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USD568836S1 - Groove formed around a semiconductor device on a circuit board - Google Patents

Groove formed around a semiconductor device on a circuit board Download PDF

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Publication number
USD568836S1
USD568836S1 US29/240,252 US24025205F USD568836S US D568836 S1 USD568836 S1 US D568836S1 US 24025205 F US24025205 F US 24025205F US D568836 S USD568836 S US D568836S
Authority
US
United States
Prior art keywords
circuit board
semiconductor device
groove formed
formed around
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/240,252
Inventor
Tetsuya Ohsawa
Emiko TANI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OHSAWA, TETSUYA, TANI, EMIKO
Priority to US29/306,335 priority Critical patent/USD585394S1/en
Application granted granted Critical
Publication of USD568836S1 publication Critical patent/USD568836S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;
FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,
FIG. 3 is a sectional view taken along line 3—3 in FIG. 2.
The broken lines represent unclaimed subject matter.

Claims (1)

    CLAIM
  1. The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.
US29/240,252 2005-04-13 2005-10-11 Groove formed around a semiconductor device on a circuit board Expired - Lifetime USD568836S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/306,335 USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005010971 2005-04-13
JP2005-010971 2005-04-13
JP2005-010989 2005-04-13
JP2005010989 2005-04-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/306,335 Division USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

Publications (1)

Publication Number Publication Date
USD568836S1 true USD568836S1 (en) 2008-05-13

Family

ID=39362045

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/240,252 Expired - Lifetime USD568836S1 (en) 2005-04-13 2005-10-11 Groove formed around a semiconductor device on a circuit board
US29/306,335 Expired - Lifetime USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/306,335 Expired - Lifetime USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

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US (2) USD568836S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD580895S1 (en) * 2006-05-01 2008-11-18 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD584250S1 (en) * 2006-05-01 2009-01-06 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD585394S1 (en) * 2005-04-13 2009-01-27 Nitto Denko Corporation Groove formed around a semiconductor device on a circuit board
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5420558A (en) * 1992-05-27 1995-05-30 Fuji Electric Co., Ltd. Thin film transformer
US5467252A (en) * 1993-10-18 1995-11-14 Motorola, Inc. Method for plating using nested plating buses and semiconductor device having the same
US5777277A (en) * 1995-09-21 1998-07-07 Canon Kabushiki Kaisha Printed circuit board
JPH118275A (en) 1997-06-13 1999-01-12 Nec Corp Manufacture of semiconductor device
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
US6114937A (en) * 1996-08-23 2000-09-05 International Business Machines Corporation Integrated circuit spiral inductor
US6121552A (en) * 1997-06-13 2000-09-19 The Regents Of The University Of Caliofornia Microfabricated high aspect ratio device with an electrical isolation trench
US6486412B2 (en) * 2000-09-13 2002-11-26 Seiko Epson Corporation Wiring board, method for producing same, display device, and electronic device
US7126452B2 (en) * 2003-11-14 2006-10-24 Canon Kabushiki Kaisha Wiring structure, and fabrication method of the same
US20060266545A1 (en) * 2005-05-24 2006-11-30 Nitto Denko Corporation Wired circuit board
US20070188287A1 (en) * 2006-02-13 2007-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Magnetic-bias ferromagnetic spiral inductor
US20070205856A1 (en) * 2004-11-25 2007-09-06 Murata Manufacturing Co., Ltd. Coil component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD568836S1 (en) * 2005-04-13 2008-05-13 Nitto Denko Corporation Groove formed around a semiconductor device on a circuit board

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5420558A (en) * 1992-05-27 1995-05-30 Fuji Electric Co., Ltd. Thin film transformer
US5467252A (en) * 1993-10-18 1995-11-14 Motorola, Inc. Method for plating using nested plating buses and semiconductor device having the same
US5777277A (en) * 1995-09-21 1998-07-07 Canon Kabushiki Kaisha Printed circuit board
US6114937A (en) * 1996-08-23 2000-09-05 International Business Machines Corporation Integrated circuit spiral inductor
JPH118275A (en) 1997-06-13 1999-01-12 Nec Corp Manufacture of semiconductor device
US6121552A (en) * 1997-06-13 2000-09-19 The Regents Of The University Of Caliofornia Microfabricated high aspect ratio device with an electrical isolation trench
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
US6486412B2 (en) * 2000-09-13 2002-11-26 Seiko Epson Corporation Wiring board, method for producing same, display device, and electronic device
US7126452B2 (en) * 2003-11-14 2006-10-24 Canon Kabushiki Kaisha Wiring structure, and fabrication method of the same
US20070205856A1 (en) * 2004-11-25 2007-09-06 Murata Manufacturing Co., Ltd. Coil component
US20060266545A1 (en) * 2005-05-24 2006-11-30 Nitto Denko Corporation Wired circuit board
US20070188287A1 (en) * 2006-02-13 2007-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Magnetic-bias ferromagnetic spiral inductor

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages).
English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page).
Offica Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages).

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD585394S1 (en) * 2005-04-13 2009-01-27 Nitto Denko Corporation Groove formed around a semiconductor device on a circuit board
USD580895S1 (en) * 2006-05-01 2008-11-18 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD584250S1 (en) * 2006-05-01 2009-01-06 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD584249S1 (en) * 2006-05-01 2009-01-06 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad

Also Published As

Publication number Publication date
USD585394S1 (en) 2009-01-27

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