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CN207321631U - Stiffener placed on bridge wires on back of dual channel flex circuit - Google Patents

Stiffener placed on bridge wires on back of dual channel flex circuit Download PDF

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Publication number
CN207321631U
CN207321631U CN201721156435.0U CN201721156435U CN207321631U CN 207321631 U CN207321631 U CN 207321631U CN 201721156435 U CN201721156435 U CN 201721156435U CN 207321631 U CN207321631 U CN 207321631U
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reinforcing plate
layer
binary channels
flexible circuit
bridge
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胡强龙
柳文胜
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Wieson Technologies Dong Guan co ltd
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Wieson Technologies Dong Guan co ltd
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Abstract

The utility model provides a bridging line with a reinforcing plate arranged on the back of a double-channel flexible circuit board, which comprises a double-channel flexible circuit board, a first connecting interface and a second connecting interface which are oppositely arranged at two sides of the front of the double-channel flexible circuit board and form electric connection, the first connecting interface comprises a first bridge connector with a first socket and a first terminal group and a first reinforcing plate, the second connecting interface comprises a second bridge connector with a second socket and a second terminal group and a second reinforcing plate, the first bridge connector and the second bridge connector can be respectively connected to the bridge connector of two display cards, so as to connect the two display cards with different intervals to form an arbitrary bridge connection state, and the first reinforcing plate and the second reinforcing plate can be respectively combined on the back of the two ends of the double-channel flexible circuit board to increase the structural strength, so that a user is not easy to cause circuit fracture or damage of a welding structure due to drawing or excessive bending, can be conveniently plugged and unplugged so as to meet the convenience of plugging and unplugging use.

Description

加强板置于双通道柔性电路背面的桥接线Stiffener placed on bridge wires on back of dual channel flex circuit

技术领域technical field

本实用新型系提供一种加强板置于双通道柔性电路背面的桥接线,尤指可利用双通道柔性电路板的第一连接介面与第二连接介面连结不同间距的二个显示卡形成桥接状态,并由二端部背面上结合的加强板增加整体结构强度,以提升插拔使用上的便利性。The utility model provides a bridging line in which a reinforcing board is placed on the back of a dual-channel flexible circuit, especially two display cards with different distances can be connected by using the first connection interface and the second connection interface of the dual-channel flexible circuit board to form a bridging state. , and the strength of the overall structure is increased by the reinforcing plate combined on the back of the two ends to improve the convenience of plugging and use.

背景技术Background technique

按,现今电子科技快速发展,使电脑、伺服器等运算的速度及效能越来越快,并在电脑或伺服器内部除了具有主机板上之中央处理器与记忆体作为信息处理中枢之外,各种的萤幕、数据机等周边设备也是电脑、伺服器等电子装置进行画面显示、资料传输以及指令控制的重点,便可利用主机板上的插槽加装各种型式的介面卡,使周边设备能够通过介面卡和电子装置间进行传输资料及作为扩充用途使用。According to the rapid development of electronic technology nowadays, the computing speed and performance of computers and servers are getting faster and faster. In addition to the central processing unit and memory on the mainboard of the computer or server as the information processing center, Various screens, modems and other peripheral equipment are also the focus of computer, server and other electronic devices for screen display, data transmission and command control. You can use the slots on the motherboard to install various types of interface cards to make peripherals The device can transmit data between the interface card and the electronic device and be used as an expansion purpose.

再者,随着人们对于萤幕画面的影像不断追求,显示介面的解析度及效能要求越来越高,便有厂商发展出一种可以将二个显示卡桥接并作单一输出使用的可扩充连结介面(Scalable Link Interface,简称为SLI)技术,主要系在支援SLI技术的主机板上并排设置的二个插槽分别安装有显示卡,并在每个显示卡顶部设有桥接端接头,再利用双显卡桥接器的复数连接座分别对接于二个显示卡的桥接端接头上形成桥接状态,使主机板能运用二个显示卡上的图像处理器进行平行计算(Parallel Computing),并对3D图形进行处理,以达到最佳的图形显示效能,但随着积体电路技术的进步使得双显示卡的硬体架构逐渐式微,直到新兴的虚拟实境与混合实境技术逐渐盛行,为了处理更复杂的运算和图形加速等功能,双显卡桥接技术又再次的被重视,主要应用在目前主流的快捷外设组件互连(Peripheral Component Interconnect Express,简称为PCI Express)标准,以解决早期扩充介面的汇流排传输架构不敷使用与频宽不足的问题,使双显卡可通过SLI技术充分的发挥高速图形显示效能。Moreover, as people continue to pursue images on the screen, the resolution and performance requirements of the display interface are getting higher and higher. Some manufacturers have developed an expandable link that can bridge two display cards and use them as a single output. Interface (Scalable Link Interface, referred to as SLI) technology, mainly in the two slots arranged side by side on the motherboard supporting SLI technology to install graphics cards respectively, and a bridging terminal connector is provided on the top of each graphics card, which can be reused The multiple connectors of the dual-graphics card bridge are respectively connected to the bridge end connectors of the two display cards to form a bridging state, so that the motherboard can use the image processors on the two display cards for parallel computing (Parallel Computing), and 3D graphics processing to achieve the best graphics display performance, but with the advancement of integrated circuit technology, the hardware architecture of dual graphics cards gradually declined until the emerging virtual reality and mixed reality technologies gradually prevailed. In order to process more complex The functions of computing and graphics acceleration, etc., the dual-graphics card bridging technology has been valued again, and it is mainly used in the current mainstream Peripheral Component Interconnect Express (PCI Express) standard to solve the confluence of the early expansion interface. Due to the problems of insufficient transmission structure and insufficient bandwidth, dual graphics cards can fully utilize high-speed graphics display performance through SLI technology.

然而,市面上现有的双显卡桥接器大致上可分为单通道软板桥接线、单通道或双通道硬板桥接器,其中该传统单通道软板桥接线的软板上下二层为信号层,中间为绝缘层,由于软板制程的软性基材与线路布设方式及结构的物理限制等,使双层软板无法因应高传输率、高效能的设计趋势,并在高速传输的应用上很容易产生高频信号反射与传输过程的集肤效应,而双通道硬板桥接器虽然可利用中间二层的电源层和接地层来改善电气特性(如特性阻抗),不过随着多层软板应用的高频信号传输通道与工作频宽增加,仍存在有厚度变厚、可挠折性不足及特性阻抗要求很高等问题,所以传统单通道软板桥接线在传输速率小的应用上,还是以双层软板为主流,无法支援高阶显示卡桥接的信号传输。However, the existing dual-graphics card bridges on the market can be roughly divided into single-channel flexible board bridges, single-channel or dual-channel hard board bridges, and the upper and lower layers of the flexible board of the traditional single-channel flexible board bridges are The signal layer has an insulating layer in the middle. Due to the physical limitations of the flexible base material and circuit layout method and structure of the flexible board manufacturing process, the double-layer flexible board cannot respond to the design trend of high transmission rate and high efficiency, and it can be used in high-speed transmission. In application, it is easy to produce high-frequency signal reflection and skin effect in the transmission process. Although the dual-channel hard board bridge can use the power layer and ground layer of the middle two layers to improve electrical characteristics (such as characteristic impedance), but with The high-frequency signal transmission channel and working bandwidth of the multi-layer flexible board application increase, but there are still problems such as thicker thickness, insufficient flexibility and high characteristic impedance requirements, so the traditional single-channel flexible board bridge connection In terms of application, double-layer flexible boards are still the mainstream, which cannot support signal transmission for high-end graphics card bridging.

再者,由于一般的电脑主机、伺服器机箱等内部主机板上安装有大量的电子零组件(如中央处理单元、显示卡、记忆体、硬碟及输入/输出设备等),并在电脑主机、伺服器机箱内部空间为既定大小的规格限定下,即必需考虑到整体系统的稳定性以及维修、置换上的便利性,以方便使用者操作,惟该传统单通道软板桥接线厚度较薄且可挠折性高,便会造成使用者拉拔或下压软板正面二侧处的桥接器与显示卡的桥接端接头插拔对接时,很容易因软性基材的结构强度不足而影响到装配效果与结构稳定性,甚至是过度弯折造成其线路断裂或焊接结构的破坏,故在桥接器整体的厚度与结构强度二者难以兼顾的考量下,要如何设计出可方便使用者在有限空间内进行插拔的动作,并在不增加软性基材厚度的情况下,提升桥接端接头插拔对接时的结构强度,以有效解决过度弯折所造成结构上的破坏,如此确保高频信号传输时的稳定性与效果,即为从事于此行业者所亟欲研究改善的关键所在。Furthermore, since a large number of electronic components (such as central processing unit, display card, memory, hard disk and input/output devices, etc.) 1. The internal space of the server chassis is limited by the size of the specification, that is, the stability of the overall system and the convenience of maintenance and replacement must be considered to facilitate the user's operation, but the thickness of the traditional single-channel flexible board bridge is relatively thin Moreover, the flexibility is high, so that when the user pulls or presses down the bridges on both sides of the front of the flexible board to plug and unplug the bridge end connector of the display card, it is easy to break due to the insufficient structural strength of the flexible substrate. It affects the assembly effect and structural stability, and even excessive bending causes its circuit breakage or damage to the welding structure. Therefore, under the consideration of the overall thickness and structural strength of the bridge, how to design a bridge that is convenient for users The plugging action is performed in a limited space, and without increasing the thickness of the soft base material, the structural strength of the bridging end connector is improved when plugging and unplugging, so as to effectively solve the structural damage caused by excessive bending, so as to ensure The stability and effect of high-frequency signal transmission are the key points that people in this industry want to study and improve.

实用新型内容Utility model content

故,本实用新型设计人有鉴于上述现有的问题与缺失,乃搜集相关资料经由多方的评估及考量,并利用从事于此行业的多年研发经验不断的试作与修改,始有此种可在不增加双通道柔性电路板整体厚度的情况下提升桥接器插拔对接时的结构强度,并方便使用者进行桥接器与双显卡的插拔动作,且可随着双显卡不同的间距而任意桥接的加强板置于双通道柔性电路背面的桥接线新型诞生。Therefore, in view of the above-mentioned existing problems and deficiencies, the designer of this utility model collects relevant materials, evaluates and considers them in many ways, and makes use of many years of experience in research and development in this industry to continuously try and modify. Improve the structural strength of the bridge when plugging and unplugging without increasing the overall thickness of the dual-channel flexible circuit board, and facilitate the user to plug and unplug the bridge and dual graphics cards, and can be arbitrarily adjusted according to the different spacing of the dual graphics cards A new type of bridging wire with a bridged stiffener placed on the back of a dual-channel flex circuit was born.

为实现上述目的,本实用新型采用的技术方案是:For realizing above-mentioned object, the technical scheme that the utility model adopts is:

一种加强板置于双通道柔性电路背面的桥接线,其特征在于:包括有双通道柔性电路板及相对设置于双通道柔性电路板正面二侧处形成电性连接的第一连接介面与第二连接介面,其中:A bridging line with a reinforcing plate placed on the back of a dual-channel flexible circuit, characterized in that it includes a dual-channel flexible circuit board and a first connection interface and a second connecting interface that are arranged on both sides of the front side of the dual-channel flexible circuit board to form electrical connections. Two connection interfaces, among which:

该双通道柔性电路板依序包含第一绝缘层、第一线路层、第二绝缘层、接地层、第三绝缘层、第二线路层及第四绝缘层;The dual-channel flexible circuit board sequentially includes a first insulating layer, a first wiring layer, a second insulating layer, a grounding layer, a third insulating layer, a second wiring layer and a fourth insulating layer;

该第一连接介面包含至少二个具有第一插座的第一桥接器及具有复数插孔的第一加强板,并在第一插座内部插接槽都穿设有第一端子组一侧处的复数对接部,且各对接部设有穿出第一插座底部分别与第一线路层、接地层、第二线路层形成电性连接的焊接部,而第一加强板结合于双通道柔性电路板的一端部背面上,且第一端子组穿出双通道柔性电路板背面的焊接部分别插入对应的插孔内;The first connection interface includes at least two first bridges with first sockets and a first reinforcing plate with a plurality of sockets, and the internal slots of the first sockets are all pierced with one side of the first terminal group A plurality of docking parts, and each docking part is provided with a welding part that passes through the bottom of the first socket to form an electrical connection with the first circuit layer, the ground layer, and the second circuit layer respectively, and the first reinforcement board is combined with the dual-channel flexible circuit board On the back of one end of the two-channel flexible circuit board, and the first terminal group passes through the welding part on the back of the dual-channel flexible circuit board and inserts them into the corresponding jacks respectively;

该第二连接介面包含至少二个具有第二插座的第二桥接器及具有复数插孔的第二加强板,并在第二插座内部插接槽都穿设有第二端子组一侧处的复数对接部,且各对接部分别设有穿出第二插座底部与第一线路层、接地层、第二线路层形成电性连接的焊接部,而第二加强板结合于双通道柔性电路板另一端部背面上,且第二端子组穿出双通道柔性电路板背面的焊接部分别插入对应的插孔内。The second connection interface includes at least two second bridges with second sockets and a second reinforcing plate with a plurality of sockets, and the internal slots of the second sockets are all pierced with the second terminal group on one side A plurality of docking parts, and each docking part is provided with a soldering part passing through the bottom of the second socket to form an electrical connection with the first circuit layer, the ground layer, and the second circuit layer, and the second reinforcing plate is combined with the dual-channel flexible circuit board On the back of the other end, the second terminal group passes through the welding part on the back of the dual-channel flexible circuit board and is respectively inserted into corresponding sockets.

所述的加强板置于双通道柔性电路背面的桥接线,其中:该第一加强板与第二加强板的插孔孔径分别大于第一端子组的焊接部、第二端子组的焊接部断面尺寸,以使焊接部不会与第一加强板、第二加强板的插孔接触。The reinforcing plate is placed on the bridging line on the back of the dual-channel flexible circuit, wherein: the hole diameters of the first reinforcing plate and the second reinforcing plate are respectively larger than the cross sections of the welding part of the first terminal group and the welding part of the second terminal group Dimensions, so that the welding part will not contact with the socket of the first reinforcement board and the second reinforcement board.

所述的加强板置于双通道柔性电路背面的桥接线,其中:该第一加强板与第二加强板呈矩形,并由一该第一加强板与第二加强板的一长边贴齐于双通道柔性电路板的一短边,而该第一加强板与第二加强板的二短边则分别贴齐于双通道柔性电路板的二长边,且第一加强板与第二加强板的二短边的端部分别延伸出第一桥接器与第二桥接器外侧边处形成一高低段差状。The reinforcing board is placed on the bridging line on the back of the dual-channel flexible circuit, wherein: the first reinforcing board and the second reinforcing board are rectangular, and a long side of the first reinforcing board and the second reinforcing board are aligned on one short side of the dual-channel flexible circuit board, and the two short sides of the first reinforcement board and the second reinforcement board are respectively attached to the two long sides of the dual-channel flexible circuit board, and the first reinforcement board and the second reinforcement board The ends of the two short sides of the plate respectively extend out from the outer sides of the first bridge and the second bridge to form a height difference shape.

所述的加强板置于双通道柔性电路背面的桥接线,其中:该第一加强板与第二加强板分别为耐燃材料等级FR4的玻璃纤维板、钢片、聚丙烯、聚对苯二甲酸乙二醇酯或陶瓷材质所制成,且第一加强板与第二加强板的厚度介于0.4~1.0mm之间。The reinforcing board is placed on the bridging line on the back of the dual-channel flexible circuit, wherein: the first reinforcing board and the second reinforcing board are respectively glass fiber boards, steel sheets, polypropylene, polyethylene terephthalate of flame-resistant material grade FR4 It is made of glycol ester or ceramic material, and the thickness of the first reinforcement board and the second reinforcement board is between 0.4mm and 1.0mm.

所述的加强板置于双通道柔性电路背面的桥接线,其中:该第一加强板一侧表面上设有胶合层,并由第一加强板通过该胶合层结合于双通道柔性电路板的一端部背面上,而第二加强板一侧表面上设有另一胶合层,且第二加强板通过该另一胶合层结合于双通道柔性电路板另一端部背面上。The reinforcing plate is placed on the bridging line on the back of the dual-channel flexible circuit, wherein: a glue layer is provided on one side of the first reinforcing plate, and the first reinforcing plate is bonded to the double-channel flexible circuit board through the glue layer. On the back of one end, another adhesive layer is provided on one side of the second reinforcing board, and the second reinforcing board is combined with the back of the other end of the dual-channel flexible circuit board through the other adhesive layer.

所述的加强板置于双通道柔性电路背面的桥接线,其中:该胶合层为双面胶纸、热熔胶、环氧树脂、聚酯树脂或压克力树脂,且胶合层的厚度介于0.005~0.20mm之间。The reinforcing board is placed on the bridging line on the back of the dual-channel flexible circuit, wherein: the glued layer is double-sided adhesive paper, hot melt adhesive, epoxy resin, polyester resin or acrylic resin, and the thickness of the glued layer is between Between 0.005 and 0.20mm.

本实用新型的主要优点在于双通道柔性电路板正面二侧处为相对设置有第一连接介面的第一桥接器,以及第二连接介面的第二桥接器形成电性连接,并在双通道柔性电路板的二端部背面上分别结合有第一加强板及第二加强板,便可将第一桥接器与第二桥接器分别对接于二个显示卡的桥接端接头上,以连结不同间距的二个显示卡形成任意的桥接状态,并可运用二个显示卡提升双显卡系统更快的运算处理和图形显示的效能,且可通过第一加强板与第二加强板增加双通道柔性电路板对应于桥接器位置端部的结构强度,让使用者不易因拉拔或下压过度弯折造成其线路断裂或桥接器焊接结构上的破坏,即可方便进行插拔的动作,以满足使用者插拔使用上的便利性。The main advantage of the utility model is that the two sides of the front of the dual-channel flexible circuit board are oppositely provided with the first bridge of the first connection interface, and the second bridge of the second connection interface forms an electrical connection, and the dual-channel flexible circuit board The first reinforcing plate and the second reinforcing plate are respectively combined on the back of the two ends of the circuit board, so that the first bridge and the second bridge can be respectively connected to the bridge end connectors of the two display cards to connect different pitches. The two display cards form any bridge state, and the two display cards can be used to improve the performance of faster computing and graphics display of the dual-graphics system, and the dual-channel flexible circuit can be added through the first reinforcement board and the second reinforcement board The plate corresponds to the structural strength of the end of the bridge, so that the user is not easy to break the line or damage the welding structure of the bridge due to excessive bending by pulling or pressing down, so that the plugging action can be easily performed to meet the needs of the user. Or the convenience of plugging and unplugging.

本实用新型的另一优点在于当使用者欲将第一桥接器与第二桥接器拔起时,可利用第一加强板与第二加强板二短边的端部分别延伸出第一桥接器与第二桥接器形成一高低段差状,让使用者手指可稳定的勾住第一加强板或第二加强板端部而不易松动或滑脱,并向上拉起连带将第一桥接器或第二桥接器脱离于显示卡的桥接端接头,即可方便插拔而改善使用上的不便性,提高整体使用的机能与效果。Another advantage of the present invention is that when the user wants to pull up the first bridge and the second bridge, the ends of the two short sides of the first reinforcing plate and the second reinforcing plate can be used to extend the first bridge respectively. It forms a level difference with the second bridge, so that the user's fingers can stably hook the end of the first reinforcement plate or the second reinforcement plate without loosening or slipping off, and pull up the first bridge or the second bridge together. The bridge is detached from the bridge end connector of the display card, so that it can be easily plugged and unplugged, which improves the inconvenience of use and improves the function and effect of the overall use.

本实用新型的另一优点在于第一加强板与第二加强板一侧表面上分别设有胶合层,并将第一加强板与第二加强板通过胶合层加强压合于双通道柔性电路板的二端部背面上不易产生气泡,以确保其相互间的接着特性,同时使第一桥接器与第二桥接器于二端子组分别穿出双通道柔性电路板背面的焊接部插入其对应的插孔内,且该胶合层所使用的感压胶也可渗入于插孔内,而具有提高接着强度的效用。Another advantage of the present invention is that the first reinforcement board and the second reinforcement board are respectively provided with a glue layer on one side of the surface, and the first reinforcement board and the second reinforcement board are strengthened and pressed on the dual-channel flexible circuit board through the glue layer Air bubbles are not easy to be generated on the back of the two ends of the two-channel flexible circuit board to ensure their mutual bonding characteristics, and at the same time, the first bridge and the second bridge are inserted into the corresponding soldering parts of the two terminal groups through the back of the dual-channel flexible circuit board. In the socket, and the pressure-sensitive glue used in the glued layer can also penetrate into the socket, so as to improve the bonding strength.

附图说明Description of drawings

图1是本实用新型的立体外观图。Fig. 1 is a perspective view of the utility model.

图2是本实用新型的立体分解图。Fig. 2 is a three-dimensional exploded view of the utility model.

图3是本实用新型另一视角的立体分解图。Fig. 3 is a three-dimensional exploded view of another viewing angle of the utility model.

图4是本实用新型双通道柔性电路板的结构示意图。Fig. 4 is a structural schematic diagram of the dual-channel flexible circuit board of the present invention.

图5是本实用新型较佳实施例双通道柔性电路板的结构示意图。Fig. 5 is a schematic structural diagram of a dual-channel flexible circuit board in a preferred embodiment of the present invention.

图6是本实用新型另一较佳实施例于连结前的立体外观图。Fig. 6 is a three-dimensional appearance view of another preferred embodiment of the present invention before connection.

图7是本实用新型另一较佳实施例于连结后的立体外观图。Fig. 7 is a three-dimensional appearance view of another preferred embodiment of the present invention after connection.

图8是本实用新型再一较佳实施例的立体外观图。Fig. 8 is a perspective view of another preferred embodiment of the utility model.

附图标记说明:10-双通道柔性电路板;101-第一软性基板;102-第二软性基板;103-第三软性基板;11-第一绝缘层;111-第一薄膜;112-第一接着层;12-第一线路层;121-第一导体;13-第二绝缘层;131-第二薄膜;132-第二接着层;133-第三接着层;14-接地层;141-金属导体;15-第三绝缘层;151-第三薄膜;152-第四接着层;153-第五接着层;16-第二线路层;161-第二导体;17-第四绝缘层;171-第四薄膜;172-第六接着层;18-导通孔;20-第一连接介面;21-第一桥接器;211-第一插座;2111-插接槽;212-第一端子组;2121-对接部;2122-焊接部;22-第一加强板;221-插孔;222-胶合层;30-第二连接介面;31-第二桥接器;311-第二插座;3111-插接槽;312-第二端子组;3121-对接部;3122-焊接部;32-第二加强板;321-插孔;322-胶合层;40-系统主机;41-主机板;411-PCI-E插槽;42-显示卡;420-晶片组;421-传输介面;422-桥接端接头;4221-金属接点;43-散热装置。Description of reference signs: 10-dual-channel flexible circuit board; 101-first flexible substrate; 102-second flexible substrate; 103-third flexible substrate; 11-first insulating layer; 111-first film; 112-first bonding layer; 12-first circuit layer; 121-first conductor; 13-second insulating layer; 131-second film; 132-second bonding layer; 133-third bonding layer; 14-grounding layer; 141-metal conductor; 15-third insulating layer; 151-third film; 152-fourth bonding layer; 153-fifth bonding layer; 16-second circuit layer; 161-second conductor; 17-th Four insulation layers; 171-fourth film; 172-sixth bonding layer; 18-via hole; 20-first connection interface; 21-first bridge; 211-first socket; 2111-insert slot; 212 - the first terminal group; 2121 - the docking part; 2122 - the welding part; 22 - the first reinforcement plate; 221 - the socket; 222 - the glue layer; Two sockets; 3111-socket slot; 312-second terminal group; 3121-docking part; 3122-welding part; 32-second reinforcement board; 321-jack; Motherboard; 411-PCI-E slot; 42-display card; 420-chipset; 421-transmission interface; 422-bridge connector; 4221-metal contact;

具体实施方式Detailed ways

为达成上述目的及功效,本实用新型所采用的技术手段及其构造,兹绘图就本实用新型的较佳实施例详加说明其构造与功能如下,俾利完全了解。In order to achieve the above-mentioned purpose and effect, the technical means and the structure thereof adopted by the utility model are hereby illustrated in detail with respect to the preferred embodiment of the utility model. Its structure and function are as follows, so as to fully understand it.

请参阅图1、图2、图3、图4、图5所示,分别为本实用新型的立体外观图、立体分解图、另一视角的立体分解图、双通道柔性电路板的结构示意图及较佳实施例双通道柔性电路板的结构示意图,由图中可清楚看出,本实用新型的加强板置于双通道柔性电路背面的桥接线为包括有双通道柔性电路板10及相对设置于双通道柔性电路板10正面二侧处电性连接的第一连接介面20与第二连接介面30,其中:Please refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, and Fig. 5, which are respectively the three-dimensional appearance diagram, the three-dimensional exploded view, the three-dimensional exploded view of another angle of view, the structural schematic diagram of the dual-channel flexible circuit board and The schematic diagram of the structure of the dual-channel flexible circuit board of the preferred embodiment, it can be seen clearly from the figure that the reinforcing board of the present utility model is placed on the bridge line on the back of the dual-channel flexible circuit to include a dual-channel flexible circuit board 10 and is relatively arranged on the The first connection interface 20 and the second connection interface 30 are electrically connected at two sides of the front side of the dual-channel flexible circuit board 10, wherein:

该双通道柔性电路板10向上依序包含第一绝缘层11、第一线路层12、第二绝缘层13、接地层14、第三绝缘层15、第二线路层16及第四绝缘层17,其第一绝缘层11具有第一薄膜111,并在第一薄膜111上表面设有第一接着层112以构成一覆盖膜,且第一线路层12所具的第一导体121为通过第一接着层112结合于第一薄膜111上,而第二绝缘层13所具的第二薄膜131下表面设有结合于第一导体121上的第二接着层132,并在第二薄膜131上表面设有第三接着层133,该接地层14设置于第一线路层12与第二线路层16之间,并由接地层14所具的金属导体141通过第三接着层133结合于第二薄膜131上;另,第三绝缘层15所具的第三薄膜151下表面设有结合于金属导体141上的第四接着层152,并在第三薄膜151上表面设有第五接着层153,且第二线路层16所具的第二导体161为通过第五接着层153结合于第三薄膜151上,而第四绝缘层17所具的第四薄膜171下表面设有第六接着层172以构成另一覆盖膜,并由第四薄膜171通过第六接着层172结合于第二导体161上合而为一柔性多层板。The dual-channel flexible circuit board 10 includes a first insulating layer 11, a first wiring layer 12, a second insulating layer 13, a grounding layer 14, a third insulating layer 15, a second wiring layer 16 and a fourth insulating layer 17 upwards in sequence. , the first insulating layer 11 has a first thin film 111, and a first bonding layer 112 is provided on the upper surface of the first thin film 111 to form a cover film, and the first conductor 121 of the first wiring layer 12 is passed through the first A bonding layer 112 is bonded on the first film 111, and the lower surface of the second film 131 of the second insulating layer 13 is provided with a second bonding layer 132 bonded to the first conductor 121, and on the second film 131 The surface is provided with a third bonding layer 133, the grounding layer 14 is arranged between the first circuit layer 12 and the second circuit layer 16, and the metal conductor 141 of the grounding layer 14 is combined with the second circuit layer 133 through the third bonding layer 133. On the film 131; In addition, the third film 151 lower surface of the third insulating layer 15 is provided with the fourth bonding layer 152 combined with the metal conductor 141, and the fifth bonding layer 153 is provided on the third film 151 upper surface , and the second conductor 161 of the second circuit layer 16 is bonded to the third film 151 through the fifth bonding layer 153, and the lower surface of the fourth film 171 of the fourth insulating layer 17 is provided with a sixth bonding layer 172 to form another covering film, and the fourth film 171 is combined with the second conductor 161 through the sixth bonding layer 172 to form a flexible multi-layer board.

再者,该第一绝缘层11的第一接着层112、第二绝缘层13的第二接着层132与第三接着层133、第三绝缘层15的第四接着层152与第五接着层153、第四绝缘层17的第六接着层172包含环氧树脂(Epoxy)、聚酯树脂(Polyester)、压克力树脂(Acrylic)或其他热固胶所制成,而第一线路层12的第一导体121与第二线路层16的第二导体161则可分别为压延铜箔或电解铜箔等材质所制成,并经由蚀刻等制程成型出所需的线路,而接地层14设置于第一线路层12与第二线路层16之间,并使接地层14的金属导体141可为包含铜、铝或银等金属材质,最佳为铜箔,便可将接地层14作为邻近于上下第一线路层12与第二线路层16双通道信号传输共同的参考平面(Reference plane)或接地平面(0V参考电压,Ground plane)。Furthermore, the first bonding layer 112 of the first insulating layer 11 , the second bonding layer 132 and the third bonding layer 133 of the second insulating layer 13 , the fourth bonding layer 152 and the fifth bonding layer of the third insulating layer 15 153. The sixth bonding layer 172 of the fourth insulating layer 17 is made of epoxy resin (Epoxy), polyester resin (Polyester), acrylic resin (Acrylic) or other thermosetting adhesives, and the first circuit layer 12 The first conductor 121 of the second circuit layer 16 and the second conductor 161 of the second circuit layer 16 can be made of materials such as rolled copper foil or electrolytic copper foil, and the required circuit is formed by etching and other processes, and the ground layer 14 is set Between the first circuit layer 12 and the second circuit layer 16, and the metal conductor 141 of the ground layer 14 can be made of metal materials such as copper, aluminum or silver, preferably copper foil, the ground layer 14 can be used as an adjacent A common reference plane or ground plane (0V reference voltage, Ground plane) for two-channel signal transmission on the upper and lower first circuit layer 12 and second circuit layer 16 .

在本实施例中,双通道柔性电路板10除了包含第一绝缘层11、第一线路层12、第二绝缘层13、接地层14、第三绝缘层15、第二线路层16及第四绝缘层17,还可具有第一软性基板101、第二软性基板102及第三软性基板103,其第一软性基板101由第一绝缘层11的第一薄膜111、第一接着层112与第一线路层12的第一导体121所组构而成有胶系软性铜箔基板(3Layer FCCL),并经由蚀刻等制程成型出所需的线路,同理第二软性基板102由第二绝缘层13的第二薄膜131、第三接着层133与接地层14的金属导体141所组构而成有胶系软性铜箔基板,第三软性基板103由第四绝缘层17的第四薄膜171、第六接着层172与第二线路层16的第二导体161所组构而成有胶系软性铜箔基板,而双通道柔性电路板10或第一软性基板101、第二软性基板102加上第三软性基板103的总厚度为可介于0.2~0.6mm之间,并在双通道柔性电路板10二侧处分别设有二个群组的复数导通孔18,且各导通孔18分别电性连接于第一线路层12、接地层14与第二线路层16,以实现多层结构的层间互连。In this embodiment, the dual-channel flexible circuit board 10 includes the first insulating layer 11, the first circuit layer 12, the second insulating layer 13, the ground layer 14, the third insulating layer 15, the second circuit layer 16 and the fourth The insulating layer 17 can also have a first flexible substrate 101, a second flexible substrate 102 and a third flexible substrate 103, and the first flexible substrate 101 is made of the first thin film 111 of the first insulating layer 11, the first bonding layer Layer 112 and the first conductor 121 of the first circuit layer 12 form an adhesive flexible copper foil substrate (3Layer FCCL), and the required circuit is formed through etching and other processes. Similarly, the second flexible substrate 102 is composed of the second thin film 131 of the second insulating layer 13, the third bonding layer 133 and the metal conductor 141 of the grounding layer 14 to form an adhesive flexible copper foil substrate, and the third flexible substrate 103 is made of a fourth insulating layer. The fourth film 171 of the layer 17, the sixth bonding layer 172 and the second conductor 161 of the second circuit layer 16 form an adhesive flexible copper foil substrate, and the dual-channel flexible circuit board 10 or the first flexible The total thickness of the substrate 101, the second flexible substrate 102 and the third flexible substrate 103 can be between 0.2-0.6 mm, and two groups are respectively arranged on the two sides of the dual-channel flexible circuit board 10. There are a plurality of via holes 18, and each via hole 18 is electrically connected to the first circuit layer 12, the ground layer 14, and the second circuit layer 16, so as to realize interlayer interconnection of the multilayer structure.

该第一连接介面20包含至少二个具有第一插座211的第一桥接器21,并在二个第一插座211内部插接槽2111二侧壁面处都穿设有第一端子组212一侧处相对的复数对接部2121,且各对接部2121相对于插接槽2111上方开口的另一侧处分别设有向下穿出于第一插座211底部形成错位排列的焊接部2122,以组构成插板式或双列直插封装(dual in-linepackage,DIP)型式的第一桥接器21,而第一桥接器21的第一插座211下方处则分别设有具有复数插孔221的矩形第一加强板22,并使插孔221分别与第一端子组212下方处的焊接部2122对应设置,且第一加强板22一侧表面上设有胶合层222(如图4所示)。The first connection interface 20 includes at least two first bridges 21 with first sockets 211, and the first terminal group 212 is pierced on the two side walls of the inner sockets 211 of the two first sockets 211. There are a plurality of docking parts 2121 opposite to each other, and the other side of each docking part 2121 relative to the upper opening of the insertion groove 2111 is respectively provided with a welding part 2122 penetrating downwards at the bottom of the first socket 211 to form a dislocation arrangement, to form a group The first bridge 21 of plug-in board type or dual in-line package (dual in-linepackage, DIP) type, and the place below the first socket 211 of the first bridge 21 is respectively provided with a plurality of rectangular first sockets 221. The reinforcing plate 22 is arranged so that the insertion holes 221 correspond to the welding portions 2122 below the first terminal group 212 , and an adhesive layer 222 is provided on one side surface of the first reinforcing plate 22 (as shown in FIG. 4 ).

该第二连接介面30包含至少二个具有第二插座311的第二桥接器31,并在二个第二插座311内部插接槽3111二侧壁面处都穿设有第二端子组312一侧处相对的复数对接部3121,且各对接部3121相对于插接槽3111上方开口的另一侧处分别设有向下穿出于第二插座311底部形成错位排列的焊接部3122,以组构成插板式或双列直插封装(dual in-linepackage,DIP)型式的第二桥接器31,而第二桥接器31的第二插座311下方处则分别设有具有复数插孔321的矩形第二加强板32,并使插孔321分别与第二端子组312下方处的焊接部3122对应设置,且第二加强板32一侧表面上设有胶合层322(如图4所示)。The second connection interface 30 includes at least two second bridges 31 with second sockets 311, and the second terminal group 312 is pierced on the two side walls of the inner sockets 3111 of the two second sockets 311. There are a plurality of docking parts 3121 opposite to each other, and the other side of each docking part 3121 relative to the upper opening of the insertion groove 3111 is respectively provided with a welding part 3122 penetrating downwards at the bottom of the second socket 311 to form a dislocation arrangement, to form a group The second bridge 31 of plug-in board type or dual in-line package (dual in-linepackage, DIP) type, and the place below the second socket 311 of the second bridge 31 is respectively provided with a plurality of rectangular second sockets 321. The reinforcing plate 32 is arranged so that the insertion holes 321 correspond to the welding portions 3122 below the second terminal group 312 , and an adhesive layer 322 is provided on one side surface of the second reinforcing plate 32 (as shown in FIG. 4 ).

然而,上述第一连接介面20的第一加强板22与第二连接介面30的第二加强板32可分别为耐燃材料等级系FR4的玻璃纤维板、钢片、聚丙烯(PP)、聚对苯二甲酸乙二醇酯(PET)、陶瓷等金属或非金属(如无机或有机绝缘材料等)材质所制成,最佳为FR4的玻璃纤维板,且第一加强板22与第二加强板32厚度为可分别介于0.4~1.0mm之间,并在第一加强板22与第二加强板32表面上涂布或贴合的胶合层222、322可分别为双面胶纸、热熔胶、环氧树脂、聚酯树脂、压克力树脂等胶纸或感压胶所制成,最佳为双面胶纸,且胶合层222、322厚度依第一加强板22与第二加强板32选用材质为可分别介于0.005~0.20mm之间,最佳为50μm。However, the first reinforcing plate 22 of the first connecting interface 20 and the second reinforcing plate 32 of the second connecting interface 30 can be made of glass fiber board, steel sheet, polypropylene (PP), polyparaphenylene (PP) of the flame-resistant material grade system FR4, respectively. It is made of ethylene glycol diformate (PET), ceramics and other metal or non-metal (such as inorganic or organic insulating materials, etc.) materials, preferably FR4 glass fiber board, and the first reinforcement board 22 and the second reinforcement board 32 The thickness can be between 0.4-1.0 mm, and the glued layers 222, 322 coated or pasted on the surface of the first reinforcement board 22 and the second reinforcement board 32 can be double-sided adhesive paper, hot melt adhesive respectively. , epoxy resin, polyester resin, acrylic resin and other adhesive paper or pressure-sensitive adhesive, preferably double-sided adhesive paper, and the thickness of the glued layer 222, 322 depends on the first reinforcing plate 22 and the second reinforcing plate 32. The selected material can be between 0.005mm and 0.20mm, preferably 50μm.

当本实用新型于组装时,系先将完成制程加工(如内层制作、铜箔蚀刻成型电路、压合、钻孔与电镀形成金属化孔等)的双通道柔性电路板10本体冲切出特定外型及所需的长度,再将第一连接介面20的第一桥接器21与第二连接介面30的第二桥接器31分别设置于双通道柔性电路板10正面二侧处,其第一端子组212的焊接部2122及第二端子组312的焊接部3122便会分别向下垂直穿入于双通道柔性电路板10二侧处对应的导通孔18中,并使复数第一插座211与第二插座311底部分别抵靠于双通道柔性电路板10正面上形成前后间隔一距离而左右相对设置,再利用穿出双通道柔性电路板10的穿孔(Through Hole)焊接的方式形成电性连接,且可有效防止第一端子组212、第二端子组312与双通道柔性电路板10上的焊料结构受到破坏或剥离等,使整体的结构更为稳固。When the utility model is assembled, the dual-channel flexible circuit board 10 body that has completed the process (such as inner layer production, copper foil etching forming circuit, pressing, drilling and electroplating to form metallized holes, etc.) is punched out first. Specific appearance and required length, then the first bridge 21 of the first connection interface 20 and the second bridge 31 of the second connection interface 30 are respectively arranged on two sides of the front side of the dual-channel flexible circuit board 10. The soldering portion 2122 of the first terminal group 212 and the soldering portion 3122 of the second terminal group 312 will respectively vertically penetrate downwards into the corresponding via holes 18 on both sides of the dual-channel flexible circuit board 10, and make the plurality of first sockets 211 and the bottom of the second socket 311 respectively abut against the front of the dual-channel flexible circuit board 10 to form a distance between the front and rear and opposite to each other on the left and right. Sexual connection, and can effectively prevent the first terminal group 212, the second terminal group 312 and the solder structure on the dual-channel flexible circuit board 10 from being damaged or peeled off, so that the overall structure is more stable.

续将双通道柔性电路板10的导通孔18焊接部位上使用的助焊剂去除,并在双通道柔性电路板10相对于第一桥接器21与第二桥接器31的另一侧表面处进行上胶,或者是将第一加强板22与第二加强板32于胶合层222、322上贴附的离型膜撕离,且第一端子组212与第二端子组312穿出双通道柔性电路板10背面的焊接部2122、3122分别插入于对应的插孔221、321内,再将第一加强板22与第二加强板32分别下压,即可通过该胶合层222、322分别结合于双通道柔性电路板10的二端部背面上,使第一加强板22与第二加强板32的一长边贴齐于双通道柔性电路板10的一短边,而第一加强板22与第二加强板32的二短边则分别贴齐于双通道柔性电路板10的二长边,使第一加强板22与第二加强板32二短边的端部分别延伸出第一桥接器21与第二桥接器31外侧边处形成一高低段差状,且第一加强板22与第二加强板32的复数插孔221、321孔径为大于第一端子组212与第二端子组312的复数焊接部2122、3122断面尺寸,若第一加强板22与第二加强板32在本实施例中为一钢片时,其焊接部2122、3122不会与插孔221、321接触,可避免产生短路或电性连接不良,且该胶合层222、322所使用的感压胶也可渗入于插孔221、321内而具有提高接着强度的效用,使第一加强板22与第二加强板32可加强压合于双通道柔性电路板10背面上不易产生气泡,以确保其相互间的接着特性,便可完成本实用新型整体的组装。Continue to remove the flux used on the soldering part of the via hole 18 of the dual-channel flexible circuit board 10, and carry out the process on the other side surface of the dual-channel flexible circuit board 10 relative to the first bridge 21 and the second bridge 31 Glue, or tear off the release film attached to the first reinforcing plate 22 and the second reinforcing plate 32 on the glued layers 222, 322, and the first terminal group 212 and the second terminal group 312 pass through the dual-channel flexible The soldering parts 2122, 3122 on the back of the circuit board 10 are respectively inserted into the corresponding sockets 221, 321, and then the first reinforcement board 22 and the second reinforcement board 32 are pressed down respectively, and the glued layers 222, 322 can be combined respectively. On the back of the two ends of the dual-channel flexible circuit board 10, a long side of the first reinforcing plate 22 and a second reinforcing plate 32 are aligned with a short side of the dual-channel flexible circuit board 10, and the first reinforcing plate 22 The two short sides of the second reinforcement board 32 are respectively attached to the two long sides of the dual-channel flexible circuit board 10, so that the ends of the first reinforcement board 22 and the two short sides of the second reinforcement board 32 extend out of the first bridging bridge respectively. The outer side of the device 21 and the second bridge 31 forms a height difference shape, and the multiple insertion holes 221, 321 of the first reinforcing plate 22 and the second reinforcing plate 32 have a diameter larger than that of the first terminal group 212 and the second terminal group. The cross-sectional dimensions of the multiple welded parts 2122, 3122 of 312, if the first reinforcing plate 22 and the second reinforcing plate 32 are a steel sheet in this embodiment, the welded parts 2122, 3122 will not contact the sockets 221, 321, Short circuit or poor electrical connection can be avoided, and the pressure-sensitive adhesive used in the adhesive layer 222, 322 can also penetrate into the socket 221, 321 to improve the bonding strength, so that the first reinforcing plate 22 and the second The reinforcing plate 32 can be strengthened and pressed on the back of the dual-channel flexible circuit board 10 so as not to generate air bubbles, so as to ensure the bonding characteristics between them, and the overall assembly of the utility model can be completed.

如图5所示,在本实施例中的双通道柔性电路板10与上述的实施例差异的处在于第一软性基板101的第一薄膜111与第一导体121之间可不使用第一接着层112,并将第一线路层12的第一导体121可依制程的不同直接制作在第一薄膜111上以构成无胶系软性铜箔基板(2Layer FCCL),再经由蚀刻等制程成型出所需的线路,但于实际应用时,并不以此为限,上述第二软性基板102的第二薄膜131与金属导体141间设置的第三接着层133,以及第三软性基板103的第四薄膜171与第二导体161间设置的第六接着层172也可省略不使用,且金属导体141、第二导体161也可依制程的不同直接分别制作在第二薄膜131与第四薄膜171上以构成无胶系软性铜箔基板,而无胶系软性铜箔基板与有胶系软性铜箔基板主要的差异在于其第一软性基板101、第二软性基板102与第三软性基板103内部薄膜与铜箔之间不存在接着层,可避免接着层存在着内部应力及金属细线化等问题,具有耐挠折性好及尺寸安定性良好等优点,并在层数减少的情况下,可使整体结构的总厚度减少,但无胶系软性铜箔基板的制程(如涂布法、压合法、溅镀/电镀法等)成本较高,反观有胶系软性铜箔基板是将薄膜与铜箔通过接着层压合而成,并相较于无胶系软性铜箔基板具有成本较低的优势,但比较适合较厚的铜层制作,便可依双通道柔性电路板10所需的厚度、耐挠折性等特性采用不同的制作方式,故在本案以下的说明书内容中都一起进行说明,合予陈明。As shown in FIG. 5 , the difference between the dual-channel flexible circuit board 10 in this embodiment and the above-mentioned embodiments is that the first bonding layer may not be used between the first film 111 and the first conductor 121 of the first flexible substrate 101 . Layer 112, and the first conductor 121 of the first circuit layer 12 can be directly fabricated on the first film 111 according to different manufacturing processes to form an adhesive-free flexible copper foil substrate (2Layer FCCL), and then formed by etching and other processes. required circuit, but in actual application, it is not limited to this, the third bonding layer 133 provided between the second thin film 131 of the second flexible substrate 102 and the metal conductor 141, and the third flexible substrate 103 The sixth bonding layer 172 provided between the fourth film 171 and the second conductor 161 can also be omitted, and the metal conductor 141 and the second conductor 161 can also be directly fabricated on the second film 131 and the fourth conductor 161 according to different manufacturing processes. The adhesive-free flexible copper foil substrate is formed on the film 171, and the main difference between the adhesive-free flexible copper foil substrate and the adhesive-based flexible copper foil substrate lies in the first flexible substrate 101 and the second flexible substrate 102. There is no adhesive layer between the inner film and the copper foil of the third flexible substrate 103, which can avoid problems such as internal stress and metal thinning in the adhesive layer, and has the advantages of good bending resistance and good dimensional stability, and In the case of reducing the number of layers, the total thickness of the overall structure can be reduced, but the manufacturing process (such as coating method, pressing method, sputtering/plating method, etc.) Adhesive flexible copper foil substrates are formed by laminating thin films and copper foils through adhesive layers. Compared with non-adhesive flexible copper foil substrates, they have the advantage of lower cost, but are more suitable for thicker copper layers. Different manufacturing methods can be adopted according to the required thickness and flexural resistance of the dual-channel flexible circuit board 10 , so they will be explained together in the following description of this case and will be presented together.

请搭配参阅图6、图7、图8所示,分别为本实用新型另一较佳实施例于连结前的立体外观图、连结后的立体外观图及再一较佳实施例的立体外观图,由图中可清楚看出,本实用新型的加强板置于双通道柔性电路背面的桥接线可应用的系统主机40包含但不限于桌上型或个人电脑、工业电脑、伺服器、准系统等,该系统主机40包含主机板41,并在主机板41上设有并排设置的复数PCI-E(快捷外设组件互连标准,PCI Express,也可简称为PCIe)插槽411,且至少二个PCI-E插槽411内分别插接有显示卡(Graphics Card)42相对应的PCI-E传输介面421,而显示卡42表面上则设有可为图像处理器(GPU)的晶片组420,在本实施例中的显示卡42可支援SLI技术,并在各显示卡42顶缘靠近侧边位置分别设有二个前后间隔一距离的桥接端接头422,且各桥接端接头422左右二侧表面上分别具有复数金属接点4221,便可凭借显示卡42配合主机板41执行3D画面的运算和图形加速等功能。Please refer to Fig. 6, Fig. 7 and Fig. 8, which are respectively the three-dimensional appearance view of another preferred embodiment of the present invention before connection, the three-dimensional appearance view after connection and the three-dimensional appearance view of another preferred embodiment , it can be clearly seen from the figure that the reinforcing plate of the present invention is placed on the bridging line on the back of the dual-channel flexible circuit. etc., the system host 40 includes a motherboard 41, and is provided with a plurality of PCI-E (Express Peripheral Component Interconnect Standard, PCI Express, also referred to as PCIe) slots 411 arranged side by side on the motherboard 41, and at least The PCI-E transmission interface 421 corresponding to the graphics card (Graphics Card) 42 is respectively plugged into the two PCI-E slots 411, and the graphics card 42 surface is provided with a chipset that can be a graphics processor (GPU). 420, the display card 42 in this embodiment can support SLI technology, and two bridging end connectors 422 are respectively provided at the top edge of each display card 42 near the side, and each bridging end connector 422 is left and right. There are a plurality of metal contacts 4221 on the surfaces of the two sides, so that the display card 42 cooperates with the motherboard 41 to perform functions such as 3D image calculation and graphics acceleration.

当本实用新型的加强板置于双通道柔性电路背面的桥接线欲将主机板41上的二个显示卡42连结时,系先将图1中的双通道柔性电路板10翻面以一百八十度相反的方向表示,并使第一连接介面20对应于显示卡42,便可将第一桥接器21分别向下对接于第一个显示卡42上对应的桥接端接头422,并利用第一加强板22增加双通道柔性电路板10对应于第一桥接器21位置端部上的结构强度,让使用者不易因拉拔或下压过度弯折造成其线路断裂或第一桥接器21焊接结构上的破坏,使桥接端接头422可顺利插入于第一插座211的插接槽2111内,且第一端子组212相对的对接部2121抵持接触于桥接端接头422上对应的复数金属接点4221形成确实的电性连接,同理可将第二桥接器31的第二插座311依照上述的方式分别对接于第二个显示卡42的桥接端接头422,并利用第二加强板32增加双通道柔性电路板10对应于第二桥接器31位置另一端部上的结构强度,让使用者也可避免因拉拔或下压过度弯折造成其线路断裂或第二桥接器31焊接结构上的破坏,以确保高频信号传输时的稳定性与效果,且待第二端子组312的对接部2121抵持接触于桥接端接头422上对应的复数金属接点4221形成电性连接后,便可凭借双通道柔性电路板10二侧处所分别带有二个第一桥接器21、第二桥接器31的第一连接介面20与第二连接介面30对接于二个显示卡42的四个桥接端接头422,从而实现连结二个显示卡42形成双通道的桥接状态,使系统主机40能运用二个显示卡42上的晶片组420进行平行计算,进而提升双显卡系统更快的运算处理和图形显示的效能。When the reinforcing plate of the present utility model is placed on the bridge line on the back of the dual-channel flexible circuit to connect the two display cards 42 on the mainboard 41, the dual-channel flexible circuit board 10 in Fig. The eighty-degree opposite direction indicates that the first connection interface 20 corresponds to the display card 42, and the first bridges 21 can be respectively downwardly connected to the corresponding bridging end connectors 422 on the first display card 42, and use The first reinforcing plate 22 increases the structural strength of the end of the dual-channel flexible circuit board 10 corresponding to the position of the first bridge 21, so that the user is not easy to break the circuit or the first bridge 21 due to excessive bending by pulling or pressing down. The destruction of the welding structure allows the bridging end connector 422 to be inserted into the insertion groove 2111 of the first socket 211 smoothly, and the opposite butt joint portion 2121 of the first terminal group 212 is in contact with the corresponding plurality of metals on the bridging end connector 422 The contact 4221 forms a definite electrical connection. Similarly, the second socket 311 of the second bridge 31 can be connected to the bridging end connector 422 of the second display card 42 in the above-mentioned manner, and the second reinforcing plate 32 can be used to increase the The structural strength of the other end of the dual-channel flexible circuit board 10 corresponding to the position of the second bridge 31 allows the user to avoid circuit breakage or welding of the second bridge 31 due to excessive bending caused by pulling or pressing down. to ensure the stability and effect of high-frequency signal transmission, and after the butt joint portion 2121 of the second terminal group 312 is in contact with the corresponding plurality of metal contacts 4221 on the bridging terminal joint 422 to form an electrical connection, it can be The first connection interface 20 and the second connection interface 30 with two first bridges 21 and second bridges 31 on both sides of the dual-channel flexible circuit board 10 are connected to the four bridge ends of the two display cards 42 Connector 422, so as to realize connecting two display cards 42 to form a dual-channel bridging state, so that the system host 40 can use the chip set 420 on the two display cards 42 to perform parallel calculations, thereby improving the faster calculation processing and graphics of the dual-graphics system performance shown.

在本实施例中,当双通道柔性电路板10利用第一连接介面20与第二连接介面30共四个二对的第一桥接器21、第二桥接器31连结二个显示卡42形成任意桥接状态时,可由第一线路层12与第二线路层16提供双通道的高频信号传输,并以第一线路层12与第二线路层16间的接地层14作为高频信号传输共同的参考平面,使第一线路层12、第二线路层16与接地层14阻抗相匹配,以符合特性阻抗为50欧姆(Ω)的要求,且可降低高频信号反射与传输过程中产生集肤效应的功率损耗,同时凭借接地层14使第一线路层12与第二线路层16形成屏蔽与隔绝的效果,使其线路层与参考平面的距离接近而可降低高频信号传输时相应产生的电磁波及串音等干扰,此种双通道柔性电路板10多层结构设计,相较于传统单通道软板桥接线的工作频宽只有400MHz或传统双通道硬板桥接器的工作频宽只有680MHz无法满足工作频宽增加的需求,并随着信号传输通道与工作频宽的增加仍存在有厚度变厚及可挠折性不足等问题,本实用新型的双通道柔性电路板10不但可满足工作频宽增加至1360MHz的需求,并具有总厚度介于0.2~0.6mm之间达到薄型化及更高的耐挠折性等特性,对于高频信号传输上的完整性,仍可符合特性阻抗为50欧姆(Ω)的测试要求,进而达到稳定的双通道高频信号传输及可提升传输效率的效果。In this embodiment, when the dual-channel flexible circuit board 10 utilizes four pairs of first bridges 21 and second bridges 31 of the first connection interface 20 and the second connection interface 30 to connect two display cards 42 to form any In the bridging state, the first line layer 12 and the second line layer 16 can provide dual-channel high-frequency signal transmission, and the ground layer 14 between the first line layer 12 and the second line layer 16 is used as the common ground for high-frequency signal transmission. Reference plane, match the impedance of the first circuit layer 12, the second circuit layer 16 and the ground layer 14 to meet the requirement that the characteristic impedance is 50 ohms (Ω), and reduce the skin generated during the reflection and transmission of high-frequency signals At the same time, the ground layer 14 makes the first line layer 12 and the second line layer 16 form a shielding and isolation effect, so that the distance between the line layer and the reference plane is close to reduce the corresponding generation of high-frequency signal transmission. Electromagnetic waves and crosstalk interference, this dual-channel flexible circuit board 10-layer structure design, compared with the traditional single-channel flexible board bridge wiring, the working bandwidth is only 400MHz or the traditional dual-channel hard board bridge is only 680MHz cannot meet the demand for increased working bandwidth, and with the increase of signal transmission channels and working bandwidth, there are still problems such as thickening and insufficient flexibility. The dual-channel flexible circuit board 10 of the present invention can not only meet The working bandwidth needs to be increased to 1360MHz, and the total thickness is between 0.2-0.6mm to achieve thinner profile and higher flex resistance. For the integrity of high-frequency signal transmission, it can still meet the characteristic impedance The test requirement is 50 ohms (Ω), so as to achieve stable dual-channel high-frequency signal transmission and the effect of improving transmission efficiency.

此外,本实用新型所使用的双通道柔性电路板10具有质轻、更高的耐挠折性及薄型化特性,并可依实际需求将双通道柔性电路板10弯折形成向上拱起、下垂或折迭形成一锐角设置,且多次挠折不会出现有如双通道硬板桥接器结构破坏或断裂等现象,便可将第一连接介面20与第二连接介面30共四个二对的第一桥接器21、第二桥接器31连结所有不同间距的二个显示卡42,以适用于各家厂商制造不同规格的主机板41或显示卡42不同的设计方案,也不会受到不同的桥接距离或插拔空间的限制,以符合使用者自行升级、扩充的使用需求。In addition, the dual-channel flexible circuit board 10 used in the present invention has light weight, higher flex resistance and thinner characteristics, and the dual-channel flexible circuit board 10 can be bent to form upward arching and drooping according to actual needs. Or fold to form an acute angle setting, and multiple flexing will not cause damage or breakage of the structure of the double-channel hard board bridge, etc., so that the first connection interface 20 and the second connection interface 30 can be divided into four pairs The first bridge 21 and the second bridge 31 connect all the two display cards 42 with different spacings, so as to be applicable to the different design schemes of motherboards 41 or display cards 42 of different specifications manufactured by various manufacturers, and will not be subject to different designs. The bridging distance or plug-in space is limited to meet the user's self-upgrading and expansion needs.

当使用者欲将第一连接介面20与第二连接介面30的第一桥接器21、第二桥接器31拔起时,可利用第一加强板22与第二加强板32的二端部分别延伸出第一桥接器21与第二桥接器31形成一高低段差状,让使用者的手指可稳定的勾住第一加强板22或第二加强板32端部而不易松动或滑脱,并向上拉起连带将第一桥接器21或第二桥接器31脱离于显示卡42的桥接端接头422处,即可方便使用者进行插拔的动作,以改善插拔使用上的不便性,并将本实用新型的桥接线重复使用,如此可提高整体使用的机能与效果。When the user wants to pull out the first bridge 21 and the second bridge 31 of the first connection interface 20 and the second connection interface 30, the two ends of the first reinforcement plate 22 and the second reinforcement plate 32 can be used to Extending the first bridge 21 and the second bridge 31 form a height difference shape, so that the user's fingers can stably hook the end of the first reinforcement plate 22 or the second reinforcement plate 32 without loosening or slipping, and upward Pull up the joint to disengage the first bridge 21 or the second bridge 31 from the bridge end joint 422 of the display card 42, so that the user can perform plugging and unplugging operations conveniently, so as to improve the inconvenience of plugging and unplugging. The bridging wire of the utility model is reused, so that the function and effect of the overall use can be improved.

如图8所示,在本实施例中的系统主机40与上述的实施例差异的处在于其显示卡42更包含散热装置43,并在散热装置43具有抵贴于晶片组420表面上的散热模块(如散热座或散热器的复数散热片等),且散热模块上装设有风扇,而散热模块上也可进一步穿设有复数热导管,便可将风扇的电源线连接于显示卡42提供其电力,使风扇进行运转以搭配散热模块来辅助晶片组420快速散热。As shown in FIG. 8 , the difference between the system mainframe 40 in this embodiment and the above-mentioned embodiments is that its display card 42 further includes a heat dissipation device 43, and the heat dissipation device 43 has a heat dissipation device that is attached to the surface of the chipset 420. module (such as multiple heat sinks of heat sink or heat sink, etc.), and a fan is installed on the heat dissipation module, and a plurality of heat pipes can be further pierced on the heat dissipation module, so that the power cord of the fan can be connected to the display card 42 to provide The electric power enables the fan to run to cooperate with the heat dissipation module to assist the chipset 420 to dissipate heat quickly.

由于双显卡系统的显示卡42为了达到快速散热的目的,一般都会在显示卡42上加装散热装置43,所以显示卡42宽度方向的尺寸便会增加,并使任意二个相邻的PCI-E插槽411内将无法分别插接显示卡42,便需要在二个显示卡42之间空出二个PCI-E插槽411而形成跨越四个PCI-E插槽411的架构,再将双通道柔性电路板10可利用第一连接介面20与第二连接介面30共四个二对的第一桥接器21、第二桥接器31连结在二个显示卡42之间,不但可适用于不同规格的主机板41与显示卡42,并可免除因二个显示卡42的间距不同而必须安装不同规格的双通道硬板桥接器所造成使用成本提高,以及不用时收纳不便的困扰,更具实用性与适用性的效果。Because the display card 42 of the dual-graphics card system generally can install a cooling device 43 on the display card 42 in order to achieve the purpose of rapid heat dissipation, so the size of the display card 42 in the width direction will increase, and make any two adjacent PCI- In the E slot 411, the display cards 42 cannot be inserted respectively, so two PCI-E slots 411 need to be vacated between the two display cards 42 to form a structure spanning four PCI-E slots 411, and then the The dual-channel flexible circuit board 10 can be connected between two display cards 42 by using four pairs of first bridges 21 and second bridges 31 in total between the first connection interface 20 and the second connection interface 30. The main board 41 and the display card 42 of different specifications can avoid the trouble of increasing the cost of use and inconvenient storage when not in use due to the difference in the distance between the two display cards 42 and the need to install a dual-channel hard board bridge of different specifications. More practical and applicable effects.

是以,本实用新型主要针对双通道柔性电路板10正面二侧处为电性连接有第一连接介面20与第二连接介面30,并在第一连接介面20包含具有第一插座211与第一端子组212的第一桥接器21及第一加强板22,第二连接介面30包含具有第二插座311与第二端子组312的第二桥接器31及第二加强板32,便可将第一加强板22与第二加强板32以压合方式分别结合于双通道柔性电路板10二端部的背面上增加其结构强度,让使用者将第一桥接器21与第二桥接器31分别对接于二个显示卡42的桥接端接头422上,不易因拉拔或下压过度弯折造成其线路断裂或桥接器焊接结构上的破坏,即可方便进行插拔的动作,以满足使用者插拔使用上的便利性。Therefore, the utility model is mainly aimed at the two sides of the front of the dual-channel flexible circuit board 10 being electrically connected with the first connection interface 20 and the second connection interface 30, and the first connection interface 20 includes a first socket 211 and a second connection interface. The first bridge 21 and the first reinforcing plate 22 of a terminal group 212, the second connection interface 30 includes the second bridge 31 and the second reinforcing plate 32 with the second socket 311 and the second terminal group 312, so that the The first reinforcing plate 22 and the second reinforcing plate 32 are respectively combined on the back of the two ends of the dual-channel flexible circuit board 10 in a press-fitting manner to increase its structural strength, allowing the user to connect the first bridge 21 and the second bridge 31 They are respectively connected to the bridging end connectors 422 of the two display cards 42, so that the circuit breakage or the damage to the welding structure of the bridge is not easy to be caused by excessive bending due to pulling or pressing down, so that the plugging and unplugging actions can be easily performed to meet the needs of users. Or the convenience of plugging and unplugging.

以上说明对本实用新型而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离权利要求所限定的精神和范围的情况下,可作出许多修改、变化或等效,但都将落入本实用新型的保护范围之内。The above description is only illustrative, rather than restrictive, of the present utility model. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined in the claims. But all will fall within the protection scope of the present utility model.

Claims (6)

1. a kind of reinforcing plate is placed in the bridging line at the binary channels flexible circuit back side, it is characterised in that:Include binary channels flexible electrical Road plate and it is relatively arranged on the first connecting interface being electrically connected at positive two sides of binary channels flexible PCB and the second company Interface is connect, wherein:
The binary channels flexible PCB is sequentially comprising the first insulating layer, first line layer, the second insulating layer, ground plane, the 3rd exhausted Edge layer, the second line layer and the 4th insulating layer;
First connecting interface includes at least two the first bridges with the first socket and first adding with plural number jack Strong plate, and inserting groove is all equipped with the plural docking section at first end subgroup side inside the first socket, and each docking section is set Have and be pierced by the weld part that the first socket back portion is electrically connected with first line layer, ground plane, the second line layer respectively, and the One reinforcing plate is incorporated on the one end back side of binary channels flexible PCB, and first end subgroup is pierced by binary channels flexible PCB The weld part at the back side is inserted into corresponding jack respectively;
Second connecting interface includes at least two the second bridges with the second socket and second adding with plural number jack Strong plate, and inserting groove is all equipped with the plural docking section at second end subgroup side, and each butted part inside the second socket It She You not be pierced by the weld part that the second socket bottom and first line layer, ground plane, the second line layer are electrically connected, and the Two reinforcing plates are incorporated on the back side of binary channels flexible PCB the other end, and second end subgroup is pierced by binary channels flexible PCB The weld part at the back side is inserted into corresponding jack respectively.
2. reinforcing plate according to claim 1 is placed in the bridging line at the binary channels flexible circuit back side, it is characterised in that:This The jack aperture of one reinforcing plate and the second reinforcing plate is respectively greater than the weld part of first end subgroup, the weld part of second end subgroup breaks Face size, so that weld part will not be with the jack contact of the first reinforcing plate, the second reinforcing plate.
3. reinforcing plate according to claim 1 is placed in the bridging line at the binary channels flexible circuit back side, it is characterised in that:This One reinforcing plate and the second reinforcing plate are rectangular, and are pasted by a long side of first reinforcing plate and the second reinforcing plate together in binary channels One short side of flexible PCB, and two short sides of first reinforcing plate and the second reinforcing plate then paste together in binary channels flexible electrical respectively Two long sides of road plate, and the first reinforcing plate and the end of two short sides of the second reinforcing plate each extend over out the first bridge and second A height segment difference shape is formed at bridge outer side edges.
4. reinforcing plate according to claim 1 is placed in the bridging line at the binary channels flexible circuit back side, it is characterised in that:This One reinforcing plate and the second reinforcing plate are respectively the glass mat of flame resistant material grade FR4, steel disc, polypropylene, poly- terephthaldehyde Made by sour glycol ester or ceramic material, and the thickness of the first reinforcing plate and the second reinforcing plate is between 0.4~1.0mm.
5. reinforcing plate according to claim 1 is placed in the bridging line at the binary channels flexible circuit back side, it is characterised in that:This One reinforcing plate, one side surface is equipped with cementing layer, and is incorporated into binary channels flexible PCB by the cementing layer by the first reinforcing plate The one end back side on, and one side surface of the second reinforcing plate is equipped with another cementing layer, and the second reinforcing plate passes through another glue Layer is closed to be incorporated on the back side of binary channels flexible PCB the other end.
6. reinforcing plate according to claim 5 is placed in the bridging line at the binary channels flexible circuit back side, it is characterised in that:The glue Conjunction layer is Double-face gummed paper, hot melt adhesive, epoxy resin, polyester resin or acryl resin, and the thickness of cementing layer between 0.005~ Between 0.20mm.
CN201721156435.0U 2017-09-08 2017-09-08 Stiffener placed on bridge wires on back of dual channel flex circuit Expired - Fee Related CN207321631U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721156435.0U CN207321631U (en) 2017-09-08 2017-09-08 Stiffener placed on bridge wires on back of dual channel flex circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721156435.0U CN207321631U (en) 2017-09-08 2017-09-08 Stiffener placed on bridge wires on back of dual channel flex circuit

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CN207321631U true CN207321631U (en) 2018-05-04

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