TWI776665B - Alignment mechanism and bonding machine using the alignment mechanism - Google Patents

Abstract

The invention is an alignment mechanism for bonding machine, which includes a carrier, a plurality of bearing pins, a first alignment pin and a plurality of second alignment pins. The carrying pins are arranged around the carrier to carry a first substrate and drive the first substrate to rise and fall relative to the carrier. The first and second alignment pins are arranged around the carrier, can be raised and lowered relative to the carrier, and are far away from or close to the carrier. The first alignment pin rises and moves toward the bearing pin to contact the first substrate on the bearing pin, so that the first substrate is aligned with an alignment area on the carrier. The second alignment pins are evenly distributed around the carrier, and are used to carry and align a second substrate that is carried, so that the second substrate is aligned with the first substrate.

Description

Bonding alignment mechanism and bonding machine using the same

The present invention relates to a bonding alignment mechanism, in particular to an alignment mechanism applied to a bonding machine. A plurality of pins are mainly arranged around the carrier, which can quickly and accurately align a plurality of substrates, so as to align a plurality of substrates. The aligned substrates are bonded.

The development of integrated circuit technology has matured, and electronic products are currently developing towards the trend of light, thin, short, high performance, high reliability and intelligence. The wafer in an electronic product can have a significant impact on the performance of the electronic product, which is partly related to the thickness of the wafer. For example, thinner chips can improve heat dissipation efficiency, increase mechanical performance, improve electrical properties, and reduce package size and weight.

In the semiconductor manufacturing process, the substrate thinning process, the via etching process and the backside metallization process are usually performed on the back surface (ie, the lower surface) of the wafer. However, in the process of substrate thinning, when the thickness of the substrate is too thin (for example, less than or equal to 150 microns), it may cause wafer breakage or bending deformation of the wafer, making the wafer unusable and reducing the wafer yield.

Therefore, before the substrate thinning process is performed, a bonding process is performed, and the wafer is bonded to the carrier (eg, sapphire glass) mainly through the bonding of the adhesive layer, and after the substrate thinning process is completed, a debonding process is performed to bond the The wafer is separated from the carrier.

In the bonding process, a bonding machine needs to be used to align the wafer and the carrier first, and then bond the stacked wafers and the carrier. However, most of the existing bonding machines can only be applied to wafers of a certain size, and during the bonding process, the bonding layer between the substrate and the carrier may have poor bonding force due to improper pressing force, non-level pressing plate or other factors. Bonding bubbles, and poor total thickness variation (TTV) of the wafer after bonding.

In order to solve the problems faced by the prior art, the present invention is a novel bonding machine, which can be used to replace bearing pins of different sizes according to the size of the substrate, so that the bonding machine of the present invention can be used to align various sizes substrates, and the bonding of the substrates is performed after the alignment steps are completed.

An object of the present invention is to provide a bonding alignment mechanism, which mainly includes a carrier, a plurality of bearing pins and a first alignment pin, wherein the plurality of carrier pins and the first alignment pins are arranged around the carrier , and extends to the bearing surface of the stage.

The carrying pins can lift up and down relative to the carrying surface of the carrier, and are used for carrying a first substrate. The first alignment stitch faces the plurality of bearing pins, wherein the first alignment stitch and the plurality of alignment stitches are located on two sides of the center line of the carrier, respectively. The first alignment pins can be raised and lowered relative to the bearing surface of the carrier, and approach or move away from the alignment area on the bearing surface. When the first alignment pins are displaced in the direction of the plurality of bearing pins, they will contact and push against the first substrate carried by the bearing pins, so that the first substrate is aligned with the alignment area of the bearing surface.

The plurality of second alignment pins are evenly distributed around the carrier, can be raised and lowered relative to the carrier surface of the carrier, and are close to or away from the alignment area of the carrier surface. After the second alignment pins are displaced toward the alignment area by a distance, a second substrate can be placed on the second alignment pins. Then, the second alignment pins will continue to move toward the alignment area, and contact and abut the second substrate carried, so that the second substrate is aligned with the first substrate and the alignment area.

After the alignment of the first substrate and the second substrate is completed, the second alignment pins will descend relative to the carrier surface of the stage and gradually move away from the alignment area of the carrier surface to place the second substrate on the first substrate superior. Through the bonding alignment mechanism of the present invention, the first substrate and the second substrate can be quickly and accurately aligned, and the aligned first substrate and the second substrate can be bonded.

An object of the present invention is to provide a bonding alignment mechanism, which can replace bearing pins with different lengths according to the size of the first substrate and the second substrate, and adjust the lifting and lowering of the first alignment pins and the second alignment pins. range of movement. Therefore, the bonding alignment mechanism of the present invention can be widely used in the first and second substrates of various sizes, and can complete the alignment of the first substrate and the second substrate.

An object of the present invention is to provide a bonding alignment mechanism, wherein the first alignment pin and the second alignment pin are respectively connected to a driving unit. The driving unit includes a guide rail, a connecting base and a driving rod body, wherein the connecting base is arranged on the guide rail, and the driving rod body is located below the connecting base and contacts the connecting base. When the driving rod body is extended, it will push the connecting seat and drive the connecting seat to move along the guide rail.

In addition, a limit unit can be arranged above the connection seat to limit the maximum height of the connection seat, and the maximum height of the first and second alignment pins connected by the connection seat, and the movement toward the alignment area of the bearing surface. The maximum distance makes the first and second alignment pins suitable for aligning substrates of various sizes.

An object of the present invention is to provide a bonding machine, which includes a first cavity, a second cavity, a pressing unit and a bonding alignment mechanism, wherein the pressing unit is arranged on the first cavity , and the bonding alignment mechanism is arranged on the second cavity. The first cavity faces the second cavity. When the first cavity is connected to the second cavity, a closed space can be formed between the first cavity and the second cavity, and the gas in the closed space can be extracted. Make the closed space a low pressure or vacuum state.

The pressing unit faces the bonding alignment mechanism, can be displaced toward the carrier of the bonding alignment mechanism, and presses the first substrate and the second substrate stacked on the carrier to complete the bonding of the first substrate and the second substrate combine.

In order to achieve the above purpose, the present invention proposes a bonding alignment mechanism, comprising: a carrier, including a bearing surface, and defining an alignment area on the bearing surface; a plurality of lifting units arranged around the carrier; A plurality of bearing pins are respectively connected with a plurality of lifting units, and the plurality of bearing pins are moved up and down relative to the bearing surface of the carrier through the plurality of lifting units, wherein the plurality of bearing pins are used to carry a first substrate; a first driving unit , arranged around the carrier; a first alignment pin is connected to the first drive unit, and the first alignment pin is driven up and down relative to the bearing surface of the carrier through the first drive unit, and drives the first alignment pin to approach or an alignment area away from the bearing surface, wherein the first alignment pins are used to push against the first substrate placed on the bearing pins, so that the first substrate is aligned with the alignment area; a plurality of second driving units are arranged around the carrier ; and a plurality of second alignment pins connected to the second driving unit, wherein the second alignment pins are used to carry a second substrate, and the second driving unit is used to drive the second alignment pins to carry relative to the carrier The surface is lifted up and down, and the second alignment pins are driven close to or away from the alignment area of the bearing surface to push against the second substrate, so that the second substrate is aligned with the first substrate.

The present invention provides a bonding machine, comprising: a first cavity; a second cavity facing the first cavity, wherein when the first cavity is connected to the second cavity, the first cavity and the second cavity A closed space is formed between the cavities; a pressing unit is connected to the first cavity; a key alignment mechanism is arranged in the second cavity and faces the pressing unit, including: a carrier, including a bearing and define an alignment area on the bearing surface; a plurality of lifting units are arranged around the carrier; a plurality of bearing pins are respectively connected to the plurality of lifting units, and through the plurality of lifting units, the plurality of bearing pins are driven relative to each other. The bearing surface of the carrier moves up and down, wherein a plurality of bearing pins are used to carry a first substrate; a first driving unit is arranged around the carrier; a first alignment pin is connected to the first driving unit, wherein the first driving unit The unit is used to drive the first alignment pins to move up and down relative to the bearing surface of the carrier, and to drive the first alignment pins to be close to or away from the alignment area of the carrier surface, so as to push against the first substrate carried by the carrier pins, so that the first substrate an alignment area; a plurality of second driving units arranged around the carrier; and a plurality of second alignment pins connected to the second driving units, wherein the second alignment pins are used to carry a second substrate, and The driving unit is used to drive the second alignment pins to move up and down relative to the bearing surface of the carrier, and drive the second alignment pins to approach or move away from the alignment area of the carrier surface to push against the second substrate to align the second substrate the first substrate.

The bonding alignment mechanism and the bonding machine, wherein the carrier includes a plurality of grooves facing the center of the bearing surface or the alignment area, and the carrier pins, the first alignment pins and the second alignment pins are respectively located in the plurality of in a groove.

In the bonding alignment mechanism and the bonding machine, the bearing pin includes a bearing portion and a first alignment portion, the bearing portion is used for bearing the first substrate, and the first alignment portion protrudes from the bearing portion, and used for contacting and aligning the first substrate.

In the bonding alignment mechanism and the bonding machine, one end of the second alignment pin which is not connected to the second driving unit includes a protruding portion for carrying the second substrate.

Said bonding alignment mechanism and bonding machine, wherein the first driving unit and the second driving unit include: a guide rail, inclined relative to the bearing surface of the carrier; a connecting seat, connecting the guide rail, wherein the connecting seat is connected to the first an alignment pin or a second alignment pin; and a driving rod body, which is connected to the connecting seat, the first alignment pin or the second alignment pin, and the driving rod body is used to drive the connection seat to move along the slide rail, so that the first alignment pin The alignment pins or secondary alignment pins are raised and lowered relative to the loading surface of the stage and approach or away from the alignment area.

The bonding machine includes: a first drive device connected to the first cavity and used to drive the first cavity to approach or away from the second cavity; and a second drive device connected to the pressing unit and used to drive The pressing unit is close to or far from the carrier, so that the pressing unit presses the first substrate and the second substrate stacked on the carrier.

The bonding machine and the bonding machine include a pick-up device for clamping the first substrate and the second substrate, and placing the first substrate and the second substrate on the bonding alignment mechanism, wherein the pick-up device is used to hold the first and second substrates. The pickup device includes a plurality of first alignment units, and the bonding alignment mechanism includes a plurality of second alignment units located around the carrier, and the first alignment unit and the second alignment unit align the pickup device. and stage.

Please refer to FIG. 1 , which is a three-dimensional schematic diagram of an embodiment of the bonding alignment mechanism of the present invention. As shown in the figure, the bonding alignment mechanism 10 includes a stage 11, a plurality of lifting units 13, a plurality of bearing pins 14, a first driving unit 15, a first alignment pin 16, and a plurality of second driving units 17 and a plurality of second alignment pins 18, wherein the lifting unit 13, the first driving unit 15 and the second driving unit 17 are arranged around the stage 11, and are respectively connected to the bearing pins 14, the first alignment pins 16 and the first Two align with pin 18.

The stage 11 includes a carrying surface 111 for carrying the substrate. In addition, an alignment area 113 may be further defined on the bearing surface 111 , wherein the alignment area 113 may be a central area of the bearing surface 111 , for example, the bearing surface 111 may be circular, and the alignment area 113 is located in the bearing surface 111 A smaller circle, and the centers of the carrying surface 111 and the alignment area 113 overlap. During the alignment step, a first substrate 121 and a second substrate 123 may be aligned or overlapped with the alignment region 113 , respectively, so that the second substrate 123 is aligned and overlapped with the first substrate 121 .

Each lifting unit 13 is connected to each bearing pin 14 respectively, and is used for driving each bearing pin 14 to lift and lower relative to the bearing surface 111 of the carrier 11 . Specifically, the bearing pins 14 may be elongated, wherein one end of the bearing pins 14 is connected to the lifting unit 13 .

In an embodiment of the present invention, as shown in FIG. 2 and FIG. 5 , the bearing pin 14 includes a bearing portion 141 and a first alignment portion 143 , wherein the bearing portion 141 is located at the end of the bearing pin 14 that is not connected to the lifting unit 13 , And the first alignment portion 143 protrudes from the bearing portion 141 . The carrying pins 14 carry the first substrate 121 through the carrying portion 141 , and align the carried first substrate 121 through the first alignment portion 143 . The detailed alignment method will be described in subsequent embodiments.

Specifically, a gap 142 is formed at one end of the bearing pin 14 that is not connected to the lifting unit 13 to form a bearing portion 141 at one end of the bearing pin 14 , and the bearing pin 14 without the gap 142 is the first alignment portion 143 , wherein The height of the first alignment portion 143 is greater than that of the bearing portion 141 . In addition, one end of the first alignment portion 143 facing the carrier portion 141 may be provided with a chamfered or rounded corner, so that the first substrate 121 not accurately placed on the carrier portion 141 slides down to the carrier portion 141 from the first alignment portion 143 . In another embodiment of the present invention, a raised portion can also be provided on the upper surface of the bearing pin 14 , and the raised portion is used as the first alignment portion 143 .

In an embodiment of the present invention, as shown in FIG. 2 , the lifting unit 13 includes a guide rail 131 , a connecting base 133 and a driving rod 135 , wherein the guide rail 131 is perpendicular to the bearing surface 111 of the carrier 11 . The connecting base 133 is connected to the guide rail 131 , and the driving rod body 135 is located under the connecting base 133 and contacts the connecting base 133 .

When the driving rod body 135 is extended or shortened, it will drive or push the connecting base 133 to move along the guide rail 131 , so that the bearing pins 14 connected by the connecting base 133 are lifted and lowered relative to the bearing surface 111 of the carrier 11 . For example, the driving rod body 135 may be a The pneumatic cylinder is driven up and down by a motor.

The first driving unit 15 is connected to the first alignment pins 16 to drive the first alignment pins 16 to move up and down relative to the bearing surface 111 of the carrier 11 , and to drive the first alignment pins 16 to align close to or away from the bearing surface 111 . The area 113, wherein the first alignment pins 16 are elongated.

In an embodiment of the present invention, the bearing surface 111 of the carrier 11 may be circular, wherein the plurality of lifting units 13 and the first driving units 15 are located on both sides of the diameter or the center line of the bearing surface 111 , and the plurality of bearing The pins 14 and the first alignment pins 16 are located on two sides of the diameter centerline of the bearing surface 111 , respectively.

In practical application, the lifting unit 13 can drive the bearing pins 14 to lift up, and place the first substrate 121 on the bearing portion 141 of the bearing pins 14 . Then, the first driving unit 15 drives the first alignment pins 16 to rise relative to the bearing surface 111 of the stage 11 and approach the alignment area 113 of the bearing surface 111 . The first alignment pins 16 contact and push against the first substrate 121 placed on the bearing portion 141 carrying the pins 14 , and push against the first substrate 121 in the direction of the first alignment portions 143 carrying the plurality of pins 14 . The first alignment portion 143 of the carrier pin 14 and the first alignment pin 16 both contact the outer edge of the first substrate 121 , so that the first substrate 121 is aligned with the alignment area 113 of the carrier surface 111 .

After the alignment of the first substrate 121 is completed, the first driving unit 15 drives the first alignment pins 16 to descend relative to the bearing surface 111 of the stage 11 and away from the alignment area 113 of the bearing surface 111 . Then, the lifting unit 13 drives the bearing pins 14 to descend relative to the bearing surface 111 of the carrier 11 , and places the first substrate 121 on the bearing surface 111 and/or the alignment area 113 of the carrier 11 .

In an embodiment of the present invention, the plurality of lifting units 13 can synchronously drive the respective bearing pins 14 to descend, so as to place the first substrate 121 on the bearing surface 111 and/or the alignment area 113 of the carrier 11 . In an embodiment of the present invention, one of the lifting units 13 may first drive the connected carrying pins 14 to descend, so that the first substrate 121 is inclined on the carrying surface 111 of the carrier 11 . After the first substrate 121 contacts the bearing surface 111 of the carrier 11 , the other lifting units 13 will drive the connected carrier pins 14 to descend, so as to place the first substrate 121 on the bearing surface 111 of the carrier 11 and/or align area 113.

The second driving unit 17 is connected to the second alignment pins 18 for driving the second alignment pins 18 to move up and down relative to the bearing surface 111 of the carrier 11 , and approach or away from the alignment area 113 of the bearing surface 111 . In an embodiment of the present invention, the bearing surface 111 of the carrier 11 may be circular, and the plurality of second driving units 17 are evenly distributed around the bearing surface 111 of the carrier 11 , such as adjacent second driving units 17 And/or the distance and/or angle of the second alignment pins 18 are the same, and are used to carry and align the second substrate 123 .

As shown in FIG. 3 and FIG. 6 , one end of the second alignment pin 18 not connected to the second driving unit 17 has a protruding portion 181 , wherein the protruding portion 181 protrudes from one end of the second alignment pin 18 and is used for A second substrate 123 is carried. Specifically, the protruding portion 181 can be disposed in the middle area of one end of the second alignment pin 18 , and a first gap 183 is formed above the protruding portion 181 , and a second gap is formed below the protruding portion 181 185.

The second substrate 123 is located in the first notch 183 and supports the second substrate 123 through the protruding portion 181 . The first substrate 121 is located in the second gap 185 , wherein the second substrate 123 and the first substrate 121 are located on the upper and lower sides of the protruding portion 181 , respectively. For example, the first substrate 121 is a wafer, and the second substrate 123 is a carrier.

In practical application, the second driving unit 17 is used to drive the second alignment pins 18 to rise relative to the bearing surface 111 of the carrier 11 and approach the alignment area 113 of the bearing surface 111 , so that the first substrate 121 is located in the second Align under the protrusion 181 of the pin 18.

The second substrate 123 is placed on the protruding parts 181 of the second alignment pins 18 , and the protruding parts 181 support the second substrate 123 . The second driving unit 17 will continue to drive the second alignment pins 18 to move toward the alignment area 113 , so that one end of each second alignment pin 18 contacts and aligns the second substrate 123 , for example, the first alignment pin 18 above the protruding portion 181 is used for alignment. The first alignment pins 18 in the notches 183 contact and push against the second substrate 123 , so that the second substrate 123 is aligned with the alignment area 113 of the bearing surface 111 and/or the first substrate 121 .

In an embodiment of the present invention, a chamfer or a rounded corner may be provided on the second alignment pins 18 above the protruding portion 181 , so that the second substrate 123 that is not accurately placed on the protruding portion 181 slides down to the protruding portion 181. In addition, the bottom of the protruding portion 181 may be an inclined surface. For example, the angle between the inclined surface of the bottom of the protruding portion 181 and the bearing surface 111 of the carrier 11 is less than 90 degrees, so as to prevent the second alignment pins 18 from approaching or away from the bearing surface 111 . When the alignment area 113 is located, the first substrate 121 that has been aligned is touched.

After the second substrate 123 is aligned with the alignment area 113 of the carrier surface 111 and/or the first substrate 121 , the second driving unit 17 drives the second alignment pins 18 to descend relative to the carrier surface 111 of the carrier 11 and move away from the carrier surface 111 . The alignment area 113 of the bearing surface 111 is to place the second substrate 123 on the first substrate 121 .

In another embodiment of the present invention, one of the second driving units 17 may first drive the connected second alignment pins 18 to descend and move away from the alignment area 113 , so that the second substrate 123 is placed obliquely on the first substrate 121 . Then the other second driving units 17 will drive the connected second alignment pins 18 to descend and move away from the alignment area 113 , and place the second substrate 123 on the first substrate 121 to avoid placing the second substrate 123 on the first substrate 121 . Residual gas is generated in the adhesive layer between the substrates 121 .

In an embodiment of the present invention, as shown in FIG. 3 and FIG. 4 , the first driving unit 15 and the second driving unit 17 may have the same structure. Taking the second driving unit 17 as an example for illustration, the second driving unit 17 includes a guide rail 171 , a connecting seat 173 and a driving rod body 175 , wherein the guide rail 171 is inclined relative to the bearing surface 111 of the stage 11 , such as the guide rail 171 . The included angle between the extension line and the extension line of the bearing surface 111 of the stage 11 is less than 90 degrees. The connecting seat 173 is connected to the guide rail 171 , and the driving rod body 175 contacts the connecting seat 173 , the first alignment pin 16 or the second alignment pin 18 , for example, is located below the connecting seat 173 .

When the driving rod body 175 is extended or shortened, it will drive or push the connecting base 173 to move along the guide rail 171 . Since the guide rails 171 are inclined relative to the bearing surface 111 of the carrier 11 , the second alignment pins 18 connected to the connecting base 173 will rise and fall relative to the bearing surface 111 of the carrier 11 , and move closer to or away from the alignment area 113 of the bearing surface 111 . For example, the driving rod body 175 can be a pneumatic cylinder, and the pneumatic cylinder is driven up and down by a motor.

In an embodiment of the present invention, the second driving unit 17 may include a fixing frame 177, wherein the fixing frame 177 includes a bottom 1771, a top 1773 and an inclined portion 1775, the bottom 1771 and the top 1773 face each other, and the inclined portion 1775 connects top 1773 and bottom 1771. The inclined portion 1775 has an inclined surface inclined relative to the bearing surface 111 of the stage, and the guide rail 171 is disposed on the inclined surface of the inclined portion 1775 .

In addition, a limit unit 179 can be disposed on the top 1773 , wherein the limit unit 179 is used to limit the displacement range of the connecting seat 173 and the second alignment pin 18 . For example, the limit unit 179 can be a screw and pass through the The screw hole is used to limit the highest position of the displacement of the connection seat 173 and the second alignment pin 18 . Specifically, when the connecting seat 173 contacts the limiting unit 179 , the driving rod body 175 cannot continue to drive the connecting seat 173 to move upward along the guide rail 171 , so as to limit the displacement range of the connecting seat 173 . When the length of the limiting unit 179 protruding from the lower surface of the top 1773 is larger, the highest position of the displacement of the connecting seat 173 and the second alignment pin 18 will be lower.

In an embodiment of the present invention, a roller 1751 may be provided at one end of the driving rod body 175 that contacts the connecting seat 173 , and a wire rail or groove may be provided on the surface of the connecting seat 173 that contacts or faces the driving rod body 175 , wherein the roller 1751 is located in the track or groove. The arrangement of the rollers 1751 facilitates the relative displacement of the driving rod body 175 and the connecting seat 173 , so that the connecting seat 173 and the second alignment pins 18 are close to or away from the alignment area 113 of the bearing surface 11 .

In an embodiment of the present invention, a plurality of grooves 115 may be formed on the bearing surface 111 of the carrier 11 , and the bearing pins 14 , the first alignment pins 16 and the second alignment pins 18 are arranged in each of the grooves 115 , can be raised and lowered relative to the bearing surface 111 along the groove 115 , and can be displaced relative to the alignment area 113 of the bearing surface 111 along the groove 115 . In addition, the bearing surface 111 of the carrier 11 is circular, and the grooves 115 , the bearing pins 14 , the first alignment pins 16 and the second alignment pins 18 face the center or the center of the carrier surface 111 .

Please refer to FIG. 7 , which is a three-dimensional perspective schematic diagram of an embodiment of a bonding machine of the present invention. Please refer to FIG. 1 , the bonding machine 20 includes a first cavity 21 , a second cavity 23 , a pressing unit 25 and a bonding alignment mechanism 10 , wherein the pressing unit 25 is connected to the first cavity 21 , and the bonding alignment mechanism 10 is disposed on the second cavity 23 , and the pressing unit 25 faces the bonding alignment mechanism 10 .

The first cavity 21 faces the second cavity 23 . When the first cavity 21 is connected to the second cavity 23 , a closed space is formed between the first cavity 21 and the second cavity 23 . Then, the gas in the closed space can be extracted through an air extraction device, so that the closed space between the first cavity 21 and the second cavity 23 is in a low pressure state. In addition, when the first cavity 21 is connected to the second cavity 23 , the pressing unit 25 is also close to the stage 11 of the bonding alignment mechanism 10 .

In an embodiment of the present invention, the bonding machine 20 may include a first driving device 271 and a second driving device 273 , wherein the first driving device 271 is connected to the first cavity 21 and used to drive the first cavity 21 close to or away from the second cavity 23 . The second driving device 273 is connected to the pressing unit 25. For example, the second driving device 273 may be disposed on the first cavity 21, and connect and drive the pressing unit 25 to move relative to the first cavity 21, so that the pressing unit 25 is close to or away from the stage 11 of the bonding alignment mechanism 10 .

Specifically, after the bonding alignment mechanism 10 completes the alignment of the first substrate 121 and the second substrate 123 , the second driving device 273 drives the pressing unit 25 to approach the stage 11 of the bonding alignment mechanism 10 , and The first substrate 121 and the second substrate 123 stacked on the stage 11 are pressed by the pressing unit 25 . In addition, a heating device may be provided in the stage 11 and/or the pressing unit 25, and the first substrate 121 and the second substrate 123 pressed by the stage 11 and the pressing unit 25 can be heated by the heating device, so that the first substrate The adhesive layer between the first substrate 121 and the second substrate 123 bonds the two substrates to complete the bonding of the first substrate 121 and the second substrate 123 .

In practical application, the picking device 30 shown in FIG. 8 can be used, wherein the picking device 30 is used to pick up the first substrate 121 and the second substrate 123 and place the first substrate 121 and the second substrate 123 on the key on the alignment mechanism 10. Specifically, the pick-up device 30 may include at least one white-effort suction cup, and pick up the first substrate 121 or the second substrate 123 by means of suction.

In addition, the picking device 30 may include a plurality of first alignment units 31, and the bonding alignment mechanism 10 may include a plurality of second alignment units 19, wherein the second alignment units 19 are located on the circumference of the carrier 11, The first substrate 121 and the second substrate 123 are placed on the carrier 11 through the first alignment unit 31 and the second alignment unit 19 to align the pick-up device 30 and the carrier 11 of the bonding alignment mechanism 10 . fixed position. For example, the first alignment unit 31 can be a protruding portion, and the second alignment unit 19 can be a concave portion, wherein the first alignment unit 31 is used to insert the second alignment unit 19 .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included within the scope of the patent application of the present invention.

10: Bonding Alignment Mechanism 11: Carrier 111: Bearing surface 113: Alignment area 115: Groove 121: The first substrate 123: Second substrate 13: Lifting unit 131: Rails 133: Connector 135: Drive rod body 14: Bearing pins 141: Bearing Department 142: Notch 143: First Alignment Section 15: The first drive unit 16: The first alignment pin 17: Second drive unit 171: Rails 173: Connector 175: Drive rod body 1751: Roller 177:Fixed frame 1771: Bottom 1773: Top 1775: Slope 179: Limit unit 18: Second alignment pin 181: Projection 183: First Gap 185: Second Gap 19: Second alignment unit 20: Bonding machine 21: The first cavity 23: Second cavity 25: Press unit 271: First Drive 273 Second Drive 30: Take the device 31: The first alignment unit

[FIG. 1] is a three-dimensional schematic diagram of an embodiment of the bonding alignment mechanism of the present invention.

FIG. 2 is a perspective view of an embodiment of the lifting unit and the bearing pins of the bonding alignment mechanism of the present invention.

3 is a perspective view of an embodiment of the second driving unit and the second alignment pins of the bonding alignment mechanism of the present invention.

4 is a perspective view of an embodiment of the first driving unit and the first alignment pins of the bonding alignment mechanism of the present invention.

[ Fig. 5 ] A schematic cross-sectional view of an embodiment of the carrier pin of the bonding alignment mechanism of the present invention carrying the first substrate.

6 is a schematic cross-sectional view of an embodiment of the second alignment pin of the bonding alignment mechanism of the present invention carrying the second substrate.

[ Fig. 7 ] is a perspective perspective view of an embodiment of a bonding machine of the present invention.

FIG. 8 is a perspective view of an embodiment of a pickup device for the bonding alignment mechanism of the present invention.

10: Bonding Alignment Mechanism

11: Carrier

111: Bearing surface

113: Alignment area

115: Groove

121: The first substrate

13: Lifting unit

14: Bearing pins

15: The first drive unit

16: The first alignment pin

17: Second drive unit

18: Second alignment pin

19: Second alignment unit

Claims (10)

A bond alignment mechanism, comprising: a carrier, including a bearing surface and defining an alignment area on the bearing surface; A plurality of lifting units are arranged around the carrier; A plurality of bearing pins are respectively connected to the plurality of lifting units, and the plurality of lifting units are used to drive the plurality of bearing pins to lift and lower relative to the bearing surface of the carrier, wherein the plurality of bearing pins are used to carry a first substrate ; a first drive unit, arranged around the carrier; A first alignment pin is connected to the first driving unit, and the first alignment pin is driven to move up and down relative to the bearing surface of the carrier through the first driving unit, and drive the first alignment pin to move closer to or away from the the alignment area of the bearing surface, wherein the first alignment pin is used to push against the first substrate placed on the carrier pin, so that the first substrate is aligned with the alignment area; a plurality of second driving units arranged around the stage; and A plurality of second alignment pins are connected to the second driving unit, wherein the second alignment pins are used for carrying a second substrate, and the second driving unit is used for driving the second alignment pins relative to the carrier The bearing surface of the stage moves up and down, and drives the second alignment pins close to or away from the alignment area of the bearing surface to push against the second substrate, so that the second substrate is aligned with the first substrate. The bonding alignment mechanism of claim 1, wherein the carrier comprises a plurality of grooves facing the center of the carrier surface or the alignment area, and the carrier pins, the first alignment pins and the second pair of The quasi-pins are respectively located in the plurality of grooves. The bonding alignment mechanism of claim 1, wherein the bearing pin comprises a bearing portion and a first alignment portion, the bearing portion is used for bearing the first substrate, and the first alignment portion protrudes The carrying portion is used for contacting and aligning the first substrate. The bonding alignment mechanism of claim 3, wherein one end of the second alignment pin not connected to the second driving unit includes a protruding portion for supporting the second substrate. The bonding alignment mechanism of claim 1, wherein the first driving unit and the second driving unit comprise: a guide rail inclined relative to the bearing surface of the carrier; a connecting seat connected to the guide rail, wherein the connecting seat is connected to the first alignment pin or the second alignment pin; and A driving rod connected to the connection seat, the first alignment pin or the second alignment pin, the driving rod is used to drive the connection seat to move along the slide rail, so that the first alignment pin or the second alignment pin The second alignment pins are raised and lowered relative to the bearing surface of the carrier, and approach or move away from the alignment area. A bonding machine, comprising: a first cavity; a second cavity facing the first cavity, wherein when the first cavity is connected to the second cavity, a closed space is formed between the first cavity and the second cavity; a pressing unit connected to the first cavity; A key alignment mechanism, disposed in the second cavity and facing the pressing unit, includes: a carrier, including a bearing surface and defining an alignment area on the bearing surface; A plurality of lifting units are arranged around the carrier; A plurality of bearing pins are respectively connected to the plurality of lifting units, and the plurality of lifting units are used to drive the plurality of bearing pins to lift and lower relative to the bearing surface of the carrier, wherein the plurality of bearing pins are used to carry a first substrate ; a first drive unit, arranged around the carrier; A first alignment pin is connected to the first driving unit, wherein the first driving unit is used to drive the first alignment pin to ascend and descend relative to the bearing surface of the carrier, and to drive the first alignment pin to approach or away from the alignment area of the bearing surface to push against the first substrate carried by the bearing pins, so that the first substrate is aligned with the alignment area; a plurality of second driving units arranged around the stage; and A plurality of second alignment pins are connected to the second driving unit, wherein the second alignment pins are used to carry a second substrate, and the driving unit is used to drive the second alignment pins relative to the stage. The carrying surface lifts and lowers, and drives the second alignment pins to approach or move away from the alignment area of the carrying surface, so as to push against the second substrate, so that the second substrate is aligned with the first substrate. The bonding machine according to claim 6, comprising: a first driving device is connected to the first cavity and used to drive the first cavity to approach or move away from the second cavity; and A second driving device is connected to the pressing unit and used to drive the pressing unit to approach or move away from the carrier, so that the pressing unit presses the first substrate and the second substrate stacked on the carrier. The bonding machine of claim 6, comprising a holding device for holding the first substrate and the second substrate, and placing the first substrate and the second substrate on the bonding alignment mechanism , wherein the pick-up device includes a plurality of first alignment units, and the bonding alignment mechanism includes a plurality of second alignment units located around the carrier, and passed through the first alignment unit and the first alignment unit Two alignment units align the pick-up device and the carrier. The bonding machine of claim 6, wherein the bearing pin comprises a bearing portion and a first alignment portion, the bearing portion is used for bearing the first substrate, and the first alignment portion protrudes from the The carrying portion is used for contacting and aligning the first substrate. One end of the second alignment pin includes a protruding portion for carrying the second substrate. The bonding machine of claim 6, wherein the first driving unit and the second driving unit comprise: a guide rail inclined relative to the bearing surface of the carrier; a connecting seat connected to the guide rail, wherein the connecting seat is connected to the first alignment pin or the second alignment pin; and A driving rod connected to the connection seat, the first alignment pin or the second alignment pin, the driving rod is used to drive the connection seat to move along the slide rail, so that the first alignment pin or the second alignment pin The second alignment pins are raised and lowered relative to the bearing surface of the carrier, and approach or move away from the alignment area.

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