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US3187083A - Container for an electrical component - Google Patents

Container for an electrical component Download PDF

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Publication number
US3187083A
US3187083A US288144A US28814463A US3187083A US 3187083 A US3187083 A US 3187083A US 288144 A US288144 A US 288144A US 28814463 A US28814463 A US 28814463A US 3187083 A US3187083 A US 3187083A
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United States
Prior art keywords
container
tubular member
base
ceramic
ceramic base
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Expired - Lifetime
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US288144A
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Grimes Milton Jacob
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RCA Corp
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RCA Corp
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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/124Metallic interlayers based on copper
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/125Metallic interlayers based on noble metals, e.g. silver
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/407Copper
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59Aspects relating to the structure of the interlayer
    • C04B2237/592Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62Forming laminates or joined articles comprising holes, channels or other types of openings
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64Forming laminates or joined articles comprising grooves or cuts
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/84Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/88Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates generally to containers, and more particularly to an improved, hermetically sealed container employing a metal-to-ceramic seal.
  • the improved con tainer of the present invention is particularly useful for enclosing electronic components, integrated circuits, and the like.
  • Another object of the present invention is to provide an improved container of the type described that is relatively simple in construction, easy to manufacture, and highly eflicient for hermetically sealing electronic components and the like.
  • the improved container of the present invention comprises a base of ceramic material that has a metalized coating fired on one side and a tubular member that has a tubular wall disposed substantially perpendicularly to the metalized coating.
  • the edge of the end (called the lower end for convenience of description) of the tubular Wall adjacent the base is fixed to the metalized coating by a brazed joint.
  • the other, upper, end of the tubular member is formed with an outwardly extending flange for receiving a cover, as by means of a cold seal.
  • FIG. 1 is a plan view of an improved container according to the present invention, with its top cover removed;
  • FIG. 2 is a side elevational view of the improved container shown in FIG. 1;
  • FIG. 3 is a bottom view of shown in FIG. 1;
  • FIG. 4 is a central, cross-sectional view of one half of the improved container shown in FIG. 1, taken along the line 55, illustrating the tubular member before it is brazed to the metalized coating on the ceramic base;
  • FIG. 5 is a cross-sectional view similar to FIG. 4, but showing the tubular member brazed to the metalized coating of the ceramic base, and also showing a cover, in phantom, fixed to the upper flange of the tubular member.
  • an improved container comprising a ceramic base 12 and a metallic tubular member 14, preferably of copper.
  • the ceramic base 12 may comthe improved container Patented June 1, 1965 prise an insulating material, such as alumina, having an upper surface 16 and a lower surface 18.
  • At least one portion of the upper surface 16 of the base 12 is metalized, as with a molybdenum-manganese fire-on paint.
  • a molybdenum-manganese fire-on paint In the embodiment of the container 10 illustrated in the drawing, an annular, metalized coating 29 is fired on the upper surface 16 adjacent to its outer periphery.
  • a rectangular, metalized coating 22 is fired on the upper surface 16, in its middle portion, to form a part of an electronic circuit (not shown).
  • the base 12 is formed with a plurality of openings 24, each for receiving therethrough a different one of a plurality of pins 26 which are suitably hermetically sealed to the base 12 and provide electrical connections for elec tronic components (not shown).
  • the electronic components are adapted to be disposed on the ceramic base 12, surrounded by the tubular member 14, but they are not illustrated in the drawing for the sake of clarity and because they form no part of the present invention.
  • Each pin 26 may be fixed, as by welding, to a separate electrical connector (not shown) for external circuit connection.
  • a washer 38 of brazing material such as BT eutectic solder (a copper-silver solder) is placed between the metalized coating 29 on the base 12 and the lower edge 40 of the tubular wall 42 of the tubular member 14, as shown in FIG. 4.
  • BT eutectic solder a copper-silver solder
  • the washer 38 of solder melts and forms a brazed joint with fillets 43 and 45 (see FIG. 5) between the metalized coating and the inner and outer walls, respectively, of the tubular member 14 adjacent to its lower edge 40.
  • the tubular member 14 is formed with an outwardly extending flange 44 at its upper end for receiving a soft metal cover 46 thereon, as shown in phantom in FIG. 5.
  • the cover 46 may be a soft metal disc that is adapted to be sealed to the flange 44, as by a cold pressed seal.
  • a container for electrical components comprising, in combination,

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Casings For Electric Apparatus (AREA)

Description

June 1, 1965 M. J. GRIMES 3,137,083
CONTAINER FOR AN ELECTRICAL COMPONENT Filed June 17, 1963 INVENTOR. 7 M14 ro/v J 47/4455 4? fi a Alia-lie United States Patent 3 187,983 CONTAINER FOR AN ELE(ITRICAL COMPONENT Milton Jacob Grimes, Flemington, N.J., assignor to Radio Corporation of America, a corporation of Delaware Filed June 17, 1963, Scr. No. 288,144 1 Claim. (Cl. 174-505) This invention relates generally to containers, and more particularly to an improved, hermetically sealed container employing a metal-to-ceramic seal. The improved con tainer of the present invention is particularly useful for enclosing electronic components, integrated circuits, and the like.
It has been proposed to enclose electronic components that are mounted on a ceramic base by surrounding the electronic components with a metallic tubular member and covering the open end of the tubular member. The tubular members were formed with either an outwardly or an inwardly extending flange at each end, and one of these flanges was soldered to a metalized surface of the ceramic base. A metal cover was sealed to the other flange of the tubular member. Since there was usually a difference in the coefficients of thermal expansion between the ceramic base and the tubular member, severe thermal stresses were set up in the ceramic base under normal operating conditions, often resulting in a fracture of the ceramic base and, thereby, breaking the hermetic seal of the enclosure.
It is an object of the present invention to provide a container employing an improved metal-to-ceramic seal by means of which the danger of cracking the ceramic material due to thermal stresses is greatly reduced.
Another object of the present invention is to provide an improved container of the type described that is relatively simple in construction, easy to manufacture, and highly eflicient for hermetically sealing electronic components and the like.
Briefly, the improved container of the present invention comprises a base of ceramic material that has a metalized coating fired on one side and a tubular member that has a tubular wall disposed substantially perpendicularly to the metalized coating. The edge of the end (called the lower end for convenience of description) of the tubular Wall adjacent the base is fixed to the metalized coating by a brazed joint. The other, upper, end of the tubular member is formed with an outwardly extending flange for receiving a cover, as by means of a cold seal.
The improved features of the present invention, both as to its organization and method of operation, as well as additional objects and advantages thereof, will be more readily understood from the following description, when read in connection with the accompanying drawing, in which similar reference characters designate similar parts throughout, and in which:
FIG. 1 is a plan view of an improved container according to the present invention, with its top cover removed;
FIG. 2 is a side elevational view of the improved container shown in FIG. 1;
FIG. 3 is a bottom view of shown in FIG. 1;
FIG. 4 is a central, cross-sectional view of one half of the improved container shown in FIG. 1, taken along the line 55, illustrating the tubular member before it is brazed to the metalized coating on the ceramic base; and
FIG. 5 is a cross-sectional view similar to FIG. 4, but showing the tubular member brazed to the metalized coating of the ceramic base, and also showing a cover, in phantom, fixed to the upper flange of the tubular member.
Referring, now, with greater particularity to the drawing, there is shown an improved container comprising a ceramic base 12 and a metallic tubular member 14, preferably of copper. The ceramic base 12 may comthe improved container Patented June 1, 1965 prise an insulating material, such as alumina, having an upper surface 16 and a lower surface 18.
At least one portion of the upper surface 16 of the base 12 is metalized, as with a molybdenum-manganese fire-on paint. In the embodiment of the container 10 illustrated in the drawing, an annular, metalized coating 29 is fired on the upper surface 16 adjacent to its outer periphery. A rectangular, metalized coating 22 is fired on the upper surface 16, in its middle portion, to form a part of an electronic circuit (not shown).
The base 12 is formed with a plurality of openings 24, each for receiving therethrough a different one of a plurality of pins 26 which are suitably hermetically sealed to the base 12 and provide electrical connections for elec tronic components (not shown). The electronic components are adapted to be disposed on the ceramic base 12, surrounded by the tubular member 14, but they are not illustrated in the drawing for the sake of clarity and because they form no part of the present invention. Each pin 26 may be fixed, as by welding, to a separate electrical connector (not shown) for external circuit connection.
Means are provided to fix the tubular member 14 to the ceramic base 12 substantially perpendicular thereto to provide a hermetic seal therebetween. To this end, a washer 38 of brazing material, such as BT eutectic solder (a copper-silver solder) is placed between the metalized coating 29 on the base 12 and the lower edge 40 of the tubular wall 42 of the tubular member 14, as shown in FIG. 4. When heated to a temperature above 779 C., preferably 850 (1., the washer 38 of solder melts and forms a brazed joint with fillets 43 and 45 (see FIG. 5) between the metalized coating and the inner and outer walls, respectively, of the tubular member 14 adjacent to its lower edge 40.
Since only the narrow, lower edge of the tubular member 14 is fixed to the ceramic base 12, the stresses due to any difference in the coefficients of thermal expansion between the tubular member 14 and the ceramic base 12 are greatly reduced. It has been found that, unless such stresses are reduced, the ceramic base tends to crack, thereby breaking the hermetic seal. The smaller the area on the metalized coating 20 that is contacted by the lower edge 40 of the tubular member 14, the smaller will be the stresses produced in the ceramic base 12.
The tubular member 14 is formed with an outwardly extending flange 44 at its upper end for receiving a soft metal cover 46 thereon, as shown in phantom in FIG. 5. The cover 46 may be a soft metal disc that is adapted to be sealed to the flange 44, as by a cold pressed seal.
From the foregoing description, it will be apparent that there has been provided an improved container with a metal-to-ceramic seal adapted to reduce stresses in the ceramic part due to changes in the temperature of the container during the manufacturing processes and the operation of the components within the container. While only one improved container has been described herein, variations in the structure coming within the spirit of this invention will, no doubt, readily suggest themselves to those skilled in the art. Hence, it is desired that the foregoing shall be considered as illustrative and not in a limiting sense.
What is claimed is:
A container for electrical components comprising, in combination,
(a) a base comprising a water of alumina for supporting said components thereon, said wafer having a flat upper and lower side,
(b) a metalized coating on at least a portion of one of said sides of said base,
(c) a tubular member of copper open at both ends and comprising a tubular wall disposed substantially perpendicularly to said metalized coating, one end of A u? J said tubular wall having only its edge fixed to said 2,647,070 7/53 Litton 29-472.9 metalized coating with a brazed butt joint, the other 2,667,427 1/ 54 Noite 117-160 X of said ends of said tubular member comprising an 2,866,928 12/58 Blundell 317-234 outwardly extending flange, and 2,882,116 4/59 Williams. (d) a cover of a soft metal cold pressed sealed to said 5 2,913,077 11/59 DAltroy et al. 174-15061 metal flange, whereby to provide a hermetically 3,020,454 2/62 Dixon. sealed container'for said components. 3,057,445 10/62 Bronnes 189-365 3,160,798 12/64 Lootens et al. 317-234 References Cited by the Examiner UNITED STATES PATENTS 10 FOREIGN PATENTS 1 691 77 11 2 1d 761,662 11/56 Great Britain. 2,125,113 7/38 Kling 220-23 2,285,220 6/42 Mona-H JOHN F. BURNS, Przmary Examzner. 2,373,720 4/45 Stupakoff 189-365 15 THERON E. CONDON, DARRELL L. CLAY,
2,402,029 6/46 Dinnick et al 189-365 X E iner
US288144A 1963-06-17 1963-06-17 Container for an electrical component Expired - Lifetime US3187083A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3265802A (en) * 1963-11-18 1966-08-09 Mitronics Inc Cap for hermetically sealed semiconductor
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3355564A (en) * 1966-06-03 1967-11-28 John W Ranheim Vacuum-type circuit interrupter
US3364400A (en) * 1964-10-22 1968-01-16 Texas Instruments Inc Microwave transistor package
US3665592A (en) * 1970-03-18 1972-05-30 Vernitron Corp Ceramic package for an integrated circuit
US5726386A (en) * 1993-09-10 1998-03-10 Calhoun Pitch Company, Inc. Potted electrical circuits

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1691778A (en) * 1927-04-18 1928-11-13 Wilcox Products Corp Method of forming valve tappets
US2125113A (en) * 1936-06-17 1938-07-26 Gen Electric Evacuated receptacle
US2285220A (en) * 1941-07-28 1942-06-02 Jacque C Morrell Container
US2373720A (en) * 1940-08-02 1945-04-17 Stupakoff Ceramic And Mfg Co Composite ceramic and metal structure and method of making the same
US2402029A (en) * 1942-08-29 1946-06-11 Westinghouse Electric Corp Electron device and method of manufacture
US2647070A (en) * 1950-11-17 1953-07-28 Charles V Litton Method of making metal-to-ceramic seals
US2667427A (en) * 1951-07-27 1954-01-26 Gen Electric Method of metalizing a ceramic member
GB761662A (en) * 1953-08-04 1956-11-21 Vickers Electrical Co Ltd Improvements relating to joints between metal and dielectric materials
US2866928A (en) * 1955-05-23 1958-12-30 British Thomson Houston Co Ltd Electric rectifiers employing semi-conductors
US2882116A (en) * 1956-09-20 1959-04-14 Eitel Mccullough Inc Method of making electron tubes
US2913077A (en) * 1958-09-11 1959-11-17 Bell Telephone Labor Inc Gas seal
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices
US3057445A (en) * 1958-05-23 1962-10-09 Philips Corp Metal-to-ceramic seal and method of making same
US3160798A (en) * 1959-12-07 1964-12-08 Gen Electric Semiconductor devices including means for securing the elements

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1691778A (en) * 1927-04-18 1928-11-13 Wilcox Products Corp Method of forming valve tappets
US2125113A (en) * 1936-06-17 1938-07-26 Gen Electric Evacuated receptacle
US2373720A (en) * 1940-08-02 1945-04-17 Stupakoff Ceramic And Mfg Co Composite ceramic and metal structure and method of making the same
US2285220A (en) * 1941-07-28 1942-06-02 Jacque C Morrell Container
US2402029A (en) * 1942-08-29 1946-06-11 Westinghouse Electric Corp Electron device and method of manufacture
US2647070A (en) * 1950-11-17 1953-07-28 Charles V Litton Method of making metal-to-ceramic seals
US2667427A (en) * 1951-07-27 1954-01-26 Gen Electric Method of metalizing a ceramic member
GB761662A (en) * 1953-08-04 1956-11-21 Vickers Electrical Co Ltd Improvements relating to joints between metal and dielectric materials
US2866928A (en) * 1955-05-23 1958-12-30 British Thomson Houston Co Ltd Electric rectifiers employing semi-conductors
US2882116A (en) * 1956-09-20 1959-04-14 Eitel Mccullough Inc Method of making electron tubes
US3057445A (en) * 1958-05-23 1962-10-09 Philips Corp Metal-to-ceramic seal and method of making same
US2913077A (en) * 1958-09-11 1959-11-17 Bell Telephone Labor Inc Gas seal
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices
US3160798A (en) * 1959-12-07 1964-12-08 Gen Electric Semiconductor devices including means for securing the elements

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3265802A (en) * 1963-11-18 1966-08-09 Mitronics Inc Cap for hermetically sealed semiconductor
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