TW201350003A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- TW201350003A TW201350003A TW101118928A TW101118928A TW201350003A TW 201350003 A TW201350003 A TW 201350003A TW 101118928 A TW101118928 A TW 101118928A TW 101118928 A TW101118928 A TW 101118928A TW 201350003 A TW201350003 A TW 201350003A
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- 230000017525 heat dissipation Effects 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims description 52
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種散熱裝置，特別涉及一種用於對電子元件散熱的散熱裝置。The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component.
隨著電子裝置內部晶片運算速度的提升及消耗功率的增大，相應產生的熱量亦隨之劇增，為了使晶片能在正常工作溫度下運行，通常需在晶片表面貼設一散熱器來及時排出晶片產生的熱量。As the speed of the internal processing of the electronic device increases and the power consumption increases, the corresponding heat is also greatly increased. In order to enable the wafer to operate at a normal operating temperature, it is usually necessary to attach a heat sink to the surface of the wafer in time. The heat generated by the wafer is discharged.
業界為了使散熱器與晶片之間緊密貼合以達到良好的散熱效果，採用多個扣合結構固定在散熱器上。傳統的扣合結構包括一螺桿、套置於該螺桿上的一彈簧和一圓形墊片。該螺桿下端開置一個卡槽，該螺桿穿過該散熱器的基板，該圓形墊片卡置於該螺桿的卡槽上並貼靠在散熱器的基板底部，從而將該扣合結構固定在該散熱器上。然而，在運輸等過程中，該圓形墊片容易從螺桿上脫落，導致扣合結構從散熱器上脫離。再者，散熱器上裝了幾個扣合結構，就要相應地使用幾個圓形墊片，工廠產線為了將圓形墊片卡置於螺桿上，需要專門安排人力及卡置圓形墊片的專用治具，增加了組裝工時及人力和治具製作的成本。In order to achieve a good heat dissipation effect between the heat sink and the wafer, the industry is fixed on the heat sink by a plurality of fastening structures. The conventional snap-fit structure includes a screw, a spring placed over the screw, and a circular spacer. a screw slot is opened at the lower end of the screw, and the screw passes through the base plate of the heat sink. The circular gasket is placed on the slot of the screw and abuts against the bottom of the base plate of the heat sink, thereby fixing the fastening structure. On the heat sink. However, during transportation or the like, the circular spacer is easily detached from the screw, causing the fastening structure to be detached from the heat sink. In addition, several fastening structures are installed on the radiator, and several circular gaskets should be used accordingly. In order to place the circular gasket on the screw, the factory production line needs to arrange the manpower and the circular shape. Special fixtures for gaskets increase the cost of assembly man-hours and labor and fixture manufacturing.
有鑒於此，有必要提供一種結構穩固且易於安裝的散熱裝置。In view of this, it is necessary to provide a heat sink that is structurally stable and easy to install.
一種散熱裝置，包括一個基板及一個扣合結構，該扣合結構包括一個扣件及套置在該扣件上的一個彈性元件，該扣件包括一個連接部、設於連接部一端的一個操作部及設於連接部相反的另一端的一個固定部，該基板開設一個貫穿該基板的支撐部，該支撐部包括彼此連通的孔及第一槽，該連接部靠近該固定部處的周緣向外凸設一個卡置部，該卡置部的直徑小於該支撐部的孔的直徑且大於第一槽的直徑，該連接部的直徑小於第一槽的直徑，該卡置部從基板頂部穿過該孔，使所述卡置部與彈性元件分別置於基板上下兩側，彈性元件彈性抵靠在孔頂部周緣；然後將該扣件朝向第一槽水平移動，使連接部進入第一槽，卡置部抵靠在第一槽底部周緣，彈性元件彈性抵靠在第一槽頂部周緣。A heat dissipating device comprising a substrate and a fastening structure, the fastening structure comprising a fastening component and an elastic component sleeved on the fastening component, the fastening component comprising a connecting portion and an operation provided at one end of the connecting portion And a fixing portion disposed at the opposite end of the connecting portion, the substrate defines a supporting portion penetrating the substrate, the supporting portion includes a hole communicating with each other and a first groove, and the connecting portion is adjacent to a periphery of the fixing portion a latching portion is formed, the diameter of the latching portion is smaller than the diameter of the hole of the supporting portion and larger than the diameter of the first slot, the diameter of the connecting portion is smaller than the diameter of the first slot, and the latching portion is worn from the top of the substrate Through the hole, the locking portion and the elastic member are respectively placed on the upper and lower sides of the substrate, and the elastic member elastically abuts against the periphery of the top of the hole; then the fastener is horizontally moved toward the first groove, so that the connecting portion enters the first groove The latching portion abuts against the periphery of the bottom of the first slot, and the elastic member elastically abuts against the periphery of the top of the first slot.
與習知技術相比，本發明的散熱裝置的扣合結構結構緊湊穩固，便於安裝拆卸，且在運輸等過程中不存在從散熱裝置上脫落的風險。Compared with the prior art, the fastening structure of the heat dissipating device of the present invention has a compact and stable structure, is easy to be installed and disassembled, and has no risk of falling off from the heat dissipating device during transportation or the like.
請參閱圖1至圖3，本發明第一實施例的散熱裝置100包括一矩形基板10及設於該基板10的一扣合結構20。該扣合結構20用於將該散熱裝置100固定於一具有電子元件的電路板上，使該基板10與電路板上的電子元件導熱接觸。Referring to FIG. 1 to FIG. 3 , the heat dissipation device 100 of the first embodiment of the present invention includes a rectangular substrate 10 and a fastening structure 20 disposed on the substrate 10 . The fastening structure 20 is used to fix the heat sink 100 to a circuit board having electronic components such that the substrate 10 is in thermal contact with electronic components on the circuit board.
該基板10開設一個貫穿該基板10的支撐部14。該支撐部14包括彼此連通的孔142、第一槽144及第二槽146。該孔142貫穿該基板10，且與該基板10的外緣相間隔。該第二槽146與該第一槽144同軸並設置在孔142的一側以與孔142連通。該第二槽146位於該第一槽144上方。該孔142的直徑小於該第二槽146的直徑，且大於該第一槽144的直徑。基板10在第二槽146與第一槽144相連接處形成一台階部148。The substrate 10 defines a support portion 14 that extends through the substrate 10. The support portion 14 includes a hole 142, a first groove 144, and a second groove 146 that communicate with each other. The hole 142 extends through the substrate 10 and is spaced from the outer edge of the substrate 10. The second groove 146 is coaxial with the first groove 144 and is disposed at one side of the hole 142 to communicate with the hole 142. The second slot 146 is located above the first slot 144. The diameter of the hole 142 is smaller than the diameter of the second groove 146 and larger than the diameter of the first groove 144. The substrate 10 forms a step 148 at the junction of the second groove 146 and the first groove 144.
該扣合結構20包括一個扣件21及套置在該扣件21上的一個彈性元件23。該彈性元件23本實施例中為一彈簧，當然還可以為彈片等其他彈性體。所述扣件21包括一個固定部210、一個圓形的操作部211及位於該固定部210和該操作部211之間的一個連接部212。The fastening structure 20 includes a fastener 21 and an elastic member 23 sleeved on the fastener 21. The elastic member 23 is a spring in this embodiment, and may of course be another elastic body such as a spring piece. The fastener 21 includes a fixing portion 210 , a circular operation portion 211 , and a connecting portion 212 between the fixing portion 210 and the operation portion 211 .
該固定部210呈柱狀，用於將該散熱裝置100固定到電路板上。該連接部212為一個圓柱狀長桿。該連接部212的直徑小於該支撐部14的第一槽144的直徑。該連接部212靠近該固定部210處的周緣水平向外凸設一個卡置部213。該卡置部213的截面積大於該連接部212的截面積。該卡置部213的直徑小於該支撐部14的孔142的直徑及彈性元件23的內徑，大於第一槽144的直徑。該操作部211自該連接部212的另一端向上延伸形成。該彈性元件23位於該扣件21的操作部211和卡置部213之間並套設於該連接部212上。該彈性元件23的外徑大於孔142的直徑，小於第二槽146的直徑，使第二槽146收容彈性元件23，以限制螺絲彈性元件23左右晃動脫出。該操作部211的直徑大於該彈性元件23的內徑。該連接部212靠近該操作部211處的周緣水平向外凸設一個限位部214，該限位部214的直徑略小於彈性元件23的內徑，用以防止扣件21相對於彈性元件23晃動。The fixing portion 210 has a column shape for fixing the heat sink 100 to the circuit board. The connecting portion 212 is a cylindrical long rod. The diameter of the connecting portion 212 is smaller than the diameter of the first groove 144 of the support portion 14. A connecting portion 213 is protruded horizontally outward from the periphery of the connecting portion 212. The cross-sectional area of the latching portion 213 is larger than the cross-sectional area of the connecting portion 212. The diameter of the latching portion 213 is smaller than the diameter of the hole 142 of the support portion 14 and the inner diameter of the elastic member 23, which is larger than the diameter of the first groove 144. The operation portion 211 is formed to extend upward from the other end of the connection portion 212. The elastic member 23 is located between the operating portion 211 of the fastener 21 and the locking portion 213 and is sleeved on the connecting portion 212. The outer diameter of the elastic member 23 is larger than the diameter of the hole 142, and is smaller than the diameter of the second groove 146, so that the second groove 146 receives the elastic member 23 to restrict the left and right of the screw elastic member 23 from swaying. The diameter of the operating portion 211 is larger than the inner diameter of the elastic member 23. A limiting portion 214 is protruded outwardly from the periphery of the connecting portion 212 . The limiting portion 214 has a diameter slightly smaller than the inner diameter of the elastic member 23 for preventing the fastener 21 from being opposite to the elastic member 23 . Shake.
請同時參照圖4至圖5，安裝時，該彈性元件23套設在該扣件21的連接部212上，該扣件21的卡置部213對準該基板10的孔142，該扣件21的卡置部213從該基板10頂部穿過孔142，使所述卡置部213與彈性元件23分別置於基板10兩側，彈性元件23被壓縮彈性抵靠在孔142周緣。然後將該扣件21朝向第一槽144水平移動，使彈性元件23回彈收容在第二槽146內並彈性抵靠在台階部148上。由於該第一槽144的直徑小於孔142的直徑，卡置部213從孔142移至第一槽144後抵靠在第一槽144底部周緣限制了扣件21相對於基板10向上移動，從而將該扣合結構20牢靠地安裝在該基板10上。拆卸的過程與安裝的過程相反，不再贅述。Referring to FIG. 4 to FIG. 5 simultaneously, the elastic member 23 is sleeved on the connecting portion 212 of the fastener 21, and the locking portion 213 of the fastener 21 is aligned with the hole 142 of the substrate 10. The locking portion 213 of the 21 passes through the hole 142 from the top of the substrate 10, so that the locking portion 213 and the elastic member 23 are respectively placed on both sides of the substrate 10, and the elastic member 23 is compressed and elastically abutted against the periphery of the hole 142. The fastener 21 is then horizontally moved toward the first groove 144, so that the elastic member 23 is reboundly received in the second groove 146 and elastically abuts against the step portion 148. Since the diameter of the first groove 144 is smaller than the diameter of the hole 142, the movement of the locking portion 213 from the hole 142 to the first groove 144 and the bottom periphery of the first groove 144 restrict the fastener 21 from moving upward relative to the substrate 10, thereby The fastening structure 20 is securely mounted on the substrate 10. The disassembly process is the reverse of the installation process and will not be described again.
與習知技術相比，本發明的散熱裝置100的扣合結構20結構緊湊穩固，便於安裝拆卸，且在運輸等過程中不存在從散熱裝置100上脫落的風險。另外，該扣合結構20的扣件21上一體形成有卡置部213來取代習知技術的圓形墊片，減少了扣合結構20的零件的數量，生產的過程中降低了組裝圓形墊片的人力成本。Compared with the prior art, the fastening structure 20 of the heat dissipation device 100 of the present invention is compact and stable, is easy to install and disassemble, and has no risk of falling off from the heat dissipation device 100 during transportation or the like. In addition, the fastening member 21 of the fastening structure 20 is integrally formed with a locking portion 213 instead of the circular gasket of the prior art, which reduces the number of parts of the fastening structure 20, and reduces the assembly circular shape during the production process. The labor cost of the gasket.
圖6所示為本發明第二實施例的散熱裝置的基板10a。該基板10a開設一個貫穿該基板10a的支撐部14a。該支撐部14a包括彼此連通的孔142a、第一槽144a及第二槽146a，該孔142貫穿該基板10。與第一實施例的區別僅在於：該孔142與該基板10的外緣相連通。Fig. 6 shows a substrate 10a of a heat sink according to a second embodiment of the present invention. The substrate 10a has a support portion 14a penetrating the substrate 10a. The support portion 14a includes a hole 142a that communicates with each other, a first groove 144a, and a second groove 146a that penetrates the substrate 10. The only difference from the first embodiment is that the hole 142 is in communication with the outer edge of the substrate 10.
圖7所示為本發明第三實施例的散熱裝置的基板10b。該基板10b開設一個貫穿該基板10b的支撐部14b。該支撐部14b包括彼此連通的孔142b、第一槽144b及第二槽146b。與第一實施例的區別僅在於：在基板10b底部對應該支撐部14b處向下凸伸出一個凸台12b，該凸台12b藉由衝壓形成，基板10b頂部對應該凸台12b形成一個凹槽16b，該孔142b及第一槽144b貫穿該凸台12b。Fig. 7 shows a substrate 10b of a heat sink according to a third embodiment of the present invention. The substrate 10b defines a support portion 14b penetrating the substrate 10b. The support portion 14b includes a hole 142b, a first groove 144b, and a second groove 146b that communicate with each other. The only difference from the first embodiment is that a boss 12b protrudes downwardly from the bottom of the substrate 10b corresponding to the supporting portion 14b. The boss 12b is formed by punching, and the top of the substrate 10b forms a concave corresponding to the boss 12b. The groove 16b, the hole 142b and the first groove 144b penetrate the boss 12b.
圖8所示為本發明第四實施例的散熱裝置的基板10c。該基板10c開設一個貫穿該基板10c的支撐部14c。該支撐部14c包括彼此連通的孔142c、第一槽144c及第二槽146c。與第二實施例的區別僅在於：在基板10c底部對應該支撐部14c處向下凸伸出一個凸台12c，該凸台12c藉由衝壓形成，基板10c頂部對應該凸台12c形成一個凹槽16c，該孔142c及第一槽144c貫穿該凸台12c。Fig. 8 shows a substrate 10c of a heat sink according to a fourth embodiment of the present invention. The substrate 10c has a support portion 14c penetrating the substrate 10c. The support portion 14c includes a hole 142c, a first groove 144c, and a second groove 146c that communicate with each other. The difference from the second embodiment is only that a boss 12c protrudes downwardly from the bottom of the substrate 10c corresponding to the supporting portion 14c. The boss 12c is formed by punching, and the top of the substrate 10c forms a concave corresponding to the boss 12c. The groove 16c, the hole 142c and the first groove 144c penetrate the boss 12c.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10、10a、10b、10c．．．基板10, 10a, 10b, 10c. . . Substrate
20．．．扣合結構20. . . Fastening structure
100．．．散熱裝置100. . . Heat sink
12b、12c．．．凸台12b, 12c. . . Boss
14、14a、14b、14c．．．支撐部14, 14a, 14b, 14c. . . Support
142、142a、142b、142c．．．孔142, 142a, 142b, 142c. . . hole
144、144a、144b、144c．．．第一槽144, 144a, 144b, 144c. . . First slot
146、146a、146b、146c．．．第二槽146, 146a, 146b, 146c. . . Second slot
148．．．台階部148. . . Step
21．．．扣件twenty one. . . Fastener
23．．．彈性元件twenty three. . . Elastic component
210．．．固定部210. . . Fixed part
211．．．操作部211. . . Operation department
212．．．連接部212. . . Connection
213．．．卡置部213. . . Card section
214．．．限位部214. . . Limiting department
16b、16c．．．凹槽16b, 16c. . . Groove
圖1為本發明第一實施例的散熱裝置的分解圖。1 is an exploded view of a heat sink according to a first embodiment of the present invention.
圖2為圖1中所示散熱裝置的組裝圖，其中該散熱裝置的扣合結構處於非鎖固狀態的示意圖。2 is an assembled view of the heat sink shown in FIG. 1 , wherein the snap structure of the heat sink is in a non-locked state.
圖3為圖2中所示散熱裝置沿著III-III線的剖視圖。Figure 3 is a cross-sectional view of the heat sink shown in Figure 2 taken along line III-III.
圖4為圖1中所示散熱裝置的組裝圖，其中該散熱裝置的扣合結構處於鎖固狀態的示意圖。4 is an assembled view of the heat sink shown in FIG. 1 , wherein the snap structure of the heat sink is in a locked state.
圖5為圖4中所示散熱裝置沿著V-V線的剖視圖。Figure 5 is a cross-sectional view of the heat sink shown in Figure 4 taken along line V-V.
圖6為本發明第二實施例的散熱裝置的基板的示意圖。6 is a schematic view of a substrate of a heat sink according to a second embodiment of the present invention.
圖7為本發明第三實施例的散熱裝置的基板的示意圖。Fig. 7 is a schematic view showing a substrate of a heat sink according to a third embodiment of the present invention.
圖8為本發明第四實施例的散熱裝置的基板的示意圖。Fig. 8 is a schematic view showing a substrate of a heat sink according to a fourth embodiment of the present invention.
10．．．基板10. . . Substrate
20．．．扣合結構20. . . Fastening structure
100．．．散熱裝置100. . . Heat sink
14．．．支撐部14. . . Support
142．．．孔142. . . hole
144．．．第一槽144. . . First slot
146．．．第二槽146. . . Second slot
148．．．台階部148. . . Step
21．．．扣件twenty one. . . Fastener
23．．．彈性元件twenty three. . . Elastic component
210．．．固定部210. . . Fixed part
211．．．操作部211. . . Operation department
212．．．連接部212. . . Connection
213．．．卡置部213. . . Card section
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210151667.2A CN103429044B (en) | 2012-05-16 | 2012-05-16 | Heat abstractor |
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| TW201350003A true TW201350003A (en) | 2013-12-01 |
| TWI581696B TWI581696B (en) | 2017-05-01 |
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| CN103517612B (en) * | 2012-06-25 | 2017-06-13 | 富瑞精密组件（昆山）有限公司 | Heat abstractor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2416612Y (en) * | 2000-04-05 | 2001-01-24 | 富准精密工业(深圳)有限公司 | Radiator |
| CN1848035A (en) * | 2005-04-14 | 2006-10-18 | 富准精密工业(深圳)有限公司 | Locking module |
| CN101594765B (en) * | 2008-05-28 | 2013-03-20 | 富准精密工业(深圳)有限公司 | Heat radiating device and fixing structure thereof |
| TWM404585U (en) * | 2010-12-22 | 2011-05-21 | Chaun Choung Technology Corp | Easily assembled and disassembled of heat sink fastener |
-
2012
- 2012-05-16 CN CN201210151667.2A patent/CN103429044B/en not_active Expired - Fee Related
- 2012-05-28 TW TW101118928A patent/TWI581696B/en not_active IP Right Cessation
- 2012-08-02 US US13/564,742 patent/US20130306294A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN103429044B (en) | 2017-07-28 |
| US20130306294A1 (en) | 2013-11-21 |
| CN103429044A (en) | 2013-12-04 |
| TWI581696B (en) | 2017-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |