CN103418873A - Method for applying laser welding machine to welding or unsoldering shielding screen - Google Patents

Abstract

The invention discloses a method for applying a laser welding machine to the desoldering or welding of a shielding screen, which mainly comprises the steps of feeding, positioning, laser, sucking or cooling and the like, so that the shielding screen on a substrate is rapidly heated by the laser in a short time, the temperature is conducted to a colloid, the temperature of the colloid is melted after reaching a melting point, and the shielding screen is further connected with or separated from the substrate through the colloid, thereby greatly improving the desoldering or welding efficiency of the shielding screen; in addition, the shielding screen is an integrally formed shielding cover made of aluminum, white iron or stainless steel, so that the shielding screen, the substrate and the colloid are tightly adhered without any gap after welding, thereby effectively preventing electromagnetic wave signal interference and maintaining the normal operation of the circuit on the substrate.

Description

The laser welding machine is used in the method of desoldering or welding the shield

technical field

The present invention relates to a method for laser welding machine to be used in desoldering or welding of shielding shields, in particular to a laser welding machine that can precisely position substrates, and indirectly heats colloids through lasers in a short time to make shielding The shield is bonded or separated from the substrate through the colloid, and the laser welding machine that greatly improves the efficiency of shield shield desoldering or welding is applied to the method of shield shield desoldering or welding.

Background technique

With the miniaturization and high-speed performance of electronic products, more and more components are soldered on the surface of the substrate (ie printed circuit board: PCB board), which are nothing more than components such as resistors, capacitors, inductors, chips or patches; As far as the soldering method of the patch is concerned, the most commonly used method is Surface Mount Technology (hereinafter referred to as SMT); please refer to Figure 1 and Figure 2 at the same time. The technical process of SMT is mainly as follows:

A. Preparation 10: prepare the substrate 2 on which the patch 30 is to be soldered.

B. Glue coating 11: the patch 30 on the substrate 2 is then manually or automatically coated with solder paste 4 .

C. Chip placement 12: place the chip on the substrate 2 coated with solder paste 4 by manual or automatic means.

D. Reflow 13: The substrate 2 is passed through the high temperature to low temperature process of the reflow furnace, so that the pins 300 of the chip 30 are fixed on the substrate 2 through the melting and condensation of the solder paste 4 .

Therefore, although the substrate 2 can complete the bonding of the chip 30 through the SMT technology, the bonding efficiency of the chip 30 is not ideal, and it may not be able to meet the large demand of the electronics industry, resulting in a situation in short supply, and the cost of bonding equipment It is also quite impressive.

In addition, the aforementioned patch 30 is hollowed out, so that the detection operation of the substrate 2 can be carried out after the substrate 2 completes the bonding of the patch 30. Then, please refer to FIG. 30 are engaged with each other to form a shielding screen 3; however, although the substrate 2 after SMT technology does not affect the subsequent detection operations, since the patch 30 and the patch cover 31 are mutually engaged, the patch 30 and the patch cover 31 are formed by mutual engagement. The shielding screen 3 formed by the chip cover 31 has a gap 32. Therefore, when the substrate 2 is in actual operation, chips or other electronic components located on the substrate 2 and between the substrate 2 and the chip 30 will inevitably be affected by the shielding screen 3. The electromagnetic wave signal interference of external electronic components will affect the operation of the device.

Also, when the substrate 2 is damaged and needs to be repaired, the patch cover 31 must be manually disassembled, and even the patch 30 must be manually desoldered before repairing, and the manual desoldering of the patch 30 takes more than a few minutes; Manual desoldering of the patch 30 may easily damage other circuits on the substrate 2 and cause more serious damage to the substrate 2 . Therefore, maintenance is time-consuming and labor-intensive.

Contents of the invention

In view of this, the purpose of the present invention is to provide a laser welding machine that can precisely position the substrate, and indirectly heat the colloid in a short time through the laser, so that the shielding screen can be bonded or separated from the substrate through the colloid, which greatly improves The mask desoldering or welding efficient laser welding machine is applied to the method of desoldering or welding the mask.

In order to solve the above-mentioned technical problems, the laser welding machine provided by the present invention is applied to the method of unsoldering the shielding screen. The laser welding machine includes a working platform, a laser, an image aligner, a displacement device and an extractor, wherein the working platform It is set above the displacement device, the laser is set on the corresponding top of the work platform, the image aligner is set on the side of the laser, and the absorber is also set on the side of the laser.

Described desoldering method comprises the following steps:

A. Feeding: Manually or automatically place the substrate followed by the shielding screen on the working platform.

B. Positioning: Use the image aligner and shifter to position the substrate on the work platform.

C. Laser: The laser emitted by the laser is shot on the shielding screen connected to the substrate, so that the shielding screen will conduct the temperature to the colloid connecting the substrate and the shielding screen.

D. Suction: Use the displacement device to displace the work platform, so that the suction device can absorb the shielding screen on the substrate.

As a preferred solution, the wavelength of the laser is mainly the wavelength that does not damage the shielding screen.

As a preferred solution, the laser is red light with a wavelength of 1064nm.

As a preferred solution, the colloid is solder paste.

As a preferred solution, the shielding shield is an integrally formed shielding cover made of aluminum, white iron or stainless steel.

Therefore, by means of the above-mentioned desoldering steps, the shielding screen that was closely connected to the substrate through the colloid, after being rapidly heated by the laser, transmits the temperature to the colloid, and after the colloid is heated and melted, the shielding screen can be absorbed, so that the substrate and the shielding screen In this way, the method of using laser desoldering is not only simple in structure, but also can accurately locate and desolder, and improve the efficiency of desoldering.

And the laser welding machine provided by the present invention is applied in the method for shielding shield welding, and described laser welding machine comprises working platform, laser device, image aligner and displacement device, wherein, operating platform is arranged on the top of displacement device, and laser device is arranged on Correspondingly above the work platform, the image aligner is set on one side of the laser.

Described desoldering method comprises the following steps:

A. Feeding: Manually or automatically place the substrate coated with colloid on the work platform, wherein the colloid is connected with a shielding screen that has not yet been bonded.

B. Positioning: Use the image aligner and shifter to position the substrate on the work platform.

C. Laser: hit the laser emitted by the laser on the shielding screen corresponding to the colloid, so that the shielding screen will transmit the temperature to the colloid. When the colloid is heated and melted, the pins of the shielding screen will be connected to the colloid and the substrate.

D. Absorption: After the colloid is cooled, the substrate, colloid and shielding screen are closely connected to each other.

As a preferred solution, the wavelength of the laser is mainly the wavelength that does not damage the shielding screen.

As a preferred solution, the laser is red light with a wavelength of 1064nm.

As a preferred solution, the colloid is solder paste.

As a preferred solution, the shielding shield is an integrally formed shielding cover made of aluminum, white iron or stainless steel.

Therefore, by means of the above soldering steps, the shielding screen, which is coated on the substrate and has not been bonded to the substrate and the gel, is rapidly heated by the laser, and the temperature is transmitted to the gel. After the gel is heated and melted, the bonding of the shielding screen The legs are then bonded to the substrate through the glue, and after the glue is cooled, the shielding shield is closely connected to the substrate and the glue. In this way, the laser welding method not only has a simple structure, but also can accurately position the welding and improve welding efficiency.

The laser welding machine of the present invention is applied to the method of desoldering or welding the shielding screen, and has the following beneficial effects:

1. The laser welding machine described in the present invention is applied to the method of desoldering or welding the shielding screen, which can not only accurately position the substrate, but also indirectly heat the colloid through the laser in a short time, and separate the substrate from the shielding screen, with a large Improve the efficiency of shielding desoldering;

2. The laser welding machine of the present invention is applied to the method of desoldering or welding the shielding screen, which can not only accurately position the substrate, but also indirectly heat the colloid through the laser in a short time, and closely bond the shielding screen to the substrate through the colloid , which greatly improves the efficiency of shield welding;

3. The laser welding machine of the present invention is applied to the method of desoldering or welding the shielding shield. The shielding shield is an integrally formed shielding cover made of aluminum, white iron or stainless steel, so that the shielding shield, the substrate and the colloid are tightly bonded after welding. There is no gap, therefore, it can effectively prevent electromagnetic wave signal interference, so as to maintain the normal operation of the circuit on the substrate.

Description of drawings

Fig. 1 is a flow chart of known surface bonding technology applied to patches;

FIG. 2 is a schematic diagram of a conventional patch bonding substrate;

FIG. 3 is a schematic diagram of a known shielding shield bonded to a substrate;

Fig. 4 is the schematic diagram of the laser welding machine of embodiment 1 of the present invention;

Fig. 5 is the flow process of the laser welding machine in Embodiment 1 of the present invention to unsolder the shielding screen;

Fig. 6 is the schematic diagram of the laser welding machine of embodiment 2 of the present invention;

Fig. 7 is a flow chart of welding the shielding shield by the laser welding machine according to Embodiment 2 of the present invention.

Explanation of reference signs

1 Surface Bonding Technology

10 preparation

11 gluing

12 patch placement

13 reflow

2 Substrate

3 Masking screen

30 patches

300 pins

31 patch cover

32 Clearance

4 solder paste

5 Laser welding machine

50 working platform

51 lasers

52 Image aligner

53 Displacer

54 extractor

6 The method of laser welding machine to unsolder the shield

60 Feeding

61 positioning

62 laser

63 absorb

7 Substrate

70 shadow screen

700 pins

71 colloid

8 Laser welding machine welding method for shielding

80 feed

81 positioning

82 laser

83 cooling.

Detailed ways

In order to facilitate a more detailed understanding of the purpose, effects and structural features of the present invention, the following preferred embodiments are listed and described in conjunction with the accompanying drawings.

Example 1

See Figure 4.

It can be seen from the figure that the laser welding machine of the present invention is applied to the method of unsoldering the shielding screen. The laser welding machine 5 includes a working platform 50, a laser 51, an image aligner 52, a displacement device 53 and an absorber 54, wherein, The working platform 50 is set above the displacement device 53 , the laser 51 is set correspondingly above the working platform 50 , the image aligner 52 is set on one side of the laser 51 , and the absorber 54 is also set on the side of the laser 51 .

Please refer to Fig. 5; the method 6 of the laser welding machine for desoldering the shield includes the following steps:

A. Feeding 60: Manually or automatically place the substrate 7 followed by the shielding screen 70 on the work platform 50, wherein the shielding screen 70 is an integrally formed shielding cover made of aluminum, white iron or stainless steel.

B. Positioning 61 : using the image aligner 52 and the shifter 53 to move forward, backward, left, and right to position the substrate 7 .

C, laser 62: the laser that the laser 51 sends out hits on the shielding screen 70 that is connected on the substrate 7, makes the shielding screen 70 conduct temperature to the colloid 71 that connects the substrate 7 and the shielding screen 70, wherein, the laser 51 emits The best laser is the red laser with a wavelength of 1064nm, and the colloid 71 is solder paste.

D. Suction 63: use the displacement device 53 to move the working platform 50 below the suction device 54, so that the suction device 54 suctions the shield 70 on the substrate 7, thereby separating the substrate 7 and the shield 70 from each other.

Therefore, when the circuit of the substrate 7 is damaged and needs to be repaired, the method 6 of desoldering the shielding shield by the above-mentioned laser welding machine can be used. Fast scanning on the shadow screen 70 makes the shadow screen 70 greatly improved in a short time, and conducts the high temperature to the colloid 71,

Make the temperature of the colloid 71 reach the melting point and melt. At this time, the absorber 54 can be used to absorb the shielding screen 70 that was originally closely attached to the substrate 7, and after the substrate 7 and the shielding screen 70 are separated, the maintenance operation of the substrate 7 can be carried out. In this way, the first embodiment of the present invention uses a laser welding machine with a simple structure to unsolder the shielding method 6, which can not only accurately position the substrate 7, but also indirectly heat the colloid 71 through the laser in a short time, and connect the substrate 7 with the The shielding shield 70 is separated, which greatly improves the efficiency of desoldering the shielding shield 70 .

Example 2

See Figure 6.

As can be seen from the figure, the difference between the laser welding machine described in Embodiment 2 of the present invention and the laser welding machine 5 of Embodiment 1 applied to shielding shield welding is that the laser welding machine 5 of Embodiment 2 will not be used for welding. Therefore, the absorber is not shown in FIG. 6 , so that the structure of the laser welding machine 5 is simplified, and only includes a working platform 50 , a laser 51 , an image alignment device 52 and a displacement device 53 .

Referring to Fig. 7, the method 8 of shielding shield welding by laser welding machine includes the following steps:

A. Feeding 80: Manually or automatically, the substrate 7 coated with the colloid 71 is placed on the work platform 50, wherein the colloid 71 is connected with the unbonded shield 70, and the shield 70 is integrally formed aluminum, Covers in white iron or stainless steel.

B. Positioning 81 : using the image aligner 52 and the shifter 53 to move forward, backward, left, and right to position the substrate 7 .

C. Laser 82: hit the laser emitted by the laser 51 on the shielding screen 70 corresponding to the colloid 71, so that the shielding screen 70 will transmit the temperature to the colloid 71. When the colloid 71 is heated and melted, the pins 700 of the shielding screen 70 will immediately The colloid 71 is bonded to the substrate 7, wherein the laser emitted by the laser 51 is preferably a red laser with a wavelength of 1064nm, and the colloid 71 is solder paste.

D. Cooling 83: After the shielding screen 70 is attached to the substrate 7, the laser is stopped immediately, and the colloid 71 is left to cool down, so that the substrate 7, colloid 71 and the shielding screen 70 are closely bonded to each other.

Therefore, when the substrate 7 is to be welded with the shielding shield 70, the glue 71 is soldered on the place where the shielding shield 70 is to be welded, using lead-free solder or leaded solder. Rapid heating on the shield 70 corresponding to the gel 71 causes the shield 70 to generate high temperature in a short time, and transmits the high temperature to the gel 71. After the gel 71 reaches the melting point and melts, the pin 700 of the shield 70 passes through the gel 71 immediately. And to join with the substrate 7, after the colloid 71 is left to cool, the shielding screen 70 is closely connected with the substrate 7 and the colloid 71, and the welding of the shielding screen 70 is completed; thus, the second embodiment of the present invention uses a laser welding machine to apply to the shielding The shield welding method 8 is not only able to precisely position the substrate 7 as in the first embodiment, but also indirectly heats the colloid 71 through the laser in a short time, and the shield 70 is closely bonded to the substrate 7 through the colloid 71, which greatly improves the shield 70 welding efficiency.

In addition, since the shielding shield 70 mentioned above is integrally formed with an aluminum, white iron or stainless steel shielding cover, the shielding shield 70, the substrate 7 and the colloid 71 are welded tightly without any gaps. Therefore, electromagnetic wave signals can be effectively prevented. Interference, to maintain the normal operation of the circuit on the substrate 7.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention.

Claims (8)

1. A laser welding machine is applied to a method for shielding shielding, wherein the laser welding machine includes a working platform, a laser, an image aligner, a displacement device and an extractor, wherein the working platform is arranged on Above the displacement device, the laser is set on the corresponding top of the working platform, the image aligner is set on the side of the laser, and the absorber is also set on the side of the laser; Described desoldering method comprises the following steps: A. Feeding: Manually or automatically place the substrate followed by the shielding screen on the working platform; B. Positioning: Use the image aligner and shifter to position the substrate on the work platform; C. Laser: hit the laser emitted by the laser on the shielding screen connected to the substrate, so that the shielding screen will conduct the temperature to the colloid connecting the substrate and the shielding screen; D. Suction: Use the displacement device to displace the work platform, so that the suction device can absorb the shielding screen on the substrate. 2. The laser welding machine as claimed in claim 1 is applied in the method for shielding desoldering, characterized in that, the laser is a red light with a wavelength of 1064nm. 3. The laser welding machine as claimed in claim 1 is used in the method of desoldering the shield, characterized in that the colloid is solder paste. 4. The laser welding machine as claimed in claim 1 is used in the method of unwelding a shield, wherein the shield is an integrally formed shield cover made of aluminum, white iron or stainless steel. 5. A laser welding machine is applied to a method for shielding shield welding, characterized in that the laser welding machine includes a working platform, a laser, an image aligner and a displacement device, wherein the working platform is arranged above the displacement device, The laser is set on the corresponding top of the work platform, and the image aligner is set on the side of the laser; Described welding method comprises the following steps: A. Feeding: Manually or automatically place the substrate coated with colloid on the work platform, wherein the colloid is connected with a shielding screen that has not yet been bonded; B. Positioning: Use the image aligner and shifter to position the substrate on the work platform; C. Laser: hit the laser emitted by the laser on the shielding screen corresponding to the colloid, so that the shielding screen will transmit the temperature to the colloid. When the colloid is heated and melted, the pins of the shielding screen will be connected to the colloid and the substrate immediately; D. Cooling: After the colloid is cooled, the substrate, colloid and shielding screen are closely connected to each other. 6. The laser welding machine as claimed in claim 5 is used in the method of desoldering or welding the shield, wherein the laser is red light with a wavelength of 1064nm. 7. The laser welding machine as claimed in claim 5 is used in a method of desoldering or welding a shield, wherein the colloid is solder paste. 8. The laser welding machine as claimed in claim 5 is used in the method of desoldering or welding the shielding shield, characterized in that the shielding shield is an integrally formed shielding cover made of aluminum, white iron or stainless steel.

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