[go: up one dir, main page]

TWM531055U - 具有３５個容置區的排列組態之晶圓載具 - Google Patents

具有３５個容置區的排列組態之晶圓載具 Download PDF

Info

Publication number
TWM531055U
TWM531055U TW105205256U TW105205256U TWM531055U TW M531055 U TWM531055 U TW M531055U TW 105205256 U TW105205256 U TW 105205256U TW 105205256 U TW105205256 U TW 105205256U TW M531055 U TWM531055 U TW M531055U
Authority
TW
Taiwan
Prior art keywords
wafer carrier
accommodating
wafer
top surface
circles
Prior art date
Application number
TW105205256U
Other languages
English (en)
Inventor
亞歷山大 古拉瑞
曼達 戴許潘德
阿尼魯 巴雷
由里 拉什科夫斯基
Original Assignee
維克儀器公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 維克儀器公司 filed Critical 維克儀器公司
Publication of TWM531055U publication Critical patent/TWM531055U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

具有35個容置區的排列組態之晶圓載具
本創作係關於半導體製造技術，並且尤其是關於化學氣相沉積(CVD)製程及相關設備，用於在製程期間保持半導體晶圓。
在發光二極體(LED)和諸如鐳射二極體、光探測器和場效應電晶體的其它高性能器件的製造中，典型地使用化學氣相沉積(CVD)製程在藍寶石或矽基板之上使用諸如氮化鎵的材料生長薄膜堆疊結構。CVD工具包括一處理艙體，該處理艙體是密封環境以允許注入的氣體在基板(通常為晶圓的形式)上反應以生長薄膜層。這種製造設備的現行生產線的實例是由Plainview，New York的Veeco Instruments Inc.製造的TurboDisc®和MOCVD系統的EPIK系列。
控制諸如溫度、壓強和氣體流速的一些製程參數以獲得所希望的晶體生長。使用不同的材料和製程參數來生長不同層。例如，典型地，由諸如III-V族半導體的化合物半導體形成的器件是藉由使用金屬有機化學氣相沉積(MOCVD)生長連續的該化合物半導體層而形成的。在此製程中，晶圓被暴露於氣體的組合中，典型地，該氣體包括作為III族金屬的源的金屬有機化合物，並且更包括當晶圓保持在升高的溫度下時在晶圓表面上流動的V族元素的源。通常，金屬有機化合物和V族源與明顯不參與反應的載氣組合，該載氣例如是氮氣。III-V族半導體的一個實例是氮化鎵，可以在晶圓具有適當晶格間隙的基板(例如藍寶石晶圓)上 藉由有機鎵化合物和氨氣的反應來形成氮化鎵。在沉積氮化鎵和相關化合物期間一般將該晶圓保持在大約1000-1100℃的溫度下。
在藉由基板表面上的化學反應而發生晶體生長的MOCVD製程中，必須特別小心地控制製程參數以確保在所要求的條件下進行該化學反應。在製程條件中即使小的變化也可能不利地影響器件品質和生產良率。例如，如果沉積氮化鎵銦層(gallium and indium nitride layer)，晶圓表面溫度的變化將會引起沉積層的成分和帶隙的變化。因為銦具有相對高的蒸氣壓，在表面溫度較高的晶圓區域中該沉積層將會具有較低的銦比例和較大的帶隙。如果該沉積層為主動、LED結構的發光層，那麼由該晶圓形成的LED的輻射波長也將會變至不可接受的程度。
在MOCVD處理艙體中，在其上生長薄膜層的半導體晶圓設置於被稱作晶圓載具的快速旋轉的旋轉料架(carousel)上，以在反應艙體之內使它們的表面均勻暴露於氣體環境中，以沉積半導體材料。轉速是大約1000RPM。該晶圓載具典型地是由諸如石墨的高導熱材料機械加工出來的，並且經常塗覆有諸如碳化矽材料的保護層。每個晶圓載具具有一組圓形凹部(indentation)，或容置區(pocket)，在其頂表面中放置有單個的晶圓。典型地，晶圓被支撐為與每個容置區的底部表面成間隔關係以允許在該晶圓的邊緣周圍流動氣體。在U.S.專利申請公開No.2012/0040097、U.S.專利No.8092599、U.S.專利No.8021487、U.S.專利申請公開No.2007/0186853、U.S.專利No.6902623、U.S.專利No.6506252和U.S.專利No.6492625中描述了有關技術的一些實例，藉由引用將其公開內容合併於此。
晶圓載具被支撐於反應艙體中的轉軸(spindle)上，使得具有晶圓的暴露表面的晶圓載具的頂表面向上朝向氣體分配 裝置。當該轉軸旋轉時，該氣體被向下引導到該晶圓載具的頂表面上並且經過該頂表面流向該晶圓載具的外周。使用過的氣體透過設置在該晶圓載具下方的通口從反應艙體中排出。藉由加熱元件將該晶圓載具保持在期望的升高溫度，該加熱元件典型地是設置在該晶圓載具的底表面之下的電阻加熱元件。將這些加熱元件保持在比該晶圓表面的期望溫度還要高的溫度，然而典型地將該氣體分配裝置保持在遠低於期望反應溫度的溫度，以防止氣體過早反應。因而，熱量從該加熱元件向該晶圓載具的底表面傳輸並向上通過晶圓載具流向單個晶圓。
在晶圓之上的氣流依賴於每個晶圓的徑向位置而變化，其中位於最外側的晶圓會具有較高流動率，此乃他們在轉動過程中較快的速度所導致。甚至在每個單個晶圓上都可能存在溫度非均勻性，即冷點和熱點。影響溫度非均勻性的形成的一個可變因素是晶圓載具內的容置區的形狀。通常，容置區形狀在該晶圓載具的表面中形成圓形。由於晶圓載具旋轉，因而該晶圓在其最外面的邊緣(即離旋轉軸最遠的邊緣)處受到實質性的向心力，導致晶圓擠靠該晶圓載具中各個容置區的內壁。在這種情況下，在晶圓的這些外部邊緣和容置區的邊緣之間存在緊密接觸。向晶圓的這些最外面部分的增加的熱傳導導致更大的溫度非均勻性，進一步使上述的問題惡化。既有的處理方式為藉由增加晶圓的邊緣和容置區的內壁之間的間隙來最小化溫度非均勻性，包括將晶圓設計為邊緣的一部分上是平的(即平邊晶圓)。晶圓的此平坦部分產生間隙並減小與該容置區的內壁的接觸點，由此緩和溫度非均勻性。其他影響晶圓載具所支撐晶圓各處的熱均勻性的因素包括晶圓載具的熱傳輸和發射特性，並結合晶圓容置區的佈局。
與溫度均勻性需求相關的，對於晶圓載具的另一個 所希望的特性是增加CVD製程的生產量。在增加製程生產量中該晶圓載具的角色是保持大量的單個晶圓。提供具有更多晶圓的晶圓載具佈局影響熱模型。例如，由於來自晶圓載具邊緣的輻射熱損耗，靠近邊緣的晶圓載具的部分傾向處在比其他部分更低的溫度下。
因此，需要在其中解決高密度佈局中的溫度均勻性和機械應力的用於晶圓載具的實用解決方案。
本創作提出一種晶圓載具，其包括新的容置區配置。本文所描述的配置係有助於熱傳輸，以及有助於達成圓晶圓生長之容置區的高填充密度(high packing density)。依據本創作之一實施例，提出一種包括布置於頂表面之35個容置區的晶圓載具，其係用於化學氣相沉積裝置中，該晶圓載具包括：本體，該本體具有彼此相對布置的頂表面和底表面；以及複數個容置區，該複數個容置區限定在該晶圓載具的該頂表面中；其中該複數個容置區係由總共三十五個的容置區組成，每個容置區係沿著三個圓中的一個圓而布置，其中該三個圓係彼此同心並且係與由該頂表面的周邊所形成的圓形輪廓同心。又，依據本創作之另一實施例，該複數個容置區中的五個容置區係環繞該三個圓中的第一個圓而布置；該複數個容置區中的十二個容置區係環繞該三個圓中的第二個圓而布置；以及該複數個容置區中的十八個容置區係環繞該三個圓中的第三個圓而布置。另外，依據本創作之其他實施例，該第一個圓被該第二個圓圍繞，並且該第二個圓被該第三個圓圍繞。
142‧‧‧晶圓載具
146‧‧‧本體
148‧‧‧頂表面
152‧‧‧底表面
162、162A、162B‧‧‧容置區
164‧‧‧鎖定特徵部
166‧‧‧側壁
168‧‧‧基板
170‧‧‧孔隙空間
R1、R2、R3‧‧‧圓
在連同圖式考慮下列本創作各種實施例的詳細描述 後，可以更完整地理解本創作，其中：圖1是根據一實施例的具有35個容置區配置的晶圓載具的立體圖。
圖2是根據一實施例的具有35個容置區配置的晶圓載具的俯視圖。
圖3是根據一實施例的具有35個容置區配置的晶圓載具的側視圖。
圖4是根據一實施例的具有35個容置區配置的晶圓載具的仰視圖。
圖5是根據一實施例的具有35個容置區配置的晶圓載具的部分細節圖，其顯示來自立體圖的單個容置區。
圖1是根據一實施例的晶圓載具142的立體圖，該晶圓載具142係用於化學氣相沉積裝置中。圖2是同一晶圓載具142的俯視圖。晶圓載具142包括：具有頂表面148的本體146，和限定於其中的三十五個容置區162。在圖1和圖2所示的實施例中，容置區162布置在三個圓R1、R2和R3中，每個圓與由本體146的外邊緣限定的圓是同心的。在徑向內圓R1中，五個容置區162在方位上均勻地間隔開。同樣地，在徑向中圓R2中，十二個容置區162在方位上均勻地間隔開。在徑向外圓R3中，十八個容置區162在方位上均勻地間隔開。每個容置區162是形成在本體146中的孔口，該孔口實質上延伸垂直於頂表面148所配置的平面。
在圖1和圖2中描繪的容置區的布置的優點在於：在頂表面148上保持相對高密度的容置區162的同時，其提供了期望水準的熱均勻性。而容置區162的尺寸可容納於此頂表面148的區域中。
如圖1和圖2所示，在各個圓R1、R2與R3中，容置區162相互交疊並且因而生長在每個容置區162中的晶圓與生長在相鄰的容置區162中的晶圓連接。當完全地生長時，生長在容置區162中的所有晶圓與生長在相同圓中的任何容置區162中的每個其它晶圓機械互連。
圖3為一側視圖，其為圖1和圖2的晶圓載具142的側視圖。在圖3所示的視圖中，可以看出頂表面148和底表面152之間的尺寸上的相對差異。尤其是，頂表面更如圖3中顯示，往頁面頂部及底部延伸，或者在圖1和圖2中顯示的圖中進一步向徑向延伸。先前在圖1和圖2中描繪的每個容置區162都從頂表面148朝向底表面152延伸。底表面152提供固態基底，在該固態基底上可以將晶圓生長在晶圓載具142中。
圖4是先前關於圖1至圖3所描述的晶圓載具142的仰視圖。如圖4中所示，晶圓載具142包括在底表面152的中心的鎖定特徵部164。
圖5為顯示其中一個容置區162的局部立體圖。每個容置區162包括側壁166，除了孔隙空間170之外，其基本上是圓柱形的，其中容置區162與同一圓中的相鄰的容置區162A和162B交疊。由側壁166形成的圓柱的底部是基板168。
這些實施例是用作示例的目的而非限制。附加的實施例為在申請專利範圍內。另外，儘管已參考具體實施例來描述本創作的多個方面，但是所屬領域的技術人員將會認識到可以在不脫離由申請專利範圍所限定的本創作的範圍的情況下對形式和細節上作出改變。
142‧‧‧晶圓載具
148‧‧‧頂表面
162‧‧‧容置區
R1、R2、R3‧‧‧圓

Claims (3)

  1. 一種晶圓載具，其係用於化學氣相沉積裝置中，該晶圓載具包括：本體，該本體具有彼此相對布置的頂表面和底表面；以及複數個容置區，該複數個容置區限定在該晶圓載具的該頂表面中；其中該複數個容置區係由總共三十五個的容置區組成，每個容置區係沿著三個圓中的一個圓而布置，其中該三個圓係彼此同心並且係與由該頂表面的周邊所形成的圓形輪廓同心。
  2. 如請求項1所述之晶圓載具，其中：該複數個容置區中的五個容置區係環繞該三個圓中的第一個圓而布置；該複數個容置區中的十二個容置區係環繞該三個圓中的第二個圓而布置；以及該複數個容置區中的十八個容置區係環繞該三個圓中的第三個圓而布置。
  3. 如請求項2所述之晶圓載具，其中該第一個圓被該第二個圓圍繞，並且該第二個圓被該第三個圓圍繞。
TW105205256U 2015-04-16 2015-10-16 具有３５個容置區的排列組態之晶圓載具 TWM531055U (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/524,104 USD778247S1 (en) 2015-04-16 2015-04-16 Wafer carrier with a multi-pocket configuration

Publications (1)

Publication Number Publication Date
TWM531055U true TWM531055U (zh) 2016-10-21

Family

ID=55358780

Family Applications (6)

Application Number Title Priority Date Filing Date
TW105205254U TWM531054U (zh) 2015-04-16 2015-10-16 具有３６個容置區的排列組態之晶圓載具
TW104305767F TWD181305S (zh) 2015-04-16 2015-10-16 晶圓載具
TW104305766F TWD181304S (zh) 2015-04-16 2015-10-16 晶圓載具
TW105205256U TWM531055U (zh) 2015-04-16 2015-10-16 具有３５個容置區的排列組態之晶圓載具
TW104305768F TWD181306S (zh) 2015-04-16 2015-10-16 晶圓載具
TW105205257U TWM531049U (zh) 2015-04-16 2015-10-16 具有３４個容置區的排列組態之晶圓載具

Family Applications Before (3)

Application Number Title Priority Date Filing Date
TW105205254U TWM531054U (zh) 2015-04-16 2015-10-16 具有３６個容置區的排列組態之晶圓載具
TW104305767F TWD181305S (zh) 2015-04-16 2015-10-16 晶圓載具
TW104305766F TWD181304S (zh) 2015-04-16 2015-10-16 晶圓載具

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW104305768F TWD181306S (zh) 2015-04-16 2015-10-16 晶圓載具
TW105205257U TWM531049U (zh) 2015-04-16 2015-10-16 具有３４個容置區的排列組態之晶圓載具

Country Status (4)

Country Link
US (2) USD778247S1 (zh)
KR (1) KR20160003714U (zh)
DE (1) DE202015007242U1 (zh)
TW (6) TWM531054U (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD893682S1 (en) 2018-05-31 2020-08-18 Smith Industries Inc. Floor drain grate
USD1002915S1 (en) * 2022-05-18 2023-10-24 Chen Wu Lens

Family Cites Families (265)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1448769A (en) * 1922-02-10 1923-03-20 American Foundry & Mfg Company Floor drain
DE1427772A1 (de) 1965-11-23 1968-12-12 Telefunken Patent Verfahren zum Zerlegen einer Halbleiterscheibe in einzelne Halbleiterplaettchen
US3409138A (en) * 1967-09-15 1968-11-05 Lawrence Robert Eaves-box strainer
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3783822A (en) * 1972-05-10 1974-01-08 J Wollam Apparatus for use in deposition of films from a vapor phase
US3845738A (en) * 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
IL56224A (en) 1978-01-16 1982-08-31 Veeco Instr Inc Substrate clamp for use in semiconductor fabrication
USD265069S (en) * 1979-07-16 1982-06-22 Corning Glass Works Tray for flower pots or the like
USD280803S (en) * 1982-09-20 1985-10-01 Peterson Robert T Dial face for electronic timepiece
USD296029S (en) * 1985-08-27 1988-05-31 Mag-Nif Incorporated Coin bank
USD302204S (en) * 1986-11-05 1989-07-11 Gatton James W Portable outdoor fireplace
USD310874S (en) * 1988-09-14 1990-09-25 Utley Jr James E Solar powered roof vent fan
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
USD325934S (en) * 1990-04-20 1992-05-05 Vinko Ramljak Holder for crayons, markers, pencils and the like
USD344788S (en) * 1991-03-22 1994-03-01 Castro Marco G Combined ventilated toilet seat and cover
US5152842A (en) 1991-12-05 1992-10-06 Rohm Co., Ltd. Reactor for epitaxial growth
USD365541S (en) * 1993-05-25 1995-12-26 Hirsch Jeffrey G Terracotta pot insert
JP2849533B2 (ja) * 1993-08-18 1999-01-20 長野電子工業株式会社 ウェーハの研磨方法
JP2716653B2 (ja) * 1993-11-01 1998-02-18 不二越機械工業株式会社 ウェーハの研磨装置および研磨方法
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
JPH0878347A (ja) * 1994-09-06 1996-03-22 Komatsu Electron Metals Co Ltd エピタキシャル成長装置のサセプタ
US5674107A (en) * 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
USD388123S (en) * 1995-04-28 1997-12-23 Copal Company Limited Light-emitting diode indicator
JPH0936049A (ja) * 1995-07-21 1997-02-07 Mitsubishi Electric Corp 気相成長装置およびこれによって製造された化合物半導体装置
USD398997S (en) * 1995-11-22 1998-09-29 Strix Limited Base part for a liquid heating vessel
JPH09201765A (ja) 1996-01-25 1997-08-05 Shin Etsu Handotai Co Ltd バッキングパッドおよび半導体ウエーハの研磨方法
USD383377S (en) * 1996-05-03 1997-09-09 Sellers Kathleen R Cushioned furniture protector
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
USD410408S (en) * 1998-05-18 1999-06-01 Green Richard D Flower vase
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
USD428133S (en) * 1999-12-14 2000-07-11 Shu-Chin Chen Ceiling fan motor housing
US6331136B1 (en) 2000-01-25 2001-12-18 Koninklijke Philips Electronics N.V. (Kpenv) CMP pad conditioner arrangement and method therefor
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
DE10023002B4 (de) * 2000-05-11 2006-10-26 Siltronic Ag Satz von Läuferscheiben sowie dessen Verwendung
US6454635B1 (en) 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6492625B1 (en) * 2000-09-27 2002-12-10 Emcore Corporation Apparatus and method for controlling temperature uniformity of substrates
US7204887B2 (en) 2000-10-16 2007-04-17 Nippon Steel Corporation Wafer holding, wafer support member, wafer boat and heat treatment furnace
USD466597S1 (en) * 2000-11-10 2002-12-03 Bricmont, Inc. Roller hearth reheat furnace tire
US6500059B2 (en) 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US6528124B1 (en) * 2000-12-01 2003-03-04 Komag, Inc. Disk carrier
US6506252B2 (en) 2001-02-07 2003-01-14 Emcore Corporation Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6645049B2 (en) * 2001-04-23 2003-11-11 Phuong Van Nguyen Polishing holder for silicon wafers and method of use thereof
US6902623B2 (en) * 2001-06-07 2005-06-07 Veeco Instruments Inc. Reactor having a movable shutter
USD464420S1 (en) * 2002-01-03 2002-10-15 Rochelle Tolar Portable battery-powered neck fan
KR20040094390A (ko) 2002-04-11 2004-11-09 세키스이가가쿠 고교가부시키가이샤 반도체 칩의 제조 방법
US6710611B2 (en) 2002-04-19 2004-03-23 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
US7015418B2 (en) 2002-05-17 2006-03-21 Gsi Group Corporation Method and system for calibrating a laser processing system and laser marking system utilizing same
USD475023S1 (en) * 2002-06-06 2003-05-27 Caterpillar Inc Piezoelectric actuator device
US7044083B2 (en) 2002-06-12 2006-05-16 United Pet Group, Inc. Pet enclosure
USD490511S1 (en) * 2002-06-29 2004-05-25 Hunter Fan Company Ceiling fan motor housing
JP2004207606A (ja) 2002-12-26 2004-07-22 Disco Abrasive Syst Ltd ウェーハサポートプレート
TWD100642S1 (zh) * 2003-01-29 2004-10-01 台達電子工業股份有限公司 扇框(一)
TWD100860S1 (zh) * 2003-01-29 2004-10-11 台達電子工業股份有限公司 扇框(二)
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7052371B2 (en) 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
USD493246S1 (en) * 2003-07-28 2004-07-20 Lusa Lighting, Inc. Lighting fixture
USD490183S1 (en) * 2003-07-28 2004-05-18 Lusa Lighting, Inc. Lighting fixture
USD491098S1 (en) * 2003-09-24 2004-06-08 Wilton Industries, Inc. Tiered floral centerpiece
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
USD502990S1 (en) * 2003-12-09 2005-03-15 Ground Control Systems, Inc. Airflow screen
USD510988S1 (en) * 2004-03-24 2005-10-25 Frank Blateri Heater fan
US7570368B2 (en) * 2004-05-12 2009-08-04 Veeco Instruments Inc. Method and apparatus for measuring the curvature of reflective surfaces
USD512500S1 (en) * 2004-05-20 2005-12-06 Lasko Holdings, Inc. Body of a horizontal blower fan
USD577159S1 (en) * 2004-06-08 2008-09-16 Nicholas Steven Hasapoglou Seed catcher for birdfeeders
USD517073S1 (en) * 2004-07-14 2006-03-14 Capital One Financial Corporation Data card
USD511827S1 (en) * 2004-07-28 2005-11-22 Lasko Holdings, Inc. Body of a vertical blower fan
USD512501S1 (en) * 2004-07-28 2005-12-06 Lasko Holdings, Inc. Body of a horizontal blower fan
USD504666S1 (en) * 2004-08-26 2005-05-03 Emtelle (Uk) Limited Closure for conduits for cables
JP2006092722A (ja) * 2004-08-27 2006-04-06 Showa Denko Kk 磁気ディスク用基板および磁気ディスクの製造方法
TWD110200S1 (zh) 2004-10-14 2006-04-11 東芝照明技術股份有限公司 照明用發光體
USD551923S1 (en) 2005-03-03 2007-10-02 Robert Bosch Gmbh Saw blade
US8083041B2 (en) 2005-08-11 2011-12-27 American Axle & Manufacturing, Inc. Electrohydraulic torque transfer device
TWD119070S1 (zh) * 2005-09-08 2007-09-21 東京應化工業股份有限公司 支撐板
TWD115746S1 (zh) * 2005-09-08 2007-03-01 東京應化工業股份有限公司 支撐板
JP2007075949A (ja) * 2005-09-14 2007-03-29 Ebara Corp 研磨プラテン、研磨装置
EP1772901B1 (en) 2005-10-07 2012-07-25 Rohm and Haas Electronic Materials, L.L.C. Wafer holding article and method for semiconductor processing
ITMN20060032A1 (it) 2006-04-21 2007-10-22 Luciano Pinotti Sistema ed apparecchiatura per autoabbronzatura
USD570075S1 (en) * 2006-06-08 2008-05-27 Gary Wood Coin display folder
CA117839S (en) * 2006-10-11 2007-08-02 Beta Calco Inc Light fixture
US20080102199A1 (en) * 2006-10-26 2008-05-01 Veeco Instruments Inc. Multi-wafer rotating disc reactor with wafer planetary motion induced by vibration
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
USD556880S1 (en) 2007-03-27 2007-12-04 Samsung Electronics Co., Ltd. Air conditioner
DE102007023970A1 (de) 2007-05-23 2008-12-04 Aixtron Ag Vorrichtung zum Beschichten einer Vielzahl in dichtester Packung auf einem Suszeptor angeordneter Substrate
USD571436S1 (en) * 2007-06-14 2008-06-17 Alsons Corporation Showerhead
US8092599B2 (en) 2007-07-10 2012-01-10 Veeco Instruments Inc. Movable injectors in rotating disc gas reactors
USD591695S1 (en) * 2007-07-11 2009-05-05 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode module
USD629547S1 (en) * 2007-09-20 2010-12-21 Glp German Light Products Gmbh Lights
JP2009088088A (ja) 2007-09-28 2009-04-23 Sharp Corp 基板処理装置および基板処理方法
USD597639S1 (en) * 2007-11-19 2009-08-04 Yeh Chen Lee Fan forced heater
US8021487B2 (en) * 2007-12-12 2011-09-20 Veeco Instruments Inc. Wafer carrier with hub
US20110114022A1 (en) * 2007-12-12 2011-05-19 Veeco Instruments Inc. Wafer carrier with hub
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8022372B2 (en) * 2008-02-15 2011-09-20 Veeco Instruments Inc. Apparatus and method for batch non-contact material characterization
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
US20090276333A1 (en) 2008-05-05 2009-11-05 Cortes Ricardo D Electronic submission and management of digital products for network-based distribution
JP2009283551A (ja) 2008-05-20 2009-12-03 Showa Denko Kk 半導体発光素子及びその製造方法、ランプ
USD610290S1 (en) * 2008-05-26 2010-02-16 Toshiba Lighting & Technology Corporation Recessed lighting fixture
KR20110019442A (ko) * 2008-06-26 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 캄파니 다공성 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법 및 이용 방법
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
TWD135511S1 (zh) 2008-10-03 2010-06-21 日本碍子股份有限公司 靜電夾頭
US9000605B2 (en) * 2008-10-15 2015-04-07 Altaeros Energies, Inc. Lighter-than-air craft for energy-producing turbines
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD606952S1 (en) 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
JP2010194704A (ja) * 2009-01-27 2010-09-09 Shinano Denki Seiren Kk 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法
US8216379B2 (en) 2009-04-23 2012-07-10 Applied Materials, Inc. Non-circular substrate holders
USD611042S1 (en) * 2009-06-24 2010-03-02 Research In Motion Limited Handheld electronic device skin
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9581756B2 (en) * 2009-10-05 2017-02-28 Lighting Science Group Corporation Light guide for low profile luminaire
KR20110006715U (ko) 2009-12-29 2011-07-06 이태호 일회용 음식용기 손잡이 홀더
KR20110006718U (ko) 2009-12-29 2011-07-06 인택 김 피에이치시험지와 지지대를 결합한 일회성 피에이치농도 측정도구
KR20110006716U (ko) 2009-12-29 2011-07-06 이태호 일회용 음식용기 손잡이 홀더
USD618328S1 (en) * 2010-01-20 2010-06-22 C.C. & L Company Limited Air cleaner
TWM392431U (en) 2010-02-04 2010-11-11 Epistar Corp Systems for epitaxial growth
WO2011100972A1 (en) * 2010-02-16 2011-08-25 Martin Professional A/S Illumination device with interlocked yoke shell parts
EP2539920A1 (en) * 2010-02-24 2013-01-02 Veeco Instruments Inc. Processing methods and apparatus with temperature distribution control
USD624692S1 (en) * 2010-04-21 2010-09-28 Tri-Lite, Inc. LED dock light head
TWI390074B (zh) 2010-04-29 2013-03-21 Chi Mei Lighting Tech Corp 有機金屬化學氣相沉積機台
TWI398545B (zh) 2010-04-29 2013-06-11 Chi Mei Lighting Tech Corp 有機金屬化學氣相沉積機台
KR20110136583A (ko) 2010-06-15 2011-12-21 삼성엘이디 주식회사 서셉터 및 이를 구비하는 화학 기상 증착 장치
USD668577S1 (en) * 2010-06-18 2012-10-09 Blueink.com LLC Interactive artwork display
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
EP2623849B1 (en) * 2010-07-28 2018-05-02 Corporació Sanitària Parc Taulí Laminar air flow ceiling for an operating room
US8460466B2 (en) * 2010-08-02 2013-06-11 Veeco Instruments Inc. Exhaust for CVD reactor
US8535445B2 (en) * 2010-08-13 2013-09-17 Veeco Instruments Inc. Enhanced wafer carrier
US8414361B2 (en) 2010-08-13 2013-04-09 Phuong Van Nguyen Silicon carbide, sapphire, germanium, silicon and pattern wafer polishing templates holder
TWM397030U (en) 2010-08-16 2011-01-21 Liang Meng Plastic Share Co Ltd LED packaging structure
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD668211S1 (en) * 2010-09-10 2012-10-02 Novellus Systems, Inc. Segmented electroplating anode and anode segment
USD648289S1 (en) 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
CN201942749U (zh) 2010-11-16 2011-08-24 璨圆光电股份有限公司 一种气相沉积设备用的载盘结构
US8562746B2 (en) * 2010-12-15 2013-10-22 Veeco Instruments Inc. Sectional wafer carrier
USD675171S1 (en) * 2010-12-16 2013-01-29 Tecella Llc Multi-electrode holder
US20120171377A1 (en) * 2010-12-30 2012-07-05 Veeco Instruments Inc. Wafer carrier with selective control of emissivity
EP2489930B1 (en) * 2011-02-21 2015-03-25 LG Innotek Co., Ltd. Lighting module and lighting device
USD677376S1 (en) * 2011-03-02 2013-03-05 Gary Wolff Bird and large insect vent cap for exhaust pipes for high efficiency furnaces
USD681867S1 (en) * 2011-03-11 2013-05-07 GE Lighting Solutions, LLC Suspended luminaire
TW201239124A (en) 2011-03-22 2012-10-01 Chi Mei Lighting Tech Corp Wafer susceptor and chemical vapor deposition apparatus
WO2012139006A2 (en) * 2011-04-07 2012-10-11 Veeco Instruments Inc. Metal-organic vapor phase epitaxy system and process
US9653340B2 (en) * 2011-05-31 2017-05-16 Veeco Instruments Inc. Heated wafer carrier profiling
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
TWM420823U (en) 2011-07-29 2012-01-11 Hermes Epitek Corp Multi-wafer susceptor
USD686354S1 (en) * 2011-08-02 2013-07-16 Acolyte Technologies Corporation Lighting device
USD690840S1 (en) * 2011-08-02 2013-10-01 Acolyte Technologies Corporation Lighting device
USD690841S1 (en) * 2011-08-02 2013-10-01 Acolyte Technologies Corporation Lighting device
US20130043493A1 (en) 2011-08-18 2013-02-21 Richard Ta-Chung Wang Light-emitting diode structure
USD700987S1 (en) * 2011-08-30 2014-03-11 Cooper Technologies Company Trapezoidal luminaire
JP1438745S (zh) 2011-09-20 2015-04-06
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD674961S1 (en) * 2011-10-10 2013-01-22 Hella Kgaa Hueck & Co. LED approach light
WO2013065666A1 (ja) * 2011-10-31 2013-05-10 京セラ株式会社 ガスノズル、これを用いたプラズマ装置およびガスノズルの製造方法
USD679446S1 (en) * 2011-11-17 2013-04-02 Myotek Pacific Corp. LED spot lamp
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD672915S1 (en) * 2011-12-09 2012-12-18 Martin Professional A/S Lens of a lighting fixture
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
TWD151017S (zh) * 2012-01-20 2012-12-21 隆達電子股份有限公司 發光二極體模組
JP5999807B2 (ja) 2012-03-07 2016-09-28 東洋炭素株式会社 サセプタ
USD695242S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
US9816184B2 (en) * 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD678294S1 (en) * 2012-04-13 2013-03-19 3M Innovative Properties Company Case for a tablet electronic device
US10316412B2 (en) * 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
USD673113S1 (en) * 2012-04-19 2012-12-25 Better Energy Systems Inc. Portable energy storage and power supply device
USD677422S1 (en) * 2012-05-01 2013-03-05 Foxsemicon Integrated Technology, Inc. Lens cover for LED lamp
USD769432S1 (en) * 2012-05-14 2016-10-18 Technologies Holdings Corp. Vapor compression dehumidifier
USD713492S1 (en) * 2012-09-13 2014-09-16 Canada Pipeline Accessories, Co. Ltd. Flow conditioner with internal vanes
USD697581S1 (en) * 2012-09-13 2014-01-14 Canada Pipeline Accessories, Co. Ltd. Flow conditioner
USD686713S1 (en) * 2012-09-19 2013-07-23 Shizuoka Seiki Co., Ltd. Infrared oil heater
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD722150S1 (en) * 2012-10-11 2015-02-03 ResMed Humidification Technologies GmbH Passover humidifier
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD682028S1 (en) * 2012-11-06 2013-05-14 Victor Preisler Gas burner
USD693782S1 (en) 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
CN102983093B (zh) 2012-12-03 2016-04-20 安徽三安光电有限公司 一种用于led外延晶圆制程的石墨承载盘
CN203007414U (zh) 2012-12-26 2013-06-19 光达光电设备科技（嘉兴）有限公司 一种化学气相沉积设备及其托盘
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
US9388493B2 (en) * 2013-01-08 2016-07-12 Veeco Instruments Inc. Self-cleaning shutter for CVD reactor
USD701939S1 (en) * 2013-01-11 2014-04-01 Canada Pipeline Accessories, Co. Ltd Flow conditioner
USD708728S1 (en) * 2013-02-13 2014-07-08 Lg Electronics Inc. Air cleaner
USD714488S1 (en) * 2013-02-26 2014-09-30 Shanghai Sansi Electronics Engineering Co., Ltd. Chessboard shaped LED lamp
USD699691S1 (en) 2013-03-06 2014-02-18 Posco Led Company Ltd. Light emitting diode module for LED lighting
USD736941S1 (en) * 2013-03-08 2015-08-18 Egerton Roy Nicholson Gel pack
US9273413B2 (en) * 2013-03-14 2016-03-01 Veeco Instruments Inc. Wafer carrier with temperature distribution control
US10167571B2 (en) * 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD732647S1 (en) * 2013-03-15 2015-06-23 Illinois Tool Works Inc. Air filtration device
USD702357S1 (en) * 2013-03-15 2014-04-08 Tesseract Sensors, LLC Electrode patch array
USD702356S1 (en) * 2013-03-15 2014-04-08 Tesseract Sensors, LLC Electrode patch array
USD721417S1 (en) * 2013-04-11 2015-01-20 Canada Pipeline Accessories, Co., Ltd. Flow conditioner
USD778423S1 (en) 2013-04-15 2017-02-07 Integrated Global Services, Inc. High surface area ash removal screen
US9328908B2 (en) 2013-04-16 2016-05-03 Checkers Industrial Products, Llc LED strobe light with integrated magnet and heat sink chimney
USD751773S1 (en) * 2013-04-26 2016-03-15 Robert Gailen Feeding platter for pets
TWI609991B (zh) * 2013-06-05 2018-01-01 維克儀器公司 具有熱一致性改善特色的晶圓舟盒
USD760883S1 (en) 2013-08-05 2016-07-05 Oransi, Llc Air purifier
USD752202S1 (en) * 2013-08-08 2016-03-22 Homewerks Worldwide, LLC Fan grille
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD708346S1 (en) * 2013-09-18 2014-07-01 Lmi Ip, Llc Laminar flow swim spa jet
US10015868B2 (en) * 2014-11-03 2018-07-03 Osram Sylvania Inc. Solid-state lamps with electronically adjustable light beam distribution
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
TWI650832B (zh) * 2013-12-26 2019-02-11 維克儀器公司 用於化學氣相沉積系統之具有隔熱蓋的晶圓載具
TW201526287A (zh) 2013-12-30 2015-07-01 Lextar Electronics Corp 半導體裝置之製造方法
DE102014100024A1 (de) 2014-01-02 2015-07-02 Aixtron Se Vorrichtung zur Anordnung von Substraten, insbesondere Suszeptor eines CVD-Reaktors
USD742770S1 (en) 2014-01-06 2015-11-10 Greenwave Systems Pte. Ltd. Enclosure for electronic device
JP1518059S (zh) * 2014-01-09 2015-02-23
USD754785S1 (en) 2014-01-22 2016-04-26 Karen Theresa Gibson Musical steel pan with drum sticks
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD717086S1 (en) * 2014-04-28 2014-11-11 Pendleton Safe Company, Inc. Shelf
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US9500341B2 (en) * 2014-05-16 2016-11-22 The Boeing Company Optical filtering system for solar cell testing
DE102014114947A1 (de) 2014-05-16 2015-11-19 Aixtron Se Vorrichtung zum Abscheiden von Halbleiterschichten sowie einen Suszeptor zur Verwendung in einer derartigen Vorrichtung
USD746437S1 (en) * 2014-05-22 2015-12-29 3M Innovative Properties Company Respirator mask having a communication grille
USD785575S1 (en) * 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD731409S1 (en) * 2014-06-26 2015-06-09 Water Technology Llc Surface ornamentation for a passive solar heating article
USD764957S1 (en) 2014-07-14 2016-08-30 Vivint, Inc. Mobile personal device
USD752199S1 (en) * 2014-09-22 2016-03-22 Homewerks Worldwide, LLC Bath fan with speaker
JP1529977S (zh) 2014-11-04 2015-07-27
USD778422S1 (en) 2014-12-10 2017-02-07 Minka Lighting, Inc. Combination ceiling fan and light fixture
USD779052S1 (en) * 2014-12-10 2017-02-14 Minka Lighting, Inc. Ceiling fan housing with light fixture
US20160169503A1 (en) * 2014-12-14 2016-06-16 Shih-Yun Chen Led lamp for ceiling fan and ceiling fan having the same
USD778416S1 (en) 2014-12-15 2017-02-07 Samsung Electronics Co., Ltd. Air conditioner
USD785678S1 (en) * 2014-12-24 2017-05-02 Ngk Insulators, Ltd. Catalyst carrier for exhaust gas purification
USD753269S1 (en) * 2015-01-09 2016-04-05 Asm Ip Holding B.V. Top plate
USD789924S1 (en) 2015-01-16 2017-06-20 Apple Inc. Electronic device
USD751380S1 (en) * 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751381S1 (en) * 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751383S1 (en) * 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751382S1 (en) * 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751384S1 (en) * 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD765608S1 (en) 2015-02-03 2016-09-06 Lg Electronics Inc. Smart key for automobiles
USD778651S1 (en) 2015-02-16 2017-02-14 Home Depot Product Authority, Llc Magnetic drawer divider piece
USD758905S1 (en) 2015-03-11 2016-06-14 BleepBleeps Limited Motion alarm
USD774128S1 (en) 2015-03-12 2016-12-13 Matthew Pinner Young Metal tongue drum
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
AU362435S (en) 2015-03-26 2015-07-07 Tronac Pty Ltd Thermostat/hub for climate control and monitoring
USD808063S1 (en) * 2015-04-07 2018-01-16 Flos S.P.A. Table lamp
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD768538S1 (en) 2015-05-12 2016-10-11 Viicii Llc Cufflink
US20160341400A1 (en) * 2015-05-22 2016-11-24 Posco Led Company Ltd. Optical semiconductor lighting apparatus
USD780821S1 (en) * 2015-06-02 2017-03-07 Transitions Optical, Inc. Lens holder
US20160370019A1 (en) * 2015-06-18 2016-12-22 Technologies Holdings Corp. Heating and cooling system for hazardous environments
US10438795B2 (en) * 2015-06-22 2019-10-08 Veeco Instruments, Inc. Self-centering wafer carrier system for chemical vapor deposition
KR101737364B1 (ko) * 2015-08-31 2017-05-18 엘지전자 주식회사 공기조화기
US20170076972A1 (en) * 2015-09-15 2017-03-16 Veeco Instruments Inc. Planetary wafer carriers
USD771785S1 (en) * 2015-09-22 2016-11-15 Hao-Yu Huang Essential oil diffuser
USD756907S1 (en) 2015-10-01 2016-05-24 Joe Secard Floating solar heating device
USD781165S1 (en) * 2015-10-01 2017-03-14 Htc Corporation Weight scale
US10081295B2 (en) * 2015-10-13 2018-09-25 Ford Global Technologies, Llc Illuminated badge for a vehicle
USD787357S1 (en) 2015-10-21 2017-05-23 Apple Inc. Security attachment
USD772334S1 (en) 2015-10-30 2016-11-22 Roland Corporation Electronic percussion instrument
US20170122506A1 (en) * 2015-10-30 2017-05-04 Dale Collins Personal Safety Light
USD784429S1 (en) * 2015-11-04 2017-04-18 Samsung Electronics Co., Ltd. Condenser for refrigerator
KR102419890B1 (ko) * 2015-11-05 2022-07-13 삼성전자주식회사 발광 장치 및 그 제조 방법

Also Published As

Publication number Publication date
KR20160003714U (ko) 2016-10-26
TWM531054U (zh) 2016-10-21
USD778247S1 (en) 2017-02-07
TWD181305S (zh) 2017-02-11
TWM531049U (zh) 2016-10-21
USD806046S1 (en) 2017-12-26
TWD181306S (zh) 2017-02-11
TWD181304S (zh) 2017-02-11
DE202015007242U1 (de) 2016-02-02

Similar Documents

Publication Publication Date Title
TWM531052U (zh) 具有３１個容置區的排列組態之晶圓載具
TWM531053U (zh) 具有１４個容置區的排列組態之晶圓載具
TWM531055U (zh) 具有３５個容置區的排列組態之晶圓載具
TWI619843B (zh) 在化學氣相沉積系統內具有供改善加熱一致性之設計的晶圓舟盒
TWI488258B (zh) 增強之晶圓載體
TWI471973B (zh) 具有斜邊之晶圓載體
US8562746B2 (en) Sectional wafer carrier
US20130065403A1 (en) Wafer carrier with thermal features
US11248295B2 (en) Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
US20030168174A1 (en) Gas cushion susceptor system
US20120171377A1 (en) Wafer carrier with selective control of emissivity
KR20170037912A (ko) 열 특성이 개선된 웨이퍼 서셉터
CN204644466U (zh) 晶片托盘
EP3863043A1 (en) Susceptor
TW202430715A (zh) 多盤化學氣相沉積系統
TWM567957U (zh) 晶圓載體
JP5306432B2 (ja) 気相成長方法
KR20200071276A (ko) 대구경 웨이퍼용 웨이퍼 캐리어
KR20190001371U (ko) 33-포켓 구성을 갖는 웨이퍼 캐리어
CN112144113A (zh) 石墨载盘及具有其的mocvd反应装置
TWM538238U (zh) 具有複數個容置區的排列組態之晶圓載具
TWM538237U (zh) 具有31個容置區的排列組態之晶圓載具
KR20210029567A (ko) 웨이퍼 캐리어
TWM571587U (zh) 晶圓載體
KR20180092669A (ko) 대구경 웨이퍼용 웨이퍼 캐리어 및 그것을 이용한 에피층 성장 방법

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees