US3202529A - Disposition of nickel-cobalt alloy on aluminum substrates - Google Patents
Disposition of nickel-cobalt alloy on aluminum substrates Download PDFInfo
- Publication number
- US3202529A US3202529A US215735A US21573562A US3202529A US 3202529 A US3202529 A US 3202529A US 215735 A US215735 A US 215735A US 21573562 A US21573562 A US 21573562A US 3202529 A US3202529 A US 3202529A
- Authority
- US
- United States
- Prior art keywords
- aluminum
- nickel
- cobalt
- zinc
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
Definitions
- This invention relates to the deposition of nickelcobalt alloy on aluminum substrates. More particularly, this invention relates to the plating or coating of aluminum articles with a nickel-cobalt magnetic alloy film.
- aluminum includes pure aluminum, commercial aluminum containing the usual impurities, aluminum base alloys and aluminum alloys wherein aluminum is the major and characterizing alloy component.
- Aluminum storage devices or memory units comprising aluminum discs, drums and the like having deposited on the surface thereof a magnetic metal film are useful.
- the manufacture of such memory or storage devices from aluminum is attractive since aluminum is relatively cheap, easily machined, readily available and is lightweight.
- Aluminum is a reactive metal and it is difficult to plate another metal onto aluminum using conventional plating techniques.
- a magnetic film or coating such as a film of magnetic nickel-cobalt alloy
- Yet another object of this invention is to provide alu minum articles coated with a film of magnetic nickelcobalt alloy.
- a nickel-cobalt film is eifectively deposited on an aluminum substrate by first providing the aluminum substrate with a protective coating of zinc and then placing the zinc coated aluminum substrate into contact with an aqueous niclrel-cobal-t-containiug solution, said nickel-cobalt-containing solution having a composition effec ive for the deposition of nickel-cobalt alloy directly onto said aluminum substrate with the simultaneous dissolution of the zinc coating from said aluminum substrate into said solution, to effect deposition of said nickel-cobalt alloy directly upon said aluminum substrate.
- An aluminum substrate or an aluminum article to be coated is cleaned for the removal of oil, grease, dirt and other surface contaminants.
- the cleaned aluminum article is then treated for the removal of the adherent surface aluminum oxide film which rapidly forms upon aluminum in contact with an oxygen atmosphere.
- the removal of the adherent surface film of aluminum oxide can be effected by immersing the aluminum article in a nitric acid bath.
- the aluminum substrate or aluminum article is immersed in a zinc plating bath, such as an aqueous solution of an alkali metal zincate, to effect electroless deposition of a protective layer of zinc onto the aluminum.
- a zinc plating bath such as an aqueous solution of an alkali metal zincate
- the purpose of the zinc layer is to protect the aluminum substrate against oxidation prior to the deposition of the nickel-cobalt film thereon.
- the spent zinc plating bath is recovered for regeneration or for the recovery of values, such as zinc values, therefrom.
- the aluminum article, now coated with a protective layer of zinc is immersed in an aqueous nickel-cobalt-containing plating bath having a composition such that the protective layer of zinc is removed from the aluminum substrate and dissolves within the bath and substantially simultaneously a film or coating of nickel-cobalt alloy is deposited on the aluminum substrate.
- an aqueous nickel-cobalt-containing plating bath having a composition such that the protective layer of zinc is removed from the aluminum substrate and dissolves within the bath and substantially simultaneously a film or coating of nickel-cobalt alloy is deposited on the aluminum substrate.
- the aluminum substrate, now coated with a film of nickelcobalt magnetic alloy is recovered. If desired, the nickelcobalt plating bath can be recovered for regeneration or the recovery of the metal values therefrom.
- the aluminum article to be coated is carefully cleaned to remove from the surface thereof any oil, grease, dirt, and extraneous matter. Cleaning may be effected by washing in a water bath and/or by applying a jet of wet steam to the aluminum article. Grease and oil and like contaminants are removed by solvent washing. Desirably, the methods of removing surface contaminants from the aluminum article should not chemically attack the aluminum article itself.
- the adherent surface film or layer of aluminum oxide is removed by known methods, such as dipping in an acid bath, such as a bath of nitric acid, preferably followed by a water rinse.
- an acid bath such as a bath of nitric acid
- the aluminum article is immersed in an aqueous zinc plating bath. This operation usually involves immersing the aluminum article for about 0.253 minutes at room temperature in an aqueous solution of alkali metal zincate which may be made up with about grams of zinc oxide and about 400 grams of caustic soda per liter of bath, the balance being substantially water.
- alkali metal zincate oath may vary widely in the proportions and concentrations of its components.
- the amount of Zinc oxide may be less than 109 grams per liter of bath but the ratio of caustic soda to zinc oxide is usually in the range from about 3:1 to 8:1.
- the alkali metal Zincate bath may also be prepared from equivalent amounts of zinc salts and other caustic alltalis. Desirably, there 'iron, cobalt and nickel.
- the alkali metal zincate bath may be incorporated in the alkali metal zincate bath a minor amount of at least one of the hydrous oxides of The presence of these added compounds promotes the deposition of a uniform, dense and adherent Zinc coating on the surface of the aluminum article.
- the presence of added copper salts to the alkali metal zincate solution also is useful.
- An alkali metal zincate bath having the following composition in grams per liter may be employed:
- An alkali metal zincate bath also suitable in the practice of this invention has the composition:
- the aluminum article is removed and subjected to a water rinse to remove any adhering zincate solution.
- the aluminum article is now coated with a protective layer of zinc.
- the zinc coated aluminum article is then immersed in an aqueous nickel-cobalt electroless plating solution to eifect'substantially simultaneously the dissolution of the protective zinc layer and the deposition of a film of nickel-cobalt magnetic alloy directly onto the surface of "1 and ff ti for therdeposition bf a nickepcoba'lt alloy the aluminum article, the nickel-cobalt alloy being deposited onto the aluminum surface without any intervening Zinc layer.
- An electroless plating bath suitable for the deposition of a nickel-cobalt magnetic alloy film has the following composition: a
- the hypophosphite ion content in the nickelcobalt plating bath is in the range from about 11 to about 13 grams per liter.
- the nickel-cobalt plating bath contains about 60 grams per liter CoCl .6H O and about 2 grams per liter NiCl .6I-I O, the amounts of the other components hereinabove identified remaining unchanged, there is deposited upon the aluminum article a nickelcobalt magnetic alloy film having the approximate composition by weight 90% cobalt, 7% nickel and 3% phosphorus.
- the nickel-cobalt plating bath contains about grams per liter CoCl .6I-I O and about 25 grams per liter-NiCl .6H O;there is deposited on the aluminum article a nickel-cobalt magnetic alloy filmhaving the composition by weight approximately cobalt, 56% nickel and 4% phosphorus.
- compositions of nickel-cobalt plating baths particularly useful in the practice of this invention are disclosed in copending, coassigned patent application Serial No. 148,953 filed October 31, 1961 in the name'of Ernest,
- ⁇ may be carried out at any suitable temperature from about room temperature up to about 180 F. or higher, if desired, and for a period of time sufiicient to deposit on the aluminum article a nickel-cobalt alloy coating of the desired thickness, usually from about 1-10 minutes, more or less. 7 H
- the aluminum article Following immersion in the nickel-cobalt electroless plating bath the aluminum article is removed and washed and may be in the form ready for installation in an operating device.
- the spent nickel-cobalt plating bath is desirably recovered and treated for regeneration for the recovery of metal values therefrom, including nickel, cobalt and zinc.
- a method of depositing a nickel-cobalt alloy film directly onto an aluminum substrate which comprises depositing a layer of zinc on said aluminum substrate by contacting said aluminum substrate with an aqueous alkali metal zincate solution .and placing the zinc coated aluminum substrate into the contact with an aqueous nickelcobalt-containing solution, said nickel-cobalt-containmg solution having the composition:
- alkali metal zincate solution is preparedfrom zinc oxide and caustic soda, the weight ratio of caustic soda to zinc oxide being in the range from about 3: 1 to about 8:1.
- alkali metal zincate solution is prepared from zinc oxide and caustic soda, the weight ratio of caustic soda to zinc oxide being in the range from about 3:1 to about 8:1.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
Description
Aug. 24, 1965 W. N. DUNLAP, JR, ET AL DISPOSITION OF NICKEL-COBALT ALLOY ON ALUMINUM SUBSTRATES ALUMINUM SUBSTRATE COATED WITH NL-Co MAGNETIC ALLOY FILM Filed Aug. 8, 1962 ALU/W/V/M SZ/ESTRATE 70 BE COATED CL EA/V/NG REMOVAL OF 0/4 GREASE, D/RT 9 OTHER SUP/",4 CE CO/VT/IM/NANTS N/T/Q/C AC/D BATH REMOVAL OF 50/?- FICE AAVE F 0F AAU/V/A/Z/M dX/DE Z/NC PLAT/N6 547/7 ELECT/POLESS DEPOS/T/O/V 0F Z/A/C b n E ELEC T/POLESS Mi-Co PLAT/N6 VA LU ES RECOVERY OF FROM PLA SOLUTION INVENTORS W/LL/AM N1 DUA/LAP EPA/EST M dG/VES JAMES V, W/Q/GHT United States Patent DISPOSITION OF NICKEL-CQBALT ALLOY 0N ALUMINUM .dUllSTRATES William N. Dunlap, In, and Ernest W. Jones, Philadelphia, and James V. Wright, North Wales, Pa., assignors to Sperry Rand Corporation, New York, N.Y., a corporation of Delaware Filed Aug. 3, 1962, Ser. No. 215,735
. 4 Claims. (Cl. =1175t)) This invention relates to the deposition of nickelcobalt alloy on aluminum substrates. More particularly, this invention relates to the plating or coating of aluminum articles with a nickel-cobalt magnetic alloy film. As used herein aluminum includes pure aluminum, commercial aluminum containing the usual impurities, aluminum base alloys and aluminum alloys wherein aluminum is the major and characterizing alloy component.
Aluminum storage devices or memory units comprising aluminum discs, drums and the like having deposited on the surface thereof a magnetic metal film are useful. The manufacture of such memory or storage devices from aluminum is attractive since aluminum is relatively cheap, easily machined, readily available and is lightweight. Aluminum, however, is a reactive metal and it is difficult to plate another metal onto aluminum using conventional plating techniques. Heret-ofore it has been extremely difficult to deposit a magnetic film or coating, such as a film of magnetic nickel-cobalt alloy, onto an aluminum substrate.
It is an object of this invention to provide a method for depositing a magnetic metal alloy film onto an aluminum substrate.
It is another object of this invention to provide a method of depositing a magnetic metal alloy film onto an aluminum substrate by elect-roless deposition.
It is another object of this invention to provide a method of depositing a film of nickel-cobalt magnetic alloy directly onto an aluminum substrate by electroless deposition from an aqueous nickel-cobalt-containing solution.
Yet another object of this invention is to provide alu minum articles coated with a film of magnetic nickelcobalt alloy.
How these and other objects of this invention are achieved will become apparent in the light of the accompanying disclosure made with reference to the accompanying drawing wherein there is schematically presented a flow diagram illustrative of one embodiment of the practice of this invention.
In accordance with this invention, it has now been discovered a nickel-cobalt film is eifectively deposited on an aluminum substrate by first providing the aluminum substrate with a protective coating of zinc and then placing the zinc coated aluminum substrate into contact with an aqueous niclrel-cobal-t-containiug solution, said nickel-cobalt-containing solution having a composition effec ive for the deposition of nickel-cobalt alloy directly onto said aluminum substrate with the simultaneous dissolution of the zinc coating from said aluminum substrate into said solution, to effect deposition of said nickel-cobalt alloy directly upon said aluminum substrate.
ice
Referring now to the accompanying drawing, there is indicated therein in block diagram various operations carried out in the practice of this invention. An aluminum substrate or an aluminum article to be coated is cleaned for the removal of oil, grease, dirt and other surface contaminants. The cleaned aluminum article is then treated for the removal of the adherent surface aluminum oxide film which rapidly forms upon aluminum in contact with an oxygen atmosphere. As indicated, the removal of the adherent surface film of aluminum oxide can be effected by immersing the aluminum article in a nitric acid bath.
Following the treatment for the removal of the surface layer of aluminum oxide, the aluminum substrate or aluminum article is immersed in a zinc plating bath, such as an aqueous solution of an alkali metal zincate, to effect electroless deposition of a protective layer of zinc onto the aluminum. The purpose of the zinc layer is to protect the aluminum substrate against oxidation prior to the deposition of the nickel-cobalt film thereon. If desired, the spent zinc plating bath is recovered for regeneration or for the recovery of values, such as zinc values, therefrom.
Following the zinc plating operation the aluminum article, now coated with a protective layer of zinc, is immersed in an aqueous nickel-cobalt-containing plating bath having a composition such that the protective layer of zinc is removed from the aluminum substrate and dissolves within the bath and substantially simultaneously a film or coating of nickel-cobalt alloy is deposited on the aluminum substrate. Following this electroless plating operation the aluminum substrate, now coated with a film of nickelcobalt magnetic alloy, is recovered. If desired, the nickelcobalt plating bath can be recovered for regeneration or the recovery of the metal values therefrom.
In the practice of this invention the aluminum article to be coated is carefully cleaned to remove from the surface thereof any oil, grease, dirt, and extraneous matter. Cleaning may be effected by washing in a water bath and/or by applying a jet of wet steam to the aluminum article. Grease and oil and like contaminants are removed by solvent washing. Desirably, the methods of removing surface contaminants from the aluminum article should not chemically attack the aluminum article itself.
Following the cleaning operation the adherent surface film or layer of aluminum oxide is removed by known methods, such as dipping in an acid bath, such as a bath of nitric acid, preferably followed by a water rinse. Following the removal of the aluminum oxide layer the aluminum article is immersed in an aqueous zinc plating bath. This operation usually involves immersing the aluminum article for about 0.253 minutes at room temperature in an aqueous solution of alkali metal zincate which may be made up with about grams of zinc oxide and about 400 grams of caustic soda per liter of bath, the balance being substantially water. The alkali metal zincate oath may vary widely in the proportions and concentrations of its components. The amount of Zinc oxide may be less than 109 grams per liter of bath but the ratio of caustic soda to zinc oxide is usually in the range from about 3:1 to 8:1. The alkali metal Zincate bath may also be prepared from equivalent amounts of zinc salts and other caustic alltalis. Desirably, there 'iron, cobalt and nickel.
may be incorporated in the alkali metal zincate bath a minor amount of at least one of the hydrous oxides of The presence of these added compounds promotes the deposition of a uniform, dense and adherent Zinc coating on the surface of the aluminum article. The presence of added copper salts to the alkali metal zincate solution also is useful.
An alkali metal zincate bath having the following composition in grams per liter may be employed:
ZnO 1-00 NaOl-I 400 FCCI3.6H2O 1 C4H405 5 An alkali metal zincate bath also suitable in the practice of this invention has the composition:
Water liter 1 Caustic soda grams 400 Zinc oxide do 80 Copper, in the form of potassium copper cyanide do 2 Sodium sulfite do The alkali metal zincatevbath is also effective to remove any remaining adherent aluminum oxide film from the aluminum article.
Following the immersion in the 'Zincate bath the aluminum article is removed and subjected to a water rinse to remove any adhering zincate solution. The aluminum article is now coated with a protective layer of zinc. The zinc coated aluminum article is then immersed in an aqueous nickel-cobalt electroless plating solution to eifect'substantially simultaneously the dissolution of the protective zinc layer and the deposition of a film of nickel-cobalt magnetic alloy directly onto the surface of "1 and ff ti for therdeposition bf a nickepcoba'lt alloy the aluminum article, the nickel-cobalt alloy being deposited onto the aluminum surface without any intervening Zinc layer.
An electroless plating bath suitable for the deposition of a nickel-cobalt magnetic alloy film has the following composition: a
Gms./l.
CoCl .6H O 60-35 NiCl .6I-I O 2-25 Rochelle salt 200 NH CI r 50 NaI-I PO H O 20 Desirably, the hypophosphite ion content in the nickelcobalt plating bath is in the range from about 11 to about 13 grams per liter. When the nickel-cobalt plating bath contains about 60 grams per liter CoCl .6H O and about 2 grams per liter NiCl .6I-I O, the amounts of the other components hereinabove identified remaining unchanged, there is deposited upon the aluminum article a nickelcobalt magnetic alloy film having the approximate composition by weight 90% cobalt, 7% nickel and 3% phosphorus. When the nickel-cobalt plating bath contains about grams per liter CoCl .6I-I O and about 25 grams per liter-NiCl .6H O;there is deposited on the aluminum article a nickel-cobalt magnetic alloy filmhaving the composition by weight approximately cobalt, 56% nickel and 4% phosphorus.
The compositions of nickel-cobalt plating baths particularly useful in the practice of this invention are disclosed in copending, coassigned patent application Serial No. 148,953 filed October 31, 1961 in the name'of Ernest,
W. Jones, one of the co-inventors of the inventiondescribed herein, now'abandoned. Thedisclosures of the above-identified patent application are herein incorp orated and made part of this disclosure.
The electroless plating of the aluminum article for the deposition of the magnetic film of nickel-cobalt thereon 7 follows:
may be carried out at any suitable temperature from about room temperature up to about 180 F. or higher, if desired, and for a period of time sufiicient to deposit on the aluminum article a nickel-cobalt alloy coating of the desired thickness, usually from about 1-10 minutes, more or less. 7 H
Following immersion in the nickel-cobalt electroless plating bath the aluminum article is removed and washed and may be in the form ready for installation in an operating device. The spent nickel-cobalt plating bath is desirably recovered and treated for regeneration for the recovery of metal values therefrom, including nickel, cobalt and zinc.
As will be apparent to those skilled in the art in the light of the foregoing disclosure many modifications, alterations and substitutions are possible in the practice of this invention without departing from the spirit or scope thereof. V
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as 1. A method of depositing a nickel-cobalt alloy film directly onto an aluminum substrate which comprises depositing a layer of zinc on said aluminum substrate by contacting said aluminum substrate with an aqueous alkali metal zincate solution .and placing the zinc coated aluminum substrate into the contact with an aqueous nickelcobalt-containing solution, said nickel-cobalt-containmg solution having the composition:
'Gms./ 1. CoCl- .6H O 60-35 NiCl .6l-I O 2-25 Rochelle salt 200 NH Cl '50 NaH2PO2.H2O
directly onto said aluminum substrate with the simultane ous dissolution of the Zinc coating from said aluminum substrate into said solution to effect deposition of said nickel-cobalt alloy directly upon said aluminum substrate;
2. A method in accordance with claim 1 wherein said alkali metal zincate solution is preparedfrom zinc oxide and caustic soda, the weight ratio of caustic soda to zinc oxide being in the range from about 3: 1 to about 8:1.
3. A method of depositing a nickel-cobalt magnetic alloy film directly upon the surface of'an aluminum article Gms./1. CoCl .6H O 60-35 V NiCl .6H O 2-25 Rochelle salt 200 nan ro' n o 20 and eifective for the deposition of ahickel-cobalt alloy directly upon the aluminum surface of said article with the simultaneousdissolution of the zinc layer from said article, to effect deposition of said nickel-cobalt alloy directly upon the aluminum surface of saidtarticle.
4.: A method in accordance with claim 3 wherein said alkali metal zincate solution is prepared from zinc oxide and caustic soda, the weight ratio of caustic soda to zinc oxide being in the range from about 3:1 to about 8:1. g
7 (References on following page) References Citcii by the Examiner UNlTE-D STATES PATENTS Roux.
Hewitssn 117-130 X 5 Ker-pium.
Zelley 117-130 Culverhouse 117-130 X Reschan 117-50 Wasserman 117-50 10 6 OTHER REFERENCES Brenner et al. I, Deposition of Nickel and Cobalt by Chemical Reduction, US. Dept. of Commerce, National Bureau of Standards, 1 esearch Paper RP 1835, v01. 39, November 1947 part of the Jsurnal of Research of the National Bureau of Standards, pp. 385-395.
RECHARD D. NEVIUS, Primary Examiner.
1V ILLTAM D MARTIN, Examiner.
Claims (1)
1. A METHOD OF DEPOSITING A NICKEL-COBALT ALLOY FILM DIRECTLY ONTO AN ALUMINUM SUBSTRATE WHICH COMPRISES DEPOSITING A LAYER OF ZINC ON SAID ALUMINUM SUBSTRATE BY CONTACTING SAID ALUMINUM SUBSTRATE WITH AN AQUEOUS ALKALI METAL ZINCATE SOLUTION AND PLACING THE ZINC COATED ALUMINUM SUBSTRTE INTO THE CONTACT WITH AN AQUEOUS NICKELCOBALT-CONTAINING SOLUTION, SAID NICKEL-COBALT-CONTAINING SOLUTION HAVING THE COMPOSITION:
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US215735A US3202529A (en) | 1962-08-08 | 1962-08-08 | Disposition of nickel-cobalt alloy on aluminum substrates |
GB29703/63A GB1014271A (en) | 1962-08-08 | 1963-07-26 | Deposition of nickel-cobalt alloy on aluminium substrates |
DE19631521457 DE1521457B2 (en) | 1962-08-08 | 1963-08-06 | PROCESS FOR THE PRODUCTION OF MAGNETIZABLE RECORDING LAYERS ON ALUMINUM BASES FOR INFORMATION STORAGE DEVICES |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US215735A US3202529A (en) | 1962-08-08 | 1962-08-08 | Disposition of nickel-cobalt alloy on aluminum substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
US3202529A true US3202529A (en) | 1965-08-24 |
Family
ID=22804164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US215735A Expired - Lifetime US3202529A (en) | 1962-08-08 | 1962-08-08 | Disposition of nickel-cobalt alloy on aluminum substrates |
Country Status (3)
Country | Link |
---|---|
US (1) | US3202529A (en) |
DE (1) | DE1521457B2 (en) |
GB (1) | GB1014271A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3472742A (en) * | 1966-03-15 | 1969-10-14 | Webb James E | Plating nickel on aluminum castings |
US3508924A (en) * | 1965-08-17 | 1970-04-28 | Ball Corp | Lithographic plate and method of making same |
US3718594A (en) * | 1970-11-30 | 1973-02-27 | Eastman Kodak Co | Method of preparing magnetically responsive carrier particles |
US3930081A (en) * | 1972-11-06 | 1975-12-30 | Oxy Metal Industries Corp | Composition and process for displacement plating of zinc surfaces |
US3930899A (en) * | 1972-12-06 | 1976-01-06 | Nippon Piston Ring Co., Ltd. | Method of spraying molybdenum on aluminum or aluminum alloy |
US4171393A (en) * | 1977-06-20 | 1979-10-16 | Eastman Kodak Company | Electroless plating method requiring no reducing agent in the plating bath |
US4197359A (en) * | 1975-10-21 | 1980-04-08 | Rager Edgar A | Hub for a disk storage medium |
DE3315062A1 (en) * | 1982-04-26 | 1983-10-27 | Mitsubishi Denki K.K., Tokyo | METHOD FOR DEPOSITING SOLDER ON ALUMINUM METAL MATERIAL |
EP0289838A2 (en) * | 1987-04-24 | 1988-11-09 | Gerhard Collardin GmbH | Process for the electroless plating of ternary alloys containing nickel and phosphor |
US5141778A (en) * | 1989-10-12 | 1992-08-25 | Enthone, Incorporated | Method of preparing aluminum memory disks having a smooth metal plated finish |
US5368719A (en) * | 1993-05-12 | 1994-11-29 | Hughes Aircraft Company | Method for direct plating of iron on aluminum |
US5391395A (en) * | 1992-12-30 | 1995-02-21 | Witco Corporation | Method of preparing substrates for memory disk applications |
US5534358A (en) * | 1992-10-13 | 1996-07-09 | Hughes Aircraft Company | Iron-plated aluminum alloy parts |
US6146702A (en) * | 1995-06-06 | 2000-11-14 | Enthone-Omi, Inc. | Electroless nickel cobalt phosphorous composition and plating process |
US6629878B1 (en) * | 1998-11-09 | 2003-10-07 | Seagate Technology Llc | Pretreatment for reducing surface treatments defects |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1207218A (en) * | 1914-01-19 | 1916-12-05 | L Aluminium Francais Soc | Process of producing metallic deposits. |
US1627900A (en) * | 1926-08-23 | 1927-05-10 | Eastman Kodak Co | Process of coating aluminum surfaces |
US2142564A (en) * | 1935-11-19 | 1939-01-03 | Schering Kahlbaum Ag | Process for electrodeposition on aluminum and aluminum alloys |
US2650886A (en) * | 1951-01-19 | 1953-09-01 | Aluminum Co Of America | Procedure and bath for plating on aluminum |
US2662831A (en) * | 1950-07-19 | 1953-12-15 | Anderson Brass Works | Method of bonding copper to aluminum or aluminum alloys |
US2694017A (en) * | 1952-09-16 | 1954-11-09 | Gen American Transporation Cor | Process of chemical nickel plating of aluminum and its alloys and baths therefor |
US2761792A (en) * | 1952-06-13 | 1956-09-04 | Eutectic Welding Alloys | Process for preparing aluminum cables for soldering |
-
1962
- 1962-08-08 US US215735A patent/US3202529A/en not_active Expired - Lifetime
-
1963
- 1963-07-26 GB GB29703/63A patent/GB1014271A/en not_active Expired
- 1963-08-06 DE DE19631521457 patent/DE1521457B2/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1207218A (en) * | 1914-01-19 | 1916-12-05 | L Aluminium Francais Soc | Process of producing metallic deposits. |
US1627900A (en) * | 1926-08-23 | 1927-05-10 | Eastman Kodak Co | Process of coating aluminum surfaces |
US2142564A (en) * | 1935-11-19 | 1939-01-03 | Schering Kahlbaum Ag | Process for electrodeposition on aluminum and aluminum alloys |
US2662831A (en) * | 1950-07-19 | 1953-12-15 | Anderson Brass Works | Method of bonding copper to aluminum or aluminum alloys |
US2650886A (en) * | 1951-01-19 | 1953-09-01 | Aluminum Co Of America | Procedure and bath for plating on aluminum |
US2761792A (en) * | 1952-06-13 | 1956-09-04 | Eutectic Welding Alloys | Process for preparing aluminum cables for soldering |
US2694017A (en) * | 1952-09-16 | 1954-11-09 | Gen American Transporation Cor | Process of chemical nickel plating of aluminum and its alloys and baths therefor |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3508924A (en) * | 1965-08-17 | 1970-04-28 | Ball Corp | Lithographic plate and method of making same |
US3472742A (en) * | 1966-03-15 | 1969-10-14 | Webb James E | Plating nickel on aluminum castings |
US3718594A (en) * | 1970-11-30 | 1973-02-27 | Eastman Kodak Co | Method of preparing magnetically responsive carrier particles |
US3930081A (en) * | 1972-11-06 | 1975-12-30 | Oxy Metal Industries Corp | Composition and process for displacement plating of zinc surfaces |
US3930899A (en) * | 1972-12-06 | 1976-01-06 | Nippon Piston Ring Co., Ltd. | Method of spraying molybdenum on aluminum or aluminum alloy |
US4197359A (en) * | 1975-10-21 | 1980-04-08 | Rager Edgar A | Hub for a disk storage medium |
US4171393A (en) * | 1977-06-20 | 1979-10-16 | Eastman Kodak Company | Electroless plating method requiring no reducing agent in the plating bath |
DE3315062A1 (en) * | 1982-04-26 | 1983-10-27 | Mitsubishi Denki K.K., Tokyo | METHOD FOR DEPOSITING SOLDER ON ALUMINUM METAL MATERIAL |
EP0289838A2 (en) * | 1987-04-24 | 1988-11-09 | Gerhard Collardin GmbH | Process for the electroless plating of ternary alloys containing nickel and phosphor |
EP0289838A3 (en) * | 1987-04-24 | 1989-11-08 | Gerhard Collardin GmbH | Process for the electroless plating of ternary alloys containing nickel and phosphor |
US5141778A (en) * | 1989-10-12 | 1992-08-25 | Enthone, Incorporated | Method of preparing aluminum memory disks having a smooth metal plated finish |
US5534358A (en) * | 1992-10-13 | 1996-07-09 | Hughes Aircraft Company | Iron-plated aluminum alloy parts |
US6258415B1 (en) * | 1992-10-13 | 2001-07-10 | Hughes Electronics Corporation | Iron-plated aluminum alloy parts and method for planting same |
US5391395A (en) * | 1992-12-30 | 1995-02-21 | Witco Corporation | Method of preparing substrates for memory disk applications |
US5368719A (en) * | 1993-05-12 | 1994-11-29 | Hughes Aircraft Company | Method for direct plating of iron on aluminum |
US6146702A (en) * | 1995-06-06 | 2000-11-14 | Enthone-Omi, Inc. | Electroless nickel cobalt phosphorous composition and plating process |
US6629878B1 (en) * | 1998-11-09 | 2003-10-07 | Seagate Technology Llc | Pretreatment for reducing surface treatments defects |
Also Published As
Publication number | Publication date |
---|---|
DE1521457A1 (en) | 1969-07-31 |
GB1014271A (en) | 1965-12-22 |
DE1521457B2 (en) | 1971-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3202529A (en) | Disposition of nickel-cobalt alloy on aluminum substrates | |
US3152009A (en) | Electroless nickel plating | |
US2983634A (en) | Chemical nickel plating of magnesium and its alloys | |
US3666529A (en) | Method of conditioning aluminous surfaces for the reception of electroless nickel plating | |
US2454610A (en) | Method for metalization on nonconductors | |
JPS59500869A (en) | Metallizing solutions and methods | |
JPS62246145A (en) | Non-electrolytic deposition magnetic recording medium method | |
US2639997A (en) | Metallization of nonmetallic surfaces | |
JPH06128757A (en) | Zincate solution improved to process aluminum and aluminum alloy and its processing method | |
US2662831A (en) | Method of bonding copper to aluminum or aluminum alloys | |
US3698919A (en) | Preparation of plastic substrates for electroless plating and solutions therefor | |
US2929742A (en) | Electroless deposition of nickel | |
US3736170A (en) | Process for improved adhesion of electroless copper to a polyimide surface | |
US3167491A (en) | Polyfluorinated ethylene polymermetal article and method | |
US3178311A (en) | Electroless plating process | |
JPS6045274B2 (en) | Compositions and methods for chemical stripping of metal deposits | |
US5437887A (en) | Method of preparing aluminum memory disks | |
US3963841A (en) | Catalytic surface preparation for electroless plating | |
KR20010025001A (en) | Low etch alkaline zincate composition and process for zincating aluminum | |
US3467540A (en) | Method of increasing the adhesion of metal to a subsurface | |
US3326700A (en) | Electroless copper plating | |
US3274022A (en) | Palladium deposition | |
GB2237032A (en) | Plating aluminium | |
US3063850A (en) | Metal plating by chemical reduction with amine boranes | |
US3305389A (en) | Process of coating lead with tin |