USD920937S1 - Power module device containing semiconductor elements - Google Patents
Power module device containing semiconductor elements Download PDFInfo
- Publication number
- USD920937S1 USD920937S1 US35/355,085 US35508564F USD920937S US D920937 S1 USD920937 S1 US D920937S1 US 35508564 F US35508564 F US 35508564F US D920937 S USD920937 S US D920937S
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- US
- United States
- Prior art keywords
- power module
- semiconductor elements
- device containing
- module device
- containing semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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1. Power module device containing semiconductor elements
The broken lines showing portions of the power module device containing semiconductor elements form no part of the claim.
This article is a power module device containing semiconductor elements; this product is used to control and/or supply electric power.
Claims (1)
- The ornamental design for a power module device containing semiconductor elements, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35/355,085 USD920937S1 (en) | 2019-03-29 | 2019-03-29 | Power module device containing semiconductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35/355,085 USD920937S1 (en) | 2019-03-29 | 2019-03-29 | Power module device containing semiconductor elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD920937S1 true USD920937S1 (en) | 2021-06-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US35/355,085 Active USD920937S1 (en) | 2019-03-29 | 2019-03-29 | Power module device containing semiconductor elements |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD920937S1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD954667S1 (en) * | 2017-01-13 | 2022-06-14 | Wolfspeed, Inc. | Power module |
| USD1034490S1 (en) * | 2022-05-09 | 2024-07-09 | Shenzhen Deruisi Electronic Technology Co., Ltd. | Bracket for heat sink of CPU |
| USD1036395S1 (en) | 2018-09-12 | 2024-07-23 | Wolfspeed, Inc. | Power module |
| USD1046799S1 (en) * | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10103096B2 (en) * | 2016-03-11 | 2018-10-16 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
| US20180367054A1 (en) * | 2017-06-19 | 2018-12-20 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
| US10276466B2 (en) * | 2015-05-29 | 2019-04-30 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device and semiconductor device mounting method |
| USD847104S1 (en) * | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
| USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
| USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
| USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
| USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| US10615092B2 (en) * | 2017-02-20 | 2020-04-07 | Shindengen Electric Manufacturing Co., Ltd. | Electronic device |
| USD883241S1 (en) * | 2018-06-04 | 2020-05-05 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| USD883240S1 (en) * | 2008-09-18 | 2020-05-05 | Advanced Powertrain Engineering, Llc | Printed circuit for an automatic transmission solenoid module |
| USD886072S1 (en) * | 2017-06-30 | 2020-06-02 | Tenka Inc. | Circuit cube |
| USD887999S1 (en) * | 2018-10-17 | 2020-06-23 | Oupiin Electronic (Kunshan) Co., Ltd | Circuit board with zigzag routes |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD889423S1 (en) * | 2018-12-03 | 2020-07-07 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| US10770439B2 (en) * | 2017-02-13 | 2020-09-08 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module |
| US10818496B2 (en) * | 2017-11-01 | 2020-10-27 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device having crystal defects and method of manufacturing the semiconductor device having crystal defects |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| US10832994B2 (en) * | 2016-12-13 | 2020-11-10 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module |
| USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
| USD903612S1 (en) * | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD904991S1 (en) * | 2019-03-15 | 2020-12-15 | Tamura Corporation | Semiconductor element |
-
2019
- 2019-03-29 US US35/355,085 patent/USD920937S1/en active Active
Patent Citations (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD883240S1 (en) * | 2008-09-18 | 2020-05-05 | Advanced Powertrain Engineering, Llc | Printed circuit for an automatic transmission solenoid module |
| US10276466B2 (en) * | 2015-05-29 | 2019-04-30 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device and semiconductor device mounting method |
| US10103096B2 (en) * | 2016-03-11 | 2018-10-16 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
| US10832994B2 (en) * | 2016-12-13 | 2020-11-10 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module |
| USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
| USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
| USD875058S1 (en) * | 2017-01-05 | 2020-02-11 | Rohm Co., Ltd. | Power semiconductor module |
| US10770439B2 (en) * | 2017-02-13 | 2020-09-08 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module |
| US10615092B2 (en) * | 2017-02-20 | 2020-04-07 | Shindengen Electric Manufacturing Co., Ltd. | Electronic device |
| USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
| US20180367054A1 (en) * | 2017-06-19 | 2018-12-20 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
| USD886072S1 (en) * | 2017-06-30 | 2020-06-02 | Tenka Inc. | Circuit cube |
| USD847104S1 (en) * | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
| USD873227S1 (en) * | 2017-10-23 | 2020-01-21 | Mitsubishi Electric Corporation | Semiconductor device |
| USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| US10818496B2 (en) * | 2017-11-01 | 2020-10-27 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device having crystal defects and method of manufacturing the semiconductor device having crystal defects |
| USD883241S1 (en) * | 2018-06-04 | 2020-05-05 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| USD892754S1 (en) * | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) * | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD887999S1 (en) * | 2018-10-17 | 2020-06-23 | Oupiin Electronic (Kunshan) Co., Ltd | Circuit board with zigzag routes |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| USD889423S1 (en) * | 2018-12-03 | 2020-07-07 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| USD904991S1 (en) * | 2019-03-15 | 2020-12-15 | Tamura Corporation | Semiconductor element |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD903612S1 (en) * | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD954667S1 (en) * | 2017-01-13 | 2022-06-14 | Wolfspeed, Inc. | Power module |
| USD1036395S1 (en) | 2018-09-12 | 2024-07-23 | Wolfspeed, Inc. | Power module |
| USD1046799S1 (en) * | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| USD1034490S1 (en) * | 2022-05-09 | 2024-07-09 | Shenzhen Deruisi Electronic Technology Co., Ltd. | Bracket for heat sink of CPU |
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| FEPP | Fee payment procedure |
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