
AU (1) AU8147101A (de)
DE (1) DE10011455B4 (de)
WO (1) WO2001069640A2 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757131A (en) * 1995-08-11 1998-05-26 Nec Corporation Color plasma display panel and fabricating method
JPH11317161A (ja) * 1998-03-04 1999-11-16 Lg Electronics Inc プラズマディスプレイパネルの電極の構造及び形成方法
JPH11339672A (ja) * 1998-05-29 1999-12-10 Sony Corp 画像表示装置の製造方法
US6027862A (en) * 1996-11-21 2000-02-22 U.S. Philips Corporation Method of applying a silver layer to a glass substrate
DE19841900A1 (de) * 1998-09-11 2000-03-30 Schott Glas Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112056A (en) * 1977-03-11 1978-09-30 Fujitsu Ltd Gas discharging panel of self shift type
NL8105922A (nl) * 1981-12-31 1983-07-18 Philips Nv Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen.
DE4125863A1 (de) * 1991-08-03 1993-02-04 Lpkf Cad Cam Systeme Gmbh Verfahren zum aufbringen von strukturierten metallschichten auf glassubstraten
DE4330961C1 (de) * 1993-09-09 1994-07-28 Krone Ag Verfahren zur Herstellung von strukturierten Metallisierungen auf Oberflächen
WO1995029573A1 (de) * 1994-04-25 1995-11-02 Siemens S.A. Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen
DE4438799A1 (de) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757131A (en) * 1995-08-11 1998-05-26 Nec Corporation Color plasma display panel and fabricating method
US6027862A (en) * 1996-11-21 2000-02-22 U.S. Philips Corporation Method of applying a silver layer to a glass substrate
JPH11317161A (ja) * 1998-03-04 1999-11-16 Lg Electronics Inc プラズマディスプレイパネルの電極の構造及び形成方法
JPH11339672A (ja) * 1998-05-29 1999-12-10 Sony Corp 画像表示装置の製造方法
DE19841900A1 (de) * 1998-09-11 2000-03-30 Schott Glas Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 03 30 March 2000 (2000-03-30) *

Also Published As

Publication number Publication date
DE10011455B4 (de) 2005-12-08
WO2001069640A2 (de) 2001-09-20
AU8147101A (en) 2001-09-24
DE10011455A1 (de) 2001-09-20

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