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USD827588S1 - Chip connector - Google Patents

Chip connector Download PDF

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Publication number
USD827588S1
USD827588S1 US29/589,012 US201629589012F USD827588S US D827588 S1 USD827588 S1 US D827588S1 US 201629589012 F US201629589012 F US 201629589012F US D827588 S USD827588 S US D827588S
Authority
US
United States
Prior art keywords
chip connector
chip
connector
design
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/589,012
Inventor
Yoshitsugu Sakai
Masaaki Abe
Ichiro Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to US29/589,012 priority Critical patent/USD827588S1/en
Assigned to SONY CORPORATION reassignment SONY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ABE, MASAAKI, SAKAI, YOSHITSUGU
Application granted granted Critical
Publication of USD827588S1 publication Critical patent/USD827588S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a chip connector showing our new design;
FIG. 2 is a front elevational view thereof; and,
FIG. 3 is an enlarged partial front elevational view cut along the line 3-3 of FIG. 2.
The broken lines illustrating chip connector portions are unclaimed portions thereof and form no part of the claimed design. The dot-dash broken lines define the boundaries of, but are not included in, the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a chip connector, as shown and described.
US29/589,012 2016-12-27 2016-12-27 Chip connector Active USD827588S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/589,012 USD827588S1 (en) 2016-12-27 2016-12-27 Chip connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/589,012 USD827588S1 (en) 2016-12-27 2016-12-27 Chip connector

Publications (1)

Publication Number Publication Date
USD827588S1 true USD827588S1 (en) 2018-09-04

Family

ID=63294682

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/589,012 Active USD827588S1 (en) 2016-12-27 2016-12-27 Chip connector

Country Status (1)

Country Link
US (1) USD827588S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Citations (29)

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US4171559A (en) * 1976-10-21 1979-10-23 Stratoflex, Inc. Method of making connections in pneumatic and hydraulic systems and testing such systems
USD295282S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
US4951709A (en) * 1988-11-01 1990-08-28 Komatsu Dresser Company Hydraulic system and manifold assembly
US5640995A (en) * 1995-03-14 1997-06-24 Baxter International Inc. Electrofluidic standard module and custom circuit board assembly
USD404721S (en) * 1997-08-07 1999-01-26 Echelon Corporation Electrical housing with module
USD412699S (en) * 1998-06-11 1999-08-10 Chiu-Shan Lee Electrical adapter
USD425890S (en) 1998-11-20 2000-05-30 Sony Corporation Tape player and recorder combined with radio receiver
US6209928B1 (en) * 1998-06-04 2001-04-03 The Regents Of The University Of California Microfluidic interconnects
USD463403S1 (en) 2001-06-08 2002-09-24 Sony Corporation Remote controller
US6548895B1 (en) * 2001-02-21 2003-04-15 Sandia Corporation Packaging of electro-microfluidic devices
USD478558S1 (en) * 2002-11-18 2003-08-19 Carey N. Sparks Protective enclosure for a security switch
USD512691S1 (en) 2003-08-28 2005-12-13 Sony Corporation Remote controller
US7004198B1 (en) * 2004-07-20 2006-02-28 Sandia Corporation Micro-fluidic interconnect
US7017792B2 (en) * 2001-02-02 2006-03-28 Mitsubishi Heavy Industries, Ltd. Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same
USD550213S1 (en) 2006-01-10 2007-09-04 Sony Corporation Remote controller
USD563324S1 (en) * 2005-10-25 2008-03-04 Gen-Tran Corporation Housing for a transfer switch
USD574338S1 (en) * 2007-03-29 2008-08-05 Luminus Devices, Inc. LED assembly
US7694854B2 (en) * 2001-10-29 2010-04-13 Nordson Corporation Hot melt adhesive system having centralized manifold and zone heating capability
US20100252239A1 (en) * 2009-04-01 2010-10-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and method for manufacturing the same
USD630591S1 (en) * 2010-04-21 2011-01-11 Ojmar, S.A. Housing
US20130213449A1 (en) * 2012-02-20 2013-08-22 Marlow Industries, Inc. Thermoelectric plate and frame exchanger
USD694721S1 (en) * 2012-05-07 2013-12-03 Tseng Jyi Peng Heatsink
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
USD729750S1 (en) * 2013-06-13 2015-05-19 Yu-Syuan Chen Heat sink of lamp
US9180232B2 (en) * 2006-05-19 2015-11-10 Novartis Ag Surgical system having manifolds with integral pneumatic accumulators
USD788038S1 (en) * 2015-08-21 2017-05-30 Hitachi Kokusai Electric Inc. Heat insulating unit for substrate processing apparatus
USD798252S1 (en) * 2015-11-05 2017-09-26 Alexandros John Vourkoutiotis Pole mounted surveillance enclosure
US9791080B2 (en) * 2012-03-12 2017-10-17 Idex Health & Science Llc Microfluidic interconnect
USD802543S1 (en) * 2010-11-03 2017-11-14 Enermax Technology Corporation Cooling fin

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4171559A (en) * 1976-10-21 1979-10-23 Stratoflex, Inc. Method of making connections in pneumatic and hydraulic systems and testing such systems
USD295282S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
US4951709A (en) * 1988-11-01 1990-08-28 Komatsu Dresser Company Hydraulic system and manifold assembly
US5640995A (en) * 1995-03-14 1997-06-24 Baxter International Inc. Electrofluidic standard module and custom circuit board assembly
USD404721S (en) * 1997-08-07 1999-01-26 Echelon Corporation Electrical housing with module
US6209928B1 (en) * 1998-06-04 2001-04-03 The Regents Of The University Of California Microfluidic interconnects
USD412699S (en) * 1998-06-11 1999-08-10 Chiu-Shan Lee Electrical adapter
USD425890S (en) 1998-11-20 2000-05-30 Sony Corporation Tape player and recorder combined with radio receiver
US7017792B2 (en) * 2001-02-02 2006-03-28 Mitsubishi Heavy Industries, Ltd. Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same
US6548895B1 (en) * 2001-02-21 2003-04-15 Sandia Corporation Packaging of electro-microfluidic devices
USD463403S1 (en) 2001-06-08 2002-09-24 Sony Corporation Remote controller
US7694854B2 (en) * 2001-10-29 2010-04-13 Nordson Corporation Hot melt adhesive system having centralized manifold and zone heating capability
USD478558S1 (en) * 2002-11-18 2003-08-19 Carey N. Sparks Protective enclosure for a security switch
USD512691S1 (en) 2003-08-28 2005-12-13 Sony Corporation Remote controller
US7004198B1 (en) * 2004-07-20 2006-02-28 Sandia Corporation Micro-fluidic interconnect
USD563324S1 (en) * 2005-10-25 2008-03-04 Gen-Tran Corporation Housing for a transfer switch
USD550213S1 (en) 2006-01-10 2007-09-04 Sony Corporation Remote controller
US9180232B2 (en) * 2006-05-19 2015-11-10 Novartis Ag Surgical system having manifolds with integral pneumatic accumulators
USD574338S1 (en) * 2007-03-29 2008-08-05 Luminus Devices, Inc. LED assembly
US20100252239A1 (en) * 2009-04-01 2010-10-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and method for manufacturing the same
USD630591S1 (en) * 2010-04-21 2011-01-11 Ojmar, S.A. Housing
USD802543S1 (en) * 2010-11-03 2017-11-14 Enermax Technology Corporation Cooling fin
US20130213449A1 (en) * 2012-02-20 2013-08-22 Marlow Industries, Inc. Thermoelectric plate and frame exchanger
US9791080B2 (en) * 2012-03-12 2017-10-17 Idex Health & Science Llc Microfluidic interconnect
USD694721S1 (en) * 2012-05-07 2013-12-03 Tseng Jyi Peng Heatsink
USD729750S1 (en) * 2013-06-13 2015-05-19 Yu-Syuan Chen Heat sink of lamp
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
USD788038S1 (en) * 2015-08-21 2017-05-30 Hitachi Kokusai Electric Inc. Heat insulating unit for substrate processing apparatus
USD798252S1 (en) * 2015-11-05 2017-09-26 Alexandros John Vourkoutiotis Pole mounted surveillance enclosure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IOPScinence, "A simple add-on microfluidic appliance for accurately sorting small populations of cells with high fidelity", Published Oct. 9, 2013. (http://iopscience.iop.org/article/10.1088/0960-1317/23/11/117003). *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

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