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GB761662A - Improvements relating to joints between metal and dielectric materials - Google Patents

Improvements relating to joints between metal and dielectric materials

Info

Publication number
GB761662A
GB761662A GB2153153A GB2153153A GB761662A GB 761662 A GB761662 A GB 761662A GB 2153153 A GB2153153 A GB 2153153A GB 2153153 A GB2153153 A GB 2153153A GB 761662 A GB761662 A GB 761662A
Authority
GB
United Kingdom
Prior art keywords
per cent
copper
coating
metal
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2153153A
Inventor
Fred Ashworth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metropolitan Vickers Electrical Co Ltd
Original Assignee
Metropolitan Vickers Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metropolitan Vickers Electrical Co Ltd filed Critical Metropolitan Vickers Electrical Co Ltd
Priority to GB2153153A priority Critical patent/GB761662A/en
Priority to FR1112734D priority patent/FR1112734A/en
Publication of GB761662A publication Critical patent/GB761662A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/123—Metallic interlayers based on iron group metals, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/34—Oxidic
    • C04B2237/341—Silica or silicates
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    • C04B2237/343—Alumina or aluminates
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
    • C—CHEMISTRY; METALLURGY
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/84—Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/88—Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Lasers (AREA)
  • Ceramic Products (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)

Abstract

761,662. Soldering and brazing. METROPOLITAN-VICKERS ELECTRICAL CO., Ltd. Aug. 4, 1954 [Aug. 4, 1953], No. 21531/53. Class 83 (4). In joining a metal part to a part of dielectric material, e.g. of glass, porcelain or semi-conductive material, the latter is coated with nickel-chromium alloy by thermal evaporation in vacuo and the coating or further metal applied thereto is soldered or brazed to the metal part. The parts should preferably have similar temperature co-efficients of expansion and thus may be of a 28 per cent nickel, 54 per cent iron, 18 per cent cobalt alloy and a borosilicate glass or an aluminous porcelain formed of a mixture corresponding to 3Al 2 O 3 2SiO 2 bonded by a fusible glass. When soft soldering is used the freshly deposited coating may be tinned without flux or a further coating, e.g. of copper or tin may be deposited on the alloy by sputtering, electrodeposition, spraying or thermal evaporation in vacuo. In an example, an 80 per cent nickel 20 per cent chromium alloy is deposited on a glass plate and a copper film is deposited thereon by thermal evaporation, the surface to be coated being kept at 300-450‹ C., and a copper wire is soft-soldered to the copper film by a resin-cored solder. When hard soldering is to be used a thick further coating may be electrodeposited on the alloy coating or on to a further coating deposited on the alloy coating by thermal evaporation. In an example a first film of 80 per cent nickel, 20 per cent chromium and a second film of copper are deposited by thermal evaporation on an alumina ceramic base and the copper is built up to 0.005 inch thickness by electrodeposition. A metal disc is then soldered to the copper with a solder of composition silver 49-51 per cent, copper 14-16 per cent, zinc 15-17 per cent, and cadmium 18-20 per cent. In one embodiment the end of a glass or ceramic tube 2, Fig. 2, is coated as described in the examples and a metal tube 1 is soldered thereto, a ring of solder 6a being melted by an induction coil 7 to form a solder fillet. In a modification, Fig. 5, both the end face and a circumferential surface of a glass or ceramic tube 2 are coated and the tube is soldered into a recess in a metal tube 1 by induction heating. In a further modification the coated end of a glass or ceramic tube 2, Fig. 7, is soldered into a groove 11 in a metal tube 1a, solder being provided as a ring in the groove or as a coating on the grooves surfaces and melted by induction heating. Two ceramic tubes are secured in this manner into perpendicular faces in a metal block.
GB2153153A 1953-08-04 1953-08-04 Improvements relating to joints between metal and dielectric materials Expired GB761662A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2153153A GB761662A (en) 1953-08-04 1953-08-04 Improvements relating to joints between metal and dielectric materials
FR1112734D FR1112734A (en) 1953-08-04 1954-08-04 Improvements at joints between metallic and dielectric substances

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2153153A GB761662A (en) 1953-08-04 1953-08-04 Improvements relating to joints between metal and dielectric materials

Publications (1)

Publication Number Publication Date
GB761662A true GB761662A (en) 1956-11-21

Family

ID=10164472

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2153153A Expired GB761662A (en) 1953-08-04 1953-08-04 Improvements relating to joints between metal and dielectric materials

Country Status (2)

Country Link
FR (1) FR1112734A (en)
GB (1) GB761662A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187083A (en) * 1963-06-17 1965-06-01 Rca Corp Container for an electrical component
US3265805A (en) * 1964-02-03 1966-08-09 Power Components Inc Semiconductor power device
EP0066538A1 (en) * 1981-05-22 1982-12-08 Montres Rado S.A. Watch case
EP0170444A2 (en) * 1984-07-31 1986-02-05 THE GENERAL ELECTRIC COMPANY, p.l.c. Solderable contact materials
ITRM20090599A1 (en) * 2009-11-19 2011-05-20 V L T Vacuum Lasers Technology S R L "GLASS-METAL JOINT FOR VACUUM BRAZING OF A COMPONENT FOR RECEIVER PIPES FOR THERMODYNAMIC SOLAR SYSTEMS, AND METHOD FOR ITS REALIZATION"
WO2013186354A1 (en) * 2012-06-14 2013-12-19 Aktiebolaget Skf Machine arrangement

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3224825A1 (en) * 1982-07-02 1984-01-05 Siemens AG, 1000 Berlin und 8000 München Ceramic copper solder joints
CN107061873A (en) * 2012-03-22 2017-08-18 圣戈本陶瓷及塑料股份有限公司 Extension tube structure and forming method thereof
US9290311B2 (en) 2012-03-22 2016-03-22 Saint-Gobain Ceramics & Plastics, Inc. Sealed containment tube

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187083A (en) * 1963-06-17 1965-06-01 Rca Corp Container for an electrical component
US3265805A (en) * 1964-02-03 1966-08-09 Power Components Inc Semiconductor power device
EP0066538A1 (en) * 1981-05-22 1982-12-08 Montres Rado S.A. Watch case
EP0170444A2 (en) * 1984-07-31 1986-02-05 THE GENERAL ELECTRIC COMPANY, p.l.c. Solderable contact materials
EP0170444A3 (en) * 1984-07-31 1988-02-17 THE GENERAL ELECTRIC COMPANY, p.l.c. Solderable contact materials
ITRM20090599A1 (en) * 2009-11-19 2011-05-20 V L T Vacuum Lasers Technology S R L "GLASS-METAL JOINT FOR VACUUM BRAZING OF A COMPONENT FOR RECEIVER PIPES FOR THERMODYNAMIC SOLAR SYSTEMS, AND METHOD FOR ITS REALIZATION"
WO2013186354A1 (en) * 2012-06-14 2013-12-19 Aktiebolaget Skf Machine arrangement
CN104395724A (en) * 2012-06-14 2015-03-04 Skf公司 Machine arrangement
US9897514B2 (en) 2012-06-14 2018-02-20 Aktiebolaget Skf Machine arrangement
CN104395724B (en) * 2012-06-14 2018-08-10 Skf公司 Mechanical device

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