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USD853978S1 - High-performance semiconductor module - Google Patents

High-performance semiconductor module Download PDF

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Publication number
USD853978S1
USD853978S1 US29/615,038 US201729615038F USD853978S US D853978 S1 USD853978 S1 US D853978S1 US 201729615038 F US201729615038 F US 201729615038F US D853978 S USD853978 S US D853978S
Authority
US
United States
Prior art keywords
semiconductor module
performance semiconductor
performance
view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/615,038
Inventor
Thomas Auer
Andras Bertalan
Jens Krugmann
Christoph Messelke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AUER, THOMAS, BERTALAN, ANDRAS, KRUGMANN, JENS, Messelke, Christoph
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Publication of USD853978S1 publication Critical patent/USD853978S1/en
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Description

FIG. 1 is a top, front and right side perspective view of a high-performance semiconductor module showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front side elevational view thereof;
FIG. 4 is a right side elevational view thereof; and,
FIG. 5 is a top plan view thereof.
The broken line portions of the figure drawings are included to show portions of the article that form no part of the claimed design.
All surfaces not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a high-performance semiconductor module, as shown and described.
US29/615,038 2017-02-28 2017-08-25 High-performance semiconductor module Active USD853978S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EM003772235-0001 2017-02-28
EM37722350001 2017-02-28

Publications (1)

Publication Number Publication Date
USD853978S1 true USD853978S1 (en) 2019-07-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/615,038 Active USD853978S1 (en) 2017-02-28 2017-08-25 High-performance semiconductor module

Country Status (1)

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US (1) USD853978S1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875058S1 (en) * 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module
USD889423S1 (en) * 2018-12-03 2020-07-07 Semikron Elektronik Gmbh & Co. Kg Power module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1046799S1 (en) * 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1053824S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053814S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053822S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053823S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053825S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Citations (25)

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US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875058S1 (en) * 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD1046799S1 (en) * 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD889423S1 (en) * 2018-12-03 2020-07-07 Semikron Elektronik Gmbh & Co. Kg Power module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD1053824S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053814S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053822S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053823S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1053825S1 (en) * 2022-07-15 2024-12-10 Japan Aviation Electronics Industry, Limited Connector
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

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