TWM643180U - Card connector - Google Patents
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- TWM643180U TWM643180U TW111210408U TW111210408U TWM643180U TW M643180 U TWM643180 U TW M643180U TW 111210408 U TW111210408 U TW 111210408U TW 111210408 U TW111210408 U TW 111210408U TW M643180 U TWM643180 U TW M643180U
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Abstract
本新型為有關一種卡連接器，主要包括一符合Micro SD記憶卡通訊協定之傳輸導體組，所述傳輸導體組包括有數個訊號傳輸導體對焊接部及數個迴路傳輸導體焊接部，且各個訊號傳輸導體對焊接部乃並排設置，並各個迴路傳輸導體焊接部分別設於各個訊號傳輸導體對焊接部之兩側處，藉此本案卡連接器在運行時，訊號傳輸導體對焊接部可透過位於兩側之迴路傳輸導體焊接部進行屏蔽，使得有效降低串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射。 This model relates to a card connector, which mainly includes a transmission conductor group conforming to the Micro SD memory card communication protocol. The transmission conductor group includes several signal transmission conductor welding parts and several loop transmission conductor welding parts, and each signal transmission conductor welding part is arranged side by side, and each loop transmission conductor welding part is respectively arranged on both sides of each signal transmission conductor welding part, so that when the card connector is in operation, the signal transmission conductor welding part can be shielded through the loop transmission conductor welding parts located on both sides, so that crosstalk interference can be effectively reduced problems, and can optimize the electric field and magnetic field to improve high-frequency noise radiation.
Description
本新型為提供一種可有效降低串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射的卡連接器。 The purpose of the present invention is to provide a card connector which can effectively reduce crosstalk interference, optimize electric field and magnetic field, and improve high-frequency noise radiation.
隨著電子技術科技日新月異，數位相機、數位攝影機等電子產品之使用已經普及化，同時其功能及使用領域亦隨之不斷增加及擴大，目前上述電子產品之電子卡規格種類非常多，例如：SD卡(Secure Digital Memory Card)、MMC(Multi Media Card)卡、Memory Stick PRO Duo卡、Memory Stick PRO-HG Duo卡及通訊用之SIM卡等，上述不同規格之電子卡已經被廣泛應用於電子產品中。 With the rapid development of electronic technology, the use of electronic products such as digital cameras and digital video cameras has become popular, and their functions and fields of use have also increased and expanded. At present, there are many types of electronic cards for the above electronic products, such as: SD card (Secure Digital Memory Card), MMC (Multi Media Card) card, Memory Stick PRO Duo card, Memory Stick PRO-HG Duo card and SIM card for communication. Widely used in electronic products.
由於電子卡之發展為了符合電子產品易於使用攜帶之潮流，因此體積不斷縮小，同時傳輸之速度亦不斷提高，為了與其相互對應並達到電性連接，因此需設計出許多不同之電子卡連接器與其插接。 Since the development of electronic cards is in line with the trend of easy-to-use and portable electronic products, the volume is continuously reduced, and the transmission speed is also continuously improved. In order to correspond to each other and achieve electrical connection, many different electronic card connectors need to be designed for insertion.
在目前已經被廣泛使用之Micro SD卡連接器，是一種體積極小化之快閃記憶體卡，並被應用於行動裝置內，由於具有體積小、速度快之優點，因此幾乎為智慧型手機中所必備。 The Micro SD card connector, which has been widely used at present, is a flash memory card with extremely small size and is used in mobile devices. Due to its small size and high speed, it is almost a must for smart phones.
然上述Micro SD卡連接器於使用時，為確實存在下列問題與缺失尚待改進： However, when using the above-mentioned Micro SD card connector, there are indeed the following problems and deficiencies that need to be improved:
一般的卡連接器在傳輸導體組的排列上，訊號傳輸導體對常常會發生彼此的串音干擾，導致傳輸的訊號不穩定。 In general card connectors, in the arrangement of the transmission conductors, the signal transmission conductors often have crosstalk interference with each other, resulting in unstable transmitted signals.
是以，要如何解決上述習用之問題與缺失，即為本新型之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the creators of the new model and related manufacturers engaged in this industry want to study and improve urgently.
故，本新型之申請人有鑑於上述缺失，乃蒐集相關資料，經由多方 評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種可有效降低串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射之卡連接器的新型專利者。 Therefore, in view of the above-mentioned shortcomings, the applicant of the present model collected relevant information and Evaluation and consideration, and based on years of experience accumulated in this industry, through continuous trial and modification, we have designed this new type of card connector that can effectively reduce the problem of crosstalk interference, optimize the electric field and magnetic field, and improve high-frequency noise radiation.
本新型之主要目的在於：提供一種可有效降低串音干擾問題的Micro SD記憶卡，而本新型為可達到此主要目的，其主要結構包括一符合Micro SD記憶卡通訊協定之傳輸導體組，該傳輸導體組包括有數個訊號傳輸導體對焊接部，各該訊號傳輸導體對焊接部乃並排設置，且各該訊號傳輸導體對焊接部兩側別設有迴路傳輸導體焊接部，藉此以對各該訊號傳輸導體對焊接部進行串音干擾屏蔽，以防訊號傳輸導體對焊接部彼此間的互相干擾，而影響訊號傳輸。 The main purpose of this new model is to provide a Micro SD memory card that can effectively reduce the problem of crosstalk interference. In order to achieve this main purpose, the main structure of this new model includes a transmission conductor group that conforms to the Micro SD memory card communication protocol. The transmission conductor group includes several signal transmission conductor pair welding parts. The signal transmission conductor interferes with each other between the welding parts, which affects the signal transmission.
本新型另一個主要目的之結構包括所述第一電源傳輸導體焊接部、第二電源傳輸導體焊接部、第二接地傳輸導體焊接部、及第四接地傳輸導體焊接部之寬度乃略大於第一接地傳輸導體焊接部、第一高頻訊號傳輸導體對焊接部、第一功能傳輸導體焊接部、第三電源傳輸導體焊接部、第三接地傳輸導體焊接部、第二功能傳輸導體焊接部、第三功能傳輸導體焊接部、第五接地傳輸導體焊接部、第六接地傳輸導體焊接部、及第七接地傳輸導體焊接部之寬度，如此透過增加面積之技術，使其具有較低的溫升，而可達到大電壓大電流之功效。 Another main purpose of the present invention is that the width of the first power transmission conductor welding portion, the second power transmission conductor welding portion, the second grounding transmission conductor welding portion, and the fourth grounding transmission conductor welding portion is slightly larger than that of the first grounding transmission conductor welding portion, the first high-frequency signal transmission conductor pair welding portion, the first functional transmission conductor welding portion, the third power transmission conductor welding portion, the third grounding transmission conductor welding portion, the second functional transmission conductor welding portion, the third functional transmission conductor welding portion, the fifth grounding transmission conductor welding portion, the sixth grounding transmission conductor welding portion, and the seventh grounding transmission conductor welding portion. The advanced technology makes it have a lower temperature rise, and can achieve the effect of high voltage and high current.
藉由上述技術，可針對習用卡連接器所存在之一般的卡連接器在傳輸導體組的排列上，訊號傳輸導體對常常會發生彼此的串音干擾，導致傳輸訊號不穩定的問題點加以突破，達到本新型如上述優點之實用進步性。 By means of the above-mentioned technology, it is possible to make a breakthrough for the conventional card connector in the arrangement of the transmission conductor groups of the common card connector, and the signal transmission conductor pairs often cause crosstalk interference with each other, resulting in unstable transmission signals, so as to achieve the practical progress of the present invention such as the above-mentioned advantages.
A:傳輸導體組 A: Transmission conductor set
B:絕緣膠體 B: insulating colloid
C:屏蔽外殼 C: shielded shell
D:插置腔 D: insertion cavity
E:對手連接器 E: opponent connector
1:訊號傳輸導體對焊接部 1: Signal transmission conductor to welding part
11:第一高頻訊號傳輸導體對焊接部 11: The first high-frequency signal transmission conductor pair welding part
111:第一高頻訊號傳輸導體對接觸部 111: the first high-frequency signal transmission conductor pair contact part
12:第一低頻訊號傳輸導體對焊接部 12: The first low-frequency signal transmission conductor pair welding part
121:第一低頻訊號傳輸導體對接觸部 121: first low-frequency signal transmission conductor pair contact part
13:第二低頻訊號傳輸導體對焊接部 13: The second low-frequency signal transmission conductor pair welding part
131:第二低頻訊號傳輸導體對接觸部 131: second low-frequency signal transmission conductor pair contact part
14:第二高頻訊號傳輸導體對焊接部 14: The second high-frequency signal transmission conductor pair welding part
141:第二高頻訊號傳輸導體對接觸部 141: The second high-frequency signal transmission conductor pair contact part
2:迴路傳輸導體焊接部 2: Loop transmission conductor welding part
21:第一接地傳輸導體焊接部 21: The welding part of the first ground transmission conductor
22:第一電源傳輸導體焊接部 22: Welding part of the first power transmission conductor
221:第一電源傳輸導體接觸部 221: first power transmission conductor contact part
23:第二電源傳輸導體焊接部 23: Second power transmission conductor welding part
231:第二電源傳輸導體接觸部 231: second power transmission conductor contact part
24:第三電源傳輸導體焊接部 24: Third power transmission conductor welding part
241:第三電源傳輸導體接觸部 241: Third power transmission conductor contact part
25:第二接地傳輸導體焊接部 25: Second ground transfer conductor welding part
251:第二接地傳輸導體接觸部 251: second ground transfer conductor contact portion
26:第三接地傳輸導體焊接部 26: The welding part of the third ground transmission conductor
27:第四接地傳輸導體焊接部 27: The welding part of the fourth ground transmission conductor
271:第四接地傳輸導體接觸部 271: fourth ground transfer conductor contact portion
28:第五接地傳輸導體焊接部 28: The welding part of the fifth ground transmission conductor
281:第五接地傳輸導體接觸部 281: fifth ground transmission conductor contact portion
29:第六接地傳輸導體焊接部 29: The sixth ground transmission conductor welding part
291:第六接地傳輸導體接觸部 291: The sixth ground transmission conductor contact part
30:第七接地傳輸導體焊接部 30: The seventh ground transmission conductor welding part
40:第一功能傳輸導體焊接部 40: The welding part of the first functional transmission conductor
401:第一功能傳輸導體接觸部 401: first functional transmission conductor contact portion
41:第二功能傳輸導體焊接部 41: The welding part of the second function transmission conductor
411:第二功能傳輸導體接觸部 411: second function transmission conductor contact part
42:第三功能傳輸導體焊接部 42: Tertiary function transmission conductor welding part
421:第三功能傳輸導體接觸部 421: Tertiary function transmission conductor contact part
第一圖 為本新型較佳實施例之立體圖。 The first figure is a perspective view of a preferred embodiment of the present invention.
第二圖 為本新型較佳實施例之分解圖。 The second figure is an exploded view of a preferred embodiment of the present invention.
第三圖 為本新型較佳實施例之傳輸導體組立體圖。 The third figure is a three-dimensional view of the transmission conductor group in a preferred embodiment of the present invention.
第四圖 為本新型較佳實施例之傳輸導體組俯視圖。 Figure 4 is a top view of the transmission conductor group in a preferred embodiment of the present invention.
第五圖 為本新型較佳實施例之插接示意圖。 The fifth figure is a schematic diagram of the insertion of the preferred embodiment of the present invention.
請參閱第一圖至第五圖所示，為本新型較佳實施例之立體圖至插接示意圖，由圖中可清楚看出本新型係包括：一符合Micro SD記憶卡通訊協定之傳輸導體組A，該傳輸導體組A包括有：數個訊號傳輸導體對焊接部1，各該訊號傳輸導體對焊接部1乃並排設置，且所述訊號傳輸導體對焊接部1主要係具有：一第一高頻訊號傳輸導體對焊接部11，該第一高頻訊號傳輸導體對焊接部11乃延伸形成有一第一高頻訊號傳輸導體對接觸部111；一設於該第一高頻訊號傳輸導體對焊接部11一側之第一低頻訊號傳輸導體對焊接部12，該第一低頻訊號傳輸導體對焊接部12乃延伸形成有一第一低頻訊號傳輸導體對接觸部121；一設於該第一低頻訊號傳輸導體對焊接部12背離該第一高頻訊號傳輸導體對焊接部11一側處之第二低頻訊號傳輸導體對焊接部13，該第二低頻訊號傳輸導體對焊接部13乃延伸形成有一第二低頻訊號傳輸導體對接觸部131；一設於該第二低頻訊號傳輸導體對焊接部13背離該第一低頻訊號傳輸導體對焊接部12一側處之第二高頻訊號傳輸導體對焊接部14，該第二高頻訊號傳輸導體對焊接部14乃延伸形成有一第二高頻訊號傳輸導體對接觸部141。
Please refer to the first figure to the fifth figure, which are the perspective view to the plug-in schematic diagram of the preferred embodiment of the present invention. It can be clearly seen from the figure that the new model includes: a transmission conductor group A conforming to the Micro SD memory card communication protocol. The transmission conductor group A includes: several signal transmission conductors. It is extended to form a first high-frequency signal transmission conductor to the
而於各該訊號傳輸導體對焊接部1兩側處乃分別設有一迴路傳輸導體焊接部2，且所述迴路傳輸導體焊接部主要係具有：一第一接地傳輸導體焊接部21；一第一電源傳輸導體焊接部22，該第一電源傳輸導體焊接部22乃延伸形成有一第一電源傳輸導體接觸部221；一第二電源傳輸導體焊接部23，該第二電源傳輸導體焊接部23乃延伸形成有一第二電源傳輸導體接觸部231；一第三電源傳輸導體焊接部24，該第三電源傳輸導體焊接部24乃延伸形成有一第三電源傳輸導體接觸部241；一第二接地傳輸導體焊接部25，該第二接地傳輸導體焊接部25
乃延伸形成有一第二接地傳輸導體接觸部251；一第三接地傳輸導體焊接部26；一第四接地傳輸導體焊接部27，該第四接地傳輸導體焊接部27乃延伸形成有一第四接地傳輸導體接觸部271；一第五接地傳輸導體焊接部28，該第五接地傳輸導體焊接部28乃延伸形成有一第五接地傳輸導體接觸部281；一第六接地傳輸導體焊接部29，該第六接地傳輸導體焊接部29乃延伸形成有一第六接地傳輸導體接觸部291：一第七接地傳輸導體焊接部30；藉此以對各該訊號傳輸導體對焊接部1進行電磁干擾屏蔽。
A loop transmission
此外，於該第一電源傳輸導體焊接部22及該第二電源傳輸導體焊接部23之間設有一第一功能傳輸導體焊接部40，該第一低頻訊號傳輸導體對焊接部12及該第四接地傳輸導體焊接部27之間設有一第二功能傳輸導體焊接部41，該第二低頻訊號傳輸導體對焊接部13及該第四接地傳輸導體焊接部27之間設有一第三功能傳輸導體焊接部42。
In addition, a first function transmission
此外，若將傳輸導體組A由右至左依序排列時，其排列順序為第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一電源傳輸導體焊接部22、第一功能傳輸導體焊接部40、第二電源傳輸導體焊接部23、第三電源傳輸導體焊接部24、第二接地傳輸導體焊接部25、第三接地傳輸導體焊接部26、第一低頻訊號傳輸導體對焊接部12、第二功能傳輸導體焊接部41、第四接地傳輸導體焊接部27、第三功能傳輸導體焊接部42、第二低頻訊號傳輸導體對焊接部13、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、第二高頻訊號傳輸導體對焊接部14、及第七接地傳輸導體焊接部30。
In addition, if the transmission conductor group A is arranged in sequence from right to left, the arrangement order is the first ground transmission
其中，該第一功能傳輸導體焊接部40乃延伸形成有一第一功能傳輸導體接觸部401，該第二功能傳輸導體焊接部41乃延伸形成有一第二功能傳輸導體接觸部411，該第三功能傳輸導體焊接部42乃延伸形成有一第三功能傳輸導體接觸部421。
Wherein, the first functional transmission
因此，以排列方式而言，該第一高頻訊號傳輸導體對接觸部111、該第一功能傳輸導體接觸部401、該第三電源傳輸導體接觸部241、該
第二功能傳輸導體接觸部411、第三功能傳輸導體接觸部421、該第五接地傳輸導體接觸部281、及該第二高頻訊號傳輸導體對接觸部141乃位於同一排上，而該第一電源傳輸導體接觸部221、該第二電源傳輸導體接觸部231、該第二接地傳輸導體接觸部251、該第一低頻訊號傳輸導體對接觸部121、該第四接地傳輸導體接觸部271、該第二低頻訊號傳輸導體對接觸部131、及該第六接地傳輸導體接觸部291乃位於同一排上。
Therefore, in terms of arrangement, the first high-frequency signal transmission conductor
另外以其焊接部之面積寬度而言，所述第一電源傳輸導體焊接部22、第二電源傳輸導體焊接部23、第二接地傳輸導體焊接部25、及第四接地傳輸導體焊接部27之寬度乃略大於第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一功能傳輸導體焊接部40、第三電源傳輸導體焊接部24、第三接地傳輸導體焊接部26、第二功能傳輸導體焊接部41、第三功能傳輸導體焊接部42、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、及第七接地傳輸導體焊接部30之寬度。
In addition, in terms of the area width of the welding parts, the width of the first power transmission
其中，所述訊號傳輸導體對焊接部1係為高頻訊號傳輸導體對焊接部或低頻傳輸導體對焊接部其中之一者。
Wherein, the signal transmission
其中，所述迴路傳輸導體焊接部2係為接地傳輸導體焊接部或電源傳輸導體焊接部其中之一者。
Wherein, the loop transmission
其中，所述傳輸導體組A乃與一絕緣膠體B結合。 Wherein, the transmission conductor group A is combined with an insulating colloid B.
其中，所述絕緣膠體B乃與一屏蔽外殼C結合，並於結合後之一側處形成一插置腔D。 Wherein, the insulating colloid B is combined with a shielding shell C, and an insertion cavity D is formed at one side after the combination.
藉此，當使用者將對手連接器E從插置腔D插入本案卡連接器時，對手連接器E之差動部會先接觸到前排的第一電源傳輸導體接觸部221、第二電源傳輸導體接觸部231、第二接地傳輸導體接觸部251、第一低頻訊號傳輸導體對接觸部121、第四接地傳輸導體接觸部271、第二低頻訊號傳輸導體對接觸部131、及第六接地傳輸導體接觸部291，爾後繼續往內插置即會再與第一高頻訊號傳輸導體對接觸部111、第一功能傳輸導體接觸部401、第三電源傳輸導體接觸部241、第二功能傳輸導體接觸部411、第三功能傳輸導體接觸部421、第五接地傳輸導體接觸部281、及第二高頻訊號傳輸導體對接觸部141進行接觸。
Thus, when the user inserts the opposite connector E from the insertion cavity D into the case card connector, the differential portion of the opposite connector E will first contact the first power transmission
又於進行資訊傳遞的過程當中時，因每個訊號傳輸導體對焊接部1
的旁邊皆必然具有迴路傳輸導體焊接部2，以藉由迴路傳輸導體焊接部2將每個訊號傳輸導體對焊接部1之兩側進行包圍隔離，使每個訊號傳輸導體對焊接部1不會彼此干擾，進而有效抑制串音干擾問題，換言之詳細而論，第一高頻訊號傳輸導體對焊接部11的兩側分別有第一接地傳輸導體焊接部21及第一電源傳輸導體焊接部22的屏蔽隔離，而第一低頻訊號傳輸導體對焊接部12的兩側分別有第三接地傳輸導體焊接部26及第四接地傳輸導體焊接部27的屏蔽隔離，而第二低頻訊號傳輸導體對焊接部13的兩側分別有第四接地傳輸導體焊接部27及第五接地傳輸導體焊接部28的屏蔽隔離，而第二高頻訊號傳輸導體對焊接部14的兩側分別有第六接地傳輸導體焊接部29及第七接地傳輸導體焊接部30的屏蔽隔離。
And in the process of information transmission, because each signal transmission conductor is connected to the
再者，也因第一電源傳輸導體焊接部22、第二電源傳輸導體焊接部23、第二接地傳輸導體焊接部25、第四接地傳輸導體焊接部27之寬度乃略大於第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一功能傳輸導體焊接部40、第三電源傳輸導體焊接部24、第三接地傳輸導體焊接部26、第二功能傳輸導體焊接部41、第三功能傳輸導體焊接部42、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、及第七接地傳輸導體焊接部30之寬度，如此透過增加面積之技術，使其具有較低的溫升，而達到具有耐大電壓及大電流之功效。
Moreover, the width of the first power transmission
又者，第一高頻訊號傳輸導體對焊接部11之間的距離乃小於該第一接地傳輸導體焊接部21及該第一電源傳輸導體焊接部22相對於該第一高頻訊號傳輸導體對焊接部11之距離，而該第一低頻訊號傳輸導體對焊接部12之間的距離乃小於該第三接地傳輸導體焊接部26及該第四接地傳輸導體焊接部27相對於該第一低頻訊號傳輸導體對焊接部12之距離，而該第二低頻訊號傳輸導體對焊接部13之間的距離乃小於該第四接地傳輸導體焊接部27及該第五接地傳輸導體焊接部28相對於該第二低頻訊號傳輸導體對焊接部13之距離，而該第二高頻訊號傳輸導體對焊接部14之間的距離乃小於該第六接地傳輸導體焊接部29及該第七接地傳輸導體焊接部30相對於該第二高頻訊號傳輸導體對焊接部14之距離，藉此得以達到降低或減少訊號的損失。
Moreover, the distance between the first high frequency signal transmission
另者，又因第三電源傳輸導體焊接部24與第二接地傳輸導體焊接部25乃相鄰設置，如此即可達到最小迴路，緩解電磁干擾(EMI)與射頻干擾
(RFI)。
In addition, because the third power transmission
是以，請參閱全部附圖所示，本新型使用時，與習用技術相較，著實存在下列優點： Therefore, please refer to all the accompanying drawings and show that when the present invention is used, compared with the conventional technology, there are the following advantages:
第一，透過每個訊號傳輸導體對焊接部1的旁邊皆設有迴路傳輸導體焊接部2之設計，以藉由迴路傳輸導體焊接部2將每個訊號傳輸導體對焊接部1之兩側進行包圍隔離，使每個訊號傳輸導體對焊接部1不會彼此干擾，進而有效抑制串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射。
Firstly, through the design that each signal transmission conductor has a loop transmission
第二，透過第一電源傳輸導體焊接部22、第二電源傳輸導體焊接部23、第二接地傳輸導體焊接部25、第四接地傳輸導體焊接部27之寬度乃略大於第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一功能傳輸導體焊接部40、第三電源傳輸導體焊接部24、第三接地傳輸導體焊接部26、第二功能傳輸導體焊接部41、第三功能傳輸導體焊接部42、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、及第七接地傳輸導體焊接部30之寬度，如此透過增加面積之技術，使其具有較低的溫升，而達到具有耐大電壓及大電流之功效。
Second, the width of the first power transmission
第三，透過第三電源傳輸導體焊接部24與第二接地傳輸導體焊接部25乃相鄰設置，如此即可達到最小迴路，緩解電磁干擾(EMI)與射頻干擾(RFI)。
Thirdly, the
惟，以上所述僅為本新型之較佳實施例而已，非因此即侷限本新型之專利範圍，故舉凡運用本新型說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本新型之專利範圍內，合予陳明。 However, the above description is only a preferred embodiment of the present invention, and does not limit the scope of the patent of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the description and drawings of the present invention should be included in the scope of the patent of the present invention.
綜上所述，本新型之卡連接器於使用時，為確實能達到其功效及目的，故本新型誠為一實用性優異之創作，為符合新型專利之申請要件，爰依法提出申請，盼 審委早日賜准本新型，以保障創作人之辛苦創作，倘若 鈞局審委有任何稽疑，請不吝來函指示，創作人定當竭力配合，實感德便。 To sum up, the card connector of this new type can really achieve its function and purpose when used. Therefore, this model is a creation with excellent practicability. In order to meet the application requirements for a new type patent, an application is filed according to law. I hope that the review committee will approve this model as soon as possible to protect the hard work of the creator.
1:訊號傳輸導體對焊接部 1: Signal transmission conductor to welding part
11:第一高頻訊號傳輸導體對焊接部 11: The first high-frequency signal transmission conductor pair welding part
111:第一高頻訊號傳輸導體對接觸部 111: the first high-frequency signal transmission conductor pair contact part
12:第一低頻訊號傳輸導體對焊接部 12: The first low-frequency signal transmission conductor pair welding part
121:第一低頻訊號傳輸導體對接觸部 121: first low-frequency signal transmission conductor pair contact part
13:第二低頻訊號傳輸導體對焊接部 13: The second low-frequency signal transmission conductor pair welding part
131:第二低頻訊號傳輸導體對接觸部 131: second low-frequency signal transmission conductor pair contact part
14:第二高頻訊號傳輸導體對焊接部 14: The second high-frequency signal transmission conductor pair welding part
141:第二高頻訊號傳輸導體對接觸部 141: The second high-frequency signal transmission conductor pair contact part
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111210408U TWM643180U (en) | 2022-09-23 | 2022-09-23 | Card connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111210408U TWM643180U (en) | 2022-09-23 | 2022-09-23 | Card connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM643180U true TWM643180U (en) | 2023-07-01 |
Family
ID=88147936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111210408U TWM643180U (en) | 2022-09-23 | 2022-09-23 | Card connector |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM643180U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843210B (en) * | 2022-09-23 | 2024-05-21 | 維將科技股份有限公司 | Card Connector (Six) |
-
2022
- 2022-09-23 TW TW111210408U patent/TWM643180U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843210B (en) * | 2022-09-23 | 2024-05-21 | 維將科技股份有限公司 | Card Connector (Six) |
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