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USD997892S1 - End effector for handling wafers - Google Patents

End effector for handling wafers Download PDF

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Publication number
USD997892S1
USD997892S1 US29/735,896 US202029735896F USD997892S US D997892 S1 USD997892 S1 US D997892S1 US 202029735896 F US202029735896 F US 202029735896F US D997892 S USD997892 S US D997892S
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US
United States
Prior art keywords
end effector
handling wafers
handling
wafers
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/735,896
Inventor
Satoshi Aizawa
Tetsuya Marubayashi
Kiyoaki YAMADA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AIZAWA, SATOSHI, MARUBAYASHI, TETSUYA, YAMADA, KIYOAKI
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FIG. 1 is a front, bottom and right side perspective view of an end effector for handling wafers showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2 ; and,
FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 2 .
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an end effector for handling wafers, as shown and described.
US29/735,896 2019-11-28 2020-05-26 End effector for handling wafers Active USD997892S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP026361/2019 2019-11-28
JPD2019-26361F JP1665227S (en) 2019-11-28 2019-11-28

Publications (1)

Publication Number Publication Date
USD997892S1 true USD997892S1 (en) 2023-09-05

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Application Number Title Priority Date Filing Date
US29/735,896 Active USD997892S1 (en) 2019-11-28 2020-05-26 End effector for handling wafers

Country Status (3)

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US (1) USD997892S1 (en)
JP (1) JP1665227S (en)
TW (1) TWD211239S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1059452S1 (en) * 2022-10-13 2025-01-28 Mitsubishi Electric Corporation Gripper for robot

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD234282S (en) 2022-05-02 2024-10-21 美商蘭姆研究公司 (美國) Processing chamber purge plate
TWD228828S (en) 2023-03-23 2023-12-01 復泰科技股份有限公司 Wafer carrier
TWD234110S (en) 2023-04-10 2024-10-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 (荷蘭) End effector

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
US4417757A (en) * 1981-11-09 1983-11-29 Morrison Thomas R Recording disc handling device
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
US5622400A (en) * 1995-06-07 1997-04-22 Karl Suss America, Inc. Apparatus and method for handling semiconductor wafers
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
USD398207S (en) * 1997-06-13 1998-09-15 Nippon Light Metal Company Ltd. Disc holding tool
US5810935A (en) * 1994-12-06 1998-09-22 Electronics And Telecommunications Research Institute Apparatus for transferring a wafer
US6089630A (en) * 1997-12-27 2000-07-18 Nsk Ltd. Substrate transfer apparatus
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6183026B1 (en) * 1999-04-07 2001-02-06 Gasonics International Corporation End effector
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6409453B1 (en) * 1998-02-18 2002-06-25 Applied Materials, Inc. End effector for wafer handler in processing system
US6578893B2 (en) * 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US7644968B2 (en) * 2004-01-23 2010-01-12 Kawasaki Jukogyo Kabushiki Kaisha Substrate holding device
USD614152S1 (en) * 2008-07-21 2010-04-20 Asm Genitech Korea, Ltd. Substrate transfer device for semiconductor deposition apparatus
US8182009B2 (en) * 2008-03-13 2012-05-22 Xyratex Technology, Ltd. End effector
USD673923S1 (en) * 2011-01-20 2013-01-08 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
US8764085B2 (en) * 2012-10-19 2014-07-01 Sinfonia Technology Co., Ltd. Clamping device and workpiece conveying robot
US9349643B2 (en) * 2013-04-01 2016-05-24 Brewer Science Inc. Apparatus and method for thin wafer transfer
US9524897B2 (en) * 2012-04-09 2016-12-20 Semiconductor Technologies & Instruments Pte Ltd End handler for film and film frames and a method thereof
US9536764B2 (en) * 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
US9776333B2 (en) * 2015-11-24 2017-10-03 Hirata Corporation Hand member and hand
US10109515B2 (en) * 2016-03-31 2018-10-23 Hirata Corporation Hand unit and transfer method
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Patent Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417757A (en) * 1981-11-09 1983-11-29 Morrison Thomas R Recording disc handling device
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
US5810935A (en) * 1994-12-06 1998-09-22 Electronics And Telecommunications Research Institute Apparatus for transferring a wafer
US5622400A (en) * 1995-06-07 1997-04-22 Karl Suss America, Inc. Apparatus and method for handling semiconductor wafers
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
USD398207S (en) * 1997-06-13 1998-09-15 Nippon Light Metal Company Ltd. Disc holding tool
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6089630A (en) * 1997-12-27 2000-07-18 Nsk Ltd. Substrate transfer apparatus
US6409453B1 (en) * 1998-02-18 2002-06-25 Applied Materials, Inc. End effector for wafer handler in processing system
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6183026B1 (en) * 1999-04-07 2001-02-06 Gasonics International Corporation End effector
US6578893B2 (en) * 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
US7644968B2 (en) * 2004-01-23 2010-01-12 Kawasaki Jukogyo Kabushiki Kaisha Substrate holding device
US8182009B2 (en) * 2008-03-13 2012-05-22 Xyratex Technology, Ltd. End effector
USD614152S1 (en) * 2008-07-21 2010-04-20 Asm Genitech Korea, Ltd. Substrate transfer device for semiconductor deposition apparatus
USD673923S1 (en) * 2011-01-20 2013-01-08 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
US9524897B2 (en) * 2012-04-09 2016-12-20 Semiconductor Technologies & Instruments Pte Ltd End handler for film and film frames and a method thereof
US8764085B2 (en) * 2012-10-19 2014-07-01 Sinfonia Technology Co., Ltd. Clamping device and workpiece conveying robot
US9349643B2 (en) * 2013-04-01 2016-05-24 Brewer Science Inc. Apparatus and method for thin wafer transfer
US9536764B2 (en) * 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
US9776333B2 (en) * 2015-11-24 2017-10-03 Hirata Corporation Hand member and hand
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
US10109515B2 (en) * 2016-03-31 2018-10-23 Hirata Corporation Hand unit and transfer method
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
End Effectors for Advanced Wafer Processing & Wafer Handling,https://innoventtech.com/products/end-effectors/,Copyright © 2023 Innovent (Year: 2023). *
TEL Tokyo Electron ESCX10-350810-11 Robot Wafer End Effector New Surplus, https://www.ebay.com/itm/174097404372?chn=ps&norover=1&mkevt=1&mkrid=711-117182-37290-0&mkcid=2&mkscid=101&itemid=174097404372&targetid=1263094004546&device=c&mktype=&googleloc=9059726&poi=&campaignid=14859008593&mkgroupid, 2023. (Year: 2023). *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1059452S1 (en) * 2022-10-13 2025-01-28 Mitsubishi Electric Corporation Gripper for robot

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TWD211239S (en) 2021-05-01
JP1665227S (en) 2020-08-03

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