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US20130306294A1 - Heat dissipation device with fastener - Google Patents

Heat dissipation device with fastener Download PDF

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Publication number
US20130306294A1
US20130306294A1 US13/564,742 US201213564742A US2013306294A1 US 20130306294 A1 US20130306294 A1 US 20130306294A1 US 201213564742 A US201213564742 A US 201213564742A US 2013306294 A1 US2013306294 A1 US 2013306294A1
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US
United States
Prior art keywords
conductive plate
groove
hole
heat dissipation
dissipation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/564,742
Inventor
Ben-Fan Xia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furui Precise Component Kunshan Co Ltd, Foxconn Technology Co Ltd filed Critical Furui Precise Component Kunshan Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: XIA, BEN-FAN
Publication of US20130306294A1 publication Critical patent/US20130306294A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to heat dissipation devices and, more particularly, to a heat dissipation device with a fastener for fastening the heat dissipation device on a printed circuit board.
  • a fastener In order to keep the heat sink in intimate contact with the electronic device, a fastener extends through the heat sink and a printed circuit board where the electronic device is located to fasten the heat sink to the electronic device.
  • the fastener is usually pre-assembled on the heat sink by an annular collar which snaps with an end of the fastener extending beyond the heat sink, for facilitating transportation.
  • the collar is prone to disengage from the fastener when subjected to an outer force during transportation, resulting in falling of the fastener from the heat sink.
  • FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure.
  • FIG. 2 is an assembled view of the heat dissipation device of FIG. 1 , wherein a fastener of the heat dissipation device is in a released position.
  • FIG. 3 is a cross-sectional view of the heat dissipation device of FIG. 2 , taken along line thereof.
  • FIG. 4 is an assembled view of the heat dissipation device of FIG. 1 , wherein a fastener of the heat dissipation device is in a locked position.
  • FIG. 5 is a cross-sectional view of the heat dissipation device of FIG. 4 , taken along line V-V thereof.
  • FIG. 6 is a schematic view of a conductive plate of a heat dissipation device in accordance with a second embodiment of the disclosure.
  • FIG. 7 is a schematic view of a conductive plate of a heat dissipation device in accordance with a third embodiment of the disclosure.
  • FIG. 8 is a schematic view of a conductive plate of a heat dissipation device in accordance with a fourth embodiment of the disclosure.
  • the heat dissipation device 100 is for dissipating heat generated by an electronic device (not shown) mounted on a printed circuit board (not shown).
  • the heat dissipation device 100 includes a conductive plate 10 , and a fastener 20 for fastening the heat dissipation device 100 on the printed circuit board.
  • the conductive plate 10 defines a supporting portion 14 through the conductive plate 10 .
  • the supporting portion 14 includes a hole 142 , a first groove 144 , and a second groove 146 communicating with the hole 142 and the first groove 144 .
  • the hole 142 extends through the conductive plate 10 and is spaced from an outer edge of the conductive plate 10 .
  • the second groove 146 is located above and coaxial with the first groove 144 .
  • the hole 142 has a diameter smaller than that of the second groove 146 but larger than that of the first groove 144 .
  • a step portion 148 is formed at a joint of the first and second grooves 144 , 146 .
  • the fastener 20 comprises a fastening element 21 , and an elastic element circling the fastening element 21 .
  • the elastic element is a spring 23 .
  • the fastening element 21 comprises a column-shaped pole portion 212 , a circular head portion 211 extending from a top end of the pole portion 212 , and a column-shaped engaging portion 210 extending from an opposite bottom end of the pole portion 212 .
  • the pole portion 212 has a diameter smaller than that of the first groove 144 .
  • the head portion 211 has a diameter larger than the inner diameter of the spring 23 .
  • a flange 213 protrudes horizontally and outwardly from a periphery of the pole portion 212 adjacent to the engaging portion 210 .
  • the flange 213 has a diameter smaller than a diameter of the hole 142 and an inner diameter of the spring 23 but larger than a diameter of the first groove 144 of the supporting portion 14 .
  • the flange 213 extends through the spring 23 .
  • the spring 23 is sleeved on the pole portion 212 of the fastening element 21 .
  • the spring 23 has an outer diameter larger than the diameter of the hole 142 but smaller than the diameter of the second groove 146 .
  • a limiting portion 214 protrudes from the circumference of the pole portion 212 adjacent to the head portion 211 .
  • the limiting portion 214 has a diameter smaller than the inner diameter of the spring
  • the flange 213 extends through the spring 23 , so that the spring 23 is sleeved on the pole portion 212 of the fastening element 21 .
  • the flange 213 of the fastening element 21 then extends down through the hole 142 from a top side of the conductive plate 10 , so that the spring 23 and the flange 213 are respectively located at top and bottom sides of the conductive plate 10 , the spring 23 elastically abuts the top side of the conductive plate 10 located at a periphery of the hole 142 .
  • the fastening element 21 is then moved horizontally towards the first groove 144 , whereby the pole portion 212 enters the first groove 144 , the flange 213 abuts the bottom side of the conductive plate 10 located at a periphery of the first groove 144 , the spring 213 is received in the second groove 146 and elastically abuts against the step portion 148 .
  • the fastener 20 is securely fastened on the conductive plate 10 .
  • a conductive plate 10 a of a heat dissipation device in accordance with a second embodiment of the disclosure is shown.
  • the conductive plate 10 a defines a supporting portion 14 a through the conductive plate 10 a .
  • the supporting portion 14 a includes a hole 142 a , a first groove 144 a , and a second groove 146 a communicating with the hole 142 a and the first groove 144 a .
  • the second groove 146 a is located above and coaxial with the first groove 144 a .
  • the hole 142 a extends through the conductive plate 10 a .
  • the differences between the first embodiment and the second embodiment are in that: the hole 142 a communicates with an outer edge of the conductive plate 10 a.
  • a conductive plate 10 b of a heat dissipation device in accordance with a third embodiment of the disclosure is shown.
  • the conductive plate 10 b defines a supporting portion 14 b through the conductive plate 10 b .
  • the supporting portion 14 b includes a hole 142 b , a first groove 144 b , and a second groove 146 b communicating with the hole 142 b and the first groove 144 b .
  • the second groove 146 b is located above and coaxial with the first groove 144 b .
  • a protrusion 12 b protrudes from a bottom of the conductive plate 10 b corresponding to the supporting portion 14 b
  • a concave portion 16 b is defined in a top of the conductive plate 10 b corresponding to the protrusion 12 b
  • the hole 142 b and the first groove 144 b extend through the protrusion 12 b.
  • a conductive plate 10 c of a heat dissipation device in accordance with a fourth embodiment of the disclosure is shown.
  • the conductive plate 10 c defines a supporting portion 14 c through the conductive plate 10 c .
  • the supporting portion 14 c includes a hole 142 c , a first groove 144 c , and a second groove 146 c communicating with the hole 142 c and the first groove 144 c .
  • the second groove 146 c is located above and coaxial with the first groove 144 c .
  • a protrusion 12 c protrudes from a bottom of the conductive plate 10 c corresponding to the supporting portion 14 c
  • a concave portion 16 c is defined in a top of the conductive plate 10 c corresponding to the protrusion 12 c
  • the hole 142 c and the first groove 144 c extend through the protrusion 12 c.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion includes a hole and a groove communicating with the hole. A flange protrudes from a circumference of the pole portion. The pole portion enters the groove. The flange abuts a bottom of the conductive plate. The elastic element elastically abuts the top of the conductive plate.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to heat dissipation devices and, more particularly, to a heat dissipation device with a fastener for fastening the heat dissipation device on a printed circuit board.
  • 2. Description of Related Art
  • It is well known that, during operation of a computer, electronic devices such as central processing units (CPUs) frequently generate large amounts of heat. The heat must be quickly removed from the electronic device to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the electronic device to absorb heat from the electronic device. The heat absorbed by the heat sink is then dissipated to ambient air.
  • In order to keep the heat sink in intimate contact with the electronic device, a fastener extends through the heat sink and a printed circuit board where the electronic device is located to fasten the heat sink to the electronic device. However, before the heat sink mounted on the electronic device, the fastener is usually pre-assembled on the heat sink by an annular collar which snaps with an end of the fastener extending beyond the heat sink, for facilitating transportation. However, the collar is prone to disengage from the fastener when subjected to an outer force during transportation, resulting in falling of the fastener from the heat sink.
  • What is needed, therefore, is a heat dissipation device with a fastener which can overcome the limitations described.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure.
  • FIG. 2 is an assembled view of the heat dissipation device of FIG. 1, wherein a fastener of the heat dissipation device is in a released position.
  • FIG. 3 is a cross-sectional view of the heat dissipation device of FIG. 2, taken along line thereof.
  • FIG. 4 is an assembled view of the heat dissipation device of FIG. 1, wherein a fastener of the heat dissipation device is in a locked position.
  • FIG. 5 is a cross-sectional view of the heat dissipation device of FIG. 4, taken along line V-V thereof.
  • FIG. 6 is a schematic view of a conductive plate of a heat dissipation device in accordance with a second embodiment of the disclosure.
  • FIG. 7 is a schematic view of a conductive plate of a heat dissipation device in accordance with a third embodiment of the disclosure.
  • FIG. 8 is a schematic view of a conductive plate of a heat dissipation device in accordance with a fourth embodiment of the disclosure.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 1-3, a heat dissipation device 100 in accordance with a first embodiment of the disclosure is shown. The heat dissipation device 100 is for dissipating heat generated by an electronic device (not shown) mounted on a printed circuit board (not shown). The heat dissipation device 100 includes a conductive plate 10, and a fastener 20 for fastening the heat dissipation device 100 on the printed circuit board.
  • The conductive plate 10 defines a supporting portion 14 through the conductive plate 10. The supporting portion 14 includes a hole 142, a first groove 144, and a second groove 146 communicating with the hole 142 and the first groove 144. The hole 142 extends through the conductive plate 10 and is spaced from an outer edge of the conductive plate 10. The second groove 146 is located above and coaxial with the first groove 144. The hole 142 has a diameter smaller than that of the second groove 146 but larger than that of the first groove 144. A step portion 148 is formed at a joint of the first and second grooves 144, 146.
  • The fastener 20 comprises a fastening element 21, and an elastic element circling the fastening element 21. In this embodiment, the elastic element is a spring 23. The fastening element 21 comprises a column-shaped pole portion 212, a circular head portion 211 extending from a top end of the pole portion 212, and a column-shaped engaging portion 210 extending from an opposite bottom end of the pole portion 212.
  • The pole portion 212 has a diameter smaller than that of the first groove 144. The head portion 211 has a diameter larger than the inner diameter of the spring 23. A flange 213 protrudes horizontally and outwardly from a periphery of the pole portion 212 adjacent to the engaging portion 210. The flange 213 has a diameter smaller than a diameter of the hole 142 and an inner diameter of the spring 23 but larger than a diameter of the first groove 144 of the supporting portion 14. The flange 213 extends through the spring 23. The spring 23 is sleeved on the pole portion 212 of the fastening element 21. The spring 23 has an outer diameter larger than the diameter of the hole 142 but smaller than the diameter of the second groove 146. A limiting portion 214 protrudes from the circumference of the pole portion 212 adjacent to the head portion 211. The limiting portion 214 has a diameter smaller than the inner diameter of the spring 23.
  • Also referring to FIGS. 4-5, in assembly, the flange 213 extends through the spring 23, so that the spring 23 is sleeved on the pole portion 212 of the fastening element 21. The flange 213 of the fastening element 21 then extends down through the hole 142 from a top side of the conductive plate 10, so that the spring 23 and the flange 213 are respectively located at top and bottom sides of the conductive plate 10, the spring 23 elastically abuts the top side of the conductive plate 10 located at a periphery of the hole 142. The fastening element 21 is then moved horizontally towards the first groove 144, whereby the pole portion 212 enters the first groove 144, the flange 213 abuts the bottom side of the conductive plate 10 located at a periphery of the first groove 144, the spring 213 is received in the second groove 146 and elastically abuts against the step portion 148. Thus, the fastener 20 is securely fastened on the conductive plate 10.
  • Referring to FIG. 6, a conductive plate 10 a of a heat dissipation device in accordance with a second embodiment of the disclosure is shown. The conductive plate 10 a defines a supporting portion 14 a through the conductive plate 10 a. The supporting portion 14 a includes a hole 142 a, a first groove 144 a, and a second groove 146 a communicating with the hole 142 a and the first groove 144 a. The second groove 146 a is located above and coaxial with the first groove 144 a. The hole 142 a extends through the conductive plate 10 a. The differences between the first embodiment and the second embodiment are in that: the hole 142 a communicates with an outer edge of the conductive plate 10 a.
  • Referring to FIG. 7, a conductive plate 10 b of a heat dissipation device in accordance with a third embodiment of the disclosure is shown. The conductive plate 10 b defines a supporting portion 14 b through the conductive plate 10 b. The supporting portion 14 b includes a hole 142 b, a first groove 144 b, and a second groove 146 b communicating with the hole 142 b and the first groove 144 b. The second groove 146 b is located above and coaxial with the first groove 144 b. The differences between the first embodiment and the third embodiment are in that: a protrusion 12 b protrudes from a bottom of the conductive plate 10 b corresponding to the supporting portion 14 b, a concave portion 16 b is defined in a top of the conductive plate 10 b corresponding to the protrusion 12 b, the hole 142 b and the first groove 144 b extend through the protrusion 12 b.
  • Referring to FIG. 8, a conductive plate 10 c of a heat dissipation device in accordance with a fourth embodiment of the disclosure is shown. The conductive plate 10 c defines a supporting portion 14 c through the conductive plate 10 c. The supporting portion 14 c includes a hole 142 c, a first groove 144 c, and a second groove 146 c communicating with the hole 142 c and the first groove 144 c. The second groove 146 c is located above and coaxial with the first groove 144 c. The differences between the second embodiment and the fourth embodiment are in that: a protrusion 12 c protrudes from a bottom of the conductive plate 10 c corresponding to the supporting portion 14 c, a concave portion 16 c is defined in a top of the conductive plate 10 c corresponding to the protrusion 12 c, the hole 142 c and the first groove 144 c extend through the protrusion 12 c.
  • It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (18)

What is claimed is:
1. A heat dissipation device, comprising:
a conductive plate defining a supporting portion through the conductive plate, the supporting portion comprising a hole and a first groove communicating with the hole; and
a fastener comprising a fastening element and an elastic element around the fastening element, the fastening element comprising a pole portion, a head portion formed at one end of the pole portion, an engaging portion formed at another opposite end of the pole portion, and a flange protruding from an outer periphery of the pole portion between the engaging portion and the head portion, the flange having a diameter smaller than that of the hole but larger than a diameter of the first groove of the supporting portion, the pole portion having a diameter smaller than that of the first groove, the flange extending through the hole from a top side of the conductive plate, whereby the elastic element and the flange are respectively located at top and bottom sides of the conductive plate, the fastening element being then moved horizontally towards the first groove, whereby the pole portion enters the first groove, the flange abuts the bottom side of the conductive plate at a periphery of the first groove, the elastic element elastically abuts against the top side of the conductive plate at the periphery of the first groove.
2. The heat dissipation device of claim 1, wherein the supporting portion further comprises a second groove communicating with the hole and the first groove, the second groove being located above and coaxial with the first groove, the second groove having a diameter larger than that of the hole, a step portion being formed at a joint of the first and second grooves, the elastic element being received in the second groove and elastically abutting the step portion.
3. The heat dissipation device of claim 1, wherein the hole extends through the conductive plate and communicating with an outer edge of the conductive plate.
4. The heat dissipation device of claim 3, wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion.
5. The heat dissipation device of claim 1, wherein the hole extends through the conductive plate and is spaced from an outer edge of the conductive plate.
6. The heat dissipation device of claim 5, wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion.
7. The heat dissipation device of claim 1, wherein the elastic element has an inner diameter larger than the diameter of the flange, the flange extending through the elastic element, the elastic element being sleeved on the pole portion of the fastening element.
8. The heat dissipation device of claim 1, wherein a limiting portion protrudes from the circumference of the pole portion adjacent to the head portion, the limiting portion has a diameter smaller than the inner diameter of the elastic element.
9. The heat dissipation device of claim 1, wherein the head portion has a diameter larger than the inner diameter of the elastic element, the elastic element being compressed between the head portion and the conductive plate.
10. A heat dissipation device, comprising:
a conductive plate defining a supporting portion through the conductive plate, the supporting portion comprising a hole and a first groove communicating with the hole; and
a fastener comprising a fastening element and a elastic element around the fastening element, the fastening element comprising a pole portion, a head portion formed at one end of the pole portion, and a flange protruding from an outer periphery of the pole portion, the elastic element having an outer diameter larger than a diameter of the hole, the flange having a diameter smaller than that of the hole but larger than a diameter of the first groove of the supporting portion, the pole portion having a diameter smaller than that of the first groove, the flange extending through the hole from a top side of the conductive plate, whereby the flange is located at a bottom side of the conductive plate, the elastic element elastically abuts the top side of the conductive plate at a periphery of the hole, the fastening element being then moved horizontally towards the first groove, whereby the pole portion enters the first groove, the flange abuts the bottom side of the conductive plate at a periphery of the first groove, the elastic element elastically abuts against the top side of the conductive plate at the periphery of the first groove.
11. The heat dissipation device of claim 10, wherein the supporting portion further comprises a second groove communicating with the hole and the first groove, the second groove being located above and coaxial with the first groove, the second groove having a diameter larger than that of the hole, a step portion being formed at a joint of the first and second grooves, the elastic element being received in the second groove and elastically abutting the step portion.
12. The heat dissipation device of claim 10, wherein the hole extends through the conductive plate and communicating with an outer edge of the conductive plate.
13. The heat dissipation device of claim 12, wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion.
14. The heat dissipation device of claim 10, wherein the hole extends through the conductive plate and is spaced from an outer edge of the conductive plate.
15. The heat dissipation device of claim 14, wherein a protrusion protrudes from the bottom side of the conductive plate corresponding to the supporting portion, a concave portion being defined in the top side of the conductive plate corresponding to the protrusion, the hole and the first groove extending through the protrusion.
16. The heat dissipation device of claim 10, wherein an inner diameter of the elastic element is larger than the diameter of the flange, the flange extending through the elastic element, the elastic element being sleeved on the pole portion of the fastening element.
17. The heat dissipation device of claim 10, wherein a limiting portion protrudes from the outer periphery of the pole portion adjacent to the head portion, the limiting portion has a diameter smaller than an inner diameter of the elastic element.
18. The heat dissipation device of claim 10, wherein the head portion has a diameter larger than the inner diameter of the elastic element, the elastic element being compressed between the head portion and the conductive plate.
US13/564,742 2012-05-16 2012-08-02 Heat dissipation device with fastener Abandoned US20130306294A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210151667.2A CN103429044B (en) 2012-05-16 2012-05-16 Heat abstractor
CN201210151667.2 2012-05-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130343003A1 (en) * 2012-06-25 2013-12-26 Foxconn Technology Co., Ltd. Heat dissipation device with fastener and flange

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Publication number Priority date Publication date Assignee Title
US20060232944A1 (en) * 2005-04-14 2006-10-19 Jie Zhang Mounting device for heat dissipating apparatus
US20090296347A1 (en) * 2008-05-28 2009-12-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

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CN2416612Y (en) * 2000-04-05 2001-01-24 富准精密工业(深圳)有限公司 Radiator
TWM404585U (en) * 2010-12-22 2011-05-21 Chaun Choung Technology Corp Easily assembled and disassembled of heat sink fastener

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060232944A1 (en) * 2005-04-14 2006-10-19 Jie Zhang Mounting device for heat dissipating apparatus
US20090296347A1 (en) * 2008-05-28 2009-12-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8122945B2 (en) * 2008-05-28 2012-02-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with base having fasteners

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130343003A1 (en) * 2012-06-25 2013-12-26 Foxconn Technology Co., Ltd. Heat dissipation device with fastener and flange
US8944149B2 (en) * 2012-06-25 2015-02-03 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation device with fastener and flange

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Publication number Publication date
CN103429044B (en) 2017-07-28
TWI581696B (en) 2017-05-01
TW201350003A (en) 2013-12-01
CN103429044A (en) 2013-12-04

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AS Assignment

Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:XIA, BEN-FAN;REEL/FRAME:028704/0863

Effective date: 20120715

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:XIA, BEN-FAN;REEL/FRAME:028704/0863

Effective date: 20120715

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION