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WO1989003123A1 - Boitier de microcircuit avec broches resistantes a la corrosion, et procede de fabrication - Google Patents

Boitier de microcircuit avec broches resistantes a la corrosion, et procede de fabrication Download PDF

Info

Publication number
WO1989003123A1
WO1989003123A1 PCT/US1988/003260 US8803260W WO8903123A1 WO 1989003123 A1 WO1989003123 A1 WO 1989003123A1 US 8803260 W US8803260 W US 8803260W WO 8903123 A1 WO8903123 A1 WO 8903123A1
Authority
WO
WIPO (PCT)
Prior art keywords
pin
boss
eyelet
microcircuit
hermetic seal
Prior art date
Application number
PCT/US1988/003260
Other languages
English (en)
Inventor
Jeremy D. Scherer
Phillips Baird
Original Assignee
Aegis, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aegis, Inc. filed Critical Aegis, Inc.
Publication of WO1989003123A1 publication Critical patent/WO1989003123A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to pins used in metal packaged microcircuits. More specifically, the present invention relates to those pins having a boss thereon to inhibit the formation of a meniscus at the exterior portion of the pin otherwise caused by hermetic sealing. Background In ormation
  • metal packaged microcircuits of the plug-in type have a generally rectangular body and round pins whose base material is made of KOVAR, a material which is a combination of nickel, iron and cobalt and is therefore readily corrodible.
  • metal packaged microcircuits are typically plated with various types of corrosion resistant finishes. Because the metal package user performs a number of operations on the metal package received from the vendor, the types of finishes that can be used to prevent corrosion must be compatible with the processing which the user performs on the packages.--
  • Typical corrosion resistant finishes used on the metal package and pins include gold, nickel, a combination of gold and nickel, silver and copper. For the most part, though, gold is the corrosion resistant finish that is used. Gold not only aids the electrical connection process of the microcircuit to the pins, but also provides a very high degree of corrosion resistance.
  • Pin 10 is shown located in the eyelet 11 of the metal package, held in place by a hermetic seal formed from glass 12.
  • metal packages are made as matched seals. The matched seals obtain their hermeticity by the wetting of molten glass to the oxides on the surface of the pin. If the pin is plated with a corrosion resistant finish, the wetting action is inhibited. Because gold does not oxidize, hermetically reliable seals cannot , be obtained with gold plated surfaces.
  • the metal ⁇ lic area of the pin where the glass seal is to be created must be free of corrosion protection, as must the interior of the eyelet where the glass-to-metal seals are made. It should be noted that materials other than glass may be used to hermetically seal the pin within the eyelet. For illustrative purposes only, the present invention is described using glass as the sealing material.
  • the pins are typically hermetically sealed to the metal package prior to any plating.
  • the glass seals are being made and the glass is molten, the glass has a high affinity to the metallic oxides on the pin surface.
  • the molten glass therefore runs along the metallic surface by cohesive action.
  • the molten glass moves along the surface of the pin, it becomes increasingly thin and finally decreases to zero thickness.
  • meniscus 13 is formed.
  • critical point 14 is formed.
  • the glass which becomes increasingly thin up to the critical point, also becomes increasingly weak.
  • the geometry of the metal packaged microcircuit is such that the geometry of eyelet 11 is relatively thick and strong relative to the glass seal.
  • the pin is usu ⁇ ally thin and relatively flexible, typically extending for a considerable distance, relative to its cross-sectional area, external to the package. Because the pins are long, they are easily flexed. This flexure is trans ⁇ mitted to the glass seal, and the glass, especially at and around the critical area, is easily chipped and cracked. Not only do small pieces of glass fall away f om the surface of the pin, but fine fissures also appear in the surface of the glass.
  • the galvanic cell results in the extremely rapid destruction of the unplated area because the ratio between plated and unplated area is rather high.
  • the rapid destruction either causes the leads to fall off, rendering the microcircuit useless, or causes the integ ⁇ rity of the leads to be so poor as to make the reliability of the package highly suspect.
  • the present invention solves the problems inherent in the prior art by including on the pin an annular boss, sometimes referred to as an upset.
  • the upset is formed on the pin at the point where the pin is to be embedded in the glass hermetic seal.
  • the upset provides a horizon ⁇ tal plane against the surface of the glass, giving substantially greater mechanical strength to the pin in the glass. Due to this greater surface area, minute cracking and chipping of the glass at the point of contact is minimized. Further, due to the upset, the flow of glass up the shaft of the pin during the hermetic sealing process is retarded, thereby avoiding the critical area and all the problems inherent therewith. Additionally, not only does the upset provide greater mechanical strength to the glass, the upset also provides a focal point for pin flexion.
  • the pin When flexion occurs, the pin will tend to bend on the outside of the hermetic seal at the juncture of the pin shaft and the upset, rather than at the interior juncture of the pin shaft and the upset. Accordingly, the upset acts as a strain relief point.
  • the pin is plated during assembly of the metal packaged microcircuit so as to avoid possible galvanic deterioration effects.
  • the portion of the pin which is to reside in the hermetic seal is masked and a preplating, preferably nickel, is applied to the unmasked portion.
  • the preplated pin is then hermeti ⁇ cally sealed in the metal packaged microcircuit and the exteriorly exposed pin portion and metal package are subsequently post-plated, preferably with gold.
  • Figure 1 illustrates the prior art configuration of a pin hermeti ⁇ cally sealed by glass in a metal package.
  • Figure 2 illustrates the preferred embodiment of the pin of the present invention embedded in a hermetic seal formed by glass. DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Pin 20 is embedded in eyelet 11 due to the hermetic seal formed by" glass 12.
  • pin 20 is inserted through the molten glass to upset 21, stop ⁇ ping at exterior surface 22 of upset 21.
  • meniscus 13 forms on the interior side of the pin (the area which will be attached to the microcircuit)
  • no meniscus is formed at the exterior surface of the her ⁇ metic seal. Due to the absence of the meniscus at the exterior of the hermetic seal, and to the substantial, relative to the cross-sectional area of the pin, horizontal plane formed by upset 21, greater mechani ⁇ cal strength is given to the pin.
  • the horizontal plane crem ⁇ ated by the upset produces a stronger seal due to the large diameter of the upset relative to the cross-sectional area of the pin.
  • the upset provide greater mechanical strength to the glass, but it also provides a point for pin flexion.
  • the pin will tend to bend on the outside of the hermetic seal at the juncture of the pin sha and the upset, rather than at the interior juncture of the pin shaft and the upset. Accordingly, upset 21 becomes a strain relief point for the pin.
  • pin 20 could be fitted with a washer whose inside diameter is substantially equal to the outside diameter of the pin.
  • pin 20 is formed from straight cut wire of KOVAR having uniform diameter. The upset is created by running the wire through a our slide. We have found that locating the upset in the hermetic seal such that its exterior portion is exposed provides the greatest mechanical strength to the pin and hermetic seal assembly while simultaneously avoiding the forma ⁇ tion of the meniscus.
  • upset 21 and exte ⁇ rior portion 23 of pin 20 are preferably preplated with a corrosion resistant material, most preferably nickel.
  • the remainder of pin 20, including the area at which the hermetic seal is to be formed, is not preplated so as not to negatively affect the hermetic glass seal.
  • Many ways are available for insuring that the preplating applied to the pin attaches only to the upset and the external length of the pin.
  • the pin could be placed in a rack and dipped to the specified depth in a plating bath.
  • the internal portion of the pin is masked, most preferably with heat shrink tubing, and the preplating is attached. After preplating, the tubing is removed. .
  • the preplated pin is then inserted into the molten glass to form the hermetic seal.
  • Glass 12 is melted, by a procedure well known to those skilled in the art, and the preplated pin is inserted into the mol ⁇ ten glass to upset 21.
  • upset 21 shields critical area 14 (also defined as that point where the preplating finish on the pin and the unplated portion of the pin meet).
  • critical area 14 also defined as that point where the preplating finish on the pin and the unplated portion of the pin meet.
  • the exposed portion of the pin and the exterior portion of the metal package is post-plated.
  • the post-plating material is a material comprising gold.
  • metal packaged microcircuits having pins according to the present invention can withstand damage to glass 12 so long as the damage does not expose any of the unplated sur ace of the pin, or otherwise destroy the integrity of the hermetic seal.
  • metal packaged microcircuits using pins of the present invention offer outstanding corrosion resistant test results using con ⁇ ventional salt spray testing procedures.
  • a second embodiment of the invention is shown in Figure 3 and comprises a washer 32 instead of upset 21.
  • Washer 32 is generally donut-shaped (but may be any desired shape) and has an inside diameter that is slightly larger than the diameter of pin 30. While the glass is still molten, washer 32 is pressed in place and molten glass is forced through the inside diameter and around the outside of washer 32. When the glass cools, therefore, washer 32 will become integral with the glass.
  • the preferred material for washer 32 is an alumina ceramic, but various materials can be utilized. The chosen material, however, should be compatible with the thermal expansion characteristics of the sealing material (i.e., compatible with glass in. the preferred embodi ⁇ ment). It should be noted that washer 32 may be attached to pin 30 by suitable means to facilitate the manu acture of the device.
  • a further embodiment is illustrated in Figure 4 and comprises a combination of washer 32 and upset 21. Utilizing both washer 32 and upset 21 has achieved excellent results since upset 21 can be used to properly position washer 32 within the molten glass. The combination of upset 21 and washer 32 has also resulted in superior strength and durability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Une broche (20) utilisée dans des boîtiers de microcircuits présente un bossage annulaire (21). Le bossage (21) est formé sur la broche (20) au point où la broche (20) doit être noyée dans le joint hermétique en verre (12). En raison de l'aire de surface plus grande du bossage (21), les petits écaillages et craquelures du verre (12) au point de contact avec la broche (20) sont réduits au minimum. En outre, en raison de la présence du bossage (21), l'écoulement de verre (12) jusqu'à la tige de la broche (20) pendant le procédé de scellement est retardé, évitant ainsi la formation d'un ménisque et de tous les problèmes inhérents à un ménisque. De plus, le bossage (21) constitue un point focal pour la flexion de la broche. Lorsque se produit la flexion, la broche (20) tend à se plier sur l'extérieur du joint hermétique (12) à la jonction de la tige de la broche et du bossage (21) plutôt que de se plier au niveau de la jonction intérieure de la tige de la broche et du bossage. Dans d'autres modes de réalisation, une rondelle annulaire en céramique (32) est utilisée à la place du bossage (21) ou en plus de ce dernier.
PCT/US1988/003260 1987-09-25 1988-09-23 Boitier de microcircuit avec broches resistantes a la corrosion, et procede de fabrication WO1989003123A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10229887A 1987-09-25 1987-09-25
US102,298 1987-09-25

Publications (1)

Publication Number Publication Date
WO1989003123A1 true WO1989003123A1 (fr) 1989-04-06

Family

ID=22289158

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1988/003260 WO1989003123A1 (fr) 1987-09-25 1988-09-23 Boitier de microcircuit avec broches resistantes a la corrosion, et procede de fabrication

Country Status (2)

Country Link
AU (1) AU2538188A (fr)
WO (1) WO1989003123A1 (fr)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291660A (en) * 1939-07-25 1942-08-04 Raytheon Production Corp Stem for electrical space discharge devices
US2292863A (en) * 1941-08-26 1942-08-11 Gen Electric Lead-in arrangement
GB567521A (en) * 1942-05-11 1945-02-19 Gen Electric Co Ltd Improvements in the sealing of electrical conductors through vitreous walls
GB629742A (en) * 1947-11-14 1949-09-27 Gen Electric Co Ltd Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
US2570683A (en) * 1946-07-12 1951-10-09 Sylvania Electric Prod Lead wire construction and method of sealing
US2699594A (en) * 1952-02-27 1955-01-18 Sylvania Electric Prod Method of assembling semiconductor units
US2955386A (en) * 1956-12-04 1960-10-11 Tung Sol Electric Inc Method of forming a seal for tubular glass enclosures
US3020456A (en) * 1959-05-05 1962-02-06 Corning Glass Works Electrical capacitors and method of production
GB928614A (en) * 1960-02-09 1963-06-12 Texas Instruments Inc Header
US3107757A (en) * 1958-11-05 1963-10-22 Gen Electric Co Ltd Glass-to-metal seals
DE1913985A1 (de) * 1969-03-19 1970-10-01 Siemens Ag Einschmelzungen mit Draehten in Glas fuer Halbleiterbauelemente
US3927841A (en) * 1974-05-09 1975-12-23 Flight Connector Corp Contact
US4103416A (en) * 1975-10-21 1978-08-01 New Nippon Electric Co., Ltd. Method of manufacturing an hermatically sealed electrical terminal
JPS56101761A (en) * 1980-01-18 1981-08-14 Nec Corp Airtight package for integrated circuit
JPS57152154A (en) * 1981-03-16 1982-09-20 Fuji Denka:Kk Structure of terminal part of air-tight sealing vessel
JPS59214244A (ja) * 1983-05-20 1984-12-04 Nec Corp 半導体装置
JPS60194547A (ja) * 1984-03-16 1985-10-03 Nec Corp 半導体装置

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291660A (en) * 1939-07-25 1942-08-04 Raytheon Production Corp Stem for electrical space discharge devices
US2292863A (en) * 1941-08-26 1942-08-11 Gen Electric Lead-in arrangement
GB567521A (en) * 1942-05-11 1945-02-19 Gen Electric Co Ltd Improvements in the sealing of electrical conductors through vitreous walls
US2570683A (en) * 1946-07-12 1951-10-09 Sylvania Electric Prod Lead wire construction and method of sealing
GB629742A (en) * 1947-11-14 1949-09-27 Gen Electric Co Ltd Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
US2699594A (en) * 1952-02-27 1955-01-18 Sylvania Electric Prod Method of assembling semiconductor units
US2955386A (en) * 1956-12-04 1960-10-11 Tung Sol Electric Inc Method of forming a seal for tubular glass enclosures
US3107757A (en) * 1958-11-05 1963-10-22 Gen Electric Co Ltd Glass-to-metal seals
US3020456A (en) * 1959-05-05 1962-02-06 Corning Glass Works Electrical capacitors and method of production
GB928614A (en) * 1960-02-09 1963-06-12 Texas Instruments Inc Header
DE1913985A1 (de) * 1969-03-19 1970-10-01 Siemens Ag Einschmelzungen mit Draehten in Glas fuer Halbleiterbauelemente
US3927841A (en) * 1974-05-09 1975-12-23 Flight Connector Corp Contact
US4103416A (en) * 1975-10-21 1978-08-01 New Nippon Electric Co., Ltd. Method of manufacturing an hermatically sealed electrical terminal
JPS56101761A (en) * 1980-01-18 1981-08-14 Nec Corp Airtight package for integrated circuit
JPS57152154A (en) * 1981-03-16 1982-09-20 Fuji Denka:Kk Structure of terminal part of air-tight sealing vessel
JPS59214244A (ja) * 1983-05-20 1984-12-04 Nec Corp 半導体装置
JPS60194547A (ja) * 1984-03-16 1985-10-03 Nec Corp 半導体装置

Also Published As

Publication number Publication date
AU2538188A (en) 1989-04-18

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