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USD802543S1 - Cooling fin - Google Patents

Cooling fin Download PDF

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Publication number
USD802543S1
USD802543S1 US29/556,581 US201629556581F USD802543S US D802543 S1 USD802543 S1 US D802543S1 US 201629556581 F US201629556581 F US 201629556581F US D802543 S USD802543 S US D802543S
Authority
US
United States
Prior art keywords
cooling fin
view
fin
cooling
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/556,581
Inventor
Jer-Sheng HWANG
Sheam-Chyun Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enermax Technology Corp
Original Assignee
Enermax Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enermax Technology Corp filed Critical Enermax Technology Corp
Priority to US29/556,581 priority Critical patent/USD802543S1/en
Application granted granted Critical
Publication of USD802543S1 publication Critical patent/USD802543S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F28F1/325—Fins with openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

FIG. 1 is a perspective view of a cooling fin showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a cooling fin, as shown and described.
US29/556,581 2010-11-03 2016-03-01 Cooling fin Active USD802543S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/556,581 USD802543S1 (en) 2010-11-03 2016-03-01 Cooling fin

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW099221252U TWM403012U (en) 2010-11-03 2010-11-03 Heat dissipating device having swirl generator
US13/106,938 US20120103572A1 (en) 2010-11-03 2011-05-13 Heat dissipating apparatus with vortex generator
US29/556,581 USD802543S1 (en) 2010-11-03 2016-03-01 Cooling fin

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US13/106,938 Continuation US20120103572A1 (en) 2010-11-03 2011-05-13 Heat dissipating apparatus with vortex generator

Publications (1)

Publication Number Publication Date
USD802543S1 true USD802543S1 (en) 2017-11-14

Family

ID=43829294

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/106,938 Abandoned US20120103572A1 (en) 2010-11-03 2011-05-13 Heat dissipating apparatus with vortex generator
US29/556,581 Active USD802543S1 (en) 2010-11-03 2016-03-01 Cooling fin

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US13/106,938 Abandoned US20120103572A1 (en) 2010-11-03 2011-05-13 Heat dissipating apparatus with vortex generator

Country Status (4)

Country Link
US (2) US20120103572A1 (en)
JP (1) JP3167993U (en)
DE (1) DE202011002064U1 (en)
TW (1) TWM403012U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
USD827588S1 (en) * 2016-12-27 2018-09-04 Sony Corporation Chip connector
USD906268S1 (en) * 2018-09-11 2020-12-29 Rheem Manufacturing Company Heat exchanger fin

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM403012U (en) * 2010-11-03 2011-05-01 Enermax Tech Corporation Heat dissipating device having swirl generator
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
KR20160139094A (en) * 2015-05-26 2016-12-07 엘에스산전 주식회사 Closed cabinet for electric device having heat pipe
WO2018174153A1 (en) * 2017-03-24 2018-09-27 パナソニックＩｐマネジメント株式会社 Heat-dissipation device and power generation device
US10739832B2 (en) * 2018-10-12 2020-08-11 International Business Machines Corporation Airflow projection for heat transfer device
TWI736460B (en) * 2020-10-30 2021-08-11 華擎科技股份有限公司 Heat dissipation fin and heat dissipation module
TWI812136B (en) * 2022-03-31 2023-08-11 宏碁股份有限公司 Electronic device, heat dissipation assembly, and thermal fin thereof
CN220357540U (en) * 2023-06-19 2024-01-16 惠州市讯硕科技有限公司 Radiator with fins with restarting boundary layer heat radiation effect

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6578627B1 (en) * 2001-12-28 2003-06-17 Industrial Technology Research Institute Pattern with ribbed vortex generator
US20040194936A1 (en) * 2001-08-10 2004-10-07 Kahoru Torii Heat transfer device
US20060231241A1 (en) * 2005-04-18 2006-10-19 Papapanu Steven J Evaporator with aerodynamic first dimples to suppress whistling noise
US20060266500A1 (en) * 2005-05-29 2006-11-30 Tong-Hua Lin Heat dissipating apparatus
USD597497S1 (en) * 2007-10-26 2009-08-04 Delta Electronics Inc. Heat dissipating module
US20110024088A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
US20110155351A1 (en) * 2009-12-30 2011-06-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20120103572A1 (en) * 2010-11-03 2012-05-03 Enermax Technology Corporation Heat dissipating apparatus with vortex generator
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD699690S1 (en) * 2013-03-29 2014-02-18 Silverstone Technology Co., Ltd. Cooling fin
US20140138074A1 (en) * 2012-11-16 2014-05-22 Tsung-Hsien Huang Heat sink module
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US20150359138A1 (en) * 2014-06-10 2015-12-10 Wistron Corporation Detachable guiding mechanism and related electronic device
US20170075394A1 (en) * 2015-09-10 2017-03-16 Cooler Master Technology Inc. Heat sink assembly and fan and fan module thereof

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US1853315A (en) * 1925-09-25 1932-04-12 Modine Mfg Co Radiator
HU181538B (en) * 1980-03-11 1983-10-28 Energiagazdalkodasi Intezet Turbulent heat exchanger
US4817709A (en) * 1987-12-02 1989-04-04 Carrier Corporation Ramp wing enhanced plate fin
JPH07293232A (en) * 1994-04-21 1995-11-07 Nippon Soken Inc Metallic catalyst support for purifying exhaust gas
US5730214A (en) * 1997-01-16 1998-03-24 General Motors Corporation Heat exchanger cooling fin with varying louver angle
US20030024687A1 (en) * 2001-07-31 2003-02-06 Cheng Chung Pin Radiation fin set for heat sink
US20070051502A1 (en) * 2004-05-19 2007-03-08 Showa Denko K.K. Heat exchanger fin, heat exchanger, condensers, and evaporators
JP4982870B2 (en) * 2005-12-28 2012-07-25 国立大学法人横浜国立大学 Heat transfer device
EP2006629A2 (en) * 2006-03-23 2008-12-24 Panasonic Corporation Fin-tube heat exchanger, fin for heat exchanger, and heat pump device
CN101427094B (en) * 2006-04-21 2012-07-18 松下电器产业株式会社 Heat transmission fin and fin-tube heat exchanger
KR100821180B1 (en) * 2006-11-28 2008-04-14 현대모비스 주식회사 Heat sink fin for heat exchanger
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
CN101641005B (en) * 2008-07-31 2011-08-31 富准精密工业(深圳)有限公司 Radiating device
US7961462B2 (en) * 2009-05-28 2011-06-14 Alcatel Lucent Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components
CN201488626U (en) * 2009-07-09 2010-05-26 跃腾科技股份有限公司 Heat pipe type radiating fin capable of generating vortex

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040194936A1 (en) * 2001-08-10 2004-10-07 Kahoru Torii Heat transfer device
US6578627B1 (en) * 2001-12-28 2003-06-17 Industrial Technology Research Institute Pattern with ribbed vortex generator
US20060231241A1 (en) * 2005-04-18 2006-10-19 Papapanu Steven J Evaporator with aerodynamic first dimples to suppress whistling noise
US20060266500A1 (en) * 2005-05-29 2006-11-30 Tong-Hua Lin Heat dissipating apparatus
USD597497S1 (en) * 2007-10-26 2009-08-04 Delta Electronics Inc. Heat dissipating module
US20110024088A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same
US20110155351A1 (en) * 2009-12-30 2011-06-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20120103572A1 (en) * 2010-11-03 2012-05-03 Enermax Technology Corporation Heat dissipating apparatus with vortex generator
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
US20140138074A1 (en) * 2012-11-16 2014-05-22 Tsung-Hsien Huang Heat sink module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD699690S1 (en) * 2013-03-29 2014-02-18 Silverstone Technology Co., Ltd. Cooling fin
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US20150359138A1 (en) * 2014-06-10 2015-12-10 Wistron Corporation Detachable guiding mechanism and related electronic device
US20170075394A1 (en) * 2015-09-10 2017-03-16 Cooler Master Technology Inc. Heat sink assembly and fan and fan module thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
USD827588S1 (en) * 2016-12-27 2018-09-04 Sony Corporation Chip connector
USD906268S1 (en) * 2018-09-11 2020-12-29 Rheem Manufacturing Company Heat exchanger fin

Also Published As

Publication number Publication date
US20120103572A1 (en) 2012-05-03
TWM403012U (en) 2011-05-01
JP3167993U (en) 2011-05-26
DE202011002064U1 (en) 2011-03-31

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