USD368802S - 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment - Google Patents
150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment Download PDFInfo
- Publication number
- USD368802S USD368802S US29/029,711 US2971194F USD368802S US D368802 S USD368802 S US D368802S US 2971194 F US2971194 F US 2971194F US D368802 S USD368802 S US D368802S
- Authority
- US
- United States
- Prior art keywords
- wafer
- handling equipment
- semi standard
- cassette
- wafer cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front perspective view of a 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment showing my new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a back elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a "150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment", as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/029,711 USD368802S (en) | 1994-10-13 | 1994-10-13 | 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/029,711 USD368802S (en) | 1994-10-13 | 1994-10-13 | 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
USD368802S true USD368802S (en) | 1996-04-16 |
Family
ID=71107536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/029,711 Expired - Lifetime USD368802S (en) | 1994-10-13 | 1994-10-13 | 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment |
Country Status (1)
Country | Link |
---|---|
US (1) | USD368802S (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD378873S (en) * | 1995-10-13 | 1997-04-22 | Empak, Inc. | 300 mm microenvironment pod with door on side |
USD381344S (en) * | 1995-07-31 | 1997-07-22 | Kaijo Corporation | Disk carrier |
US6625898B2 (en) | 2001-06-13 | 2003-09-30 | Applied Materials, Inc | Variable method and apparatus for alignment of automated workpiece handling systems |
US6763281B2 (en) | 1999-04-19 | 2004-07-13 | Applied Materials, Inc | Apparatus for alignment of automated workpiece handling systems |
US20050203664A1 (en) * | 1999-04-19 | 2005-09-15 | Applied Materials, Inc. | Method and apparatus for aligning a cassette |
US20100078867A1 (en) * | 2008-09-29 | 2010-04-01 | Tokyo Electron Limited | Substrate processing apparatus |
-
1994
- 1994-10-13 US US29/029,711 patent/USD368802S/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD381344S (en) * | 1995-07-31 | 1997-07-22 | Kaijo Corporation | Disk carrier |
USD378873S (en) * | 1995-10-13 | 1997-04-22 | Empak, Inc. | 300 mm microenvironment pod with door on side |
US6763281B2 (en) | 1999-04-19 | 2004-07-13 | Applied Materials, Inc | Apparatus for alignment of automated workpiece handling systems |
US20050203664A1 (en) * | 1999-04-19 | 2005-09-15 | Applied Materials, Inc. | Method and apparatus for aligning a cassette |
US7158857B2 (en) | 1999-04-19 | 2007-01-02 | Applied Materials, Inc. | Method and apparatus for aligning a cassette |
US6625898B2 (en) | 2001-06-13 | 2003-09-30 | Applied Materials, Inc | Variable method and apparatus for alignment of automated workpiece handling systems |
US20100078867A1 (en) * | 2008-09-29 | 2010-04-01 | Tokyo Electron Limited | Substrate processing apparatus |
US8585030B2 (en) * | 2008-09-29 | 2013-11-19 | Tokyo Electron Limited | Substrate processing apparatus |
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