TWM551762U - Thin type dual channel flexible circuit bridge wire - Google Patents

Description

Micro-thin dual-channel flexible circuit bridge wiring

The present invention provides a micro-thin double-channel flexible circuit bridge connection, in particular, a two-channel flexible circuit board can be used to connect two expansion interface cards of different pitches to form a bridge state, and meet the requirements of high-frequency signal transmission characteristic impedance and can reduce electromagnetic interference. In order to achieve stable dual-channel high-frequency signal transmission and improve transmission efficiency.

According to the rapid development of electronic technology, the speed and performance of computers and servers are getting faster and faster. In addition to the central processing unit and memory on the motherboard as the information processing hub in the computer or server, Various peripheral devices such as screens and data devices are also the focus of screen display, data transmission and command control of electronic devices such as computers and servers. You can use the slots on the motherboard to install various types of interface cards to enable peripheral devices. Transfer data between the interface card and the electronic device and use it for expansion purposes.

Furthermore, as people continue to pursue the image of the screen, the resolution and performance requirements of the display interface are getting higher and higher, and some manufacturers have developed an expandable interface that can bridge two display cards and use them as a single output. Scalable Link Interface (SLI) technology is mainly used to install display cards in two slots arranged side by side on the motherboard supporting SLI technology, and a bridge connector at the top of each display card. The multiple connectors of the video card bridge are respectively connected to two display cards The bridge connector forms a bridge state, enabling the motherboard to use Parallel Computing on the image processor on the two display cards and processing the 3D graphics for optimal graphics performance, but with Advances in integrated circuit technology have led to a gradual decline in the hardware architecture of dual-display cards, until emerging virtual reality and hybrid real-world technologies are becoming more prevalent. In order to handle more complex computing and graphics acceleration functions, dual-display bridge technology is again It is mainly used in the current mainstream Peripheral Component Interconnect Express (PCI Express) standard to solve the problem that the bus interface architecture of the early expansion interface is insufficient and the bandwidth is insufficient. Dual graphics cards can fully utilize high-speed graphics display performance through SLI technology.

However, the existing dual graphics bridges on the market can be roughly divided into single-channel soft-slab bridges, single-channel or dual-channel hard-board bridges, wherein the traditional two-channel soft-board bridges have a soft layer on the lower layer of the signal layer. For the insulating layer, due to the soft substrate manufacturing process and the physical arrangement of the wiring layout and structure, the double-layer flexible board can not be designed according to the high transmission rate and high-efficiency design trend, and is easy to generate in high-speed transmission applications. The skin effect of high-frequency signal reflection and transmission process, while the use of multi-layer soft board structure can use the power layer and ground plane of the middle two layers to improve electrical characteristics (such as characteristic impedance), but with the high frequency of multi-layer soft board application The signal transmission channel and the working bandwidth increase, and there are still problems such as thickening of the thickness, insufficient flexibility, and high characteristic impedance. Therefore, the traditional single-channel soft-board bridge is used in a double-layer soft board in applications with a small transmission rate. For the mainstream, it is unable to support the signal transmission of high-order video card bridges.

In addition, traditional single-channel or dual-channel hard-board bridges follow the board process technology The maturity of the technology can produce high-performance, high-density and multi-layer interconnected circuit boards, and in order to meet the needs of high-frequency signal transmission, and to meet electrical characteristics, reduce skin effect and electromagnetic interference between adjacent circuit layers, etc. Add more power and ground planes, the number of layers is representative of the number of layers with independent circuit layers, usually the number of layers is even (such as double, four, eight, etc.), but because the number of layers is more than thickness Thickening and flexible folding can not be bent. If it is applied to the dual-channel dual-channel bridging technology, it will also be unable to bridge the distance of the dual graphics card due to different design schemes of motherboards or display cards manufactured by various manufacturers. Unification, the traditional dual-channel hard-board bridge can not be bridged arbitrarily with the different spacing of the dual graphics cards, which is difficult to meet the user's own upgrade and expansion requirements, which is the key to research and improvement for those engaged in this industry. .

Therefore, in view of the above-mentioned problems and shortcomings, the new creators have collected such relevant materials through various evaluations and considerations, and have used the trial and modification of many years of R&D experience in this industry to start such a meager dual-channel flexible circuit. A new type of bridge wiring was born.

The main purpose of the present invention is to sequentially include a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second wiring layer and a fourth insulating layer by using a dual-channel flexible circuit board. The invention has the advantages of thinning and higher flexural resistance between 0.2 and 0.6 mm, and is electrically connected to the first connection interface by the first circuit layer, the ground layer and the second circuit layer respectively. And the second connection interface, the first connection interface and the second connection interface can connect the two expansion interface cards of all the different spacings to form an arbitrary bridge state, and the ground layer between the first circuit layer and the second line is used as the dual channel High-frequency signals transmit a common reference plane, which not only meets the requirements of working bandwidth, but also meets the requirements of characteristic impedance for high-frequency signal integrity and reduces the skin effect of high-frequency signal reflection and transmission processes. The formation is shielded The effect of isolation and isolation makes the distance between the circuit layer and the reference plane close, which can reduce the electromagnetic wave and crosstalk generated by the high-frequency signal transmission, thereby achieving stable double-channel high-frequency signal transmission and improving transmission efficiency.

10‧‧‧Double-channel flexible circuit board

101‧‧‧First flexible substrate

102‧‧‧Second flexible substrate

103‧‧‧ Third soft substrate

11‧‧‧First insulation

111‧‧‧First film

112‧‧‧ first layer

12‧‧‧First line layer

121‧‧‧First conductor

13‧‧‧Second insulation

131‧‧‧Second film

132‧‧‧second second layer

133‧‧‧ third layer

14‧‧‧ Grounding layer

141‧‧‧Metal conductor

15‧‧‧ third insulation

151‧‧‧ Third film

152‧‧‧ fourth layer

153‧‧‧ fifth layer

16‧‧‧Second circuit layer

161‧‧‧second conductor

17‧‧‧fourth insulation

171‧‧‧fourth film

172‧‧‧ sixth layer

18‧‧‧through hole

20‧‧‧First connection interface

21‧‧‧First Bridge

211‧‧‧First socket

2111‧‧‧ Socket slot

212‧‧‧First terminal group

2121‧‧‧Docking Department

2122‧‧‧Welding Department

22‧‧‧First reinforcement board

221‧‧‧ jack

222‧‧‧ glue layer

30‧‧‧Second connection interface

31‧‧‧Second Bridge

311‧‧‧second socket

3111‧‧‧ Socket slot

312‧‧‧Second terminal group

3121‧‧‧Docking Department

3122‧‧‧Welding Department

32‧‧‧Second reinforcing plate

321‧‧‧ jack

322‧‧ ‧ glue layer

40‧‧‧System Host

41‧‧‧ motherboard

411‧‧‧ slots

42‧‧‧Expansion interface card

420‧‧‧ chipsets

421‧‧‧Transport interface

422‧‧‧Bridge end connector

4221‧‧‧Metal joints

43‧‧‧heating device

The first picture is a three-dimensional appearance of the creation.

The second picture is a three-dimensional exploded view of the creation.

The third picture is a three-dimensional exploded view of another perspective of the creation.

The fourth picture is a schematic diagram of the structure of the two-channel flexible circuit board.

The fifth figure is a schematic structural view of a two-channel flexible circuit board according to a preferred embodiment of the present invention.

Figure 6 is a perspective view of another preferred embodiment of the present invention prior to joining.

Figure 7 is a perspective view of another preferred embodiment of the present invention after being joined.

The eighth drawing is a perspective view of a further preferred embodiment of the present invention.

In order to achieve the above objectives and effects, the technical means and its construction adopted in the present invention are described in detail in the preferred embodiment of the present invention, and the structure and function are as follows.

Please refer to the first, second, third, fourth and fifth figures, which are respectively the three-dimensional appearance drawing, the three-dimensional exploded view, the three-dimensional exploded view of another perspective, the structure diagram of the two-channel flexible circuit board and the better implementation. For a schematic diagram of the structure of the dual-channel flexible circuit board, it can be clearly seen from the figure that the micro-thin double-channel flexible circuit bridge connection of the present invention includes a dual-channel flexible circuit board 10 and a planar arrangement corresponding to the dual-channel flexible circuit board 10 The first connection of the electrical connection at the side The interface 20 and the second connection interface 30, wherein the dual-channel flexible circuit board 10 sequentially includes the first insulation layer 11, the first circuit layer 12, the second insulation layer 13, the ground layer 14, and the third insulation layer 15 The second circuit layer 16 and the fourth insulating layer 17 have a first insulating layer 11 having a first film 111, and a first bonding layer 112 is disposed on the upper surface of the first film 111 to form a cover film, and the first line The first conductor 121 of the layer 12 is bonded to the first film 111 through the first adhesive layer 112, and the lower surface of the second film 131 of the second insulating layer 13 is provided on the first conductor 121. a second adhesive layer 132 is disposed on the upper surface of the second film 131. The grounding layer 14 is disposed between the first circuit layer 12 and the second circuit layer 16 and is provided by the ground layer 14. The metal conductor 141 is bonded to the second film 131 through the third adhesive layer 133. The lower surface of the third film 151 of the third insulating layer 15 is provided with a fourth adhesive layer 152 bonded to the metal conductor 141. And a fifth bonding layer 153 is disposed on the upper surface of the third film 151, and the second wiring layer 16 has a second guiding 161 is bonded to the third film 151 through the fifth adhesive layer 153, and the lower surface of the fourth film 171 of the fourth insulating layer 17 is provided with a sixth adhesive layer 172 to form another cover film, and is formed by the fourth The film 171 is bonded to the second conductor 161 through the sixth adhesive layer 172 to form a flexible multilayer board.

Furthermore, the first film 111 of the first insulating layer 11, the second film 131 of the second insulating layer 13, the third film 151 of the third insulating layer 15, and the fourth film 171 of the fourth insulating layer 17 comprise a polycrystalline film. Amine (PI), polyethylene terephthalate (PET) or other film material with insulation and flexibility, preferably made of polyimide film material, wherein the first film 111 And the thickness of the fourth film 171 can be respectively between 0 Between 5 and 1 mil (1 mil = 0.0254 mm), preferably 25 μm (1 mm = 1000 μm), and the thickness of the second film 131 and the third film 151 may be between 1 and 2 mils, respectively. Good for 50μm.

The first adhesive layer 112 of the first insulating layer 11, the second adhesive layer 132 of the second insulating layer 13, and the third adhesive layer 133, the fourth adhesive layer 152 and the fifth adhesive layer 153 of the third insulating layer 15, The sixth adhesive layer 172 of the fourth insulating layer 17 is made of epoxy resin, polyester resin, acrylic resin or other thermosetting glue, wherein the first adhesive layer 112, The thickness of the fourth adhesive layer 152 and the sixth adhesive layer 172 may be between 20 and 30 μm, preferably 25 μm, and the thicknesses of the second adhesive layer 132, the third adhesive layer 133 and the fifth adhesive layer 153 may be respectively Between 15 and 25 μm, preferably 20 μm; in addition, the first conductor 121 of the first circuit layer 12 and the second conductor 161 of the second circuit layer 16 can be made of materials such as rolled copper foil or electrolytic copper foil. Preferably, the rolled copper foil has higher flexural resistance, and the desired wiring is formed by etching or the like, and the ground layer 14 is disposed between the first wiring layer 12 and the second wiring layer 16, and The metal conductor 141 of the ground layer 14 may be made of a metal material such as copper, aluminum or silver, preferably copper foil to form a metal foil film. Or the aspect of the woven mesh, and the thickness of the first circuit layer 12, the ground layer 14, and the second circuit layer 16 may be between 30 and 40 μm, preferably 35 μm, and the ground layer 14 may be adjacent to The first and second circuit layers 12 and the second circuit layer 16 transmit a common reference plane or a ground plane (0V reference plane).

In this embodiment, the dual-channel flexible circuit board 10 includes the first insulation. The layer 11, the first circuit layer 12, the second insulating layer 13, the ground layer 14, the third insulating layer 15, the second circuit layer 16, and the fourth insulating layer 17 may further have a first flexible substrate 101 and a second flexible substrate. The first flexible substrate 101 is composed of a first film 111 of the first insulating layer 11, a first bonding layer 112, and a first conductor 121 of the first circuit layer 12. A flexible copper foil substrate (3 Layer FCCL) is formed, and a desired wiring is formed by etching or the like. Similarly, the second flexible substrate 102 is connected to the second thin film 131 and the third adhesive layer 133 of the second insulating layer 13. The metal conductor 141 of the formation 14 is formed with a rubber-based flexible copper foil substrate, and the third flexible substrate 103 is composed of a fourth film 171 of the fourth insulating layer 17, a sixth back layer 172 and a second circuit layer 16. The two conductors 161 are configured to have a rubber-based flexible copper foil substrate, and the total thickness of the two-channel flexible circuit board 10 or the first flexible substrate 101 and the second flexible substrate 102 plus the third flexible substrate 103 is 0.2. Between ~0.6mm, and two groups of multiple conduction on the two sides of the dual-channel flexible circuit board 10 18, 18 and each of the vias are electrically connected to the first wiring layer 12, ground layer 14 and the second wiring layer 16, in order to achieve the interconnection between the layers of the multilayer structure.

The first connection interface 20 includes at least two first bridges 21 having a first socket 211, and the first terminal group 212 is oppositely disposed on the two side wall surfaces of the two sockets 211. A plurality of butting portions 2121 are suspended, and each of the abutting portions 2121 is respectively provided with a welded portion 2122 which is disposed to be displaced from the bottom of the first socket 211 with respect to the other side of the upper opening of the insertion slot 2111, and is configured to form a plug-in type. Or the first bridge 21 of the dual in-line package (DIP) type, and the first socket 211 of the first bridge 21 is divided below The first reinforcing plate 22 having the plurality of jacks 221 is disposed, and the jacks 221 are respectively disposed corresponding to the soldering portions 2122 at the lower portion of the first terminal group 212, and the surface of the first reinforcing plate 22 is provided with a glue layer. 222 (as shown in the fourth figure).

The second connection interface 30 includes at least two second bridges 31 having a second socket 311, and the second terminal group 312 is opposite to the two side walls of the two sockets 311. The plurality of abutting portions 3121 are suspended, and each of the abutting portions 3121 is respectively provided with a welded portion 3122 that is disposed to be displaced from the bottom of the second socket 311 to form a misaligned portion with respect to the other side of the upper opening of the insertion slot 3111. Or a second bridge 31 of a dual in-line package (DIP) type, and a second reinforcing plate with a plurality of jacks 321 respectively disposed under the second socket 311 of the second bridge 31 32, and the jacks 321 are respectively disposed corresponding to the soldering portions 3122 at the lower portion of the second terminal group 312, and the surface of the second reinforcing plate 32 is provided with a bonding layer 322 (as shown in the fourth figure).

However, the first reinforcing plate 22 of the first connecting interface 20 and the second reinforcing plate 32 of the second connecting interface 30 may respectively be a fiberglass board, a steel sheet, a polypropylene (PP), a polyphenylene dioxide of a flame resistant material grade FR4. Made of ethylene glycol formate (PET), ceramic or other metal or non-metal (such as inorganic or organic insulating materials), preferably FR4 fiberglass board, and the thickness of the first reinforcing plate 22 and the second reinforcing plate 32 The glue layers 222 and 322 which are coated or bonded on the surfaces of the first reinforcing plate 22 and the second reinforcing plate 32 respectively may be double-sided adhesive tape, hot melt adhesive, Epoxy resin, polyester resin, acrylic resin and other adhesive paper or pressure sensitive adhesive, preferably double-sided adhesive tape, and the thickness of the glue layer 222, 322 depends on the first reinforcing plate 22 and the second reinforcing plate 32 Use material as separable Do not be between 0.005~0.20mm, and most preferably 50μm.

When the creation is assembled, the body of the dual-channel flexible circuit board 10 that completes the processing (such as inner layer fabrication, copper foil etching circuit, pressing, drilling, and plating to form metallized holes, etc.) is first punched out to a specific The first bridge 21 of the first connection interface 20 and the second bridge 31 of the second connection interface 30 are respectively disposed on two sides of the same plane of the dual-channel flexible circuit board 10, The soldering portion 2122 of the one terminal group 212 and the soldering portion 3122 of the second terminal group 312 respectively penetrate vertically downward into the corresponding via holes 18 at the two sides of the dual-channel flexible circuit board 10, and the plurality of first sockets 211 The bottom of the second socket 311 is formed on the same plane as the two-channel flexible circuit board 10, and is disposed at a distance from the bottom of the two-channel flexible circuit board 10 to the left and right, and is formed by using a through hole welding through the two-channel flexible circuit board 10. The connection is made, and the solder structure on the first terminal group 212, the second terminal group 312 and the two-channel flexible circuit board 10 is effectively prevented from being damaged or peeled off, so that the overall structure is more stable.

The flux used on the soldering portion of the via hole 18 of the dual-channel flexible circuit board 10 is continuously removed, and the double-channel flexible circuit board 10 is sized on the other side surface of the first bridge 21 and the second bridge 31. Or, the release film attached to the first reinforcing plate 22 and the second reinforcing plate 32 on the bonding layers 222 and 322 is peeled off, and each of the insertion holes 221 and 321 respectively corresponds to the first terminal group 212 and the second terminal. The terminal group 312 passes through the soldering portions 2122 and 3122 on the back surface of the dual-channel flexible circuit board 10, and then presses the first reinforcing plate 22 and the second reinforcing plate 32 respectively, so as to be coupled to the dual channel through the bonding layers 222 and 322. On the back surface of the flexible circuit board 10, the plurality of jacks 221 and 321 of the first reinforcing board 22 and the second reinforcing board 32 have a larger aperture than the first terminal group 212 and the second terminal group 312. The plurality of soldering portions 2122, 3122 enable the first reinforcing plate 22 and the second reinforcing plate 32 to be reinforced and pressed against the back surface of the dual-channel flexible circuit board 10 to prevent air bubbles from being generated, thereby ensuring the mutual characteristics of the mutual reinforcing members. Create an assembly of the whole.

As shown in the fifth figure, the two-channel flexible circuit board 10 in this embodiment is different from the above embodiment in that the first film 111 of the first flexible substrate 101 and the first conductor 121 may not be used first. The layer 112 and the first conductor 121 of the first circuit layer 12 can be directly formed on the first film 111 according to the process to form a non-glue flexible copper foil substrate (2 Layer FCCL), and then formed by etching or the like. The required circuit, but not limited thereto, the third adhesive layer 133 disposed between the second film 131 of the second flexible substrate 102 and the metal conductor 141, and the third flexible substrate 103 The sixth bonding layer 172 disposed between the fourth film 171 and the second conductor 161 may also be omitted, and the metal conductor 141 and the second conductor 161 may be directly formed on the second film 131 and the fourth film 171 according to different processes. The gel-free flexible copper foil substrate and the gel-free flexible copper foil substrate are mainly different from each other in the first flexible substrate 101, the second flexible substrate 102, and the third flexible substrate 103. Between film and copper foil In the adhesive layer, problems such as internal stress and thinning of the metal can be avoided in the adhesive layer, and the flexibility and the dimensional stability are good, and the total thickness of the overall structure can be reduced in the case where the number of layers is reduced. However, the process of the non-adhesive soft copper foil substrate (such as coating method, pressing method, sputtering/electroplating method, etc.) is relatively expensive, and in contrast, the adhesive soft copper foil substrate is obtained by passing the film and the copper foil through the subsequent lamination. Compared with the non-adhesive soft copper foil substrate, it has the advantage of lower cost, but is more suitable for thicker copper layer fabrication, and can meet the required thickness, flexural resistance, etc. of the dual-channel flexible circuit board 10. The characteristics are different in the production method, so it is below this case. The contents of the manual are explained together and combined with Chen Ming.

The three-dimensional external view of the preferred embodiment of the present invention, the three-dimensional external view after the connection, and the three-dimensional external view of a further preferred embodiment are shown in the accompanying drawings. As can be clearly seen from the figure, the system host 40 to which the micro-dual flexible circuit bridge connection of the present invention can be applied includes, but is not limited to, a desktop or personal computer, an industrial computer, a server, a bare system, etc., the system host 40 includes The motherboard 41 is provided with a plurality of slots 411 arranged side by side on the motherboard 41. For example, the computer bus is interconnected based on the existing peripheral component interconnection (PCI) standard (PCI Express, PCI for short). -E or PCIe) standard, and at least two slots 411 are respectively connected with a transmission interface 421 of the expansion interface card 42, for example, a Graphics Card capable of supporting SLI technology, but actually The application is not limited to this, and it can also be an expansion card of PCI-E to USB/SATA/eSATA/RS-232 interface, a network card of PCI-E interface or a sound card, and the expansion interface card 42 On the surface, there are image processing units (GPUs) and network chips. The chip set 420 of the audio chip or the like, the expansion interface card 42 in the embodiment is a display card capable of supporting SLI technology, and two front and rear intervals are respectively disposed at the top edge of each expansion interface card 42 near the side edge. A bridge connector 422 is provided at a distance, and a plurality of metal contacts 4221 are respectively disposed on the left and right sides of the bridge connector 422. The expansion interface card 42 cooperates with the motherboard 41 to perform functions such as 3D picture calculation and graphics acceleration.

When the micro-small two-channel flexible circuit bridge of the present invention is to be connected to the two expansion interface cards 42 on the motherboard 41, the two-channel flexible circuit board 10 in the first figure is first turned over at 180 degrees. The direction of the representation, and the first connection interface 20 and the second connection interface The face 30 corresponds to the two expansion interface cards 42 respectively, and the first bridge 21 can be respectively butted downwardly to the corresponding bridge end connector 422 of the first expansion interface card 42, and the bridge end connector 422 is inserted into the first The socket 211 is inserted into the slot 2111, and the first terminal block 212 is pushed outwardly relative to the abutting portion 2121, so that the bridge terminal 422 can be smoothly inserted into the slot 2111, and then the bridge terminal 422 can be smoothly inserted into the slot 2111. The abutting portion 2121 of the first terminal group 212 abuts the corresponding plurality of metal contacts 4221 on the bridge terminal 422 to form a positive electrical connection. Similarly, the second socket 311 of the second bridge 31 can be in the manner described above. The bridge ends 422 of the second expansion interface card 42 are respectively connected to each other, and the abutting portion 2121 of the second terminal group 312 is electrically connected to the corresponding plurality of metal contacts 4221 on the bridge terminal 422. The first connection interface 20 with the two first bridges 21 and the second bridge 31 on the two sides of the dual-channel flexible circuit board 10 and the second connection interface 30 are connected to the four expansion interface cards 42. Bridge the end joint 422, thereby achieving the connection of two The expansion interface card 42 forms a dual channel bridge state, enabling the system host 40 to perform parallel calculations using the wafer set 420 on the two expansion interface cards 42, thereby improving the efficiency of faster computational processing and graphics display.

In this embodiment, when the two-channel flexible circuit board 10 is connected to the second connection interface 32 by using the first connection interface 20 and the second connection interface 30, the first bridge 21 and the second bridge 31 are connected to form two expansion interface cards 42. In the bridge state, the two-channel high-frequency signal transmission can be provided by the first circuit layer 12 and the second circuit layer 16, and the ground layer 14 between the first circuit layer 12 and the second circuit layer 16 is used as a high-frequency signal transmission. The reference plane matches the impedance of the first circuit layer 12 and the second circuit layer 16 with the ground layer 14 to meet the requirement of a characteristic impedance of 50 ohms (Ω), and can reduce the generation of skin during high-frequency signal reflection and transmission. Effectual Power loss, at the same time, the first circuit layer 12 and the second circuit layer 16 are shielded and insulated by the ground layer 14, so that the distance between the circuit layer and the reference plane is close to reduce the electromagnetic wave generated when the high-frequency signal is transmitted. And crosstalk and other interference, the multi-layer flexible circuit board 10 multi-layer structure design, compared to the traditional single-channel soft-board bridge wiring work bandwidth is only 400MHz or the traditional dual-channel hard-board bridge's working bandwidth is only 680MHz can not meet the work The need for increased bandwidth, and with the increase of signal transmission channel and working bandwidth, there are still problems such as thickening of the thickness and insufficient flexibility. The dual-channel flexible circuit board 10 of the present invention not only satisfies the increase of the working bandwidth to 1360MHz demand, with a total thickness of between 0.2 ~ 0.6mm to achieve thinner and higher flexural resistance, for high-frequency signal transmission integrity, can still meet the characteristic impedance of 50 ohms (Ω The test requirements, in order to achieve stable dual-channel high-frequency signal transmission and improve transmission efficiency.

In addition, the dual-channel flexible circuit board 10 used in the present invention has light weight, higher flex resistance and thinning characteristics, and can bend the double-channel flexible circuit board 10 to form upward arching, sagging or The folding forms an acute angle setting, and the plurality of flexing does not cause the destruction or breakage of the structure of the two-channel hard board bridge, so that the first connection interface 20 and the second connection interface 30 can be the first of the two pairs. The bridge 21 and the second bridge 31 connect the two expansion interface cards 42 of different pitches to suit different designs of the motherboard 41 or the expansion interface card 42 manufactured by various manufacturers, and are not subject to different bridge distances. Or the space limit is limited to meet the user's own upgrade and expansion requirements.

As shown in the eighth embodiment, the system host 40 in this embodiment differs from the above embodiment in that the expansion interface card 42 further includes a heat sink 43 and has a heat sink 43 against the surface of the wafer set 420. Thermal module (such as heat sink or heat sink) A number of heat sinks, etc., and a fan is mounted on the heat dissipation module or a plurality of heat pipes can be further disposed, and the power cable of the fan can be connected to the expansion interface card 42 to operate the fan to cooperate with the heat dissipation module. The wafer set 420 is rapidly dissipated.

Since the expansion interface card 42 is generally provided with a heat sink 43 on the expansion interface card 42 for the purpose of rapid heat dissipation, the size of the expansion interface card 42 in the width direction is increased, and any two adjacent slots 411 are added. In the case that the expansion interface card 42 cannot be separately inserted, two slots 411 need to be vacant between the two expansion interface cards 42 to form an architecture spanning the four slots 411, and then the dual-channel flexible circuit board 10 is utilized. The first bridge 21 and the second bridge 31 of the connection interface 20 and the second connection interface 30 are connected between the two expansion interface cards 42, and can be applied not only to the motherboard 41 and the expansion of different specifications. The interface card 42 can eliminate the need to install different specifications of the dual-channel hard-board bridge due to the difference between the two expansion interface cards 42, and the utility model has the advantages of increased use cost and inconvenient storage when not in use, and is more practical and applicable. The effect.

Therefore, the present invention is mainly directed to the first flexible layer 10, the first circuit layer 12, the second insulating layer 13, the ground layer 14, the third insulating layer 15, and the second circuit layer. 16 and the fourth insulating layer 17 have a thickness of 0.2 to 0.6 mm and a thinning and higher flexural resistance, and are electrically connected by the first connection of the two sides of the dual-channel flexible circuit board 10 The interface card 20 and the second connection interface 30 are connected to the two expansion interface cards 42 of different pitches to form a bridge state, and the ground layer 14 between the first circuit layer 12 and the second circuit layer 16 can be used as a dual channel high frequency signal transmission. The reference plane not only satisfies the requirements of working bandwidth and characteristic impedance, but also makes the line layer and the reference plane close to each other, thereby reducing electromagnetic wave interference during high-frequency signal transmission, thereby achieving stable two-channel high-frequency signals. Transmission and the effect of improving transmission efficiency.

The above detailed description is intended to be illustrative of a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other equivalents and modifications may be made without departing from the spirit of the invention. Changes are to be included in the scope of patents covered by this creation.

In summary, the above-mentioned micro-thin double-channel flexible circuit bridge wiring is used to achieve its efficacy and purpose. Therefore, this creation is a practical and excellent creation, which is in line with the application requirements of the new patent. To apply, I hope that the trial committee will grant this case as soon as possible to protect the hard work of the new creators. If there is any doubt in the bureau, please do not hesitate to give a letter, and the new creators will try their best to cooperate with them.

10‧‧‧Double-channel flexible circuit board

18‧‧‧through hole

20‧‧‧First connection interface

21‧‧‧First Bridge

211‧‧‧First socket

2111‧‧‧ Socket slot

212‧‧‧First terminal group

2121‧‧‧Docking Department

2122‧‧‧Welding Department

22‧‧‧First reinforcement board

30‧‧‧Second connection interface

31‧‧‧Second Bridge

311‧‧‧second socket

3111‧‧‧ Socket slot

312‧‧‧Second terminal group

3121‧‧‧Docking Department

3122‧‧‧Welding Department

32‧‧‧Second reinforcing plate

Claims (18)

A micro-thin dual-channel flexible circuit bridge connection includes a dual-channel flexible circuit board and a first connection interface and a second connection interface formed on the two sides of the dual-channel flexible circuit board to form an electrical connection, wherein: the double The channel flexible circuit board sequentially includes a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer, the first The circuit layer, the ground layer, and the second side of the second circuit layer are electrically connected to the first connection interface and the second connection interface, respectively, the ground layer is disposed between the first circuit layer and the second circuit layer Used to transmit a common reference plane as a two-channel signal, whereby the first circuit layer and the second circuit layer match the impedance of the ground layer. The micro-thin double-channel flexible circuit bridge of claim 1, wherein the first insulating layer has a first film; the first circuit layer has a first conductor; and the second insulating layer has a second a film, a lower surface of the second film is provided with a second adhesive layer bonded to the first conductor; the ground layer has a metal conductor; the third insulating layer has a third film, and the lower surface of the third film is provided a fourth bonding layer bonded to the metal conductor, the third film is provided with a fifth bonding layer on the upper surface thereof; the second wiring layer has a second bonding layer bonded to the third film through the second bonding layer a conductor; the fourth insulating layer has a fourth film. The micro-thin flexible circuit bridge of claim 2, wherein the dual-channel flexible circuit board has a first flexible substrate, a second flexible substrate, and a third flexible substrate on the first film. a first adhesive layer is disposed on the surface, and the first conductive system is bonded to the first film through the first adhesive layer, the first flexible substrate is formed by the first film, The first adhesive layer and the first conductor are formed with a rubber-based flexible copper foil substrate; the upper surface of the second film is provided with a third adhesive layer, and the metal conductive system is bonded to the second film through the third adhesive layer The second flexible substrate is composed of the second film, the third adhesive layer and the metal conductor, and a rubber-based flexible copper foil substrate; the lower surface of the fourth film is provided with a sixth adhesive layer, and the fourth film is provided. The third flexible substrate is bonded to the second conductor through the sixth flexible substrate, and the fourth thin film, the sixth adhesive layer, and the second conductive conductor are formed of a gel-based flexible copper foil substrate. The micro-thin two-channel flexible circuit bridge connection according to claim 3, wherein the thickness of the first adhesive layer and the sixth adhesive layer are between 20 and 30 μm, respectively. The micro-thin two-channel flexible circuit bridge connection according to claim 3, wherein the third adhesive layer has a thickness of between 15 and 25 μm. The micro-thin two-channel flexible circuit bridge connection according to claim 3, wherein the first adhesive layer, the third adhesive layer and the sixth adhesive layer comprise an epoxy resin, a polyester resin or an acrylic resin production. The micro-thin flexible circuit bridge of claim 2, wherein the dual-channel flexible circuit board has a first flexible substrate, a second flexible substrate, and a third flexible substrate, the first flexible substrate The first circuit layer is formed on the first film to form a gel-free flexible copper foil substrate; the second flexible substrate is formed on the second film by the metal conductor to form a gel-free soft copper foil substrate. The third flexible substrate is formed on the fourth film from the second conductor to form a gel-free flexible copper foil substrate. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the first film and the fourth film have a thickness of between 0.5 and 1 mil, respectively. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the second film and the third film have a thickness of between 1 and 2 mils respectively. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the first film, the second film, the third film and the fourth film comprise polyimide or poly(ethylene terephthalate) Made of a film of an alcohol ester. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the thickness of the second adhesive layer and the fifth adhesive layer are between 15 and 25 μm, respectively. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the fourth adhesive layer has a thickness of between 20 and 30 μm. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the second adhesive layer, the fourth adhesive layer and the fifth adhesive layer comprise an epoxy resin, a polyester resin or an acrylic resin production. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the first conductor, the ground layer and the second conductor have a thickness of between 30 and 40 μm, respectively. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the first conductor and the second conductor are respectively a rolled copper foil or an electrolytic copper foil, and the circuit is formed through an etching process. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the metal conductor is made of copper, aluminum or silver. The micro-thin two-channel flexible circuit bridge connection according to claim 2, wherein the metal conductor is a copper foil. The micro-thin flexible circuit bridge connection according to claim 1, wherein the dual-channel flexible circuit board has a thickness of between 0.2 and 0.6 mm.