TWI835583B - electrical connector - Google Patents
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- TWI835583B TWI835583B TW112108923A TW112108923A TWI835583B TW I835583 B TWI835583 B TW I835583B TW 112108923 A TW112108923 A TW 112108923A TW 112108923 A TW112108923 A TW 112108923A TW I835583 B TWI835583 B TW I835583B
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Abstract
本發明為涉及一種電連接器，主要依序排列包括第一高頻差分訊號傳輸導體組、第一接地傳輸導體、電源傳輸導體、第二接地傳輸導體、低頻差分訊號傳輸導體組、第三接地傳輸導體、第四接地傳輸導體、第五接地傳輸導體、及第二高頻差分訊號傳輸導體組，透過上述之組合結構，可使本案達到防止低頻對高頻的串音干擾，以及防止電源共模干擾等優勢。 The invention relates to an electrical connector, which mainly includes a first high-frequency differential signal transmission conductor group, a first ground transmission conductor, a power transmission conductor, a second ground transmission conductor, a low-frequency differential signal transmission conductor group, and a third ground conductor arranged in sequence. Through the above combined structure of the transmission conductor, the fourth ground transmission conductor, the fifth ground transmission conductor, and the second high-frequency differential signal transmission conductor group, this case can prevent low-frequency to high-frequency crosstalk interference and prevent power supply coherence. Mode interference and other advantages.
Description
本發明係涉及一種可防止低頻對高頻的串音干擾，且防止電源共模干擾的電連接器。 The invention relates to an electrical connector that can prevent crosstalk interference between low frequency and high frequency and prevent common mode interference in power supply.
隨著科技的進步，電子設備的發展帶來了人們生活的便利，例如智慧型手機以及數位相機等等，人們可利用上述電子設備隨時捕捉相片而傳輸到個人桌上型電腦、平板電腦或筆記型電腦等等，也因為上述之傳輸資料之行為，使得連接器為上述各種電子設備所必備的傳輸介面，其中，連接器以萬用序列匯流排(Universal Series Bus；USB)最為人所熟知。 With the advancement of technology, the development of electronic devices has brought convenience to people's lives, such as smart phones and digital cameras. People can use the above electronic devices to capture photos at any time and transfer them to personal desktop computers, tablets or notebooks. Computers, etc., and because of the above-mentioned data transmission behavior, connectors are a necessary transmission interface for the above-mentioned various electronic devices. Among them, the connector is the most well-known Universal Series Bus (USB).
萬用串列匯流排早期是由微軟(Microsoft)與英特爾(Intel)公司所倡導而發起，至今已歷經USB1.0、USB1.1、USB2.0至現有之USB3.0，其中，USB1.0在低速模式之傳輸速率為每秒1.5Mbps，USB2.0在全速模式之傳輸速率為每秒12Mbps，USB3.0在高速模式之傳輸速率為每秒480Mbps，而現有之USB3.0之傳輸速率甚至可達每秒5Gbps，因而許多公司極力推廣此技術，其中，USB3.0的傳輸介面係在USB2.0具有四根端子的基礎上增加二組差動端子和一根接地端子，使得USB3.0的傳輸介面具有九根端子，從而使雙向傳輸速率每秒達到5Gbps的水準。 Universal Serial Bus was initiated by Microsoft and Intel in the early days. It has gone through USB1.0, USB1.1, USB2.0 and now USB3.0. Among them, USB1.0 The transfer rate in low-speed mode is 1.5Mbps per second, the transfer rate of USB2.0 in full-speed mode is 12Mbps, the transfer rate of USB3.0 in high-speed mode is 480Mbps, and the transfer rate of existing USB3.0 is even It can reach 5Gbps per second, so many companies are trying their best to promote this technology. Among them, the USB3.0 transmission interface adds two sets of differential terminals and a grounding terminal to the four terminals of USB2.0, making USB3.0 The transmission interface has nine terminals, allowing the two-way transmission rate to reach 5Gbps per second.
然而現階段的USB3.0電連接器具有較為嚴重的串音干擾及共模干擾，因此導致傳輸訊號不穩定。 However, the current USB3.0 electrical connector has serious crosstalk interference and common mode interference, which results in unstable transmission signals.
是以，要如何解決上述習用之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above conventional problems and deficiencies is the direction that the inventor of the present invention and related manufacturers engaged in this industry are eager to research and improve.
本發明之課題主要目的在於提供一種可防止低頻對高頻的串音干擾 ，且防止電源共模干擾。 The main object of the present invention is to provide a device that can prevent crosstalk interference between low frequency and high frequency. , and prevent common mode interference from the power supply.
本發明能夠達成上述主要目的之結構包括一第一高頻差分訊號傳輸導體組，所述第一高頻差分訊號傳輸導體組一側設有一第一接地傳輸導體，第一接地傳輸導體背離第一高頻差分訊號傳輸導體組側處設有一電源傳輸導體，電源傳輸導體背離第一接地傳輸導體側處設有一第二接地傳輸導體，第二接地傳輸導體背離電源傳輸導體側處設有一低頻差分訊號傳輸導體組，低頻差分訊號傳輸導體組背離第二接地傳輸導體側處設有一第三接地傳輸導體，第三接地傳輸導體背離低頻差分訊號傳輸導體組側處設有一第四接地傳輸導體，第四接地傳輸導體背離第三接地傳輸導體側處設有一第五接地傳輸導體，第五接地傳輸導體背離第四接地傳輸導體側處設有一第二高頻差分訊號傳輸導體組。 The structure of the present invention that can achieve the above main objectives includes a first high-frequency differential signal transmission conductor group. A first ground transmission conductor is provided on one side of the first high-frequency differential signal transmission conductor group. The first ground transmission conductor is away from the first ground transmission conductor. A power transmission conductor is provided on the side of the high-frequency differential signal transmission conductor set, a second ground transmission conductor is provided on the side of the power transmission conductor away from the first ground transmission conductor, and a low-frequency differential signal is provided on the side of the second ground transmission conductor away from the power transmission conductor. Transmission conductor set, the low-frequency differential signal transmission conductor set is provided with a third ground transmission conductor on the side away from the second ground transmission conductor, and a fourth ground transmission conductor is provided on the side of the third ground transmission conductor away from the low-frequency differential signal transmission conductor set. A fifth ground transmission conductor is provided on the side of the ground transmission conductor away from the third ground transmission conductor, and a second high frequency differential signal transmission conductor set is provided on the side of the fifth ground transmission conductor away from the fourth ground transmission conductor.
當本案作動而電性連接時，第一接地傳輸導體、電源傳輸導體、及第二接地傳輸導體可有效將第一高頻差分訊號傳輸導體組與低頻差分訊號傳輸導體組進行隔離，而第三接地傳輸導體、第四接地傳輸導體、及第五接地傳輸導體可有效將第二高頻差分訊號傳輸導體組與低頻差分訊號傳輸導體組進行隔離，達到防止低頻對高頻的串音干擾。此外，第一接地傳輸導體、及第二接地傳輸導體將電源傳輸導體進行包圍，可達到防止電源共模干擾。 When the case is activated and electrically connected, the first ground transmission conductor, power transmission conductor, and second ground transmission conductor can effectively isolate the first high-frequency differential signal transmission conductor group from the low-frequency differential signal transmission conductor group, and the third The ground transmission conductor, the fourth ground transmission conductor, and the fifth ground transmission conductor can effectively isolate the second high-frequency differential signal transmission conductor group from the low-frequency differential signal transmission conductor group to prevent crosstalk interference between low frequency and high frequency. In addition, the first ground transmission conductor and the second ground transmission conductor surround the power transmission conductor, thereby preventing power supply common mode interference.
藉由上述技術，可針對習用USB3.0電連接器所存在之具有較為嚴重的串音干擾及共模干擾，因此導致傳輸訊號不穩定的問題點加以突破，達到本發明如上述優點之實用進步性。 Through the above technology, it is possible to break through the problems of conventional USB3.0 electrical connectors, which have relatively serious crosstalk interference and common mode interference, resulting in unstable transmission signals, and achieve the practical progress of the above advantages of the present invention. sex.
10:第一高頻差分訊號傳輸導體組 10: The first high-frequency differential signal transmission conductor group
101:第一高頻差分訊號焊接部組 101: The first high frequency differential signal welding department group
102:第一高頻差分訊號固持部組 102: The first high frequency differential signal holding unit
103:第一高頻差分訊號基部組 103: The first high frequency differential signal base group
104:第一高頻差分訊號接觸部組 104: The first high frequency differential signal contact group
11:第一接地傳輸導體 11: First ground transmission conductor
111:第一接地焊接部 111: First ground welding part
112:第一接地固持部 112: First ground holding part
1121:第一接地穿孔 1121: First ground through hole
12:電源傳輸導體 12:Power transmission conductor
121:電源焊接部 121:Power welding department
122:電源固持部 122: Power supply holding part
123:電源基部 123:Power supply base
124:電源接觸部 124:Power contact part
13:第二接地傳輸導體 13: Second ground transmission conductor
131:第二接地焊接部 131: Second ground welding part
132:第二接地固持部 132: Second ground holding part
133:第二接地基部 133:Second ground base
134:第二接地接觸部 134: Second ground contact part
14:低頻差分訊號傳輸導體組 14: Low frequency differential signal transmission conductor set
14a:第一低頻差分訊號傳輸導體 14a: The first low frequency differential signal transmission conductor
141a:第一低頻差分訊號焊接部 141a: The first low frequency differential signal welding part
142a:第一低頻差分訊號固持部 142a: The first low-frequency differential signal holding part
143a:第一低頻差分訊號基部 143a: First low frequency differential signal base
144a:第一低頻差分訊號接觸部 144a: First low frequency differential signal contact part
14b:第二低頻差分訊號傳輸導體 14b: Second low frequency differential signal transmission conductor
141b:第二低頻差分訊號焊接部 141b: Second low frequency differential signal welding part
142b:第二低頻差分訊號固持部 142b: The second low-frequency differential signal holding part
143b:第二低頻差分訊號基部 143b: Second low frequency differential signal base
144b:第二低頻差分訊號接觸部 144b: Second low-frequency differential signal contact part
141:低頻差分訊號焊接部組 141: Low frequency differential signal welding department group
142:低頻差分訊號固持部組 142: Low frequency differential signal holding unit
143:低頻差分訊號基部組 143: Low frequency differential signal base group
144:低頻差分訊號接觸部組 144: Low frequency differential signal contact group
15:第三接地傳輸導體 15:Third ground transmission conductor
151:第三接地焊接部 151:Third ground welding department
152:第三接地固持部 152: Third ground holding part
153:第三接地基部 153:Third ground base
16:第四接地傳輸導體 16: Fourth ground transmission conductor
161:第四接地焊接部 161: Fourth ground welding department
162:第四接地固持部 162: The fourth ground holding part
163:第四接地基部 163:Fourth ground base
164:第四接地接觸部 164: Fourth ground contact part
17:第五接地傳輸導體 17: Fifth ground transmission conductor
171:第五接地焊接部 171: Fifth ground welding department
172:第五接地固持部 172: Fifth ground holding part
1721:第五接地穿孔 1721:Fifth ground hole
18:第二高頻差分訊號傳輸導體組 18: The second high-frequency differential signal transmission conductor group
181:第二高頻差分訊號焊接部組 181: The second high frequency differential signal welding department group
182:第二高頻差分訊號固持部組 182: The second high frequency differential signal holding part group
183:第二高頻差分訊號基部組 183: The second high-frequency differential signal base group
184:第二高頻差分訊號接觸部組 184: The second high frequency differential signal contact group
20:第一屏蔽殼體接地部 20: First shielding shell grounding part
21:第二屏蔽殼體接地部 21: Second shield shell grounding part
3:屏蔽殼體 3: Shielding shell
第一圖 為本發明第一較佳實施例之母座立體圖。 The first figure is a perspective view of the base of the first preferred embodiment of the present invention.
第二圖 為本發明第一較佳實施例之母座傳輸導體俯視圖。 The second figure is a top view of the female transmission conductor according to the first preferred embodiment of the present invention.
第三圖 為本發明第一較佳實施例之公頭立體圖。 The third figure is a perspective view of the male head of the first preferred embodiment of the present invention.
第四圖 為本發明第一較佳實施例之公頭傳輸導體俯視圖。 The fourth figure is a top view of the male transmission conductor of the first preferred embodiment of the present invention.
第五圖 為本發明第一較佳實施例之對接剖視圖。 The fifth figure is a docking cross-sectional view of the first preferred embodiment of the present invention.
第六圖 為本發明第二較佳實施例之實施示意圖。 Figure 6 is a schematic diagram of the second preferred embodiment of the present invention.
第七圖 為本發明第三較佳實施例之實施示意圖。 Figure 7 is a schematic diagram of the third preferred embodiment of the present invention.
第八圖 為本發明第四較佳實施例之第一接地傳輸導體及第五接地傳 輸導體示意圖。 Figure 8 shows the first ground transmission conductor and the fifth ground transmission conductor according to the fourth preferred embodiment of the present invention. Schematic diagram of transmission conductor.
第九圖 為本發明第五較佳實施例之第一接地傳輸導體及第五接地傳輸導體示意圖。 Figure 9 is a schematic diagram of the first ground transmission conductor and the fifth ground transmission conductor according to the fifth preferred embodiment of the present invention.
請參閱第一圖至第五圖所示，為本發明第一較佳實施例之母座立體圖至對接剖視圖，由圖中可清楚看出本發明係包括： Please refer to the first to fifth figures, which are a three-dimensional view to a docking cross-sectional view of the female base of the first preferred embodiment of the present invention. It can be clearly seen from the figures that the present invention includes:
一第一高頻差分訊號傳輸導體組10；
a first high-frequency differential signal
一設於該第一高頻差分訊號傳輸導體組10一側之第一接地傳輸導體11；
A first
一設於該第一接地傳輸導體11背離該第一高頻差分訊號傳輸導體組10側處之電源傳輸導體12；
A
一設於該電源傳輸導體12背離該第一接地傳輸導體11側處之第二接地傳輸導體13；
a second
一設於該第二接地傳輸導體13背離該電源傳輸導體12側處之低頻差分訊號傳輸導體組14；
A low-frequency differential signal transmission conductor set 14 located on the side of the second
一設於該低頻差分訊號傳輸導體組14背離該第二接地傳輸導體13側處之第三接地傳輸導體15；
a third
一設於該第三接地傳輸導體15背離該低頻差分訊號傳輸導體組14側處之第四接地傳輸導體16；
a fourth grounded
一設於該第四接地傳輸導體16背離該第三接地傳輸導體15側處之第五接地傳輸導體17；及
a fifth
一設於該第五接地傳輸導體17背離該第四接地傳輸導體16側處之第二高頻差分訊號傳輸導體組18。
A second high-frequency differential signal
其中，基於上述之電連接器架構，得應用於母座部分，如第一圖及第二圖，以母座而言，該第一高頻差分訊號傳輸導體組10具有一第一高頻差分訊號焊接部組101、一由該第一高頻差分訊號焊接部組101延伸形成之第一高頻差分訊號固持部組102、一由該第一高頻差分訊號固持部組102延伸形成之第一高頻差分訊號基部組103、及一由該第一高頻差分訊號基部組103延伸形成之第一高頻差分訊號接觸部組104，再該第一接地傳輸導
體11具有一第一接地焊接部111、一由該第一接地焊接部111延伸形成之第一接地固持部112，再該電源傳輸導體12具有一電源焊接部121、一由該電源焊接部121延伸形成之電源固持部122、一由該電源固持部122延伸形成之電源基部123、及一由該電源基部123延伸形成之電源接觸部124，再該第二接地傳輸導體13具有一第二接地焊接部131、一由該第二接地焊接部131延伸形成之第二接地固持部132、一由該第二接地固持部132延伸形成之第二接地基部133、及一由該第二接地基部133延伸形成之第二接地接觸部134，再該低頻差分訊號傳輸導體組14具有一低頻差分訊號焊接部組141、一由該低頻差分訊號焊接部組141延伸形成之低頻差分訊號固持部組142、一由該低頻差分訊號固持部組142延伸形成之低頻差分訊號基部組143、及一由該低頻差分訊號基部組143延伸形成之低頻差分訊號接觸部組144，再該第三接地傳輸導體15具有一第三接地焊接部151、一由該第三接地焊接部151延伸形成之第三接地固持部152、及一由該第三接地固持部152延伸形成之第三接地基部153，該第三接地基部153乃與該第二接地接觸部134連接，再該第四接地傳輸導體16具有一第四接地焊接部161、一由該第四接地焊接部161延伸形成之第四接地固持部162、一由該第四接地固持部162延伸形成之第四接地基部163、及一由該第四接地基部163延伸形成之第四接地接觸部164，再該第五接地傳輸導體17具有一第五接地焊接部171、一由該第五接地焊接部171延伸形成之第五接地固持部172，再該第二高頻差分訊號傳輸導體組18具有一第二高頻差分訊號焊接部組181、一由該第二高頻差分訊號焊接部組181延伸形成之第二高頻差分訊號固持部組182、一由該第二高頻差分訊號固持部組182延伸形成之第二高頻差分訊號基部組183、及一由該第二高頻差分訊號基部組183延伸形成之第二高頻差分訊號接觸部組184，另外該低頻差分訊號接觸部組144之左右兩側分別具有該第三接地基部153、及該第二接地基部133，且該第二接地接觸部134位於該低頻差分訊號接觸部組144前方處。
Among them, based on the above-mentioned electrical connector structure, it can be applied to the female base part, as shown in the first figure and the second figure. In terms of the female base, the first high-frequency differential signal
若再基於上述之電連接器架構，不僅可應用於母座部分，亦可應用於公頭部分，如第三圖及第四圖，以公頭而言，該第一高頻差分訊號傳輸導體組10具有一第一高頻差分訊號焊接部組101、一由該第一高頻差分訊號焊
接部組101延伸形成之第一高頻差分訊號固持部組102、一由該第一高頻差分訊號固持部組102延伸形成之第一高頻差分訊號基部組103、及一由該第一高頻差分訊號基部組103延伸形成之第一高頻差分訊號接觸部組104，再該第一接地傳輸導體11具有一第一接地焊接部111、一由該第一接地焊接部111延伸形成之第一接地固持部112，再該電源傳輸導體12具有一電源焊接部121、一由該電源焊接部121延伸形成之電源固持部122、一由該電源固持部122延伸形成之電源基部123、及一由該電源基部123延伸形成之電源接觸部124，再該第二接地傳輸導體13具有一第二接地焊接部131、一由該第二接地焊接部131延伸形成之第二接地固持部132、一由該第二接地固持部132延伸形成之第二接地基部133、及一由該第二接地基部133延伸形成之第二接地接觸部134，再該低頻差分訊號傳輸導體組14具有一第一低頻差分訊號傳輸導體14a、及一第二低頻差分訊號傳輸導體14b，而所述第一低頻差分訊號傳輸導體14a具有一第一低頻差分訊號焊接部141a、一由該第一低頻差分訊號焊接部141a延伸形成之第一低頻差分訊號固持部142a、一由該第一低頻差分訊號固持部142a延伸形成之第一低頻差分訊號基部143a、及一由該第一低頻差分訊號基部143a延伸形成之第一低頻差分訊號接觸部144a，而所述第二低頻差分訊號傳輸導體14b具有一第二低頻差分訊號焊接部141b、一由該第二低頻差分訊號焊接部141b延伸形成之第二低頻差分訊號固持部142b、一由該第二低頻差分訊號固持部142b延伸形成之第二低頻差分訊號基部143b、及一由該第二低頻差分訊號基部143b延伸形成之第二低頻差分訊號接觸部144b，再該第三接地傳輸導體15具有一第三接地焊接部151、一由該第三接地焊接部151延伸形成之第三接地固持部152、及一由該第三接地固持部152延伸形成之第三接地基部153，該第三接地基部153乃與該第二接地接觸部134連接，再該第四接地傳輸導體16具有一第四接地焊接部161、一由該第四接地焊接部161延伸形成之第四接地固持部162、一由該第四接地固持部162延伸形成之第四接地基部163、及一由該第四接地基部163延伸形成之第四接地接觸部164，再該第五接地傳輸導體17具有一第五接地焊接部171、一由該第五接地焊接部171延伸形成之第五接地固持部172，再該第二高頻差分訊號傳輸導體組18具
有一第二高頻差分訊號焊接部組181、一由該第二高頻差分訊號焊接部組181延伸形成之第二高頻差分訊號固持部組182、一由該第二高頻差分訊號固持部組182延伸形成之第二高頻差分訊號基部組183、及一由該第二高頻差分訊號基部組183延伸形成之第二高頻差分訊號接觸部組184，另外該第一低頻差分訊號接觸部144a、及該第二低頻差分訊號接觸部144b之左右兩側具有該第三接地基部153、及該第二接地基部133，且該第二接地接觸部134位於該第一低頻差分訊號接觸部144a與該第二低頻差分訊號接觸部144b之間。
If based on the above electrical connector structure, it can be applied not only to the female part, but also to the male part, as shown in the third and fourth figures. For the male part, the first high-frequency differential signal transmission conductor The
再者，根據上述電連接器組構，可清楚看出，所述該電源焊接部121兩側分別具有該第一接地焊接部111、及該第二接地焊接部131，如此優勢在於可藉由該第一接地焊接部111、及該第二接地焊接部131將該電源焊接部121進行包圍，而降低電源共模干擾的產生。
Furthermore, according to the above electrical connector structure, it can be clearly seen that the
又者，根據上述電連接器組構，可清楚看出，該低頻差分訊號傳輸導體組14兩側分別具有該第二接地傳輸導體13、及該第三接地傳輸導體15，如此優勢在於可藉由該第二接地傳輸導體13、及該第三接地傳輸導體15包圍該低頻差分訊號傳輸導體組14，而降低串音干擾的產生。
Furthermore, according to the above electrical connector structure, it can be clearly seen that the low-frequency differential signal
另者，根據上述電連接器組構，可清楚看出，該第一高頻差分訊號基部組103與該低頻差分訊號基部組143之間具有該電源基部123、及該第二接地基部133，再該第二高頻差分訊號基部組183與該低頻差分訊號基部組143之間具有該第三接地基部153、及該第四接地基部163，以藉由該電源基部123、及該第二接地基部133將該第一高頻差分訊號基部組103與該低頻差分訊號基部組143進行雙重隔離干擾之效果；而該第三接地基部153、及該第四接地基部163則將該第二高頻差分訊號基部組183與該低頻差分訊號基部組143進行雙重隔離干擾之效果。
In addition, according to the above electrical connector structure, it can be clearly seen that there is the
而該第一高頻差分訊號固持部組102與該低頻差分訊號固持部組142之間具有該第一接地固持部112、該電源固持部122、及該第二接地固持部132，該第二高頻差分訊號固持部組182與該低頻差分訊號固持部組142之間具有該第三接地固持部152、該第四接地固持部162、及該第五接地固持部172，以藉由該第一接地固持部112、該電源固持部122、及該第二接地固持部132將該第一高頻差分訊號固持部組102與該
低頻差分訊號固持部組142進行三重隔離干擾之效果，而由該第三接地固持部152、該第四接地固持部162、及該第五接地固持部172將該第二高頻差分訊號固持部組182與該低頻差分訊號固持部組142進行三重隔離干擾之效果。
There is the first
如此，經由上述的雙重隔離或三重隔離之方式，皆可有效防止低頻對高頻的串音干擾。 In this way, through the above-mentioned double isolation or triple isolation method, crosstalk interference between low frequency and high frequency can be effectively prevented.
因此，當母座電連接器與公頭電連接器進行差動電性連接時，電源焊接部121會有其電源共模干擾產生，此時之第一接地焊接部111、及第二接地焊接部131可將干擾源抑制於此之間，而使得干擾源不會向外散逸。另外，又因第一高頻差分訊號傳輸導體組10與第二高頻差分訊號傳輸導體組18於作動時，會產生干擾源，此時分別透過第一接地傳輸導體11、電源傳輸導體12、第二接地傳輸導體13、第三接地傳輸導體15、第四接地傳輸導體16、及第五接地傳輸導體17，可有效將干擾源充分隔離在低頻差分訊號傳輸導體組14外，使低頻差分訊號傳輸導體組14不會對第一高頻差分訊號傳輸導體組10與第二高頻差分訊號傳輸導體組18產生串音干擾。
Therefore, when the female electrical connector and the male electrical connector are differentially electrically connected, the power
請參閱第六圖所示，為本發明第二較佳實施例之實施示意圖，由圖中可清楚看出，其第一高頻差分訊號焊接部組101於背離第一接地焊接部111之側處乃具有一第一屏蔽殼體接地部20，而第二高頻差分訊號焊接部組181於背離第五接地焊接部171之側處乃具有一第二屏蔽殼體接地部21，又第一屏蔽殼體接地部20與第二屏蔽殼體接地部21乃共同連結一屏蔽殼體3，意謂，當第一高頻差分訊號焊接部組101作動時，可透過第一接地焊接部111與第一屏蔽殼體接地部20對第一高頻差分訊號焊接部組101的屏蔽隔離，達到完美的訊號傳輸平衡。又當第二高頻差分訊號焊接部組181作動時，可透過第五接地焊接部171與第二屏蔽殼體接地部21對第二高頻差分訊號焊接部組181的屏蔽隔離，同樣可達到完美的訊號傳輸平衡。
Please refer to Figure 6, which is a schematic diagram of the second preferred embodiment of the present invention. It can be clearly seen from the figure that the first high-frequency differential signal
請參閱第七圖所示，為本發明第三較佳實施例之實施示意圖，由圖中可清楚看出，本實施例與第二較佳實施例不同處在於，本實施例係以母座為應用舉例，而第三較佳實施例則以公頭為應用舉例，其第一高頻差分訊號焊接部組101於背離第一接地焊接部111之側處乃具有一第一屏蔽殼體接地部20，而第二高頻差分訊號焊接部組181於背離第五接地焊接部171之側
處乃具有一第二屏蔽殼體接地部21，又第一屏蔽殼體接地部20與第二屏蔽殼體接地部21乃共同連結一屏蔽殼體3，意謂，當第一高頻差分訊號焊接部組101作動時，可透過第一接地焊接部111與第一屏蔽殼體接地部20對第一高頻差分訊號焊接部組101的屏蔽隔離，達到完美的訊號傳輸平衡。又當第二高頻差分訊號焊接部組181作動時，可透過第五接地焊接部171與第二屏蔽殼體接地部21對第二高頻差分訊號焊接部組181的屏蔽隔離，同樣可達到完美的訊號傳輸平衡。
Please refer to the seventh figure, which is a schematic diagram of the third preferred embodiment of the present invention. It can be clearly seen from the figure that the difference between this embodiment and the second preferred embodiment is that this embodiment uses a female base This is an application example, and the third preferred embodiment uses a male header as an application example. The first high-frequency differential signal
請參閱第八圖所示，為本發明第四較佳實施例之第一接地傳輸導體及第五接地傳輸導體示意圖，由圖中可清楚看出，本實施例與上述第一較佳實施例不同處在於，本實施例母座之第一接地固持部112上具有一第一接地穿孔1121，而第五接地固持部172上具有一第五接地穿孔1721，藉此，透過第一接地穿孔1121與第五接地穿孔1721之設計，使第一接地固持部112與第五接地固持部172的上端處形成一個形成環繞迴流電路、地場迴流，不會有共模干擾。
Please refer to Figure 8, which is a schematic diagram of the first ground transmission conductor and the fifth ground transmission conductor according to the fourth preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is different from the above-mentioned first preferred embodiment. The difference is that in this embodiment, the first
請參閱第九圖所示，為本發明第五較佳實施例之第一接地傳輸導體及第五接地傳輸導體示意圖，由圖中可清楚看出，本實施例與上述第一較佳實施例不同處在於，本實施例公頭之第一接地固持部112上具有一第一接地穿孔1121，而第五接地固持部172上具有一第五接地穿孔1721，藉此，透過第一接地穿孔1121與第五接地穿孔1721之設計，使第一接地固持部112與第五接地固持部172的上端處形成一個形成環繞迴流電路、地場迴流，不會有共模干擾。
Please refer to Figure 9, which is a schematic diagram of the first ground transmission conductor and the fifth ground transmission conductor according to the fifth preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is different from the above-mentioned first preferred embodiment. The difference is that the first
是以，本發明之電連接器為可改善習用之技術關鍵在於： Therefore, the electrical connector of the present invention is a technology that can improve usage and the key lies in:
第一，透過低頻差分訊號傳輸導體組14兩側分別具有第二接地傳輸導體13、及第三接地傳輸導體15，如此可達到第二接地傳輸導體13、及第三接地傳輸導體15包圍低頻差分訊號傳輸導體組14，進而降低串音干擾的產生。
First, through the low-frequency differential signal
第二，藉由該電源基部123、及該第二接地基部133將該第一高頻差分訊號基部組103與該低頻差分訊號基部組143進行雙重隔離干擾之效果；而該第三接地基部153、及該第四接地基部163則將該第二高頻差分訊號基部組183與該低頻差分訊號基部組143進行雙重隔離干擾之效
果。
Second, the first high-frequency differential
第三，藉由該第一接地固持部112、該電源固持部122、及該第二接地固持部132將該第一高頻差分訊號固持部組102與該低頻差分訊號固持部組142進行三重隔離干擾之效果，而由該第三接地固持部152、該第四接地固持部162、及該第五接地固持部172將該第二高頻差分訊號固持部組182與該低頻差分訊號固持部組142進行三重隔離干擾之效果。
Third, the first high-frequency differential signal holding
第四，利用第一接地焊接部111、及第二接地焊接部131可將電源焊接部121所產生之干擾源抑制於此之間，而使得干擾源不會向外散逸。
Fourth, the first
第五，利用第一接地傳輸導體11、電源傳輸導體12、第二接地傳輸導體13、第三接地傳輸導體15、第四接地傳輸導體16、及第五接地傳輸導體17，可有效將第一高頻差分訊號傳輸導體組10與第二高頻差分訊號傳輸導體組18所產生之干擾源充分隔離在低頻差分訊號傳輸導體組14外，使低頻差分訊號傳輸導體組14不會對第一高頻差分訊號傳輸導體組10與第二高頻差分訊號傳輸導體組18產生串音干擾。
Fifth, by using the first
第六，透過第一接地焊接部111與第一屏蔽殼體接地部20對第一高頻差分訊號焊接部組101的屏蔽隔離，達到完美的訊號傳輸平衡。
Sixth, through the shielding and isolation of the first high-frequency differential signal
第七，透過第五接地焊接部171與第二屏蔽殼體接地部21對第二高頻差分訊號焊接部組181的屏蔽隔離，可達到完美的訊號傳輸平衡。
Seventh, through the shielding and isolation of the second high-frequency differential signal
第八，透過第一接地穿孔1121與第五接地穿孔1721之設計，使第一接地固持部112與第五接地固持部172的上端處形成一個形成環繞迴流電路、地場迴流，不會有共模干擾。
Eighth, through the design of the first ground through-
惟，雖然本文中已顯示並敘明本發明之各種實施例，但僅以舉例方式提供此等實施例，本文中所提供之任何操作理論或益處既定僅作為敘明本發明之一輔助；此等理論及解釋不束縛或限制關於藉由實踐本發明而達成之組織重塑之申請專利範圍。熟習此項技術者現在可不背離本發明之情形下構想出諸多變化、改變或替代。應瞭解，可在實踐本發明時採用本文中所敘明之發明之實施例的各種替代方案。本發明之範疇、本發明之範疇內的方法及結構既定包括等效形式。 However, while various embodiments of the invention have been shown and described herein, such embodiments are provided by way of example only, and any theory of operation or benefit provided herein is intended only as an aid in illustrating the invention; These theories and explanations do not constrain or limit the scope of the patent application regarding tissue remodeling achieved by practicing the present invention. Those skilled in the art may now devise numerous variations, modifications or substitutions without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. Equivalents are intended to be included within the scope of the invention, and methods and structures within the scope of the invention.
綜上所述，本發明之電連接器於使用時，為確實能達到其功效及目 的，故本發明誠為一實用性優異之發明，為符合發明專利之申請要件，爰依法提出申請，盼 審委早日賜准本發明，以保障發明人之辛苦發明，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感公便。 To sum up, when the electrical connector of the present invention is used, it can surely achieve its effect and purpose. Therefore, this invention is truly an invention with excellent practicality and meets the application requirements for an invention patent. I file the application in accordance with the law and hope that the review committee will approve the invention as soon as possible to protect the inventor's hard work. If the review committee of the Jun Bureau has If you have any questions, please feel free to send us a letter and we will try our best to cooperate.
10:第一高頻差分訊號傳輸導體組 10: The first high-frequency differential signal transmission conductor group
101:第一高頻差分訊號焊接部組 101: The first high frequency differential signal welding department group
11:第一接地傳輸導體 11: First ground transmission conductor
111:第一接地焊接部 111: First ground welding part
112:第一接地固持部 112: First ground holding part
12:電源傳輸導體 12:Power transmission conductor
121:電源焊接部 121:Power welding department
13:第二接地傳輸導體 13: Second ground transmission conductor
131:第二接地焊接部 131: Second ground welding part
14:低頻差分訊號傳輸導體組 14: Low frequency differential signal transmission conductor set
141:低頻差分訊號焊接部組 141: Low frequency differential signal welding department group
15:第三接地傳輸導體 15:Third ground transmission conductor
151:第三接地焊接部 151:Third ground welding department
16:第四接地傳輸導體 16: Fourth ground transmission conductor
161:第四接地焊接部 161: Fourth ground welding department
17:第五接地傳輸導體 17: Fifth ground transmission conductor
171:第五接地焊接部 171: Fifth ground welding department
172:第五接地固持部 172: Fifth ground holding portion
18:第二高頻差分訊號傳輸導體組 18: The second high-frequency differential signal transmission conductor group
181:第二高頻差分訊號焊接部組 181: The second high frequency differential signal welding department group
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| TW (1) | TWI835583B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5174800B2 (en) * | 2009-01-05 | 2013-04-03 | 鴻海精密工業股▲ふん▼有限公司 | Electrical connector |
| TWI657627B (en) * | 2018-04-13 | 2019-04-21 | 岱煒科技股份有限公司 | USB A female connector |
| TWI710169B (en) * | 2019-04-12 | 2020-11-11 | 維將科技股份有限公司 | Electric connector (1) |
-
2023
- 2023-03-10 TW TW112108923A patent/TWI835583B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5174800B2 (en) * | 2009-01-05 | 2013-04-03 | 鴻海精密工業股▲ふん▼有限公司 | Electrical connector |
| TWI657627B (en) * | 2018-04-13 | 2019-04-21 | 岱煒科技股份有限公司 | USB A female connector |
| TWI710169B (en) * | 2019-04-12 | 2020-11-11 | 維將科技股份有限公司 | Electric connector (1) |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202437617A (en) | 2024-09-16 |
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