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WO1991014529A1 - Process and device for heating a welding material - Google Patents

Process and device for heating a welding material Download PDF

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Publication number
WO1991014529A1
WO1991014529A1 PCT/FR1991/000237 FR9100237W WO9114529A1 WO 1991014529 A1 WO1991014529 A1 WO 1991014529A1 FR 9100237 W FR9100237 W FR 9100237W WO 9114529 A1 WO9114529 A1 WO 9114529A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating
heated
light beam
parts
zone
Prior art date
Application number
PCT/FR1991/000237
Other languages
French (fr)
Inventor
Luc Bernard Lafond
Original Assignee
Luc Bernard Lafond
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luc Bernard Lafond filed Critical Luc Bernard Lafond
Publication of WO1991014529A1 publication Critical patent/WO1991014529A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Definitions

  • the present invention relates to a method and a device intended for heating a deposited soldering material for the soldering or desoldering of parts, and more particularly intended for soldering and desoldering of electronic components mounted on the surface on a substrate such as 'an electronic card.
  • soldering and desoldering of electronic components operated locally on a card are traditionally carried out either by thermal conduction using a conventional or CURIE effect soldering iron or using hot bars or by thermal conduction by blowing of hot air drawn through nozzles adapted to the shape of the component.
  • thermal conduction using a conventional or CURIE effect soldering iron or using hot bars
  • thermal conduction by blowing of hot air drawn through nozzles adapted to the shape of the component.
  • Patent DE-A-2360308 describes and shows a method and a device for welding using a laser beam which is surrounded by a light beam, the laser beam passing through an orifice provided in a mirror deflecting the Ray of light.
  • This method and this device are suitable for carrying out point-to-point welding, causing inhomogeneity of the weld points and consequently mechanical stresses.
  • they could only be used to perform desoldering by carrying out an additional point-to-point suction operation of the welding material.
  • the object of the present invention is in particular to remedy these drawbacks and provides a method and a device intended for heating a welding material deposited on at least one connection zone of at least two parts, for the purpose of welding or desoldering. of these.
  • the method consists in emitting on the one hand a heating beam and on the other hand a locating light beam, in bringing one of these beams in coincidence with the other of such so that they reach the area to be heated by following the same route.
  • the method consists, by deflecting this path so that these beams carry out a scan in coincidence, to proceed by scanning to locate the zone to be heated using the light beam of location and to proceed by this heating scan of this identified area using the heating beam, thus allowing the welding or desoldering of said parts.
  • the method when the zone to be heated is subdivided into several spaced parts, the method can advantageously consist in emitting the above-mentioned beams so that the latter successively and mainly reach these spaced parts to be heated.
  • the tracking light beam can advantageously be switched off during the heating operation of the area to be heated using the heating beam.
  • provision may be made to measure the temperature of the solder material and of the two parts, preferably in the vicinity of the zone to be heated, and to regulate the heating beam as a function of at least one of these temperatures.
  • the heating device comprises means for emitting a heating beam, means for emitting a locating light beam, means to bring the light beam and the heating beam into coincidence so that the heating beam and the locating light beam reach the area to be heated by following the same route, and means for deflecting this route so that the heating beam and the locating light beam scan coincidentally the area to be heated.
  • the heating beam is preferably formed by a laser beam obtained from a CO2 source and the locating light beam is preferably constituted by an infrared beam, the means for bringing these beams into coincidence being constituted preferably with a dichroic blade.
  • said scanning means deflecting the aforementioned path ' are preferably at high frequency and constituted by two reflectors with controlled pivoting, mounted on two coaxial shafts driven by galvonometric motors.
  • means can advantageously be provided for measuring the temperature of the welding material and of the two parts, these temperature measurement means being connected to means for regulating the means for emitting the heating beam in order to regulate the power of the latter as a function of at least one of these temperatures.
  • the present invention will be better understood from the study of a device for heating a welding material connecting or intended to connect two parts, one of which is an electronic component and the other of which is a substrate of the electronic card type, described by way of nonlimiting example and illustrated "by the single appended figure.
  • the heating device shown in the single figure and generally identified by the reference 1 is intended for heating the various spaced solder points 2 connecting at least some of the tabs of an electronic component 3 to a connection circuit made at the surface of an electronic card 4.
  • the component 3 comprises two series of five tabs which are provided on two opposite lateral sides, the welding points 2 being formed on two rectangular zones 5 and 6.
  • the electronic card 4 is arranged horizontally and held on a table 7 adjustable horizontally in the directions X and Y and angularly by suitable means.
  • the heating device 1 comprises a generator 8 generating a laser beam 9 obtained from a CO2 source, directed downwards. This generator 8 is supplied with electrical energy by an appropriate electrical circuit 10 'and is preferably cooled.
  • the heating device 1 also comprises a generator 11 horizontally emitting an infrared light beam 12 which meets the laser beam 9.
  • the heating device 1 comprises a dichroic blade 13 placed at 45 ° and which allows the infrared beam 12 to be deflected downwards so that the latter and the laser beam 9 , which crosses the dichroic blade 4, are in coincidence and therefore follow, from the dichroic blade 13 and downwards, the same course 14.
  • the heating device 1 further comprises a scanning system marked generally by the reference 15 which makes it possible to deflect the path 14 so that the laser beam 9 and the infrared beam 12 reach from above and scan, at high frequency, the solder points 2 to be heated in zones 5 and 6.
  • the scanning system 15 comprises a first deflector 16 which deviates horizontally the path 14 coming from the dichroic blade 13 towards a second deflector 17, the latter deflecting the path 14 downwards towards the table 7.
  • the deflectors 16 and 17 are respectively mounted on coaxial and opposite shafts 18 and 19 driven by galvanometric motors 20 and 21 which are controlled by a control circuit 22 connected to an adjustment circuit 23 so that the deflectors 16 and 17 perform controlled pivoting movements.
  • the generator 8 of the laser beam 9 being stopped, the operator starts the generator 11 which emits the infrared beam 12. It starts the scanning system 15.
  • the adjustment circuit 23 of this scanning system 15 By means of the adjustment circuit 23 of this scanning system 15 and by moving the table 7 horizontally, the operator ensures that the zones 5 and 6 scanned by the infrared beam 12 and that the latter mainly reaches the points of solder 2 to be heated.
  • the operator introduces into the adjustment circuit 23 the dimensional characteristics of the electronic component 3 and the references of the legs of the latter provided with solder points 2.
  • the control circuit 22 controlling the motors 20 and 21 of so that the infrared beam 12 scans these points successively and cyclically, the operator then moves the table 7 horizontally so as to bring the light points in coincidence with the solder points 2 to be heated.
  • the scanning system 15 and the table 7 being suitably adjusted and positioned, the operator stops the generator 11 of the infrared beam 12 and starts the generator 8 of the laser beam 9 which heats successively and cyclically to gradually reach the desired temperature homogeneously on all the points, in a single operation, the different points 2 of the zones 5 and 6.
  • the control circuit 22 regulates the electric circuit 10 so that, preferably, the laser beam does not be emitted only to the welding points 2 to be heated.
  • the laser beam 9 scans the points 2 of the zones 5 and 6 in coincidence with the light points which the infrared beam 12 scanned.
  • the operator stops the generator 8 of the laser beam 9 and can then stop the scanning system 15, these stops being able to be caused automatically after a predetermined time.
  • the welding operation is, in one operation, complete.
  • the operator can remove this component 3 for example using a suction nozzle.
  • the heating device 1 comprises a measurement circuit 24, formed for example by an optical pyrometer equipped with a reflex sight, making it possible to measure for example the temperature of the welding material 2, the temperature of the component 3 and the temperature of card 4, in the vicinity of zones 5 and 6.
  • a measurement circuit 24 formed for example by an optical pyrometer equipped with a reflex sight, making it possible to measure for example the temperature of the welding material 2, the temperature of the component 3 and the temperature of card 4, in the vicinity of zones 5 and 6.
  • the measurement circuit 24 is connected to a regulation circuit 25.
  • This regulation circuit 25 is connected to the control circuit 10 of the generator 8 of the laser beam 9.
  • the regulation circuit 25 makes it possible to regulate the supply circuit 10 in order to regulate the power of the laser beam 9 as a function of at least one of the abovementioned temperatures so that, for example, at least one of these temperatures remains below a prefixed maximum value. This provision is provided to avoid overheating of component 3 or of card 4.
  • a heating device 1 may be used in which the scanning system 15 is placed approximately 400 mm above the board 4 and whose laser and light beams 9 and 12 would have a diameter greater than 1mm, for example 1.5mm.
  • the control circuit 11 would be programmed so that the beams 9 and 12 successively and at high frequency reach the different welding points 2 of the zones 5 and 6, without transmitting between these points or by transmitting with a clearly weakened power.
  • the heating time can then be approximately five seconds.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)

Abstract

Process for heating a welding material (2) deposited on at least one joining area of at least two components (3, 4) for their welding or separation, in which means (8) emit a heating beam (9) and means (11) emit a detection light beam (12), means (13) cause one of these beams to coincide with the other so that they reach the region to be heated along the same path (14), means (15) deviate this path so that these beams together sweep the region to be heated (5). Before the region to be heated with the heating beam (9) is swept, it is detected by the light beam (12).

Description

PROCEDE ET DISPOSITIF DESTINE AU CHAUFFAGE  METHOD AND DEVICE FOR HEATING
D'UNE MATIERE DE SOUDAGE  OF A WELDING MATERIAL
La présente invention concerne un procédé et un dispositif destinés au chauffage d'une matière de soudage déposé' en vue du soudage ou du dessoudage de pièces, et plus particulièrement destinés au soudage et au dessoudage de composants électroniques montés en surface sur un substrat tel qu'une carte électronique.  The present invention relates to a method and a device intended for heating a deposited soldering material for the soldering or desoldering of parts, and more particularly intended for soldering and desoldering of electronic components mounted on the surface on a substrate such as 'an electronic card.
Le soudage et le dessoudage de composants électroniques opérés de façon localisée sur une carte sont traditionnellement réalisés soit par conduction thermique à l'aide d'un fer à souder classique ou à effet CURIE ou à l'aide de barres chaudes soit par conduction thermique par soufflage d'air chaud puisé au travers de buses adaptées à la forme du composant. En outre, on est bien souvent obligé de combiner ces deux solutions.  The soldering and desoldering of electronic components operated locally on a card are traditionally carried out either by thermal conduction using a conventional or CURIE effect soldering iron or using hot bars or by thermal conduction by blowing of hot air drawn through nozzles adapted to the shape of the component. In addition, it is often necessary to combine these two solutions.
Ces manières connues de procéder présentent plusieurs inconvénients qui sont principalement dus aux difficultés d'accéder aux soudures en raison de la proximité et de la densité d' implatation des composants sur la carte, aux risques de courts circuits entre connexions adjacentes ou dans certains cas à l'absence de soudures, aux chocs thermiques et de surchauffe que peuvent subir aussi bien les composants que la carte. Il arrive donc fréquemment que la mise en oeuvre des solutions connues précitées engendre des endommagements électriques, mécaniques ou thermiques des composants et des substrats et qu'elle en outre coûte cher.  These known ways of proceeding have several drawbacks which are mainly due to the difficulties of accessing the soldering due to the proximity and the density of implantation of the components on the card, to the risks of short circuits between adjacent connections or in certain cases due to the absence of soldering, thermal shock and overheating that can affect both the components and the card. It therefore frequently happens that the implementation of the aforementioned known solutions gives rise to electrical, mechanical or thermal damage to the components and substrates and that it is also expensive.
Le brevet DE-A-2360308 décrit et montre un procédé et un dispositif de soudage à l'aide d'un rayon laser qui est entouré par un rayon lumineux, le rayon laser passant au travers d'un orifice prévu dans un miroir déviant le rayon lumineux. Ce procédé et ce dispositif sont adaptés pour effectuer un soudage point après point, engendrant une inhomogénéïté des points de soudure et en conséquence des contraintes mécaniques. De plus, on ne pourrait les utiliser pour effectuer un dessoudage qu'en effectuant une ope'ration supplémentaire d'aspiration point après point de la matière de soudage. La présente invention a notamment pour but de remédier à ces inconvénients et propose un procédé et un dispositif destinés au chauffage d'une matière de soudage déposée sur au moins une zone de liaison d'au moins deux pièces, en vue du soudage ou du dessoudage de ces dernières. Patent DE-A-2360308 describes and shows a method and a device for welding using a laser beam which is surrounded by a light beam, the laser beam passing through an orifice provided in a mirror deflecting the Ray of light. This method and this device are suitable for carrying out point-to-point welding, causing inhomogeneity of the weld points and consequently mechanical stresses. In addition, they could only be used to perform desoldering by carrying out an additional point-to-point suction operation of the welding material. The object of the present invention is in particular to remedy these drawbacks and provides a method and a device intended for heating a welding material deposited on at least one connection zone of at least two parts, for the purpose of welding or desoldering. of these.
Le procédé, selon un premier objet de l'invention, consiste à émettre d'une part un faisceau de chauffe et d'autre part un faisceau lumineux de repérage, à amener l'un de ces faisceaux en coïncidence avec l'autre de telle sorte qu'ils atteignent la zone à chauffer en suivant un même parcours.  The method, according to a first object of the invention, consists in emitting on the one hand a heating beam and on the other hand a locating light beam, in bringing one of these beams in coincidence with the other of such so that they reach the area to be heated by following the same route.
Selon l'invention, le procédé consiste, en déviant ce parcours de telle sorte que ces faisceaux effectuent un balayage en coïncidence, à procéder par balayage au repérage de la zone à chauffer à l'aide du faisceau lumineux de repérage et à procéder par ce balayage au chauffage de cette zone repérée à l'aide du faisceau de chauffe, permettant ainsi le soudage ou le dessoudage desdites pièces.  According to the invention, the method consists, by deflecting this path so that these beams carry out a scan in coincidence, to proceed by scanning to locate the zone to be heated using the light beam of location and to proceed by this heating scan of this identified area using the heating beam, thus allowing the welding or desoldering of said parts.
Selon l'invention, lorsque la zone à chauffer est subdivisée en plusieurs parties espacées, le procé'dé peut avantageusement consister à émettre les faisceaux précités de telle sorte que ces derniers atteignent successivement et principalement ces parties espacées à chauffer.  According to the invention, when the zone to be heated is subdivided into several spaced parts, the method can advantageously consist in emitting the above-mentioned beams so that the latter successively and mainly reach these spaced parts to be heated.
Selon l'invention, le faisceau lumineux de repérage peut avantageusement être éteint lors de l'opération de chauffage de la zone à chauffer à l'aide du faisceau de chauffe.  According to the invention, the tracking light beam can advantageously be switched off during the heating operation of the area to be heated using the heating beam.
Selon l'invention, il peut être prévu de mesurer la température de la matière de soudure et des deux pièces, de préférence au voisinage de la zone à chauffer, et de réguler le faisceau de chauffe en fonction d'au moins l'une de ces températures.  According to the invention, provision may be made to measure the temperature of the solder material and of the two parts, preferably in the vicinity of the zone to be heated, and to regulate the heating beam as a function of at least one of these temperatures.
Le dispositif de chauffage selon un autre objet de l'invention, qui peut avantageusement être destine à la mise en oeuvre du procédé' précité, comprend des moyens pour émettre un faisceau de chauffe, des moyens pour émettre un faisceau lumineux de repérage, des moyens pour amener le faisceau lumineux et le faisceau de chauffe en coïncidence de telle sorte que le faisceau de chauffe et le faisceau lumineux de repérage atteignent la zone à chauffer en suivant un même parcours, et des moyens pour dévier ce parcours afin que le faisceau de chauffe et le faisceau lumineux de repérage balayent en coïncidence la zone à chauffer. The heating device according to another object of the invention, which can advantageously be intended for the implementation of the above method, comprises means for emitting a heating beam, means for emitting a locating light beam, means to bring the light beam and the heating beam into coincidence so that the heating beam and the locating light beam reach the area to be heated by following the same route, and means for deflecting this route so that the heating beam and the locating light beam scan coincidentally the area to be heated.
Selon l'invention, le faisceau de chauffe est de préférence constitué par un faisceau laser obtenu a partir d'une source CO2 et le faisceau lumineux de repérage est de préférence constitué par un faisceau infrarouge, les moyens pour amener ces faisceaux en coïncidence étant constitués de préférence par une lame dichroïque.  According to the invention, the heating beam is preferably formed by a laser beam obtained from a CO2 source and the locating light beam is preferably constituted by an infrared beam, the means for bringing these beams into coincidence being constituted preferably with a dichroic blade.
Selon l'invention, lesdits moyens de balayage déviant le parcours précité' sont de préférence à haute fréquence et constitués par deux réflecteurs à pivotement contrôlé, montés sur deux arbres coaxiaux entraines par des moteurs galvonométriques.  According to the invention, said scanning means deflecting the aforementioned path 'are preferably at high frequency and constituted by two reflectors with controlled pivoting, mounted on two coaxial shafts driven by galvonometric motors.
Selon l'invention, des moyens peuvent avantageusement être prévus pour mesurer la température de la matière de soudage et des deux pièces, ces moyens de mesure de température étant relié's à des moyens de régulation des moyens d'émission du faisceau de chauffe afin de réguler la puissance de ce dernier en fonction d'au moins l'une de ces températures.  According to the invention, means can advantageously be provided for measuring the temperature of the welding material and of the two parts, these temperature measurement means being connected to means for regulating the means for emitting the heating beam in order to regulate the power of the latter as a function of at least one of these temperatures.
La présente invention sera mieux comprise à l 'étude d'un dispositif de chauffage d'une matière de soudage reliant ou destinée à relier deux pièces dont l'une est un composant électronique et dont l'autre est un substrat du type carte électronique, décrit à titre d'exemple non limitatif et illustré" par la figure unique annexée.  The present invention will be better understood from the study of a device for heating a welding material connecting or intended to connect two parts, one of which is an electronic component and the other of which is a substrate of the electronic card type, described by way of nonlimiting example and illustrated "by the single appended figure.
Le dispositif de chauffage représenté sur la figure unique et repéré d'une manière générale par la référence 1 est destiné au chauffage des différents points de soudure espacé's 2 reliant au moins certaines des pattes d'un composant électronique 3 à un circuit de connexion réalisé à la surface d'une carte électronique 4. Dans l'exemple, le composante 3 comprend deux séries de cinq pattes qui sont prévues sur deux côtés latéraux opposés, les points de soudure 2 étant formés sur deux zones rectangulaires 5 et 6.  The heating device shown in the single figure and generally identified by the reference 1 is intended for heating the various spaced solder points 2 connecting at least some of the tabs of an electronic component 3 to a connection circuit made at the surface of an electronic card 4. In the example, the component 3 comprises two series of five tabs which are provided on two opposite lateral sides, the welding points 2 being formed on two rectangular zones 5 and 6.
La carte électronique 4 est disposée horizontalement et maintenue sur une table 7 réglable horizontalement selon les directions X et Y et angulairement par des moyens appropriés. Le dispositif de chauffage 1 comprend un générateur 8 générant un faisceau laser 9 obtenu à partir d'une source CO2, dirigé vers le bas. Ce générateur 8 est alimenté en énergie électrique par un circuit électrique 10 approprié' et est de préférence refroidi. The electronic card 4 is arranged horizontally and held on a table 7 adjustable horizontally in the directions X and Y and angularly by suitable means. The heating device 1 comprises a generator 8 generating a laser beam 9 obtained from a CO2 source, directed downwards. This generator 8 is supplied with electrical energy by an appropriate electrical circuit 10 'and is preferably cooled.
Le dispositif de chauffage 1 comprend en outre un générateur 11 émettant horizontalement un faisceau lumineux infrarouge 12 qui rencontre le faisceau laser 9.  The heating device 1 also comprises a generator 11 horizontally emitting an infrared light beam 12 which meets the laser beam 9.
A la jonction du faisceau laser 9 et du faisceau infrarouge 12, le dispositif de chauffage 1 comprend une lame dichroïque 13 placée à 45° et qui permet de dévier vers le bas le faisceau infrarouge 12 de telle sorte que ce dernier et le faisceau laser 9, qui traverse la lame dichroïque 4, soient en coïncidence et suivent donc, à partir de la lame dichroïque 13 et vers le bas, le même parcours 14.  At the junction of the laser beam 9 and the infrared beam 12, the heating device 1 comprises a dichroic blade 13 placed at 45 ° and which allows the infrared beam 12 to be deflected downwards so that the latter and the laser beam 9 , which crosses the dichroic blade 4, are in coincidence and therefore follow, from the dichroic blade 13 and downwards, the same course 14.
Le dispositif de chauffage 1 comprend en outre un système de balayage repéré' d'une manière générale par la référence 15 qui permet de dévier le parcours 14 de telle sorte que le faisceau laser 9 et le faisceau infrarouge 12 atteignent par le dessus et balayent, à haute fréquence, les points de soudure 2 à chauffer des zones 5 et 6.  The heating device 1 further comprises a scanning system marked generally by the reference 15 which makes it possible to deflect the path 14 so that the laser beam 9 and the infrared beam 12 reach from above and scan, at high frequency, the solder points 2 to be heated in zones 5 and 6.
Dans l'exemple, le système de balayage 15 comprend un premier déflecteur 16 qui dévie horizontalement le parcours 14 venant de la lame dichroïque 13 vers un second déflecteur 17, ce dernier déviant le parcours 14 vers le bas en direction de la table 7. Les déflecteurs 16 et 17 sont respectivement montés sur des arbres coaxiaux et opposés 18 et 19 entraînés par des moteurs galvanométriques 20 et 21 qui sont pilotés par un circuit de commande 22 relié à un circuit de réglage 23 de telle sorte que les déflecteurs 16 et 17 effectuent des mouvements de pivotement contrôlés.  In the example, the scanning system 15 comprises a first deflector 16 which deviates horizontally the path 14 coming from the dichroic blade 13 towards a second deflector 17, the latter deflecting the path 14 downwards towards the table 7. The deflectors 16 and 17 are respectively mounted on coaxial and opposite shafts 18 and 19 driven by galvanometric motors 20 and 21 which are controlled by a control circuit 22 connected to an adjustment circuit 23 so that the deflectors 16 and 17 perform controlled pivoting movements.
Pour effectuer le réglage du dispositif de chauffage 1, l'opérateur procède de la manière suivante.  To adjust the heating device 1, the operator proceeds as follows.
Le générateur 8 du faisceau laser 9 étant à l'arrêt, l'opérateur met en route le générateur 11 qui émet le faisceau infrarouge 12. Il met en route le système de balayage 15. Par l'intermédiaire du circuit de réglage 23 de ce système de balayage 15 et en déplaçant horizontalement la table 7, l'opérateur fait en sorte que les zones 5 et 6 balayées par le faisceau infrarouge 12 et que ce dernier atteigne principalement les points de soudure 2 à chauffer. The generator 8 of the laser beam 9 being stopped, the operator starts the generator 11 which emits the infrared beam 12. It starts the scanning system 15. By means of the adjustment circuit 23 of this scanning system 15 and by moving the table 7 horizontally, the operator ensures that the zones 5 and 6 scanned by the infrared beam 12 and that the latter mainly reaches the points of solder 2 to be heated.
Dans une variante plus simple, l'opérateur introduit dans le circuit de réglage 23 les caractéristiques dimensionnelles du composant électronique 3 et les références des pattes de ce dernier munies des points de soudure 2. Le circuit de commande 22 commandant les moteurs 20 et 21 de telle sorte que le faisceau infrarouge 12 balaye successivement et de manière cyclique ces points, l'opérateur déplace alors la table 7 horizontalement de manière à amener les points lumineux en coïncidence avec les points de soudure 2 à chauffer.  In a simpler variant, the operator introduces into the adjustment circuit 23 the dimensional characteristics of the electronic component 3 and the references of the legs of the latter provided with solder points 2. The control circuit 22 controlling the motors 20 and 21 of so that the infrared beam 12 scans these points successively and cyclically, the operator then moves the table 7 horizontally so as to bring the light points in coincidence with the solder points 2 to be heated.
Le système de balayage 15 et la table 7 étant convenablement réglés et positionnés, l'opérateur stoppe le générateur 11 du faisceau infrarouge 12 et met en marche le générateur 8 du faisceau laser 9 qui chauffe successivement et de manière cyclique pour atteindre progressivement la température désirée de façon homgène sur l'ensemble des points, en une seule opération, les différents points 2 des zones 5 et 6. Bien entendu, le circuit de commande 22 régule le circuit électrique 10 de telle sorte que, de préférence, le faisceau laser ne soit émis que vers les points de soudure 2 à chauffer.  The scanning system 15 and the table 7 being suitably adjusted and positioned, the operator stops the generator 11 of the infrared beam 12 and starts the generator 8 of the laser beam 9 which heats successively and cyclically to gradually reach the desired temperature homogeneously on all the points, in a single operation, the different points 2 of the zones 5 and 6. Of course, the control circuit 22 regulates the electric circuit 10 so that, preferably, the laser beam does not be emitted only to the welding points 2 to be heated.
Comme le faisceau laser 9 suit le parcours 14, en coïncidence avec le faisceau infrarouge 12 utilisé pour le repérage, le faisceau laser 9 balaye les points 2 des zones 5 et 6 en coïncidence avec les points lumineux que balayait le faisceau infrarouge 12.  As the laser beam 9 follows the path 14, in coincidence with the infrared beam 12 used for the location, the laser beam 9 scans the points 2 of the zones 5 and 6 in coincidence with the light points which the infrared beam 12 scanned.
Au bout du temps nécessaire de chauffage, l'opérateur stoppe le générateur 8 du faisceau laser 9 et peut ensuite arrêter le système, de balayage 15, ces arrêts pouvant être provoqués automatiquement au bout d'un temps prédéterminé.  At the end of the necessary heating time, the operator stops the generator 8 of the laser beam 9 and can then stop the scanning system 15, these stops being able to be caused automatically after a predetermined time.
Dans le cas d'un chauffage pour provoquer la soudure d'une ou de certaines des pattes du composant 3 sur la carte 4 aux points 2 où de la matière de soudage a été préalablement déposée, l'opération de soudage est, en une seule opération, terminée. Dans le cas d'une opération de dessoudage, dès que la matière de soudage déposée aux différents points de soudure 2 reliant le composant 3 à la carte 4 a été chauffée, en une seule opération, l'opérateur peut enlever ce composant 3 par exemple à l'aide d'une buse aspirante. In the case of heating to cause the welding of one or some of the legs of the component 3 on the board 4 at points 2 where welding material has been previously deposited, the welding operation is, in one operation, complete. In the case of a desoldering operation, as soon as the welding material deposited at the different welding points 2 connecting the component 3 to the card 4 has been heated, in a single operation, the operator can remove this component 3 for example using a suction nozzle.
En complément, le dispositif de chauffe 1 comprend un circuit de mesure 24, formé par exemple par un pyromètre optique équipé d'une visée réflexe, permettant de mesurer par exemple la température de la matière de soudage 2, la température du composant 3 et la température de la carte 4, au voisinage des zones 5 et 6.  In addition, the heating device 1 comprises a measurement circuit 24, formed for example by an optical pyrometer equipped with a reflex sight, making it possible to measure for example the temperature of the welding material 2, the temperature of the component 3 and the temperature of card 4, in the vicinity of zones 5 and 6.
Le circuit de mesure 24 est relié à un circuit de régulation 25. Ce circuit de régulation 25 est relié au circuit de commande 10 du générateur 8 du faisceau laser 9. Le circuit de régulation 25 permet de réguler le circuit d'alimentation 10 afin de réguler la puissance du faisceau laser 9 en fonction d'au moins l'une des températures précitées pour que par exemple au moins l'une de ces températures reste en dessous d'une valeur maximum préfixée. Cette disposition est prévue pour éviter toute surchauffe du composant 3 ou de la carte 4.  The measurement circuit 24 is connected to a regulation circuit 25. This regulation circuit 25 is connected to the control circuit 10 of the generator 8 of the laser beam 9. The regulation circuit 25 makes it possible to regulate the supply circuit 10 in order to regulate the power of the laser beam 9 as a function of at least one of the abovementioned temperatures so that, for example, at least one of these temperatures remains below a prefixed maximum value. This provision is provided to avoid overheating of component 3 or of card 4.
Dans un exemple, pour chauffer les deux séries 5 et In an example, to heat the two series 5 and
6 de cinq points de soudure 2 d'environ 1mm de diamètre chacun, espacés d'environ 1mm, on peut utiliser un dispositif de chauffage 1 dans lequel le système de balayage 15 serait placé à environ 400 mm au-dessus de la carte 4 et dont les faisceaux laser et lumineux 9 et 12 auraient un diamètre supérieur à 1mm, par exemple 1,5mm. Le circuit de commande 11 serait programmé' de telle sorte que les faisceaux 9 et 12 atteignent successivement et à haute fréquence les différents points de soudure 2 des zones 5 et 6, sans émettre entre ces points ou en émettant avec une puissance nettement affaiblie. Le temps de chauffe peut alors être d'environ cinq secondes. 6 of five solder points 2 of approximately 1 mm in diameter each, spaced approximately 1 mm, a heating device 1 may be used in which the scanning system 15 is placed approximately 400 mm above the board 4 and whose laser and light beams 9 and 12 would have a diameter greater than 1mm, for example 1.5mm. The control circuit 11 would be programmed so that the beams 9 and 12 successively and at high frequency reach the different welding points 2 of the zones 5 and 6, without transmitting between these points or by transmitting with a clearly weakened power. The heating time can then be approximately five seconds.
La présente invention ne se limite pas à l'exemple ci-dessus décrit. Bien des variantes de réalisation sont possibles sans sortir du cadre défini par les revendications annexées.  The present invention is not limited to the example described above. Many alternative embodiments are possible without departing from the scope defined by the appended claims.

Claims

REVENDICATIONS
1. Procédé de chauffage d'une matière de soudage (2) déposée sur au moins une zone de liaison d'au moins deux pièces (3, 4), consistant à émettre d'une part un faisceau de chauffe (9) et d'autre part un faisceau lumineux (12) de repérage, à amener l'un de ces faisceaux en coïncidence avec l'autre de telle sorte qu'ils atteignent la zone à chauffer en suivant un même parcours (14), caractérisé par le fait qu'il consiste en outre, en déviant ce parcours de telle sorte que ces faisceaux effectuent un balayage en coïncidence, à procéder par balayage au repérage de la zone à chauffer à l'aide du faisceau lumineux (12) de repérage et à procé'der par ce balayage au chauffage de cette zone repérée à l'aide du faisceau de chauffe (9), permettant ainsi le soudage ou le dessoudage desdites pièces.  1. A method of heating a welding material (2) deposited on at least one connection zone of at least two parts (3, 4), consisting in emitting on the one hand a heating beam (9) and d on the other hand a light beam (12) for locating, to bring one of these beams in coincidence with the other so that they reach the zone to be heated by following the same route (14), characterized by the fact that it further consists, by deflecting this path so that these beams carry out a coincident scan, to proceed by scanning the location of the zone to be heated using the light beam (12) of location and to process der by this sweep to the heating of this area identified using the heating beam (9), thus allowing the welding or desoldering of said parts.
2. Procédé selon la revendication 1, caractérisé par le fait qu'il consiste, ladite zone à chauffer étant subdivisée en plusieurs parties espacées à chauffer, à émettre lesdits faisceaux de telle sorte qu'ils atteignent principalement et successivement ces parties espacées à chauffer.  2. Method according to claim 1, characterized in that it consists, said zone to be heated being subdivided into several spaced parts to be heated, to emit said beams so that they mainly and successively reach these spaced parts to be heated.
3. Procédé selon l'une des revendications 1 et 2, caractérisé par le fait qu'il consiste à éteindre le faisceau lumineux (12) de repérage lors de l'opération de chauffage de la zone à chauffer (5) à l'aide du faisceau de chauffe (9).  3. Method according to one of claims 1 and 2, characterized in that it consists in extinguishing the light beam (12) marking during the heating operation of the area to be heated (5) using of the heating bundle (9).
4. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé par le fait qu'il consiste à mesurer la température de la matière de soudure (2) et/ou des deux pièces (3, 4), de préférence au voisinage de la zone à chauffer (5), et de réguler le faisceau de chauffe en fonction d'au moins l'une de ces températures.  4. Method according to any one of claims 1 to 3, characterized in that it consists in measuring the temperature of the solder material (2) and / or of the two parts (3, 4), preferably in the vicinity of the zone to be heated (5), and of regulating the heating beam as a function of at least one of these temperatures.
5. Dispositif de chauffage d'une matière de soudage 5. Device for heating a welding material
(2) déposée sur au moins une zone de liaison d'au moins deux pièces (3, 4) en vue du soudage ou du dessoudage de ces dernières, destiné notamment à la mise en oeuvre du procédé précité, caractérisé par le fait qu'il comprend des moyens (8) pour émettre un faisceau de chauffe (9), des moyens (11) pour émettre un faisceau lumineux (12) de repérage, des moyens (13) pour amener le faisceau lumineux et le faisceau de chauffe en coïncidence de telle sorte que le faisceau de chauffe et le faisceau lumineux de repérage suivent un même parcours (14), et des moyens (15) pour dévier ce parcours (14) afin que le faisceau de chauffe et le faisceau lumineux de repérage balayent en coïncidence la zone à chauffer. (2) deposited on at least one connection zone of at least two parts (3, 4) for the purpose of welding or desoldering the latter, intended in particular for the implementation of the aforementioned method, characterized in that it comprises means (8) for emitting a heating beam (9), means (11) for emitting a light beam (12) for locating, means (13) for bringing the light beam and the heating beam in coincidence so that the heating beam and the locating light beam follow a same path (14), and means (15) for deflecting this path (14) so that the heating beam and the tracking light beam coincidently scan the area to be heated.
6. Dispositif selon la revendication 5, caractérisé par le fait que le faisceau de chauffe (9) est constitué par un faisceau laser obtenu à partir d'une source CO2 et le faisceau lumineux de repérage est constitué par un faisceau infrarouge (12), les moyens pour amener ces faisceaux en coïncidence étant constituée par une lame dichroïque (13).  6. Device according to claim 5, characterized in that the heating beam (9) consists of a laser beam obtained from a CO2 source and the locating light beam consists of an infrared beam (12), the means for bringing these beams into coincidence being constituted by a dichroic blade (13).
7. Dispositif selon l'une des revendications 4 et 5, caracté'risé' par le fait que lesdits moyens de balayage (15) déviant le parcours précité sont à haute fréquence et sont constitués par deux réflecteurs (16, 17) à pivotement contrôlé, montés sur deux arbres coaxiaux (18, 19) entraînés par des moteurs galvonométriques (20, 21).  7. Device according to one of claims 4 and 5, characterized by the fact that said scanning means (15) deviating the aforementioned path are at high frequency and are constituted by two reflectors (16, 17) with controlled pivoting , mounted on two coaxial shafts (18, 19) driven by galvonometric motors (20, 21).
8. Dispositif selon l'une quelconque des revendications 4 à 6, caractérisé par le fait qu'il comprend des moyens (24) pour mesurer la température de la matière de soudage et des deux pièces, ces moyens de mesure de température étant reliés à des moyens de régulation (25) des moyens d'émission (10) du faisceau de chauffe (9) afin de réguler la puissance de ce dernier en fonction d'au moins l'une de ces températures.  8. Device according to any one of claims 4 to 6, characterized in that it comprises means (24) for measuring the temperature of the welding material and of the two parts, these temperature measuring means being connected to regulation means (25) emission means (10) of the heating beam (9) in order to regulate the power of the latter as a function of at least one of these temperatures.
PCT/FR1991/000237 1990-03-26 1991-03-25 Process and device for heating a welding material WO1991014529A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR90/03833 1990-03-26
FR9003833A FR2659886A1 (en) 1990-03-26 1990-03-26 METHOD AND DEVICE FOR HEATING A WELDING MATERIAL.

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Cited By (5)

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WO1999026753A1 (en) * 1997-11-20 1999-06-03 Pac Tech - Packaging Technologies Gmbh Method and device for thermally bonding connecting surfaces of two substrates
FR2802764A1 (en) * 1999-12-17 2001-06-22 Framatome Connectors Int Improved electronic component flexible board soldering having unit pre heating flexible board and attachment providing calibrated heat spots/fixed power duration/diameter brazing components.
DE10213577B3 (en) * 2002-03-26 2004-02-19 Siemens Ag Process for simultaneous laser beam soldering
EP2361714A1 (en) * 2010-02-26 2011-08-31 Reis Group Holding GmbH & Co. KG Method and assembly for laser soldering
CN103418873A (en) * 2012-05-17 2013-12-04 雷科股份有限公司 Method for applying laser welding machine to welding or unsoldering shielding screen

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DE2360308A1 (en) * 1972-12-04 1974-06-12 Mishima Kosan Co Ltd LASER SOLDERING DEVICE FOR MINIATURE SOLDERING SITES
WO1988005250A1 (en) * 1986-12-29 1988-07-14 Kabushiki Kaisha Toshiba Method and apparatus for soldering electronic component
EP0300873A1 (en) * 1987-07-24 1989-01-25 Thomson Composants Militaires Et Spatiaux Soldering furnace for integrated-circuit chips

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026753A1 (en) * 1997-11-20 1999-06-03 Pac Tech - Packaging Technologies Gmbh Method and device for thermally bonding connecting surfaces of two substrates
US6394158B1 (en) 1997-11-20 2002-05-28 Pac Tech Packaging Technologies Gmbh Method and device for thermally bonding connecting surfaces of two substrates
EP1283085A1 (en) * 1997-11-20 2003-02-12 Pac Tech - Packaging Technologies GmbH Method and apparatus for thermal assembling of connecting areas of two substrates
FR2802764A1 (en) * 1999-12-17 2001-06-22 Framatome Connectors Int Improved electronic component flexible board soldering having unit pre heating flexible board and attachment providing calibrated heat spots/fixed power duration/diameter brazing components.
EP1118411A1 (en) * 1999-12-17 2001-07-25 F.C.I. - Framatome Connectors International Method and device for soldering components
DE10213577B3 (en) * 2002-03-26 2004-02-19 Siemens Ag Process for simultaneous laser beam soldering
EP2361714A1 (en) * 2010-02-26 2011-08-31 Reis Group Holding GmbH & Co. KG Method and assembly for laser soldering
US8698039B2 (en) 2010-02-26 2014-04-15 Reis Group Holding Gmbh & Co. Kg Method and arrangement for firm bonding of materials
CN103418873A (en) * 2012-05-17 2013-12-04 雷科股份有限公司 Method for applying laser welding machine to welding or unsoldering shielding screen

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FR2659886A1 (en) 1991-09-27
FR2659886B1 (en) 1994-12-09

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