[go: up one dir, main page]

USD659657S1 - Light emitting diode (LED) package - Google Patents

Light emitting diode (LED) package Download PDF

Info

Publication number
USD659657S1
USD659657S1 US29/401,692 US201129401692F USD659657S US D659657 S1 USD659657 S1 US D659657S1 US 201129401692 F US201129401692 F US 201129401692F US D659657 S USD659657 S US D659657S
Authority
US
United States
Prior art keywords
led
package
light emitting
emitting diode
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/401,692
Inventor
Christopher P. Hussell
Shuying Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/401,692 priority Critical patent/USD659657S1/en
Application granted granted Critical
Publication of USD659657S1 publication Critical patent/USD659657S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5473—
    • H10W90/756—

Description

FIG. 1 is a top perspective view of an LED package showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a top end view thereof;
FIG. 4 is an opposing bottom end view thereof;
FIG. 5 is a bottom view thereof opposite the view of FIG. 2;
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof; and,
FIG. 8 is a back perspective view thereof.
The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29/401,692 2010-04-30 2011-09-14 Light emitting diode (LED) package Active USD659657S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/401,692 USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/360,791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package
US29/401,692 USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/360,791 Division USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
USD659657S1 true USD659657S1 (en) 2012-05-15

Family

ID=44907302

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/360,791 Expired - Lifetime USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package
US29/401,692 Active USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/360,791 Expired - Lifetime USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package

Country Status (2)

Country Link
US (2) USD648686S1 (en)
TW (2) TWD148144S1 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
USD691100S1 (en) * 2011-03-02 2013-10-08 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
TWD204008S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
TWD204009S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD648686S1 (en) 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
USD1052791S1 (en) * 2021-12-31 2024-11-26 Foshan Nationstar Optoelectronics Co., Ltd. Light emitting diode lead-frame

Citations (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679118A (en) 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US20010045640A1 (en) 1997-02-10 2001-11-29 Seishi Oida Resin-molded semiconductor device and method for manufacturing the same
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US6828170B2 (en) 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US6936855B1 (en) 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
US6943433B2 (en) 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
USD514073S1 (en) 2003-07-09 2006-01-31 Nichai Corporation Light emitting diode
US20060157726A1 (en) 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7081661B2 (en) 2001-03-16 2006-07-25 Matsushita Electric Industrial Co., Ltd. High-frequency module and method for manufacturing the same
US20060175716A1 (en) 2003-06-20 2006-08-10 Shintaro Nakashima Molded package and semiconductor device using molded package
US20060220050A1 (en) 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US20070052074A1 (en) 2005-09-08 2007-03-08 Sharp Kabushiki Kaisha Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
US20070075325A1 (en) 2005-10-04 2007-04-05 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
US7224047B2 (en) 2004-12-18 2007-05-29 Lsi Corporation Semiconductor device package with reduced leakage
US20080006837A1 (en) 2006-07-07 2008-01-10 Lg Electronics Inc. And Lg Innotek Co., Ltd Sub-mount for mounting light emitting device and light emitting device package
USD566055S1 (en) 2006-09-21 2008-04-08 Lg Innotek Co., Ltd. Light-emitting diode (LED)
JP2008091792A (en) 2006-10-04 2008-04-17 Nichia Chem Ind Ltd Semiconductor device
JP2008103480A (en) 2006-10-18 2008-05-01 Toyoda Gosei Co Ltd Light emitting device
US7400049B2 (en) 2006-02-16 2008-07-15 Stats Chippac Ltd. Integrated circuit package system with heat sink
USD573113S1 (en) 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
USD573114S1 (en) 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20080185605A1 (en) 2007-01-15 2008-08-07 Citizen Electronics Co., Ltd. Light-emitting diode and method for producing it
US7429790B2 (en) 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
US20080258162A1 (en) 2007-04-17 2008-10-23 Koung Chia-Yin Package for a high-power light emitting diode
USD580375S1 (en) 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a two-pin light emitting diode device
US20080278941A1 (en) 2007-05-07 2008-11-13 Philips Solid-State Lighting Solutions, Inc. Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
USD580891S1 (en) 2007-07-20 2008-11-18 Alti-Electronics Co. Ltd. Light emitting diode
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US20080290353A1 (en) 2007-05-24 2008-11-27 Medendorp Jr Nicholas W Microscale optoelectronic device packages
USD594827S1 (en) 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US20090159905A1 (en) 2007-12-24 2009-06-25 Kuei-Fang Chen Light Emitting Assembly
USD595675S1 (en) 2008-09-24 2009-07-07 Harvatek Corporation Light emitting diode
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US20090189178A1 (en) 2006-06-30 2009-07-30 Do Hyung Kim Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method
USD597971S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD597968S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
US7592638B2 (en) 2005-10-19 2009-09-22 Lg Innotek Co., Ltd. Light emitting diode package
US20100059783A1 (en) 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
USD614592S1 (en) 2008-08-28 2010-04-27 Cree, Inc. Light emitting diode
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US7719024B2 (en) 2006-05-10 2010-05-18 Nichia Corporation Semiconductor light emitting device and a method for producing the same
US20100133554A1 (en) 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
US20100133578A1 (en) 2009-08-04 2010-06-03 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
US20100155748A1 (en) 2009-01-14 2010-06-24 Cree Hong Kong Limited Aligned multiple emitter package
USD621799S1 (en) 2009-01-12 2010-08-17 Cree, Inc. Light emitting diode
USD621798S1 (en) 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
USD622680S1 (en) 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD626095S1 (en) 2009-12-11 2010-10-26 Everlight Electronics Co., Ltd. Light emitting diode
USD627310S1 (en) 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD628541S1 (en) 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
US20110006658A1 (en) 2009-07-07 2011-01-13 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
USD632267S1 (en) 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
US20110031865A1 (en) 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
USD632659S1 (en) 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD634286S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634284S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634285S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD641719S1 (en) * 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US20110186873A1 (en) 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
USD648686S1 (en) 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6877780B2 (en) 2000-06-23 2005-04-12 Breeze-Torca Products, Llc Clamp for joining tubular bodies

Patent Citations (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679118A (en) 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US20010045640A1 (en) 1997-02-10 2001-11-29 Seishi Oida Resin-molded semiconductor device and method for manufacturing the same
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US6828170B2 (en) 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US7081661B2 (en) 2001-03-16 2006-07-25 Matsushita Electric Industrial Co., Ltd. High-frequency module and method for manufacturing the same
US6936855B1 (en) 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
US6943433B2 (en) 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US20060175716A1 (en) 2003-06-20 2006-08-10 Shintaro Nakashima Molded package and semiconductor device using molded package
US7462870B2 (en) 2003-06-20 2008-12-09 Nichia Corporation Molded package and semiconductor device using molded package
USD514073S1 (en) 2003-07-09 2006-01-31 Nichai Corporation Light emitting diode
US20060220050A1 (en) 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7224047B2 (en) 2004-12-18 2007-05-29 Lsi Corporation Semiconductor device package with reduced leakage
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US20060157726A1 (en) 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US20070052074A1 (en) 2005-09-08 2007-03-08 Sharp Kabushiki Kaisha Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
US20070075325A1 (en) 2005-10-04 2007-04-05 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
US7592638B2 (en) 2005-10-19 2009-09-22 Lg Innotek Co., Ltd. Light emitting diode package
US7429790B2 (en) 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
USD598400S1 (en) 2005-12-09 2009-08-18 Nichia Corporation Light emitting diode
USD573113S1 (en) 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
USD584699S1 (en) 2005-12-09 2009-01-13 Nichia Corporation Light emitting diode
USD580381S1 (en) 2005-12-09 2008-11-11 Nichia Corporation Light emitting diode
US7400049B2 (en) 2006-02-16 2008-07-15 Stats Chippac Ltd. Integrated circuit package system with heat sink
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
US7719024B2 (en) 2006-05-10 2010-05-18 Nichia Corporation Semiconductor light emitting device and a method for producing the same
US20090189178A1 (en) 2006-06-30 2009-07-30 Do Hyung Kim Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method
US20080006837A1 (en) 2006-07-07 2008-01-10 Lg Electronics Inc. And Lg Innotek Co., Ltd Sub-mount for mounting light emitting device and light emitting device package
USD566055S1 (en) 2006-09-21 2008-04-08 Lg Innotek Co., Ltd. Light-emitting diode (LED)
JP2008091792A (en) 2006-10-04 2008-04-17 Nichia Chem Ind Ltd Semiconductor device
USD580375S1 (en) 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a two-pin light emitting diode device
JP2008103480A (en) 2006-10-18 2008-05-01 Toyoda Gosei Co Ltd Light emitting device
USD594827S1 (en) 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US20080185605A1 (en) 2007-01-15 2008-08-07 Citizen Electronics Co., Ltd. Light-emitting diode and method for producing it
US20080258162A1 (en) 2007-04-17 2008-10-23 Koung Chia-Yin Package for a high-power light emitting diode
USD573114S1 (en) 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20080278941A1 (en) 2007-05-07 2008-11-13 Philips Solid-State Lighting Solutions, Inc. Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
US20080290353A1 (en) 2007-05-24 2008-11-27 Medendorp Jr Nicholas W Microscale optoelectronic device packages
USD580891S1 (en) 2007-07-20 2008-11-18 Alti-Electronics Co. Ltd. Light emitting diode
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20090159905A1 (en) 2007-12-24 2009-06-25 Kuei-Fang Chen Light Emitting Assembly
USD597968S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD597971S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD614592S1 (en) 2008-08-28 2010-04-27 Cree, Inc. Light emitting diode
USD621798S1 (en) 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
US20100059783A1 (en) 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation
USD595675S1 (en) 2008-09-24 2009-07-07 Harvatek Corporation Light emitting diode
USD635527S1 (en) 2009-01-12 2011-04-05 Cree, Inc. Light emitting diode
US20110031865A1 (en) 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
USD621799S1 (en) 2009-01-12 2010-08-17 Cree, Inc. Light emitting diode
US20100155748A1 (en) 2009-01-14 2010-06-24 Cree Hong Kong Limited Aligned multiple emitter package
US20100133554A1 (en) 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
US20110186873A1 (en) 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US20110180827A1 (en) 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
USD641719S1 (en) * 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US20110006658A1 (en) 2009-07-07 2011-01-13 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
US20100133578A1 (en) 2009-08-04 2010-06-03 Cree Led Lighting Solutions, Inc. Solid state lighting device with improved heatsink
USD632659S1 (en) 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD627310S1 (en) 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD622680S1 (en) 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD626095S1 (en) 2009-12-11 2010-10-26 Everlight Electronics Co., Ltd. Light emitting diode
USD634286S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634284S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634285S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD632267S1 (en) 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
USD648686S1 (en) 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD628541S1 (en) 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting

Non-Patent Citations (44)

* Cited by examiner, † Cited by third party
Title
Certificate of Registration for Community Design Application Serial No. 001283600-0001-0003 dated Jan. 7, 2011.
Description Model No. NS6G083 issued by Nichia Corporation—at least as early as Aug. 31, 2007.
Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007.
International Preliminary Report on Patentability for PCT Application Serial No. PCT/US2010/035379 dated Dec. 8, 2011.
International Search Report and Written Opinion for PCT Serial No. PCT/US2011/043539 dated Oct. 28, 2011.
International Search Report and Written Opinion for PCT Serial No. PCT/US2011/41833 dated Oct. 24, 2011.
International Search Report/Written Opinion dated Jan. 5, 2011 for PCT/US2010/035379.
Japanese Office Action for JP2010-026185 dated Apr. 5, 2011.
Non-Final Office Action for Korean Application Serial No. KR 30-2010-0047048 dated Jan. 2, 2012.
Non-Final Office Action for Korean Application Serial No. KR 30-2010-0047049 dated Jan. 2, 2012.
Non-Final Office Action for U.S. Appl. No. 12/479,318, dated Jun. 2, 2010.
Non-final Office Action for U.S. Appl. No. 12/479,318, dated Nov. 10, 2010.
Non-Final Office Action for U.S. Appl. No. 12/853,812 dated Dec. 7, 2011.
Notice of Allowance dated Apr. 16, 2010 from U.S. Appl. No. 29/338,186.
Notice of Allowance for Chinese Application Serial No. CN 2011/30171313.0 dated Dec. 6, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015199 dated Nov. 10, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015200 dated Nov. 30, 2011.
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015201 dated Nov. 30, 2011.
Notice of Allowance for Japanese Design Appl. No. 2010-026186 dated Mar. 29, 2011.
Notice of Allowance for Taiwanese Application Serial No. TW 099305566 dated Dec. 5, 2011.
Notice of Allowance for U.S. Appl. No. 12/479,318, dated Feb. 17, 2011.
Notice of Allowance for U.S. Appl. No. 29/338,186, dated Mar. 10, 2011.
Notice of Allowance for U.S. Appl. No. 29/353,652, dated Aug. 24, 2010.
Notice of Allowance for U.S. Appl. No. 29/353,652, dated Nov. 26, 2010.
Notice of Allowance for U.S. Appl. No. 29/360,791 dated Jul. 21, 2011.
Notice of Allowance for U.S. Appl. No. 29/360,791, dated Apr. 12, 2011.
Notice of Allowance for U.S. Appl. No. 29/360,791, dated Dec. 22, 2010.
Notice of Allowance for U.S. Appl. No. 29/365,939, dated Apr. 12, 2011.
Notice of Allowance for U.S. Appl. No. 29/365,939, dated Dec. 27, 2010.
Notice of Allowance for U.S. Appl. No. 29/380,549 dated Jul. 28, 2011.
Notice of Allowance for U.S. Appl. No. 29/397,017 dated Dec. 9, 2011.
Office Action with Restriction/Election Requirement for U.S. Appl. No. 12/853,812 dated Sep. 22, 2011.
Related CIP U.S. Appl. No. 12/969,267, filed Dec. 15, 2010 entitled "Solid State Lighting Devices and Methods" (Filed With Non-Publication Request).
Related U.S. Appl. No. 29/365,939, filed Jul. 16, 2010.
Related U.S. Appl. No. 29/382,394, filed Jan. 3, 2011.
Supplemental Notice of Allowability for U.S. Appl. No. 12/479,318, dated Apr. 5, 2011.
Supplemental Notice of Allowance for U.S. Appl. No. 29/338,186, dated May 20, 2011.
Supplemental Notice of Allowance for U.S. Appl. No. 29/353,652, dated Dec. 8, 2010.
Supplemental Notice of Allowance for U.S. Appl. No. 29/360,791, dated Jan. 24, 2011.
Taiwanese Office Action for Appl. No. 099305566 dated Jul. 12, 2011.
U.S. Appl. No. 12/853,812, filed Aug. 10, 2010.
U.S. Appl. No. 13/011,609, filed Jan. 21, 2011.
U.S. Appl. No. 29/360,791, filed Apr. 30, 2010.
U.S. Appl. No. 61/404,985, filed Oct. 13, 2010.

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
USD708156S1 (en) 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD691100S1 (en) * 2011-03-02 2013-10-08 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US10962199B2 (en) 2015-04-30 2021-03-30 Cree, Inc. Solid state lighting components
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
TWD204008S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
TWD204009S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device

Also Published As

Publication number Publication date
USD648686S1 (en) 2011-11-15
TWD148144S1 (en) 2012-07-11
TWD146222S (en) 2012-04-01

Similar Documents

Publication Publication Date Title
USD659657S1 (en) Light emitting diode (LED) package
USD643819S1 (en) Package for light emitting diode (LED) lighting
USD614592S1 (en) Light emitting diode
USD650343S1 (en) Multiple configuration light emitting device package
USD734506S1 (en) LED bulb
USD641719S1 (en) Light emitting diode
USD702866S1 (en) Light-emitting diode (LED) floodlight
USD642289S1 (en) Light emitting diode
USD625847S1 (en) LED module
USD632821S1 (en) LED light fixture
USD704358S1 (en) High brightness LED package
USD626667S1 (en) Light bulb
USD622680S1 (en) Package of a light emitting diode
USD627087S1 (en) Light bulb
USD640996S1 (en) Packing structure of light-emitting diode
USD640995S1 (en) Packing structure of light-emitting diode
USD632267S1 (en) Light emitting diode packaging carrier
USD621799S1 (en) Light emitting diode
USD669040S1 (en) Light emitting diode
USD698323S1 (en) Light emitting diode
USD682225S1 (en) Light emitting diode
USD647493S1 (en) Light-emitting diode
USD696437S1 (en) LED bulb heatsink
USD640994S1 (en) Packing structure of light-emitting diode
USD675580S1 (en) Light emitting diode