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USD577692S1 - Grooves formed around a semiconductor device on a circuit board - Google Patents

Grooves formed around a semiconductor device on a circuit board Download PDF

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Publication number
USD577692S1
USD577692S1 US29/303,837 US30383708F USD577692S US D577692 S1 USD577692 S1 US D577692S1 US 30383708 F US30383708 F US 30383708F US D577692 S USD577692 S US D577692S
Authority
US
United States
Prior art keywords
semiconductor device
formed around
grooves formed
circuit board
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/303,837
Inventor
Tetsuya Ohsawa
Emiko TANI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US29/303,837 priority Critical patent/USD577692S1/en
Application granted granted Critical
Publication of USD577692S1 publication Critical patent/USD577692S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot- dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.
The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for grooves formed around a semiconductor device on a board, as shown and described.
US29/303,837 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board Expired - Lifetime USD577692S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/303,837 USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2005-010991 2005-04-13
JP2005010995 2005-04-13
JP2005010991 2005-04-13
JP2005-010995 2005-04-13
JP2005-010992 2005-04-13
JP2005010992 2005-04-13
US29/240,188 USD566060S1 (en) 2005-04-13 2005-10-11 Grooves formed around a semiconductor device on a circuit board
US29/303,837 USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/240,188 Division USD566060S1 (en) 2005-04-13 2005-10-11 Grooves formed around a semiconductor device on a circuit board

Publications (1)

Publication Number Publication Date
USD577692S1 true USD577692S1 (en) 2008-09-30

Family

ID=39263869

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/240,188 Expired - Lifetime USD566060S1 (en) 2005-04-13 2005-10-11 Grooves formed around a semiconductor device on a circuit board
US29/303,833 Expired - Lifetime USD577691S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board
US29/303,837 Expired - Lifetime USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/240,188 Expired - Lifetime USD566060S1 (en) 2005-04-13 2005-10-11 Grooves formed around a semiconductor device on a circuit board
US29/303,833 Expired - Lifetime USD577691S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Country Status (1)

Country Link
US (3) USD566060S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD658119S1 (en) * 2010-12-23 2012-04-24 Deutsche Cell Gmbh Metallization pattern of a solar cell

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD567774S1 (en) * 2006-05-01 2008-04-29 Nitto Denko Corporation Groove formed around a semiconductor device on a circuit board
USD701182S1 (en) * 2011-04-12 2014-03-18 Plasyl Limited Wave circuit pattern
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD788723S1 (en) 2015-03-04 2017-06-06 Osram Sylvania Inc. Serrated light engine and circuit board
JP1603673S (en) * 2017-07-10 2018-05-14
JP1603672S (en) * 2017-07-10 2018-05-14
JP1725479S (en) * 2022-01-05 2022-09-22
JP1725480S (en) * 2022-01-05 2022-09-22

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
USD279670S (en) * 1978-07-31 1985-07-16 Lukits John J Component side of a printed circuit board
USD288556S (en) * 1984-02-21 1987-03-03 Pace, Incorporated Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards
USD295401S (en) * 1985-03-11 1988-04-26 Detects Inc. Electronic circuit board housing
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD374541S (en) * 1995-08-25 1996-10-15 Franciso Garza Bite size snack food
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
US6114937A (en) * 1996-08-23 2000-09-05 International Business Machines Corporation Integrated circuit spiral inductor
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD510103S1 (en) * 2004-06-03 2005-09-27 American Express Travel Related Services Company, Inc. Transparent card with an antenna

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2947225B2 (en) 1997-06-13 1999-09-13 日本電気株式会社 Method for manufacturing semiconductor device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
USD279670S (en) * 1978-07-31 1985-07-16 Lukits John J Component side of a printed circuit board
USD288556S (en) * 1984-02-21 1987-03-03 Pace, Incorporated Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards
USD295401S (en) * 1985-03-11 1988-04-26 Detects Inc. Electronic circuit board housing
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
USD374541S (en) * 1995-08-25 1996-10-15 Franciso Garza Bite size snack food
US6114937A (en) * 1996-08-23 2000-09-05 International Business Machines Corporation Integrated circuit spiral inductor
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD510103S1 (en) * 2004-06-03 2005-09-27 American Express Travel Related Services Company, Inc. Transparent card with an antenna

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
USD658119S1 (en) * 2010-12-23 2012-04-24 Deutsche Cell Gmbh Metallization pattern of a solar cell

Also Published As

Publication number Publication date
USD566060S1 (en) 2008-04-08
USD577691S1 (en) 2008-09-30

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