[go: up one dir, main page]

US11869792B2 - Alignment mechanism and alignment method of bonding machine - Google Patents

Alignment mechanism and alignment method of bonding machine Download PDF

Info

Publication number
US11869792B2
US11869792B2 US17/517,342 US202117517342A US11869792B2 US 11869792 B2 US11869792 B2 US 11869792B2 US 202117517342 A US202117517342 A US 202117517342A US 11869792 B2 US11869792 B2 US 11869792B2
Authority
US
United States
Prior art keywords
substrate
placement area
supporting surface
alignment
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US17/517,342
Other versions
US20230138307A1 (en
Inventor
Jing-Cheng Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sky Tech Inc
Original Assignee
Sky Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sky Tech Inc filed Critical Sky Tech Inc
Priority to US17/517,342 priority Critical patent/US11869792B2/en
Assigned to SKY TECH INC. reassignment SKY TECH INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, JING-CHENG
Publication of US20230138307A1 publication Critical patent/US20230138307A1/en
Application granted granted Critical
Publication of US11869792B2 publication Critical patent/US11869792B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/37—Effects of the manufacturing process
    • H01L2924/37001—Yield

Definitions

  • the present disclosure relates to an alignment mechanism of a bonding machine, which allows rapid alignment of a wafer and a substrate and facilitates the subsequent bonding of the wafer and the substrate.
  • the thickness of wafers is continuously reduced to facilitate subsequent wafer dicing and packaging processes.
  • the thinning of the wafer is also conducive to reducing the size of the chip, lowering the resistance, improving the calculation speed and extending the service life.
  • the structure of the thinned wafer is very fragile, and the wafer is prone to warp or break in the subsequent manufacturing process, thereby decreasing the yield of the product.
  • an adhesive may be applied to the surface of the carrier substrate and the wafer, and then the carrier substrate and the wafer are moved to a bonding machine and aligned. Subsequently, the carrier substrate and the wafer are bonded by increasing the temperature. After the bonding is completed, the wafer may be subjected to thinning, etching and metallization processes, etc., and lastly the wafer and the carrier substrate are separated.
  • the alignment mechanism of a common bonding machine still has the problems of poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process to a certain extent.
  • the present invention proposes an alignment mechanism of a bonding machine, which effectively improves the accuracy and efficiency of the alignment between a wafer and a carrier substrate, and is beneficial to improve the efficiency and yield of the manufacturing process.
  • an alignment mechanism of the present invention the cost of installing multiple detectors on the machine can be saved.
  • An object of the present disclosure is to provide an alignment mechanism of a bonding machine, which mainly comprises a support pedestal configured with three first alignment members and three second alignment members, wherein the first and second alignment members are configured to move along a direction parallel to a supporting surface of the support pedestal and position a substrate through moving close to or away from the substrate.
  • the first and second alignment members In positioning a substrate, the first and second alignment members only need to move along a direction parallel to the supporting surface and do not need to raise or lower relative to the supporting surface. This is beneficial in simplifying the steps of aligning the substrate and the mechanisms of the machine.
  • An object of the present disclosure is to provide an alignment mechanism of a bonding machine, which mainly comprises a support pedestal configured with three alignment members and three support members, wherein the alignment members and the support members are configured to move along a direction parallel to a supporting surface of the support pedestal.
  • the support members are used in supporting a substrate, and the alignment members may align the substrate supported by the support members.
  • an alignment mechanism of a bonding machine comprising: a support pedestal including a supporting surface for supporting a first substrate, wherein the supporting surface has a placement area; three first alignment members arranged around the placement area of the supporting surface for positioning the first substrate through moving close to or away from the placement area and for supporting a second substrate, wherein the first alignment members each include a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, the base being closer to the supporting surface than the protruding part, and the base being used to position the first substrate; and three second alignment members arranged around the placement area of the supporting surface for positioning the second substrate supported by the first alignment members through moving close to or away from the placement area, wherein the first alignment members move away from the placement area to place the second substrate thereon onto the first substrate.
  • the present disclosure provides another alignment mechanism of a bonding machine, comprising: a support pedestal including a supporting surface for supporting a first substrate, wherein the supporting surface has a placement area; three alignment members arranged around the placement area of the supporting surface for positioning the first substrate and a second substrate through moving close to or away from the placement area; and three support members arranged around the placement area of the supporting surface, the support members being configured to move close to or away from the placement area and being used to support the second substrate, wherein the alignment members move toward the placement area to position the second substrate supported by the support members, and the support members subsequently move away from the placement area to place the second substrate thereon onto the first substrate, wherein the support members each include a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, the base being closer to the supporting surface than the protruding part.
  • the present disclosure also provides an alignment method for a bonding machine, comprising: placing a first substrate on a supporting surface of a support pedestal, wherein the supporting surface has a placement area; three alignment members moving toward the placement area to position the first substrate placed on the supporting surface to align the first substrate with the placement area; three support members moving toward the placement area and being used in supporting a second substrate; the alignment members moving toward the placement area to position the second substrate supported by the support members to align the second substrate with the first substrate; and the support members moving away from the placement area to place the second substrate thereon onto the first substrate.
  • the alignment mechanism of a bonding machine wherein the protruding part of the first alignment members and the support members protrudes along a radial direction of the support pedestal and is used in supporting a second substrate.
  • the first and second alignment members, the alignment members and the support members move along said radial direction close to or away from the placement area.
  • the alignment mechanism of a bonding machine wherein the protruding part of the first alignment members and the support members includes an inclined face inclined in a direction toward the supporting surface of the support pedestal or the placement area.
  • the alignment mechanism of a bonding machine comprising at least six connecting rods located on the supporting surface of the support pedestal and arranged around the placement area of the supporting surface, wherein each of the first and second alignment members and the alignment members and support members includes a fixing hole so as to be sleeved on one of the connecting rods.
  • the alignment method for a bonding machine wherein one of the support members moves away from the placement area to obliquely place the second substrate thereon on the first substrate.
  • FIG. 2 is a top view illustrating an alignment mechanism of a bonding machine positioning a first substrate according to one embodiment of the present invention.
  • FIG. 4 is a top view illustrating an alignment mechanism of a bonding machine positioning a second substrate according to one embodiment of the present invention.
  • FIG. 5 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine aligning a first substrate according to one embodiment of the present invention.
  • FIG. 7 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine placing a second substrate according to one embodiment of the present invention.
  • FIG. 9 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine placing a second substrate according to another embodiment of the present invention.
  • a minimum spacing between the first alignment members 131 and a minimum spacing between the second alignment members 133 may be adjusted according to the sizes of the first substrate 121 and the second substrate 123 , respectively.
  • the first substrate 121 and the second substrate 123 are in the shape of a round disc, wherein a circle formed by the first alignment members 131 in an alignment state has a similar size to the first substrate 121 , and a circle formed by the second alignment members 133 in an alignment state has a similar size to the second substrate 123 .
  • the supporting surface 111 of the support pedestal 11 may be used for supporting the first substrate 121 , wherein the first substrate 121 may be placed within or near to the placement area 113 of the supporting surface 111 , as shown in FIG. 2 .
  • the first alignment members 131 are located on the supporting surface 111 of the support pedestal 11 and move close to or away from the placement area 113 along a direction parallel to the supporting surface 111 to position the first substrate 121 placed on the supporting surface 111 or placement area 113 of the support pedestal 11 .
  • the supporting surface 111 and/or the placement areal 113 of the support pedestal 11 may take the shape of a circle, and the first alignment members 131 may move along a radial direction of the supporting surface 111 close to or away from the placement area 113 to position the first substrate 121 .
  • the first substrate 121 is generally not precisely located within the placement area 113 when it is placed onto the placement area 113 of the support pedestal 11 .
  • the first alignment members 131 may simultaneously or non-simultaneously move toward the placement area 113 , and contact with and position the first substrate 121 , such that the first substrate 121 is precisely placed within the placement area 113 .
  • the second substrate 123 may be placed above the placement area 113 .
  • the first alignment members 131 maintain in a position where the first substrate 121 is positioned, and are used for supporting the second substrate 123 , for example, using the protruding parts 1313 of the first alignment members 131 to support the second substrate 123 , as shown is FIG. 3 , FIG. 5 and FIG. 6 .
  • the second alignment members 133 move toward and close to the placement area 113 and the second substrate 123 , and push and position the second substrate 123 supported by the first alignment members 131 .
  • the second alignment members 133 may move along a radial direction of the supporting surface 111 , as shown in FIG. 4 and FIG. 6 .
  • the second alignment members 133 are not used for supporting a substrate, and thus the second alignment members 133 each may be a columnar body having a cross section of any shape, wherein the second alignment members 133 do not need to be configured with a protruding part as described above.
  • the second substrate 123 is aligned with the first substrate 121 , wherein the second substrate 123 is still placed on the first alignment members 131 . Then the first alignment members 131 move away from the first substrate 121 , the second substrate 123 and/or the placement area 113 , for example, move away along a radial direction of the supporting surface 111 , such that the second substrate 123 falls from the first alignment members 131 and is placed onto the first substrate 121 , as shown in FIG. 7 .
  • three first alignment members 131 may move away from the second substrate 123 in a non-simultaneous manner. For example, one of the first alignment members 131 first moves away from the second substrate 123 while the other two first alignment members 131 remain still, such that the second substrate 123 is obliquely placed on the first substrate 121 . Then the other two first alignment members 131 move away from the second substrate 123 to lay the second substrate 123 flat on the first substrate 121 .
  • the second alignment members 133 may stay still to avoid a displacement of the second substrate 123 relative to the first substrate 121 caused by a displacement of the first alignment members 131 relative to the second substrate 123 .
  • the protruding part 1313 of the first alignment members 131 may include a inclined face 1315 , wherein the inclined face 1315 is inclined in a direction toward the supporting surface 111 of the support pedestal 11 or the placement area 113 , and the second substrate 123 is placed on the inclined faces 1315 of the protruding parts 1313 of the first alignment members 131 .
  • the second substrate 123 supported by the protruding part 1313 may be guided to slide along the inclined face 1315 and fall onto the first substrate 121 , and a displacement of the second substrate 123 relative to the first substrate 121 caused by a displacement of the first alignment members 131 relative to the second substrate 123 may be avoided.
  • the alignment mechanism 10 may include at least three lift pins 135 configured on the supporting surface 111 of the support pedestal 11 , wherein the first alignment members 131 and the second alignment members 133 are arranged around the lift pins 135 .
  • the lift pins 135 may be configured within the placement area 113 of the support pedestal 11 .
  • the lift pins 135 may raise or lower relative to the supporting surface 111 , wherein lift pins 135 raise to receive and support the first substrate 121 , and the lift pins 135 lower to place the first substrate 121 thereon onto the supporting surface 111 of the support pedestal 11 .
  • the lift pins 135 may lower simultaneously or non-simultaneously to lay the first substrate 121 flat or obliquely place the first substrate 121 on the supporting surface 111 of the support pedestal 11 .
  • the lift pins 135 are not essential elements of the present invention.
  • the first substrate 121 may also be directly placed onto the placement area 113 of the support pedestal 11 .
  • the first alignment members 131 each may be a support member 231
  • the second alignment members 133 each may be an alignment member 233 , wherein the quantity, position of arrangement and structure of the support members 231 and the alignment members 233 may be the same as those of the first and second alignment members 131 / 133 .
  • Three support members 231 and three alignment members 233 are arranged around the placement area 113 of the supporting surface 111 , and configured to move close to or away from the placement area 113 .
  • both the first substrate 121 and the second substrate 123 are aligned by the alignment members 233 , and the second substrate 123 is supported by the support members 231 .
  • the support members 231 move toward and close to the first substrate 121 and the placement area 113 , while the alignment members 233 move away from the first substrate 121 .
  • the alignment members 233 may move away from the first substrate 121 after the support members 231 come to a stop, or the alignment members 233 may also be driven away from the first substrate 121 before the support members 231 come to a stop.
  • the alignment members 233 moving away from the first substrate 121 after the support members 231 come to a stop may better avoid a displacement of the first substrate 121 during the process of displacement of the alignment members 233 relative to the first substrate 121 .
  • the second substrate 123 may be placed on the support members 231 , wherein the second substrate 123 is supported by the support members 231 and is not in contact with the first substrate 121 .
  • the structure of the support members 231 is similar to that of the first alignment members 131 , and each include a base 2311 and a protruding part 2313 , wherein the protruding part 2313 is used for supporting the second substrate 123 .
  • the alignment members 233 move toward and close to the second substrate 123 .
  • the alignment members 233 may move along a radial direction of the supporting surface 111 of the support pedestal 11 .
  • the alignment members 233 contact and position the second substrate 123 supported by the support member 231 , such that the second substrate 123 is aligned with the first substrate 121 and/or the placement area 113 of the support pedestal 11 .
  • the support members 231 After aligning the first substrate 121 and the second substrate 123 , the support members 231 leave the placement area 113 , the first substrate 121 and/or the second substrate 123 , wherein the second substrate 123 falls from the protruding parts 2313 of the support members 231 and is placed onto the first substrate 121 .
  • the alignment members 233 may stay still and remain in contact with the second substrate 123 to avoid a displacement of the second substrate 123 during the process of displacement of the support members 231 relative to the second substrate 123 .
  • three support members 231 may move away from the second substrate 123 in a non-simultaneous manner. For example, one of the support members 231 first moves away from the second substrate 123 , while the other two support members 231 remain still, such that the second substrate 123 is obliquely placed on the first substrate 121 . Then the other two support members 231 move away from the second substrate 123 , and lay the second substrate 123 flat on the first substrate 121 , such that the second substrate 123 overlaps and aligns with the first substrate 121 .
  • the first alignment members 131 , the second alignment members 133 , the support members 231 and/or the alignment members 233 only need to move along a direction parallel to the supporting surface 111 of the support pedestal 11 , and do not need to raise or lower relative to the supporting surface 111 of the support pedestal 11 . This is beneficial in simplifying the steps and mechanisms for aligning the first substrate 121 and the second substrate 123 .
  • the first alignment members 131 , the second alignment members 133 , the support members 231 and/or the alignment members 233 may not only move along a direction parallel to the supporting surface 111 of the support pedestal 11 , but also raise or lower along a direction perpendicular to the supporting surface 111 .
  • the supporting surface 111 of the support pedestal 11 may be configured with six or more connecting rods 151 , arranged around the placement area 113 of the supporting surface 111 .
  • the first and second alignment members 131 / 133 , the support members 231 and the alignment members 233 on the other hand each include a fixing hole 153 , and each is sleeved on one of the connecting rods 153 through the fixing hole 153 .
  • first and second alignment members 131 / 133 , support members 231 and alignment members 233 having different forms or sizes may be chosen and fixed to the connecting rods 151 , such that the alignment mechanism 10 of the present invention may be used in aligning substrates of two different kinds or more.
  • the first substrate 121 includes but is not limited to a wafer or a chip
  • the second substrate 123 includes but is not limited to a sapphire carrier substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An alignment mechanism of a bonding machine includes a support pedestal, three first alignment members, and three second alignment members. The support pedestal includes a supporting surface having a placement area for supporting a first substrate, and the first and second alignment members are arranged around the placement area. The first alignment members each include a protruding part and a base. The protruding part is used in supporting a second substrate, and protrudes from the base and directed to the placement area. The base is used to position the first substrate. The second alignment members position the second substrate to align the first and second substrates and facilitate the bonding of the first and second substrates.

Description

TECHNICAL FIELD
The present disclosure relates to an alignment mechanism of a bonding machine, which allows rapid alignment of a wafer and a substrate and facilitates the subsequent bonding of the wafer and the substrate.
BACKGROUND
With the advancement of semiconductor technology, the thickness of wafers is continuously reduced to facilitate subsequent wafer dicing and packaging processes. In addition, the thinning of the wafer is also conducive to reducing the size of the chip, lowering the resistance, improving the calculation speed and extending the service life. However, the structure of the thinned wafer is very fragile, and the wafer is prone to warp or break in the subsequent manufacturing process, thereby decreasing the yield of the product.
In order to avoid the above problems, it is generally chosen to temporarily bond the wafer to a carrier substrate and support the thinned wafer by the carrier substrate to avoid warping or breaking of the thinned wafer during the manufacturing process.
Specifically, an adhesive may be applied to the surface of the carrier substrate and the wafer, and then the carrier substrate and the wafer are moved to a bonding machine and aligned. Subsequently, the carrier substrate and the wafer are bonded by increasing the temperature. After the bonding is completed, the wafer may be subjected to thinning, etching and metallization processes, etc., and lastly the wafer and the carrier substrate are separated.
Although bonding of the wafer and the carrier substrate can be done through the above steps, the alignment mechanism of a common bonding machine still has the problems of poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process to a certain extent.
SUMMARY
In order to address the above-mentioned problems, the present invention proposes an alignment mechanism of a bonding machine, which effectively improves the accuracy and efficiency of the alignment between a wafer and a carrier substrate, and is beneficial to improve the efficiency and yield of the manufacturing process. In addition, by using an alignment mechanism of the present invention, the cost of installing multiple detectors on the machine can be saved.
An object of the present disclosure is to provide an alignment mechanism of a bonding machine, which mainly comprises a support pedestal configured with three first alignment members and three second alignment members, wherein the first and second alignment members are configured to move along a direction parallel to a supporting surface of the support pedestal and position a substrate through moving close to or away from the substrate.
In positioning a substrate, the first and second alignment members only need to move along a direction parallel to the supporting surface and do not need to raise or lower relative to the supporting surface. This is beneficial in simplifying the steps of aligning the substrate and the mechanisms of the machine.
An object of the present disclosure is to provide an alignment mechanism of a bonding machine, which mainly comprises a support pedestal configured with three alignment members and three support members, wherein the alignment members and the support members are configured to move along a direction parallel to a supporting surface of the support pedestal.
When the alignment members move toward a substrate, they contact and push the substrate to position the substrate. The support members are used in supporting a substrate, and the alignment members may align the substrate supported by the support members.
To achieve the abovementioned objects, the present disclosure provides an alignment mechanism of a bonding machine, comprising: a support pedestal including a supporting surface for supporting a first substrate, wherein the supporting surface has a placement area; three first alignment members arranged around the placement area of the supporting surface for positioning the first substrate through moving close to or away from the placement area and for supporting a second substrate, wherein the first alignment members each include a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, the base being closer to the supporting surface than the protruding part, and the base being used to position the first substrate; and three second alignment members arranged around the placement area of the supporting surface for positioning the second substrate supported by the first alignment members through moving close to or away from the placement area, wherein the first alignment members move away from the placement area to place the second substrate thereon onto the first substrate.
The present disclosure provides another alignment mechanism of a bonding machine, comprising: a support pedestal including a supporting surface for supporting a first substrate, wherein the supporting surface has a placement area; three alignment members arranged around the placement area of the supporting surface for positioning the first substrate and a second substrate through moving close to or away from the placement area; and three support members arranged around the placement area of the supporting surface, the support members being configured to move close to or away from the placement area and being used to support the second substrate, wherein the alignment members move toward the placement area to position the second substrate supported by the support members, and the support members subsequently move away from the placement area to place the second substrate thereon onto the first substrate, wherein the support members each include a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, the base being closer to the supporting surface than the protruding part.
The present disclosure also provides an alignment method for a bonding machine, comprising: placing a first substrate on a supporting surface of a support pedestal, wherein the supporting surface has a placement area; three alignment members moving toward the placement area to position the first substrate placed on the supporting surface to align the first substrate with the placement area; three support members moving toward the placement area and being used in supporting a second substrate; the alignment members moving toward the placement area to position the second substrate supported by the support members to align the second substrate with the first substrate; and the support members moving away from the placement area to place the second substrate thereon onto the first substrate.
The alignment mechanism of a bonding machine, wherein the protruding part of the first alignment members and the support members protrudes along a radial direction of the support pedestal and is used in supporting a second substrate. The first and second alignment members, the alignment members and the support members move along said radial direction close to or away from the placement area.
The alignment mechanism of a bonding machine, wherein the protruding part of the first alignment members and the support members includes an inclined face inclined in a direction toward the supporting surface of the support pedestal or the placement area.
The alignment mechanism of a bonding machine, comprising at least six connecting rods located on the supporting surface of the support pedestal and arranged around the placement area of the supporting surface, wherein each of the first and second alignment members and the alignment members and support members includes a fixing hole so as to be sleeved on one of the connecting rods.
The alignment method for a bonding machine, wherein one of the support members moves away from the placement area to obliquely place the second substrate thereon on the first substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
The structure as well as preferred modes of use, further objects, and advantages of this present disclosure will be best understood by referring to the following detailed description of some illustrative embodiments in conjunction with the accompanying drawings, in which:
FIG. 1 is a perspective view illustrating an alignment mechanism of a bonding machine according to one embodiment of the present invention.
FIG. 2 is a top view illustrating an alignment mechanism of a bonding machine positioning a first substrate according to one embodiment of the present invention.
FIG. 3 is a top view illustrating an alignment mechanism of a bonding machine supporting a second substrate according to one embodiment of the present invention.
FIG. 4 is a top view illustrating an alignment mechanism of a bonding machine positioning a second substrate according to one embodiment of the present invention.
FIG. 5 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine aligning a first substrate according to one embodiment of the present invention.
FIG. 6 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine supporting a second substrate according to one embodiment of the present invention.
FIG. 7 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine placing a second substrate according to one embodiment of the present invention.
FIG. 8 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine supporting a second substrate according to another embodiment of the present invention.
FIG. 9 is a side view illustrating first alignment members of an alignment mechanism of a bonding machine placing a second substrate according to another embodiment of the present invention.
 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Please refer to FIG. 1 , which is a perspective view illustrating an alignment mechanism of a bonding machine according to one embodiment of the present invention. As shown in the figure, an alignment mechanism 10 of a bonding machine mainly comprises a support pedestal 11, at least three first alignment members 131 and at least three second alignment members 133, wherein the first alignment members 131 and the second alignment members 133 are arranged at an area near an edge or a periphery of the support pedestal 11. For example, a placement area 113 may be defined on a supporting surface 111 of the support pedestal 11, wherein the supporting surface 111 and the placement area 113 are used for the placement of a substrate. The first alignment members 131 and the second alignment members 133 may be disposed in a spaced manner. As shown in FIG. 1 , the elements with section line are the first alignment members 131. The first alignment members 131 and the second alignment members 133 are arranged around the placement area 113, and they may move close to or away from the placement area 113.
The alignment mechanism 10 positions a first substrate 121 and a second substrate 123 located above the support pedestal 11 through the first alignment members 131 and the second alignment members 133, respectively, such that the first substrate 121 overlaps with the second substrate 123, wherein the second substrate 123 aligns with the first substrate 121.
A minimum spacing between the first alignment members 131 and a minimum spacing between the second alignment members 133 may be adjusted according to the sizes of the first substrate 121 and the second substrate 123, respectively. Specifically, the first substrate 121 and the second substrate 123 are in the shape of a round disc, wherein a circle formed by the first alignment members 131 in an alignment state has a similar size to the first substrate 121, and a circle formed by the second alignment members 133 in an alignment state has a similar size to the second substrate 123.
The supporting surface 111 of the support pedestal 11 may be used for supporting the first substrate 121, wherein the first substrate 121 may be placed within or near to the placement area 113 of the supporting surface 111, as shown in FIG. 2 . The first alignment members 131 are located on the supporting surface 111 of the support pedestal 11 and move close to or away from the placement area 113 along a direction parallel to the supporting surface 111 to position the first substrate 121 placed on the supporting surface 111 or placement area 113 of the support pedestal 11. For example, the supporting surface 111 and/or the placement areal 113 of the support pedestal 11 may take the shape of a circle, and the first alignment members 131 may move along a radial direction of the supporting surface 111 close to or away from the placement area 113 to position the first substrate 121.
Specifically, the first substrate 121 is generally not precisely located within the placement area 113 when it is placed onto the placement area 113 of the support pedestal 11. The first alignment members 131 may simultaneously or non-simultaneously move toward the placement area 113, and contact with and position the first substrate 121, such that the first substrate 121 is precisely placed within the placement area 113.
As shown in FIG. 5 to FIG. 7 , in one embodiment of the present invention, the first alignment members 131 each include a base 1311 and a protruding part 1313, wherein the base 1311 is closer to the supporting surface 111 of the support pedestal 11 than the protruding part 1313 is, and the protruding part 1313 protrudes from the base 1311 and is directed toward the placement area 113 of the support pedestal 11. For example, the protruding part 1313 may protrude along a radial direction of the supporting surface 111 and/or the placement area 113 of the support pedestal 11. When the first alignment members 131 move toward and close to the placement area 113 and the first substrate 121, the bases 1311 of the first alignment members 131 push and position the first substrate 121.
After positioning the first substrate 121, the second substrate 123 may be placed above the placement area 113. Now the first alignment members 131 maintain in a position where the first substrate 121 is positioned, and are used for supporting the second substrate 123, for example, using the protruding parts 1313 of the first alignment members 131 to support the second substrate 123, as shown is FIG. 3 , FIG. 5 and FIG. 6 .
Subsequently, the second alignment members 133 move toward and close to the placement area 113 and the second substrate 123, and push and position the second substrate 123 supported by the first alignment members 131. For example, the second alignment members 133 may move along a radial direction of the supporting surface 111, as shown in FIG. 4 and FIG. 6 . In practical applications, the second alignment members 133 are not used for supporting a substrate, and thus the second alignment members 133 each may be a columnar body having a cross section of any shape, wherein the second alignment members 133 do not need to be configured with a protruding part as described above.
Through the above alignment process, the second substrate 123 is aligned with the first substrate 121, wherein the second substrate 123 is still placed on the first alignment members 131. Then the first alignment members 131 move away from the first substrate 121, the second substrate 123 and/or the placement area 113, for example, move away along a radial direction of the supporting surface 111, such that the second substrate 123 falls from the first alignment members 131 and is placed onto the first substrate 121, as shown in FIG. 7 .
In practical applications, three first alignment members 131 may move away from the second substrate 123 in a non-simultaneous manner. For example, one of the first alignment members 131 first moves away from the second substrate 123 while the other two first alignment members 131 remain still, such that the second substrate 123 is obliquely placed on the first substrate 121. Then the other two first alignment members 131 move away from the second substrate 123 to lay the second substrate 123 flat on the first substrate 121.
In one embodiment of the present invention, when the first alignment members 131 move away from the second substrate 123, the second alignment members 133 may stay still to avoid a displacement of the second substrate 123 relative to the first substrate 121 caused by a displacement of the first alignment members 131 relative to the second substrate 123.
As shown in FIG. 8 and FIG. 9 , the protruding part 1313 of the first alignment members 131 may include a inclined face 1315, wherein the inclined face 1315 is inclined in a direction toward the supporting surface 111 of the support pedestal 11 or the placement area 113, and the second substrate 123 is placed on the inclined faces 1315 of the protruding parts 1313 of the first alignment members 131. By configuring the protruding part 1313 with the inclined face 1315, the second substrate 123 supported by the protruding part 1313 may be guided to slide along the inclined face 1315 and fall onto the first substrate 121, and a displacement of the second substrate 123 relative to the first substrate 121 caused by a displacement of the first alignment members 131 relative to the second substrate 123 may be avoided.
In one embodiment of the present invention, the alignment mechanism 10 may include at least three lift pins 135 configured on the supporting surface 111 of the support pedestal 11, wherein the first alignment members 131 and the second alignment members 133 are arranged around the lift pins 135. For example, the lift pins 135 may be configured within the placement area 113 of the support pedestal 11. The lift pins 135 may raise or lower relative to the supporting surface 111, wherein lift pins 135 raise to receive and support the first substrate 121, and the lift pins 135 lower to place the first substrate 121 thereon onto the supporting surface 111 of the support pedestal 11. In addition, the lift pins 135 may lower simultaneously or non-simultaneously to lay the first substrate 121 flat or obliquely place the first substrate 121 on the supporting surface 111 of the support pedestal 11. The lift pins 135 are not essential elements of the present invention. In other embodiments, the first substrate 121 may also be directly placed onto the placement area 113 of the support pedestal 11.
In another embodiment of the present invention, in FIG. 1 to FIG. 9 , the first alignment members 131 each may be a support member 231, and the second alignment members 133 each may be an alignment member 233, wherein the quantity, position of arrangement and structure of the support members 231 and the alignment members 233 may be the same as those of the first and second alignment members 131/133.
Three support members 231 and three alignment members 233 are arranged around the placement area 113 of the supporting surface 111, and configured to move close to or away from the placement area 113. In certain embodiments of the present invention, both the first substrate 121 and the second substrate 123 are aligned by the alignment members 233, and the second substrate 123 is supported by the support members 231.
In practical applications, the first substrate 121 may be placed to the placement area 113 of the supporting surface 111 of the support pedestal 11, and subsequently the alignment members 233 move toward and close to the first substrate 121 and the placement area 113, for example, move along a radial direction of the support pedestal 11. The alignment members 233 contact and position the first substrate 121, such that the first substrate 121 is aligned with the placement area 113 of the support pedestal 11.
After positioning the first substrate 121, the support members 231 move toward and close to the first substrate 121 and the placement area 113, while the alignment members 233 move away from the first substrate 121. The alignment members 233 may move away from the first substrate 121 after the support members 231 come to a stop, or the alignment members 233 may also be driven away from the first substrate 121 before the support members 231 come to a stop. In theory, the alignment members 233 moving away from the first substrate 121 after the support members 231 come to a stop may better avoid a displacement of the first substrate 121 during the process of displacement of the alignment members 233 relative to the first substrate 121.
After the alignment members 233 leave the first substrate 121, the second substrate 123 may be placed on the support members 231, wherein the second substrate 123 is supported by the support members 231 and is not in contact with the first substrate 121. Specifically, the structure of the support members 231 is similar to that of the first alignment members 131, and each include a base 2311 and a protruding part 2313, wherein the protruding part 2313 is used for supporting the second substrate 123.
Subsequently, the alignment members 233 move toward and close to the second substrate 123. For example, the alignment members 233 may move along a radial direction of the supporting surface 111 of the support pedestal 11. The alignment members 233 contact and position the second substrate 123 supported by the support member 231, such that the second substrate 123 is aligned with the first substrate 121 and/or the placement area 113 of the support pedestal 11.
After aligning the first substrate 121 and the second substrate 123, the support members 231 leave the placement area 113, the first substrate 121 and/or the second substrate 123, wherein the second substrate 123 falls from the protruding parts 2313 of the support members 231 and is placed onto the first substrate 121. When the support members 231 move away from the second substrate 123, the alignment members 233 may stay still and remain in contact with the second substrate 123 to avoid a displacement of the second substrate 123 during the process of displacement of the support members 231 relative to the second substrate 123.
Further, three support members 231 may move away from the second substrate 123 in a non-simultaneous manner. For example, one of the support members 231 first moves away from the second substrate 123, while the other two support members 231 remain still, such that the second substrate 123 is obliquely placed on the first substrate 121. Then the other two support members 231 move away from the second substrate 123, and lay the second substrate 123 flat on the first substrate 121, such that the second substrate 123 overlaps and aligns with the first substrate 121.
In the process of aligning or positioning the first substrate 121 and the second substrate 123 by the alignment mechanism 10 of the present invention, the first alignment members 131, the second alignment members 133, the support members 231 and/or the alignment members 233 only need to move along a direction parallel to the supporting surface 111 of the support pedestal 11, and do not need to raise or lower relative to the supporting surface 111 of the support pedestal 11. This is beneficial in simplifying the steps and mechanisms for aligning the first substrate 121 and the second substrate 123. In one embodiment of the present invention, the first alignment members 131, the second alignment members 133, the support members 231 and/or the alignment members 233 may not only move along a direction parallel to the supporting surface 111 of the support pedestal 11, but also raise or lower along a direction perpendicular to the supporting surface 111.
In one embodiment of the present invention, as shown in FIG. 1 , the supporting surface 111 of the support pedestal 11 may be configured with six or more connecting rods 151, arranged around the placement area 113 of the supporting surface 111. The first and second alignment members 131/133, the support members 231 and the alignment members 233 on the other hand each include a fixing hole 153, and each is sleeved on one of the connecting rods 153 through the fixing hole 153. In practical applications, based on the sizes of the first substrate 121 and the second substrate 123, first and second alignment members 131/133, support members 231 and alignment members 233 having different forms or sizes may be chosen and fixed to the connecting rods 151, such that the alignment mechanism 10 of the present invention may be used in aligning substrates of two different kinds or more.
In one embodiment of the present invention, the first substrate 121 includes but is not limited to a wafer or a chip, and the second substrate 123 includes but is not limited to a sapphire carrier substrate.
It should be understood that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications can be made without departing from the spirit and scope of the present invention and without diminishing its intended advantages. It is therefore intended that such changes and modifications be covered by the appended claims.

Claims (20)

I claim:
1. An alignment mechanism of a bonding machine, comprising:
a support pedestal including a supporting surface for supporting a first substrate, wherein the supporting surface has a placement area;
three first alignment members arranged around the placement area of the supporting surface for positioning the first substrate through moving toward or away from the placement area and for supporting a second substrate, wherein the first alignment members each include a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, the base being closer to the supporting surface than the protruding part being to the support surface, and the base being used to position the first substrate; and
three second alignment members arranged around the placement area of the supporting surface for positioning the second substrate supported by the first alignment members through moving toward or away from the placement area, wherein the first alignment members move away from the placement area to place the second substrate thereon onto the first substrate.
2. The alignment mechanism according to claim 1, wherein the protruding part protrudes from the base along a radial direction of the support pedestal and is used to support the second substrate, and the first alignment members and the second alignment members move along said radial direction toward or away from the placement area.
3. The alignment mechanism according to claim 2, wherein the protruding part includes an inclined face inclined in a direction toward the supporting surface of the support pedestal or the placement area.
4. The alignment mechanism according to claim 1, comprising at least six connecting rods located on the supporting surface of the support pedestal and arranged around the placement area of the supporting surface, wherein each of the first and second alignment members includes a fixing hole so as to be sleeved on one of the connecting rods.
5. The alignment mechanism according to claim 1, comprising at least three lift pins disposed on the supporting surface of the support pedestal with the first and second alignment members being arranged around the lift pins, wherein the lift pins are configured to raise or lower relative to the supporting surface and are used in supporting the first substrate.
6. The alignment mechanism according to claim 5, wherein one of the lift pins lowers relative to the supporting surface to obliquely place the positioned first substrate on the supporting surface.
7. The alignment mechanism according to claim 1, wherein one of the first alignment members moves away from the placement area to obliquely place the positioned second substrate on the first substrate.
8. An alignment mechanism of a bonding machine, comprising:
a support pedestal including a supporting surface for supporting a first substrate, wherein the supporting surface has a placement area;
three alignment members arranged around the placement area of the supporting surface for positioning the first substrate and a second substrate through moving toward or away from the placement area; and
three support members arranged around the placement area of the supporting surface, the support members being configured to move toward or away from the placement area and being used to support the second substrate, wherein the alignment members move toward the placement area to position the second substrate supported by the support members, and the support members subsequently move away from the placement area to place the second substrate thereon onto the first substrate, wherein the support members each include a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, and the base being closer to the supporting surface than the protruding part being to the supporting surface.
9. The alignment mechanism according to claim 8, wherein the protruding part protrudes from the base along a radial direction of the support pedestal and is used to support the second substrate, and the alignment members and the support members move along said radial direction toward or away from the placement area.
10. The alignment mechanism according to claim 9, wherein the protruding part includes an inclined face inclined in a direction toward the supporting surface of the support pedestal or the placement area.
11. The alignment mechanism according to claim 8, comprising at least six connecting rods located on the supporting surface of the support pedestal and arranged around the placement area of the supporting surface, wherein each of the alignment members and support members includes a fixing hole so as to be sleeved on one of the connecting rods.
12. The alignment mechanism according to claim 8, comprising at least three lift pins disposed on the supporting surface of the support pedestal with the alignment members and the support members being arranged around the lift pins, wherein the lift pins are configured to raise or lower relative to the supporting surface and are used in supporting the first substrate.
13. The alignment mechanism according to claim 12, wherein one of the lift pins lowers relative to the supporting surface to obliquely place the positioned first substrate on the supporting surface.
14. The alignment mechanism according to claim 8, wherein one of the support members moves away from the placement area to obliquely place the positioned second substrate on the first substrate.
15. An alignment method for a bonding machine, comprising:
placing a first substrate on a supporting surface of a support pedestal, wherein the supporting surface has a placement area;
three alignment members moving toward the placement area to position the first substrate placed on the supporting surface to align the first substrate with the placement area;
three support members moving toward the placement area and being used in supporting a second substrate; wherein each of the support members includes a protruding part and a base, the protruding part being protruding from the base and directed to the placement area, the base being closer to the supporting surface than the protruding part being to the support surface; wherein when the support members move toward the placement area and the first substrate, the bases of the support members position the first substrate;
the alignment members moving toward the placement area to position the second substrate supported by the support members to align the second substrate with the first substrate; and
the support members moving away from the placement area to place the second substrate thereon onto the first substrate.
16. The alignment method according to claim 15, comprising:
one of the support members moving away from the placement area at first to obliquely place the second substrate thereon on the first substrate; and
the other two support members moving away from the placement area to place the second substrate onto the first substrate.
17. The alignment method according to claim 15, comprising:
placing the first substrate on three lift pins;
the lift pins lowering relative to the supporting surface to place the first substrate onto the supporting surface.
18. The alignment method according to claim 15, comprising:
placing the first substrate on three lift pins;
one of the lift pins lowering relative to the supporting surface to obliquely place the first substrate to the supporting surface; and
the other two lift pins lowering relative to the supporting surface to place the first substrate onto the supporting surface.
19. The alignment method according to claim 15, comprising:
the alignment members moving away from the placement area after the support members move toward the placement area and come to a stop.
20. The alignment method according to claim 15, comprising:
placing the second substrate onto the support members after the alignment members move away from the placement area and come to a stop.
US17/517,342 2021-11-02 2021-11-02 Alignment mechanism and alignment method of bonding machine Active 2042-05-03 US11869792B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/517,342 US11869792B2 (en) 2021-11-02 2021-11-02 Alignment mechanism and alignment method of bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17/517,342 US11869792B2 (en) 2021-11-02 2021-11-02 Alignment mechanism and alignment method of bonding machine

Publications (2)

Publication Number Publication Date
US20230138307A1 US20230138307A1 (en) 2023-05-04
US11869792B2 true US11869792B2 (en) 2024-01-09

Family

ID=86145583

Family Applications (1)

Application Number Title Priority Date Filing Date
US17/517,342 Active 2042-05-03 US11869792B2 (en) 2021-11-02 2021-11-02 Alignment mechanism and alignment method of bonding machine

Country Status (1)

Country Link
US (1) US11869792B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230187248A1 (en) * 2021-12-10 2023-06-15 Sky Tech Inc. Substrate-bonding device

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6237832B1 (en) * 1999-10-18 2001-05-29 Henry Chung Wave soldering fixture
US20040222269A1 (en) * 2003-05-09 2004-11-11 Yong Min Luo Supporting tray for wave soldering
US20050067464A1 (en) * 2003-09-30 2005-03-31 Peng-Wei Wang Fixture for supporting a printed circuit board in a production line
US20100216313A1 (en) * 2007-10-12 2010-08-26 Panasonic Corproation Plasma processing apparatus
WO2014098174A1 (en) * 2012-12-21 2014-06-26 株式会社新川 Flip-chip bonder and method for correcting flatness and deformation amount of bonding stage
CN104685607A (en) * 2012-09-19 2015-06-03 应用材料公司 Methods for bonding substrates
DE102015101897A1 (en) * 2015-02-10 2016-08-11 Ev Group E. Thallner Gmbh Device and method for at least partially releasing a connecting layer of a temporarily bonded substrate stack
CN107622968A (en) * 2016-07-13 2018-01-23 株式会社荏原制作所 Substrate holder and the plater using the substrate holder
KR20200021138A (en) * 2018-08-20 2020-02-28 주식회사 피엘아이 Wafer jig for bonding wafers and wafer bonding equipment including the wafer jig
CN112309945A (en) * 2020-11-11 2021-02-02 鑫天虹(厦门)科技有限公司 Alignment mechanism and alignment method of bonding machine
US20220122868A1 (en) * 2020-10-16 2022-04-21 Sky Tech Inc. Alignment mechanism and alignment method of bonding machine
US20230187248A1 (en) * 2021-12-10 2023-06-15 Sky Tech Inc. Substrate-bonding device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6237832B1 (en) * 1999-10-18 2001-05-29 Henry Chung Wave soldering fixture
US20040222269A1 (en) * 2003-05-09 2004-11-11 Yong Min Luo Supporting tray for wave soldering
US20050067464A1 (en) * 2003-09-30 2005-03-31 Peng-Wei Wang Fixture for supporting a printed circuit board in a production line
US20100216313A1 (en) * 2007-10-12 2010-08-26 Panasonic Corproation Plasma processing apparatus
CN104685607A (en) * 2012-09-19 2015-06-03 应用材料公司 Methods for bonding substrates
WO2014098174A1 (en) * 2012-12-21 2014-06-26 株式会社新川 Flip-chip bonder and method for correcting flatness and deformation amount of bonding stage
DE102015101897A1 (en) * 2015-02-10 2016-08-11 Ev Group E. Thallner Gmbh Device and method for at least partially releasing a connecting layer of a temporarily bonded substrate stack
CN107622968A (en) * 2016-07-13 2018-01-23 株式会社荏原制作所 Substrate holder and the plater using the substrate holder
KR20200021138A (en) * 2018-08-20 2020-02-28 주식회사 피엘아이 Wafer jig for bonding wafers and wafer bonding equipment including the wafer jig
US20220122868A1 (en) * 2020-10-16 2022-04-21 Sky Tech Inc. Alignment mechanism and alignment method of bonding machine
CN112309945A (en) * 2020-11-11 2021-02-02 鑫天虹(厦门)科技有限公司 Alignment mechanism and alignment method of bonding machine
US20230187248A1 (en) * 2021-12-10 2023-06-15 Sky Tech Inc. Substrate-bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230187248A1 (en) * 2021-12-10 2023-06-15 Sky Tech Inc. Substrate-bonding device
US11961753B2 (en) * 2021-12-10 2024-04-16 Sky Tech Inc. Substrate-bonding device

Also Published As

Publication number Publication date
US20230138307A1 (en) 2023-05-04

Similar Documents

Publication Publication Date Title
KR100436188B1 (en) Chip pick up device and method for manufacturing semiconductor devices
JP2000208447A (en) Semiconductor manufacturing apparatus and manufacture of semiconductor device
KR20180092274A (en) Semiconductor manufacturing device and manufacturing method of semiconductor device
JP2006191144A (en) Pickup device and pickup method
US11869792B2 (en) Alignment mechanism and alignment method of bonding machine
KR20190032180A (en) Apparatus for manufacturing semiconductor, method of manufacturing semiconductor device and collet
US9711383B2 (en) Fabrication method of semiconductor devices and fabrication system of semiconductor devices
US12211727B2 (en) Simultaneous bonding approach for high quality wafer stacking
CN114695151A (en) Impactless die bonding method for corner or side contact
US20220122868A1 (en) Alignment mechanism and alignment method of bonding machine
TWM609527U (en) Alignment mechanism of bonding machine
CN112309945A (en) Alignment mechanism and alignment method of bonding machine
JP2001196443A (en) Apparatus and method for picking up semiconductor chip
CN215644434U (en) Alignment mechanism of bonder
TW202234567A (en) Pick-up device and pick-up method for semiconductor die
TWI792447B (en) Alignment mechanism and alignment method of bonding machine
TWI769957B (en) Substrate bonding mechanism
US20040200064A1 (en) Semiconductor chip pick and place process and equipment
TWM626383U (en) Substrate Bonding Mechanism
US11961753B2 (en) Substrate-bonding device
TWM620595U (en) Alignment mechanism of bonding machine
TWI776665B (en) Alignment mechanism and bonding machine using the alignment mechanism
KR20180069381A (en) Vacuum chuck supporting semiconductor substrate
CN115692287A (en) Alignment mechanism and alignment method of bonder
US20070035034A1 (en) System and Method for Improved Auto-Boating

Legal Events

Date Code Title Description
AS Assignment

Owner name: SKY TECH INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, JING-CHENG;REEL/FRAME:058001/0640

Effective date: 20211101

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE