[go: up one dir, main page]

USD679842S1 - High brightness LED package - Google Patents

High brightness LED package Download PDF

Info

Publication number
USD679842S1
USD679842S1 US29/382,394 US201129382394F USD679842S US D679842 S1 USD679842 S1 US D679842S1 US 201129382394 F US201129382394 F US 201129382394F US D679842 S USD679842 S US D679842S
Authority
US
United States
Prior art keywords
high brightness
led package
brightness led
view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/382,394
Inventor
Sung Chul Joo
Christopher P. Hussell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47999745&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=USD679842(S1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/382,394 priority Critical patent/USD679842S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUSSELL, CHRISTOPHER P., JOO, SUNG CHUL
Priority to US13/462,450 priority patent/US8610140B2/en
Priority to US29/451,761 priority patent/USD704358S1/en
Application granted granted Critical
Publication of USD679842S1 publication Critical patent/USD679842S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of an high brightness LED package showing our design;
FIG. 2 is a side view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a side view thereof opposite the view of FIG. 2;
FIG. 5 is a bottom view thereof opposite the view of FIG. 3;
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The dashed broken lines are for illustrative purposes only and form no part of the claimed design. The dot-dash broken lines represent boundaries of the claimed design. None of the broken lines form part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a high brightness LED package, as shown and described.
US29/382,394 2010-12-15 2011-01-03 High brightness LED package Active USD679842S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/382,394 USD679842S1 (en) 2011-01-03 2011-01-03 High brightness LED package
US13/462,450 US8610140B2 (en) 2010-12-15 2012-05-02 Light emitting diode (LED) packages, systems, devices and related methods
US29/451,761 USD704358S1 (en) 2011-01-03 2013-04-08 High brightness LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/382,394 USD679842S1 (en) 2011-01-03 2011-01-03 High brightness LED package

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US12/969,267 Continuation-In-Part US8686445B1 (en) 2009-06-05 2010-12-15 Solid state lighting devices and methods
US13/367,929 Continuation-In-Part US11101408B2 (en) 2010-12-15 2012-02-07 Components and methods for light emitting diode (LED) lighting

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/362,683 Continuation-In-Part US9859471B2 (en) 2010-12-15 2012-01-31 High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US29/451,761 Division USD704358S1 (en) 2011-01-03 2013-04-08 High brightness LED package

Publications (1)

Publication Number Publication Date
USD679842S1 true USD679842S1 (en) 2013-04-09

Family

ID=47999745

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/382,394 Active USD679842S1 (en) 2010-12-15 2011-01-03 High brightness LED package
US29/451,761 Active USD704358S1 (en) 2011-01-03 2013-04-08 High brightness LED package

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/451,761 Active USD704358S1 (en) 2011-01-03 2013-04-08 High brightness LED package

Country Status (1)

Country Link
US (2) USD679842S1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD1052791S1 (en) * 2021-12-31 2024-11-26 Foshan Nationstar Optoelectronics Co., Ltd. Light emitting diode lead-frame

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738027S1 (en) * 2013-11-18 2015-09-01 Koninklijke Philips N.V. Illuminated OLED panel
USD731214S1 (en) * 2014-01-15 2015-06-09 Winston Products Llc Merchandising containers for vehicle lights
USD731825S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD731826S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD796076S1 (en) 2014-12-22 2017-08-29 Lunera Lighting Inc. Horizontal LED lamp
USD793001S1 (en) * 2015-12-24 2017-07-25 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD793618S1 (en) * 2015-12-24 2017-08-01 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD795492S1 (en) * 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD793002S1 (en) * 2015-12-24 2017-07-25 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD827876S1 (en) * 2016-12-22 2018-09-04 Luxrobo Lamp module for electronic device
JP1592827S (en) * 2017-06-15 2017-12-11
USD923206S1 (en) * 2020-09-23 2021-06-22 Ganzhou Shangjie Technology Co., Ltd. LED light
USD944444S1 (en) * 2021-01-10 2022-02-22 Xtreme Inc. Reflector
USD1094859S1 (en) * 2022-12-22 2025-09-23 Hangzhou Hpwinner Opto Corporation LED lead frame
USD1102202S1 (en) * 2024-05-13 2025-11-18 Crate3D Modular display case

Citations (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679118A (en) 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
USRE34861E (en) 1987-10-26 1995-02-14 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5506446A (en) 1994-04-14 1996-04-09 Olin Corporation Electronic package having improved wire bonding capability
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US20010045640A1 (en) 1997-02-10 2001-11-29 Seishi Oida Resin-molded semiconductor device and method for manufacturing the same
US20020004251A1 (en) 1999-03-15 2002-01-10 Roberts John K. Method of making a semiconductor radiation emitter package
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US20040075100A1 (en) 2001-04-10 2004-04-22 Georg Bogner Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20040126913A1 (en) 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US6936855B1 (en) 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
US6943433B2 (en) 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
USD514073S1 (en) 2003-07-09 2006-01-31 Nichai Corporation Light emitting diode
US20060118808A1 (en) 2003-03-14 2006-06-08 Sumitomo Electric Industries, Ltd. Semiconductor device
US20060157726A1 (en) 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7081661B2 (en) 2001-03-16 2006-07-25 Matsushita Electric Industrial Co., Ltd. High-frequency module and method for manufacturing the same
US20060186418A1 (en) 2004-05-18 2006-08-24 Edmond John A External extraction light emitting diode based upon crystallographic faceted surfaces
US20060220050A1 (en) 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US20070052074A1 (en) 2005-09-08 2007-03-08 Sharp Kabushiki Kaisha Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
US20070057364A1 (en) 2005-09-01 2007-03-15 Wang Carl B Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US20070075325A1 (en) 2005-10-04 2007-04-05 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
US20070114514A1 (en) 2005-11-21 2007-05-24 Sharp Kabushiki Kaisha Light emitting device
US7224047B2 (en) 2004-12-18 2007-05-29 Lsi Corporation Semiconductor device package with reduced leakage
US20080006837A1 (en) 2006-07-07 2008-01-10 Lg Electronics Inc. And Lg Innotek Co., Ltd Sub-mount for mounting light emitting device and light emitting device package
US20080023722A1 (en) 2006-07-28 2008-01-31 Delta Electronics, Inc. Light-emitting heat-dissipating device and packaging method thereof
USD566055S1 (en) 2006-09-21 2008-04-08 Lg Innotek Co., Ltd. Light-emitting diode (LED)
US7361940B2 (en) 2004-12-16 2008-04-22 Seoul Semiconductor Co., Ltd. Leadframe and packaged light emitting diode
US7400049B2 (en) 2006-02-16 2008-07-15 Stats Chippac Ltd. Integrated circuit package system with heat sink
USD573113S1 (en) 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
USD573114S1 (en) 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20080185605A1 (en) 2007-01-15 2008-08-07 Citizen Electronics Co., Ltd. Light-emitting diode and method for producing it
US7429790B2 (en) 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
US20080258162A1 (en) 2007-04-17 2008-10-23 Koung Chia-Yin Package for a high-power light emitting diode
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
USD580375S1 (en) 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a two-pin light emitting diode device
US20080278941A1 (en) 2007-05-07 2008-11-13 Philips Solid-State Lighting Solutions, Inc. Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
USD580891S1 (en) 2007-07-20 2008-11-18 Alti-Electronics Co. Ltd. Light emitting diode
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US20080290353A1 (en) 2007-05-24 2008-11-27 Medendorp Jr Nicholas W Microscale optoelectronic device packages
US7462870B2 (en) 2003-06-20 2008-12-09 Nichia Corporation Molded package and semiconductor device using molded package
US20090008662A1 (en) 2007-07-05 2009-01-08 Ian Ashdown Lighting device package
US20090101921A1 (en) 2007-10-17 2009-04-23 Tai-Sol Electronics Co., Ltd. LED and thermal conductivity device combination assembly
USD594827S1 (en) 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US20090159905A1 (en) 2007-12-24 2009-06-25 Kuei-Fang Chen Light Emitting Assembly
USD595675S1 (en) 2008-09-24 2009-07-07 Harvatek Corporation Light emitting diode
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US20090189178A1 (en) 2006-06-30 2009-07-30 Do Hyung Kim Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method
USD597968S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD597971S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
US7592638B2 (en) 2005-10-19 2009-09-22 Lg Innotek Co., Ltd. Light emitting diode package
US20090267085A1 (en) 2005-03-11 2009-10-29 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US20090321779A1 (en) 2005-11-25 2009-12-31 Samsung Electro-Mechanics Co., Ltd. Side view light emitting diode package
US20100059783A1 (en) 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation
USD614592S1 (en) 2008-08-28 2010-04-27 Cree, Inc. Light emitting diode
US20100102345A1 (en) 2007-04-19 2010-04-29 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US7719024B2 (en) 2006-05-10 2010-05-18 Nichia Corporation Semiconductor light emitting device and a method for producing the same
US20100133578A1 (en) 2009-08-04 2010-06-03 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
US20100133554A1 (en) 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
US20100155748A1 (en) 2009-01-14 2010-06-24 Cree Hong Kong Limited Aligned multiple emitter package
US20100163887A1 (en) 2008-12-31 2010-07-01 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same
US20100181582A1 (en) 2009-01-22 2010-07-22 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
USD621799S1 (en) 2009-01-12 2010-08-17 Cree, Inc. Light emitting diode
USD621798S1 (en) 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
USD622680S1 (en) 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD626095S1 (en) 2009-12-11 2010-10-26 Everlight Electronics Co., Ltd. Light emitting diode
US20100270577A1 (en) 2007-07-23 2010-10-28 Dsm Ip Assets B.V. Plastic component for a lighting systems
USD627310S1 (en) 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD628541S1 (en) 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
US20110006658A1 (en) 2009-07-07 2011-01-13 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
USD632267S1 (en) 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
US20110031865A1 (en) 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
USD632659S1 (en) 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD634286S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634284S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634285S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634716S1 (en) * 2009-08-06 2011-03-22 Toshiba Lighting & Technology Corporation Light emitting diode illumination device
USD641719S1 (en) 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US20110186873A1 (en) 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
USD648686S1 (en) 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
USD658599S1 (en) * 2010-03-26 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
US20120127720A1 (en) 2010-06-28 2012-05-24 Hussell Christopher P Light emitting devices and methods
US20120153317A1 (en) 2009-06-05 2012-06-21 Emerson David T Light emitting diode (led) devices, systems, and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6877780B2 (en) 2000-06-23 2005-04-12 Breeze-Torca Products, Llc Clamp for joining tubular bodies
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7852015B1 (en) 2006-10-11 2010-12-14 SemiLEDs Optoelectronics Co., Ltd. Solid state lighting system and maintenance method therein
JP4341693B2 (en) 2007-05-16 2009-10-07 ウシオ電機株式会社 LED element and manufacturing method thereof
US7566159B2 (en) 2007-05-31 2009-07-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Side-emitting LED package with improved heat dissipation
US8354992B2 (en) 2007-07-13 2013-01-15 Tte Indianapolis Appearance improvement for zone backlit LCD displays
EP2207993A4 (en) 2007-11-08 2013-09-04 Innovations In Optics Inc Led illumination system
CN101510581B (en) 2009-03-19 2011-06-29 旭丽电子(广州)有限公司 Light-emitting diodes and their associated backlight modules
EP3573432A3 (en) 2009-05-28 2020-02-12 Lynk Labs, Inc. Multi-voltage and multi-brigthness led lighting devices and methods of using
KR101114150B1 (en) 2009-10-19 2012-03-09 엘지이노텍 주식회사 Light emitting element
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
WO2012109225A1 (en) 2011-02-07 2012-08-16 Cree, Inc. Components and methods for light emitting diode (led) lighting

Patent Citations (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679118A (en) 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
USRE34861E (en) 1987-10-26 1995-02-14 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5506446A (en) 1994-04-14 1996-04-09 Olin Corporation Electronic package having improved wire bonding capability
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US20010045640A1 (en) 1997-02-10 2001-11-29 Seishi Oida Resin-molded semiconductor device and method for manufacturing the same
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US20020004251A1 (en) 1999-03-15 2002-01-10 Roberts John K. Method of making a semiconductor radiation emitter package
US6828170B2 (en) 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US7081661B2 (en) 2001-03-16 2006-07-25 Matsushita Electric Industrial Co., Ltd. High-frequency module and method for manufacturing the same
US20040075100A1 (en) 2001-04-10 2004-04-22 Georg Bogner Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
US6936855B1 (en) 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
US6943433B2 (en) 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US20040126913A1 (en) 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US20060118808A1 (en) 2003-03-14 2006-06-08 Sumitomo Electric Industries, Ltd. Semiconductor device
US7462870B2 (en) 2003-06-20 2008-12-09 Nichia Corporation Molded package and semiconductor device using molded package
USD514073S1 (en) 2003-07-09 2006-01-31 Nichai Corporation Light emitting diode
US20060220050A1 (en) 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US20060186418A1 (en) 2004-05-18 2006-08-24 Edmond John A External extraction light emitting diode based upon crystallographic faceted surfaces
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7361940B2 (en) 2004-12-16 2008-04-22 Seoul Semiconductor Co., Ltd. Leadframe and packaged light emitting diode
US7224047B2 (en) 2004-12-18 2007-05-29 Lsi Corporation Semiconductor device package with reduced leakage
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US20060157726A1 (en) 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US20090267085A1 (en) 2005-03-11 2009-10-29 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US20070057364A1 (en) 2005-09-01 2007-03-15 Wang Carl B Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US20070052074A1 (en) 2005-09-08 2007-03-08 Sharp Kabushiki Kaisha Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
US20070075325A1 (en) 2005-10-04 2007-04-05 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
US7592638B2 (en) 2005-10-19 2009-09-22 Lg Innotek Co., Ltd. Light emitting diode package
US7429790B2 (en) 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
US20070114514A1 (en) 2005-11-21 2007-05-24 Sharp Kabushiki Kaisha Light emitting device
US20090321779A1 (en) 2005-11-25 2009-12-31 Samsung Electro-Mechanics Co., Ltd. Side view light emitting diode package
USD573113S1 (en) 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
USD580381S1 (en) 2005-12-09 2008-11-11 Nichia Corporation Light emitting diode
USD598400S1 (en) 2005-12-09 2009-08-18 Nichia Corporation Light emitting diode
USD584699S1 (en) 2005-12-09 2009-01-13 Nichia Corporation Light emitting diode
US7400049B2 (en) 2006-02-16 2008-07-15 Stats Chippac Ltd. Integrated circuit package system with heat sink
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
US7719024B2 (en) 2006-05-10 2010-05-18 Nichia Corporation Semiconductor light emitting device and a method for producing the same
US20090189178A1 (en) 2006-06-30 2009-07-30 Do Hyung Kim Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method
US20080006837A1 (en) 2006-07-07 2008-01-10 Lg Electronics Inc. And Lg Innotek Co., Ltd Sub-mount for mounting light emitting device and light emitting device package
US20080023722A1 (en) 2006-07-28 2008-01-31 Delta Electronics, Inc. Light-emitting heat-dissipating device and packaging method thereof
USD566055S1 (en) 2006-09-21 2008-04-08 Lg Innotek Co., Ltd. Light-emitting diode (LED)
USD580375S1 (en) 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a two-pin light emitting diode device
USD594827S1 (en) 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US20080185605A1 (en) 2007-01-15 2008-08-07 Citizen Electronics Co., Ltd. Light-emitting diode and method for producing it
US20080258162A1 (en) 2007-04-17 2008-10-23 Koung Chia-Yin Package for a high-power light emitting diode
US20100102345A1 (en) 2007-04-19 2010-04-29 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
USD573114S1 (en) 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20080278941A1 (en) 2007-05-07 2008-11-13 Philips Solid-State Lighting Solutions, Inc. Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
US20080290353A1 (en) 2007-05-24 2008-11-27 Medendorp Jr Nicholas W Microscale optoelectronic device packages
US20090008662A1 (en) 2007-07-05 2009-01-08 Ian Ashdown Lighting device package
USD580891S1 (en) 2007-07-20 2008-11-18 Alti-Electronics Co. Ltd. Light emitting diode
US20100270577A1 (en) 2007-07-23 2010-10-28 Dsm Ip Assets B.V. Plastic component for a lighting systems
US20090101921A1 (en) 2007-10-17 2009-04-23 Tai-Sol Electronics Co., Ltd. LED and thermal conductivity device combination assembly
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20090159905A1 (en) 2007-12-24 2009-06-25 Kuei-Fang Chen Light Emitting Assembly
USD597971S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD597968S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD614592S1 (en) 2008-08-28 2010-04-27 Cree, Inc. Light emitting diode
USD621798S1 (en) 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
US20100059783A1 (en) 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation
USD595675S1 (en) 2008-09-24 2009-07-07 Harvatek Corporation Light emitting diode
US20100163887A1 (en) 2008-12-31 2010-07-01 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same
USD621799S1 (en) 2009-01-12 2010-08-17 Cree, Inc. Light emitting diode
USD635527S1 (en) 2009-01-12 2011-04-05 Cree, Inc. Light emitting diode
US20110031865A1 (en) 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20100155748A1 (en) 2009-01-14 2010-06-24 Cree Hong Kong Limited Aligned multiple emitter package
US20100181582A1 (en) 2009-01-22 2010-07-22 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
US20110180827A1 (en) 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
US20120153317A1 (en) 2009-06-05 2012-06-21 Emerson David T Light emitting diode (led) devices, systems, and methods
USD661264S1 (en) 2009-06-05 2012-06-05 Cree, Inc. Light emiting device package
US20110186873A1 (en) 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD641719S1 (en) 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US20100133554A1 (en) 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
US20110006658A1 (en) 2009-07-07 2011-01-13 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
US20100133578A1 (en) 2009-08-04 2010-06-03 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
USD634716S1 (en) * 2009-08-06 2011-03-22 Toshiba Lighting & Technology Corporation Light emitting diode illumination device
USD632659S1 (en) 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD627310S1 (en) 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD622680S1 (en) 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD626095S1 (en) 2009-12-11 2010-10-26 Everlight Electronics Co., Ltd. Light emitting diode
USD634285S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634284S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634286S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD632267S1 (en) 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
USD658599S1 (en) * 2010-03-26 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD648686S1 (en) 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD659657S1 (en) 2010-04-30 2012-05-15 Cree, Inc. Light emitting diode (LED) package
USD628541S1 (en) 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
US20120127720A1 (en) 2010-06-28 2012-05-24 Hussell Christopher P Light emitting devices and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting

Non-Patent Citations (77)

* Cited by examiner, † Cited by third party
Title
Certificate of Design Patent for Application No. 2011/015199 dated Dec. 9, 2011.
Certificate of Design Patent for Application No. 2011/015200 dated Jan. 6, 2012.
Certificate of Design Patent for Application No. 2011/015201 dated Jan. 6, 2012.
Certificate of Design Patent for Application Serial No. CN ZL 201030577293 dated Jun. 11, 2012.
Certificate of Design Patent for Application Serial No. CN ZL 201130210595 dated Jun. 11, 2012.
Certificate of Design Patent for Chinese Application Serial No. CN ZL 201130171313 dated May 7, 2012.
Certificate of Registration for Community Design Application Serial No. 001283600-0001-0003 dated Jan. 7, 2011.
Communication of European publication number and information on the application of Article 67(3) EPC dated Mar. 14, 2012.
Co-pending U.S. Appl. No. 12/498,856, filed Jul. 7, 2009.
Description Model No. NS6G083 issued by Nichia Corporation—at least as early as Aug. 31, 2007.
Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007.
Hyun-Ho Kim et al., Thermal Transient Characteristics of Die Attach in High Power LED PKG, Microelectronics Reliability, vol. 48, Issue 3, Mar. 2008, pp. 445-454.
International Preliminary Report on Patentability for PCT Application Serial No. PCT/US2010/035379 dated Dec. 8, 2011.
International Search Report and Written Opinion for Application Serial No. PCT/US2011/054560 dated May 22, 2012.
International Search Report and Written Opinion for Application Serial No. PCT/US2012/024122 dated Jul. 11, 2012.
International Search Report and Written Opinion for Application Serial No. PCT/US2012/036110 dated Oct. 4, 2012.
International Search Report and Written Opinion for Application Serial. No. PCT/US2012/021879 dated Sep. 21, 2012.
International Search Report and Written Opinion for PCT Application Serial No. PCT/US2011/043539 dated Oct. 28, 2011.
International Search Report and Written Opinion for PCT Application Serial No. PCT/US2011/41833 dated Oct. 24, 2011.
International Search Report for Application Serial No. PCT/US2012/023285 dated Jun. 27, 2012.
International Search Report for Application Serial No. TW 100305347 dated Mar. 5, 2012.
International Search Report/VVritten Opinion dated Jan. 5, 2011 for PCT/US2010/035379.
Japanese Notice of Allowance for Application Serial No. JP 2011-017747 dated Mar. 13, 2012.
Japanese Office Action for JP2010-026185 dated Apr. 5, 2011.
Korean Office Action for Application Serial No. KR 30-2010-0047049 dated Sep. 12, 2012.
Korean Office Action for Application Serial No. KR 30-2011-27243 dated Jul. 5, 2012.
Korean Office Action for Application Serial No. KR 30-2011-27244 dated Jul. 5, 2012.
Korean Office Action for Application Serial No. KR 30-2011-27245 dated Jul. 5, 2012.
Non-Final Office Action for Korean Application Serial No. KR 30/2010-0047048 dated Dec. 15, 2011.
Non-Final Office Action for Korean Application Serial No. KR 30/2010-0047049 dated Dec. 15, 2011.
Non-Final Office Action for U.S. Appl. No. 12/479,318 dated Jun. 2, 2010.
Non-final Office Action for U.S. Appl. No. 12/479,318 dated Nov. 10, 2010.
Non-Final Office Action for U.S. Appl. No. 12/853,812 dated Dec. 7, 2011.
Non-Final Office Action for U.S. Appl. No. 13/082,699 dated Apr. 13, 2012.
Notice of Allowance for Chinese Application Serial No. CN 2011/30171313.0 dated Dec. 6, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015199 dated Nov. 10, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015200 dated Nov. 30, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015201 dated Nov. 30, 2011.
Notice of Allowance for Japanese Design Appl. No. 2010-026186 dated Mar. 29, 2011.
Notice of Allowance for Taiwanese Application Serial No. TW 099305566 dated Dec. 5, 2011.
Notice of Allowance for U.S. Appl. No. 12/479,318 dated Feb. 17, 2011.
Notice of Allowance for U.S. Appl. No. 12/853,812 dated May 21, 2012.
Notice of Allowance for U.S. Appl. No. 29/338,186 dated Mar. 10, 2011.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Aug. 24, 2010.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Nov. 26, 2010.
Notice of Allowance for U.S. Appl. No. 29/360,791 dated Apr. 12, 2011.
Notice of Allowance for U.S. Appl. No. 29/360,791 dated Dec. 22, 2010.
Notice of Allowance for U.S. Appl. No. 29/360,791 dated Jul. 21, 2011.
Notice of Allowance for U.S. Appl. No. 29/365,939 dated Apr. 12, 2011.
Notice of Allowance for U.S. Appl. No. 29/365,939 dated Dec. 27, 2010.
Notice of Allowance for U.S. Appl. No. 29/380,549 dated Jul. 28, 2011.
Notice of Allowance for U.S. Appl. No. 29/397,017 dated Dec. 9, 2011.
Notice of Allowance for U.S. Appl. No. 29/397,017 dated May 17, 2012.
Notice of Allowance for U.S. Appl. No. 29/401,692 dated Jan. 20, 2012.
Notice of Allowance for U.S. Appl. No. 29/403,433 dated Feb. 2, 2012.
Notice of Allowance from U.S. Appl. No. 29/330,657 dated Sep. 25, 2009.
Notice of Allowance from U.S. Appl. No. 29/338,186 dated Apr. 16, 2010.
Notification of Grant for Chinese Application Serial No. CN 2010-305787293.2 dated Jan. 19, 2012.
Notification of Grant for Chinese Application Serial No. CN 2011/30210595.0 dated Jan. 17, 2012.
Notification of Publication for Serial No. PCT/US2012/023285 dated Aug. 9, 2012.
Notification of Publication for Serial No. PCT/US2012/024122 dated Aug. 16, 2012.
Office Action with Restriction/Election Requirement for U.S. Appl. No. 12/853,812 dated Sep. 22, 2011.
Related CIP U.S. Appl. No. 12/969,267, filed Dec. 15, 2010 (Filed With Non-publication Request).
Related U.S. Appl. No. 29/365,939, filed Jul. 16, 2010.
Related U.S. Appl. No. 29/382,394, filed Jan. 3, 2011.
Supplemental Notice of Allowability for U.S. Appl. No. 12/479,318 dated Apr. 5, 2011.
Supplemental Notice of Allowance for U.S. Appl. No. 29/338,186 dated May 20, 2011.
Supplemental Notice of Allowance for U.S. Appl. No. 29/353,652 dated Dec. 8, 2010.
Supplemental Notice of Allowance for U.S. Appl. No. 29/360,791 dated Jan. 24, 2011.
Supplemental Notice of Allowance for U.S. Appl. No. 29/397,017 dated Jul. 23, 2012.
Taiwanese Office Action for Appl. No. 099305566 dated Jul. 12, 2011.
U.S. Appl. No. 12/853,812, filed Aug. 10, 2010.
U.S. Appl. No. 13/011,609, filed Jan. 21, 2011.
U.S. Appl. No. 29/338,186, filed Jun. 5, 2009.
U.S. Appl. No. 29/353,652, filed Jan. 12, 2010.
U.S. Appl. No. 29/360,791, filed Apr. 30, 2010.
U.S. Appl. No. 61/404,985, filed Oct. 13, 2010.

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD1052791S1 (en) * 2021-12-31 2024-11-26 Foshan Nationstar Optoelectronics Co., Ltd. Light emitting diode lead-frame

Also Published As

Publication number Publication date
USD704358S1 (en) 2014-05-06

Similar Documents

Publication Publication Date Title
USD704358S1 (en) High brightness LED package
USD734506S1 (en) LED bulb
USD664274S1 (en) LED light
USD704360S1 (en) LED bulb
USD639662S1 (en) Package
USD735901S1 (en) Frosted LED bulb
USD691973S1 (en) Lamp packages
USD639996S1 (en) Ceiling-type lighting fixture
USD686496S1 (en) Capsule
USD679990S1 (en) Packaging
USD689209S1 (en) Lamp packages
USD746240S1 (en) LED package
USD672480S1 (en) Luminaire
USD646409S1 (en) Light bulb
USD704154S1 (en) Light emitter package
USD726357S1 (en) Lantern
USD673126S1 (en) LED chip
USD691569S1 (en) LED chip
USD627494S1 (en) LED bulb
USD688820S1 (en) LED lamp
USD728130S1 (en) Light bulb
USD686581S1 (en) LED package
USD689210S1 (en) Lamp packages
USD713565S1 (en) LED lamp
USD687185S1 (en) Hairband with snap ornamentation