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US3544763A - Apparatus for the evaporation of materials in a vacuum - Google Patents

Apparatus for the evaporation of materials in a vacuum Download PDF

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Publication number
US3544763A
US3544763A US602399A US3544763DA US3544763A US 3544763 A US3544763 A US 3544763A US 602399 A US602399 A US 602399A US 3544763D A US3544763D A US 3544763DA US 3544763 A US3544763 A US 3544763A
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United States
Prior art keywords
evaporation
support
vacuum
electron beam
electron
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Expired - Lifetime
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US602399A
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English (en)
Inventor
Gottfried Geir
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Bendix Corp
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Bendix Corp
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Filing date
Publication date
Application filed by Bendix Corp filed Critical Bendix Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • C23C14/30Vacuum evaporation by wave energy or particle radiation by electron bombardment

Definitions

  • the present invention consists of an electron beam apparatus for melting and/0r evaporating metals in a vacuum such as in vapor coating processes or the like.
  • the improvement of this invention is characterized in that the support for the metal to be evaporated forms a separation wall between an electron gun on one side and the material to be melted on the other, thereby electrically and magnetically shielding the melt metal.
  • the support is preferably of thin foil to suppress heat conduction losses which may also be reduced in thicker support constructions by spoked support design.
  • a VACUUM Apparatus for the evaporation of materials in which a so-called electron gun is arranged in a vacuum chamber.
  • the electron gun beam by its action in striking the material to be evaporated, heats it and brings parts of it to evaporation.
  • the vapors so produced can be condensed to coat substrates arranged in the neighborhood with the mentioned materials, for example, glass plates, optical lenses and electron microscope specimens.
  • a great advantage of the electron beam evaporation lies in the fact that an electron beam can be concentrated so that with suff cient focussing on a very small surface, a high energy density can be attained with a reasonable output and, thereby, a high temperature.
  • an electron beam can be easily deflected by electric or magnetic fields and, for example, can be directed alternately onto different materials which has significance for the production of mixed coatings.
  • the energy carried over to the evaporation material is conveniently and accurately controllable with electron beam heating, which is important for the automation of evaporation equipment.
  • the electron beam would represent the ideal means for the vacuum evaporation of material of this kind were it not also associated with some serious disadvantages.
  • the present invention has set as its object an apparatus with the practical advantages of electron beam evaporation without limiting its utilization by the aforementioned disturbing disadvantages.
  • the apparatus according to the invention relates to the evaporation of materials in a vacuum through electron bombardment and is characterized in that the support serving for the evaporation carrying the evaporation material is formed as a part of the separating wall electrically shielding two regions of space from one another.
  • the apparatus for heating the separation wall by electron bombardment is provided in the one region of space, while the side turned away from this apparatus is formed for the reception of the material to be evaporated.
  • the use of the invention has the advantage as compared with the direct bombardment of the evaporating surface of the material that essentially the heat transfer must only be effective on the material to be evaporated and the heat leakage through the support can be kept very small in contrast to all other known heating processes.
  • the known method of resistance heating for example, with a tungsten strip serving as a material support, the heat produced by the current flowing through it is uniformily distributed over the whole surface of the heating ribbon. Only a small part of this surface, which stands in direct contact with the material to be evaporated, is useable as a true support for the transfer of heat. At least percent of the heat energy produced goes off by free radiation and is lost by the conduction of heat to the two connecting electrodes.
  • electron beam heating one may limit the production of heat to that place on the support where it is immediately transferred to the material to be evaporated. Since the part of the support not covered need not be subjected to the electron bombardment, the radiation loss can be held substantially smaller.
  • FIG. I shows an embodiment of my invention wherein the evaporation support may be formed of an electrical conductor such as metal, carbon, graphite, or the like.
  • FIG. 2 shows an embodiment of my invention utilizing a cooled, double-walled return-current shell in which the evaporation support may be a nonconductor of electricity.
  • FIG. 3. shows an evaporation shield for use with my invention.
  • FIG. 4 shows the embodiment of FIG. I to which has been added means for providing change of the evaporation shield and material.
  • FIG. I A first example of the application of the invention is illustrated in the accompanying FIG. I.
  • the apparatus is built up on the flange 1 which can be secured in an opening in the baseplate ofa vacuum evaporation equipment.
  • the numeral 2 designates an annular-shaped sealing groove with an elastic sealing ring (O-ring gasket) 3, 4, a cylindrical, electrically-insulating part, for example, of porcelain, 5 a cylindrical metal shell surrounding the part 4, and 6 a hot cathode which is supplied with heating current through the vacuum tight, electrically-insulated feedthroughs 7 and 8 from the source 9 and with a negative accelerating potential for the electrons of a few one hundred to a few one thousand volts.
  • metal shell 5 which stands in electrically-conducting connection with the flange 1
  • metal disk 10 of a refractory material (metal) which serves as an evaporation support for the material to be evaporated and is provided in an advantageous way with a depression II for the receipt of the same.
  • the electrons emitted from the cathode 6 are accelerated onto the evaporation support 10 and heat it according to the energy transferred.
  • the inner wall of the electrically-insulating part 4 receives a negative surface charge through scattered electrons, which concentrates the beam current to the extent that it only strikes the part of the thin sheet 10 which serves for the evaporation.
  • more complicated known electron optical electrode arrangements can also be used in order to produce a sharply-focussed electron beam on the place of evaporation.
  • any known electrically-conducting refractory material can be used as the high temperature stable material for the part of the electrically-shielding separation wall serving for the evaporation which exhibits a sufficient mechanical strength.
  • Those known materials to be considered first are those usually used for evaporation with resistance heating, such as tungsten or molybdenum sheet or else foils.
  • nonmetals for example, plates of carbon, graphite and carbides etc. may be used.
  • Nonconductors of electricity can also be used, for example, plates of oxides if an electron gun with a focussed beam is used for the electron bombardment, such as, for example, provided in the arrangement shown in FIG. 2 as will be later described.
  • the auxiliary electrode 26 can be eliminated and the return current flow from the point of bombardment by the electrons on the insulating support 25 results from the scattering or thermal emission of electrons which are collected by the neighboring parts of the inner walls of the shielding 20.
  • the metal shell 5, together with the thin sheet form an electrically-shielding separation wall between a region of space A, containing the cathode 6 and the space region B in which the evaporation takes place.
  • the regions of space A" and B are not only electrically shielded one from the other, but also largely magnetically shielded.
  • the return flow of the electron beam current going out of the cathode 6 is uniformly distributed radially over the disc 10 and along the shell 5.
  • the magnetic effect of the electron current and the return current largely cancel each other in this way.
  • it In order to eliminate the magnetic effect of the cathode coil 6, it must be built free of induction, for example, it is built up as a double winding as is well known.
  • an additional shield of such material may be provided that substantially surrounds the space A" where only an opening for the exit of the vapor stream produced must be left free.
  • FIG. 2 Another form of application of the invention is shown in FIG. 2. It is differentiated from FIG. 1 by a differently-formed double-walled return current shield 20 into whose annular hollow space a cooling medium is led, through the conduit 22 and out again through another conduit 23.
  • the gap between the electrode 26 and the neighboring wall of the return current shell 20 is made so small that no electrical gas discharge can appear. It is well known that this will be the result if the theoretical mean free path length of the electrons in the gas situated in the gap is substantially greater than the gap width (gap widths of 1 mm. are suitable in most cases).
  • the electrode 26, for example, of copper, can be so formed that it acts as a concave mirror for the heat radiation emitted from the cathode. Thus, heat is focussed back onto the cathode which produces a
  • the evaporation support itself can exhibit different forms, for example, for the purpose of the least possible heat conduction, it can be formed of tightly woven wire mesh where the melt of the material to be evaporated is held together by its surface tension.
  • FIG. 3 shows, in an enlarged sketch, a form of the application in which only the central part 31, carried by the narrow spokes 30 serves as the evaporation surface and it likewise has the advantage that the conduction of heat from the evaporation surface is solely through the spokes and is very small, particularly since the return current flows through them and thereby warms them. For that reason, one may also use a thicker sheet which results in a longer useful life. It is evident that the small cutout portions 32 will markedly influence the electrical shielding of the separation wall.
  • FIG. 4 shows a relatively similar construction of the electron beam producing apparatus as that in H0. 1; however, the evaporation support is formed as an annular channel 40 in a rotating disc 41. Through this, one gains not only a greater heating surface which can receive more evaporation material 42 at one time, but one can, for example, provide an addition mechanism 44 to the annular channel which is indicated as a funnel in FIG. 4.
  • the invention is especially suitable for the recently used multiple flash evaporation technique for the evaporation of mixtures in which the intermittent use of very high electron beam currents is necessary.
  • the electric and magnetic fields occuring in this case disturb not only on account of their absolute magnitude, but also because of their time variation through which undesired changing potentials are produced in electrical conductors which can be very disturbing to measurements.
  • An apparatus for evaporating in a vacuum a material disposed upon a support comprising:
  • an electrically conducting housing having integral outer and inner walls, said inner wall spaced from and surrounding said electron beam generating means so that no electrical gas discharge can appear therebetween, said inner wall is further formed to position said material support so that the material located therein may be vaporized.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
US602399A 1965-12-18 1966-12-16 Apparatus for the evaporation of materials in a vacuum Expired - Lifetime US3544763A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1750165A CH452313A (de) 1965-12-18 1965-12-18 Vorrichtung zur Verdampfung von Stoffen im Vakuum

Publications (1)

Publication Number Publication Date
US3544763A true US3544763A (en) 1970-12-01

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US602399A Expired - Lifetime US3544763A (en) 1965-12-18 1966-12-16 Apparatus for the evaporation of materials in a vacuum

Country Status (6)

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US (1) US3544763A (uk)
CH (1) CH452313A (uk)
DE (1) DE1521175B2 (uk)
FR (1) FR1505169A (uk)
GB (1) GB1105989A (uk)
NL (1) NL6600952A (uk)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3996469A (en) * 1975-01-06 1976-12-07 Jersey Nuclear-Avco Isotopes, Inc. Floating convection barrier for evaporation source
US4048462A (en) * 1975-01-17 1977-09-13 Airco, Inc. Compact rotary evaporation source
US4094269A (en) * 1974-06-14 1978-06-13 Zlafop Pri Ban Vapor deposition apparatus for coating continuously moving substrates with layers of volatizable solid substances
US4123280A (en) * 1974-06-14 1978-10-31 Zlafop Pri Ban Silver halide vapor deposition method
FR2623819A1 (fr) * 1987-11-26 1989-06-02 Thomson Csf Four a bombardement electronique pour evaporation sous vide
WO1992012275A1 (de) * 1991-01-10 1992-07-23 Plasco Dr. Ehrich Plasma-Coating Gmbh Vorrichtung und verfahren zur materialverdampfung
US5179622A (en) * 1990-05-19 1993-01-12 Leybold Aktiengesellschaft Series evaporator for vacuum vapor-deposition apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2628765C3 (de) * 1976-06-26 1979-01-11 Leybold-Heraeus Gmbh & Co Kg, 5000 Koeln Vorrichtung zum Aufdampfen insbesondere sublimierbarer Stoffe im Vakuum mittels einer Elektronenstrahlquelle

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094269A (en) * 1974-06-14 1978-06-13 Zlafop Pri Ban Vapor deposition apparatus for coating continuously moving substrates with layers of volatizable solid substances
US4123280A (en) * 1974-06-14 1978-10-31 Zlafop Pri Ban Silver halide vapor deposition method
US3996469A (en) * 1975-01-06 1976-12-07 Jersey Nuclear-Avco Isotopes, Inc. Floating convection barrier for evaporation source
US4048462A (en) * 1975-01-17 1977-09-13 Airco, Inc. Compact rotary evaporation source
FR2623819A1 (fr) * 1987-11-26 1989-06-02 Thomson Csf Four a bombardement electronique pour evaporation sous vide
US5179622A (en) * 1990-05-19 1993-01-12 Leybold Aktiengesellschaft Series evaporator for vacuum vapor-deposition apparatus
WO1992012275A1 (de) * 1991-01-10 1992-07-23 Plasco Dr. Ehrich Plasma-Coating Gmbh Vorrichtung und verfahren zur materialverdampfung

Also Published As

Publication number Publication date
DE1521175A1 (de) 1969-07-31
DE1521175B2 (de) 1973-04-26
GB1105989A (en) 1968-03-13
FR1505169A (fr) 1967-12-08
NL6600952A (uk) 1967-06-19
CH452313A (de) 1968-05-31

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