TWM506380U - Illuminant device - Google Patents

Abstract

An illuminant device includes a hemispherical carrier, a circuit layer, a plurality of light emitting diode (LED) dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is arranged on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is connected to the hemispherical carrier such that the joining surface is attached to the carrying surface while the LED dies and the enclosure resin are disposed within the recess.

Description

Illuminating device

The present invention relates to a light-emitting device, and more particularly to a spherical light-emitting device.

A light emitting diode (LED) is a semiconductor component that mainly converts electrical energy into light energy through a semiconductor compound to achieve a luminous effect, thereby having the advantages of long life, high stability, and low power consumption. Widely used in home, office, outdoor and mobile lighting to replace traditional non-directional light sources such as lamps and incandescent bulbs.

Since the light-emitting diode is a point light source and has high directivity, the illuminated surface of the light-emitting diode is narrower than the conventional light-emitting source, and the light-emitting brightness gradually decreases as the distance increases, so it is more suitable for providing short Lights for distance and small area lighting, such as table lamps.

In order to make the light-emitting diodes applied to other lamps, such as bulbs or candle lamps, most manufacturers use a combination of a plurality of light-emitting diodes to achieve a problem that the illumination range is too small to achieve a small illumination range; however, the light-emitting diode is used. The increase in the number of wires causes the power required to drive the light-emitting diodes to increase, and the effect of power saving cannot be effectively achieved, and the price of the light-emitting diode lamp itself is much higher than that of the conventional light source, thereby causing the user to reduce the use of the light-emitting diode lamp. Willingness.

The invention provides a light-emitting device, which is arranged in a spherical transparent object formed by a combination of a hemispherical carrier and a hemispherical cover, thereby providing a full-angle illumination effect.

According to the present invention, there is provided a light-emitting device comprising a semi-spherical carrier, a circuit layer, a plurality of light-emitting diode dies, an encapsulant and a hemispherical cover. The hemispherical carrier comprises a crucible bearing surface, a first arc surface connected to the bearing surface, and a first protrusion connected to the bearing surface and the first arc surface intersection, the first protrusion portion comprising a first surface, The first surface has the same level as the bearing surface. The circuit layer is disposed on the first surface and the bearing surface; the light emitting diode die is electrically connected to the circuit layer; and the encapsulant is coated with the light emitting diode die. The hemispherical cover body comprises a joint surface, a second curved surface connected to the joint surface, and a recess formed on the joint surface and recessed toward the second arc surface, the hemispherical cover body being combined with the hemispherical carrier The bonding surface is attached to the bearing surface, and the LED die and the encapsulant are located in the recess.

In other embodiments of the present disclosure, the light emitting device further includes a neon fluorescent layer covering the first curved surface and the second curved surface.

In other embodiments of the present disclosure, the light emitting device further includes a fluorescent substance disposed in the encapsulant.

In other embodiments of the present disclosure, the light emitting diode dies are disposed on the carrier surface.

In other embodiments of the present disclosure, the light emitting device further includes a transparent substrate disposed in a recess formed in the bearing surface and recessed toward the first curved surface, and the light emitting diode die is disposed on the transparent substrate. .

In other embodiments of the present disclosure, the light emitting diode grains are arranged in a matrix.

In other embodiments of the present disclosure, the semi-spherical cover includes a second protrusion formed at the junction of the joint surface and the second arc surface, and the second protrusion includes a second surface, and the circuit layer is disposed on the second layer The second surface.

In other embodiments of the present disclosure, the illuminating device further includes two transparent substrates respectively disposed in a recess formed in the bearing surface and recessed toward the first arc surface, and the illuminating diode dies are respectively disposed on On a transparent substrate.

In other embodiments of the present disclosure, each of the transparent substrates includes a plate surface, wherein a plate surface of one of the transparent substrates faces the first curved surface, and a surface of the other transparent substrate faces the second curved surface, and the light emitting diode The body grains are respectively disposed on the board surface.

In other embodiments of the present disclosure, the light emitting device further includes a plurality of wires, connecting the light emitting diode die and the circuit layer.

According to the present invention, there is further provided a light-emitting device comprising a transparent substrate, a circuit layer, a plurality of light-emitting diode crystal grains, an encapsulant, a hemispherical carrier and a hemispherical cover. The transparent substrate includes a first plate surface and a second plate surface opposite to the first plate surface. The circuit layer is disposed on the first board surface; the light emitting diode die is disposed on the first board surface and electrically connected to the circuit layer. The encapsulant encapsulates the luminescent diode die. The hemispherical carrier comprises a bearing surface and a first arc surface connected to the bearing surface, and the hemispherical carrier is combined with the transparent substrate to make the bearing surface adhere to the second board surface. The hemispherical cover body comprises a joint surface, a second arc surface connected to the joint surface, and a recess formed on the joint surface and recessed toward the second arc surface. The hemispherical cover body is combined with the transparent substrate and corresponds to the hemisphere The shaped carrier is such that the bonding surface is adhered to the first board surface, and the LED die and the encapsulant are located in the recess.

In other embodiments of the present disclosure, wherein the area of the first panel is greater than the area of the mating surface.

In other embodiments of the present disclosure, a plurality of wires are further included to connect the light emitting diode die and the circuit layer.

The above and other objects, features, and advantages of the present invention will be better understood from the following description of the preferred embodiments.

Referring to FIG. 2, FIG. 2 and FIG. 3, respectively, an exploded perspective view, a perspective assembled view and a cross-sectional view of a light-emitting device according to a third embodiment of the present disclosure are provided. The illuminating device 1 can be applied to a light-emitting diode bulb, and the illuminating device 1 has a substantially spherical shape for providing a light source having a full-angle illuminating effect. The light-emitting device 1 comprises a hemispherical carrier 10, a germanium circuit layer 12, a plurality of light-emitting diode chips 14, a germanium encapsulant 16 and a hemispherical cover 18.

The hemispherical carrier 10 includes a crucible bearing surface 100, a first curved surface 102 connected to the bearing surface 100, and a first protruding portion 104 formed at the intersection of the bearing surface 100 and the curved surface 102. The first protruding portion 104 A first surface 1040 is included, and the first surface 1040 has the same level as the bearing surface 100. In the present embodiment, the outer shape of the first protruding portion 104 is substantially rectangular. The hemispherical carrier 10 is made of a transparent material (for example, glass or quartz) and is transparent to light emitted from the LEDs 14.

The circuit layer 12 is disposed on the first surface 1040 and the bearing surface 100 for use as a transmission path for electric power. Circuit layer 12 can be fabricated, for example, but not limited to, using copper or other materials having electrically conductive properties. In the present embodiment, the circuit layer 12 is composed of two conductive sheets 120, and the conductive sheets 12 are spaced apart from the first surface 1040.

The light emitting diode die 14 is disposed on the bearing surface 100 and electrically connected to the circuit layer 12 . In the present embodiment, the light emitting diode crystal grains 14 are arranged in a matrix, and the light emitting diode crystal grains 14 are connected in series (described later); in actual implementation, the light emitting diode crystal grains 14 may be linearly arranged. Or irregularly arranged, and can be connected in parallel or in series and parallel. The LED die 14 can be fixed to the carrier surface 100 by die bonding technique, and then the LED body can be crystallized by wire bonding or flip chip bonding. The particles 14 are electrically connected to the conductive sheet 120. In the present embodiment, the light emitting diode die 14 is a horizontal structure light emitting diode die, and the light emitting diode die 14 includes two electrodes 140, which are closest to the light emitting diode die 14 of the conductive chip 120. An electrode 140 is connected to the conductive sheet 120 via a wire 142, and the other electrode 140 is connected to an electrode 140 of the adjacent light-emitting diode die 14 through a wire 142; the two electrodes 140 of the other light-emitting diode die 14 The electrodes 140 are connected to the adjacent LEDs 14 of the light-emitting diodes 14 through wires 142, so that the LEDs 14 can be connected in series.

The encapsulant 16 encloses the LED die 14 and the wiring 142 for protecting the LED die 14 and the wiring 142 to avoid moisture of the LED die 14 and the wiring 142, and avoiding the surface wiring 142. It is broken by the impact of external force. The encapsulant 16 can be, for example, but not limited to, an epoxy resin, a enamel resin, or other light transmissive resin that can penetrate light from the LEDs 14 of the LED.

The hemispherical cover 18 includes an engagement surface 180, a second curved surface 182 coupled to the engagement surface 180, and a recess 184 formed in the engagement surface 180 and recessed toward the second curved surface 182. The area of the joint surface 180 is the same as the area of the bearing surface 100. The hemispherical cover 18 is combined with the hemispherical carrier 10 such that the interface 180 is fully conformed to the carrier surface 100, and the LED die 14, the wiring 142 and the encapsulant 16 are located in the recess 184. The hemispherical cover 18 is made of a transparent material (for example, quartz or glass) and is transparent to light emitted from the light-emitting diode die 14.

In summary, the light-emitting device 1 of the first embodiment of the present disclosure places the light-emitting diode crystal grains 14 in a spherical transparent body composed of a hemispherical carrier 10 and a hemispherical cover 18, whereby the light-emitting device 2 The light emitted by the polar body 14 can penetrate the hemispherical carrier 10 and the hemispherical cover 18, and the light shape is adjusted by the first curved surface 102 and the second curved surface 182 to provide a light source with a full-angle illumination effect. .

Referring to the fourth figure, a cross-sectional view of a light-emitting device according to a second embodiment of the present disclosure is shown. The light-emitting device 1A shown in the fourth figure is similar to the light-emitting device 1 of the first embodiment, and the same elements are denoted by the same reference numerals. It is worth noting that the difference between the two is that the light-emitting device 1A further includes the neon fluorescent layer 20.

The phosphor layer 20 is disposed on the periphery of the first curved surface 102 and the second curved surface 182 to cover the first curved surface 102 and the second curved surface 182. The phosphor layer 20 includes a transparent colloid 200 and a phosphor material 202 (for example, a phosphor powder) disposed inside the transparent colloid 200. The phosphor material 202 is used to generate wavelengths of a part of the light emitted from the LED body 14. The wavelength-converted light is converted and generated, and the wavelength-converted light is mixed with other light emitted by the light-emitting diode die 14 to generate a light of a specific light color. The function and related description of each element of the light-emitting device 1A are substantially the same as those of the light-emitting device 1 of the first embodiment, and will not be described herein. The light-emitting device 1A can at least achieve the same function as the light-emitting device 1.

5 is a cross-sectional view of a light-emitting device according to a third embodiment of the present disclosure. The light-emitting device 1B shown in the fifth figure is similar to the light-emitting device 1 of the first embodiment, and the same elements are denoted by the same reference numerals. It is to be noted that the difference between the two is that the light-emitting device 1B further includes a transparent substrate 22, and a groove 106B is formed on the hemispherical carrier 10B.

The groove 106B is formed in the bearing surface 100B and is recessed toward the first curved surface 102B. The transparent substrate 22 is located in the recess 106B. The transparent substrate 22 can be made of, for example, but not limited to, glass or quartz, for the light emitted by the LEDs 14 to pass through. The transparent substrate 22 has a plate surface 220. In the present embodiment, the plate surface 220 is a plane having a large area of the transparent substrate 22. The plate surface 220 faces the second curved surface 182, and the area of the plate surface 220 is smaller than the bearing surface. The area of 100B. The LEDs 14 are arranged in a matrix on the board surface 220 of the transparent substrate 22 (that is, in the present embodiment, the arrangement of the LEDs 14 on the transparent substrate 22 is the same as in the first embodiment. The arrangement of the light-emitting diode dies 14 is electrically connected to the circuit layer 12.

Furthermore, in the light-emitting device 1B of the present embodiment, a phosphor material 160B is disposed in the encapsulant 16B, and the phosphor material 160B is used for wavelength conversion with a portion of the light emitted from the LED die 14 to generate wavelength-converted light. The wavelength-converting light is mixed with other light emitted by the LED die 14 to generate a specific light color. The encapsulant 16B is disposed in the recess 184 and the recess 106B and covers the transparent substrate 22, the LED die 14 and the wiring 142. The function and related description of each element of the light-emitting device 1B are substantially the same as those of the light-emitting device 1 of the first embodiment, and will not be described herein. The light-emitting device 1B can at least achieve the same function as the light-emitting device 1.

6 and 7 are a perspective view and a cross-sectional view of a light-emitting device according to a fourth embodiment of the present disclosure. The light-emitting device 1C shown in the sixth and seventh figures is similar to the light-emitting device 1 of the first embodiment, and the same elements are denoted by the same reference numerals. It should be noted that the difference between the two is that the hemispherical cover 18C further includes a second protrusion 186, a hemispherical carrier 10C is formed with a groove 106C, and the light-emitting device 1C further includes two transparent substrates 22C.

The second protrusion 186 is formed at the junction of the joint surface 180C and the second curved surface 182C, the second protrusion 186 includes a second surface 1860, and the circuit layer 12 is disposed on the second surface 1860. The groove 106C is formed in the bearing surface 100C and is recessed toward the first curved surface 102C.

The transparent substrate 22C is juxtaposed in the recess 106C. The transparent substrate 22C can be made of, for example, but not limited to, glass or quartz, and can be used to penetrate light emitted from the LEDs 14. Each of the transparent substrates 22C includes a plate surface 220C. In this embodiment, one of the plate faces 220C of the transparent substrate 22C faces the first curved surface 102C, and the plate surface 220C of the other transparent substrate 22C faces the second curved surface 182C. . The LEDs 14 are linearly arranged on the board surface 220C and electrically connected to the circuit layer 12. The light-emitting diode die 14 disposed on the plate surface 220C facing the first curved surface 102C emits light in a direction toward the first curved surface 102C, and is disposed on the surface 220C facing the second curved surface 182C. The diode grains 14 emit light in a direction toward the second curved surface 182C.

Further, in the light-emitting device 1C of the present embodiment, a fluorescent substance 160C is provided in the encapsulant 16C. The phosphor material 160C is used for wavelength conversion with a portion of the light emitted by the light-emitting diode die 14 to generate wavelength-converted light, and the wavelength-converted light is mixed with other light emitted by the light-emitting diode die 14 to generate a light. Light of a specific light color. The encapsulant 16C covers the transparent substrate 22C, the light emitting diode die 14 and the wiring 142. The function and related description of each element of the light-emitting device 1C are substantially the same as those of the light-emitting device 1 of the first embodiment, and will not be described herein. The light-emitting device 1C can at least achieve the same function as the light-emitting device 1.

FIG. 8 is a perspective exploded view and a perspective assembled view of a light-emitting device according to a fifth embodiment of the present disclosure. The light-emitting device 3 includes a transparent substrate 30, a circuit layer 32, a plurality of light-emitting diode crystal grains 34, an encapsulant 36, a semi-spherical carrier 38, and a semi-spherical cover 40. The transparent substrate 30 can be made, for example, but not limited to, using glass or quartz to allow light from the light emitting diode die 34 to penetrate. The transparent substrate 30 includes a first plate surface 300 and a second plate surface 302 opposite to the first plate surface 300. In this embodiment, the first plate surface 300 and the second plate surface 302 are respectively planar, and the first plate The surface 300 and the second surface 302 are planes having a large area of the transparent substrate 30, and the area of the first surface 300 is the same as the area of the second surface 302. The circuit layer 32 is disposed on the first board surface 300, and the circuit layer 32 can be fabricated, for example, but not limited to, using copper or other materials having conductive properties.

The LEDs 34 are respectively disposed on the first board surface 300 and electrically connected to the circuit layer 32. The LED die 34 can be fixed to the first plate surface 300 by a die bonding technique, and then the LED die 34 is electrically connected to the circuit layer 32 by wire bonding or flip chip bonding. In the present embodiment, the light emitting diode die 34 is a horizontal structure light emitting diode die, and the light emitting diode die 34 is electrically connected to the circuit layer 32 by the wire 342.

The hemispherical carrier 38 includes a bearing surface 380 and a first curved surface 382 coupled to the bearing surface 380. The bearing surface 380 is a flat surface, and the area of the bearing surface 380 is smaller than the area of the second surface 302. The hemispherical carrier 38 can be made, for example, using a transparent material such as glass or quartz, and can penetrate the light emitted by the light-emitting diode crystal grains 34. The hemispherical carrier 38 is bonded to the transparent substrate 30 such that the bearing surface 380 is attached to the second plate surface 302.

The hemispherical cover 40 includes a joint surface 400, a second curved surface 402 coupled to the joint surface 400, and a recess 404 formed in the joint surface 400 and recessed toward the second curved surface 402. The joint surface 400 is a plane, and the area of the joint surface 400 is smaller than the area of the first plate surface 300 and substantially the same as the area of the bearing surface 380. The hemispherical cover 40 can be made of, for example, a transparent material such as glass or quartz, and can penetrate the light emitted from the light-emitting diode crystal grains 34. The semi-spherical cover 40 is coupled to the transparent substrate 30 such that the bonding surface 400 is bonded to the first surface 300, and the LED die 34, the wiring 342 and the encapsulant 36 are respectively located in the recess 404. In the present embodiment, the hemispherical cover 40 is disposed corresponding to the hemispherical carrier 38 such that the outer shape of the light-emitting device 3 is substantially spherical.

When the light-emitting device 3 is actually fabricated, a plurality of sets of light-emitting diode crystal grains 34 may be simultaneously disposed on a transparent substrate 30 having a large area (the number of the light-emitting diode crystal grains 34 is equal to the light-emitting device 3) The number of light-emitting diode grains 34 is), and the light-emitting diode crystal grains 34 are simultaneously coated by the encapsulant 36, as shown in the tenth figure. Thereafter, the hemispherical carrier 38 and the hemispherical cover 40 are correspondingly disposed on the first plate surface 300 and the second plate surface 302 of the transparent substrate 30 to form a plurality of sets of the light-emitting devices 3. This simplifies the process and reduces costs. In actual use, the user can cut one or more light-emitting devices 3 according to requirements, and connect the circuit layers of two or more light-emitting devices 3 to form light-emitting devices arranged in a linear arrangement or an array.

In summary, the transparent substrate 30, the hemispherical carrier 38 and the hemispherical cover 40 of the light-emitting device 3 are respectively made of a transparent material, so that a part of the light emitted by the light-emitting diode crystal grains 34 directly penetrates the hemisphere. The cover 40 is outwardly transmitted, and other portions of the light emitted by the LED die 34 pass through the first plate 300 and the second plate 302 of the transparent substrate 30 to be transferred to the hemispherical carrier 38, and are hemispherical. The carrier 38 is transmitted outwardly to provide a full angle illumination.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application.

1, 1A, 1B, 1C, 3‧‧‧ lighting devices

10, 10B, 10C, 38‧‧‧ hemispherical carrier

100, 100B, 100C, 380‧‧ ‧ bearing surface

102, 102B, 102C, 382‧‧‧ first curved surface

104‧‧‧First bulge

1040‧‧‧ first surface

106B, 106C‧‧‧ Groove

12, 32‧‧‧ circuit layer

120‧‧‧Conductor

14, 34‧‧‧Light-emitting diode grains

140‧‧‧electrode

142, 342‧‧‧ wiring

16, 16B, 16C, 36‧‧‧ package colloid

160B, 160C, 202‧‧‧ fluorescent substances

18, 18C, 40‧‧‧ hemispherical cover

180, 180C, 400‧‧‧ joint surface

182, 182C, 402‧‧‧ second curved surface

184, 404‧‧ ‧ pocket

186‧‧‧second bulge

1860‧‧‧ second surface

20‧‧‧Fluorescent layer

200‧‧‧Transparent colloid

22, 22C, 30‧‧‧ transparent substrate

220, 220C‧‧‧ board

300‧‧‧ first board

302‧‧‧ second board

The first figure is an exploded perspective view of a light-emitting device according to a first embodiment of the disclosure.

The second figure is a perspective assembled view of a light-emitting device according to a third embodiment of the present disclosure.

The third figure is a cross-sectional view of a light-emitting device according to a third embodiment of the present disclosure.

The fourth figure is a cross-sectional view of a light-emitting device according to a second embodiment of the present disclosure.

Fig. 5 is a cross-sectional view showing a light-emitting device according to a third embodiment of the present disclosure.

Fig. 6 is a perspective view of a light-emitting device according to a fourth embodiment of the present disclosure.

Figure 7 is a cross-sectional view of a light-emitting device according to a fourth embodiment of the present disclosure.

Figure 8 is an exploded perspective view of a light-emitting device according to a fifth embodiment of the present disclosure.

Figure 9 is a perspective assembled view of a light-emitting device according to a fifth embodiment of the present disclosure.

Fig. 10 is a perspective view showing the illuminating device of the fifth embodiment of the present disclosure.

1‧‧‧Lighting device

10‧‧‧hemispherical carrier

100‧‧‧ bearing surface

102‧‧‧First curved surface

104‧‧‧First bulge

1040‧‧‧ first surface

12‧‧‧ circuit layer

120‧‧‧Conductor

14‧‧‧Light Emitting Diode Grains

140‧‧‧electrode

142‧‧‧ wiring

16‧‧‧Package colloid

18‧‧‧hemispherical cover

180‧‧‧ joint surface

182‧‧‧second curved surface

184‧‧ ‧ pocket

Claims (13)

The illuminating device comprises: a hemispherical carrier, a ㄧ bearing surface, a first curved surface connected to the bearing surface, and a first protruding portion connected to the bearing surface and the first curved surface intersection The first protrusion includes a first surface, the first surface and the bearing surface have the same level; a circuit layer disposed on the first surface and the bearing surface; a plurality of light emitting diode grains, and The circuit layer is electrically connected; the encapsulating colloid is coated with the light emitting diode crystal grains; and the hemispherical cover body comprises a crucible joint surface, a second arc surface connected to the joint surface, and a formation a recess that is recessed in the direction of the second arcuate surface, the hemispherical cover is coupled to the hemispherical carrier, and the bonding surface is attached to the bearing surface, the light emitting diode die and The encapsulant is located in the pocket. The illuminating device of claim 1, further comprising a fluorescing layer covering the first curved surface and the second curved surface. The illuminating device of claim 1, further comprising a fluorescent substance disposed in the encapsulant. The illuminating device of claim 1, wherein the illuminating diode dies are disposed on the bearing surface. The illuminating device of claim 1, further comprising: a transparent substrate disposed in a recess formed in the bearing surface and recessed toward the first arc surface, the LED arrays of the LEDs The encapsulant covers the transparent substrate on the transparent substrate. The illuminating device of claim 4, wherein the illuminating diode crystal grains are arranged in a matrix. The illuminating device of claim 1, wherein the hemispherical cover comprises a second protrusion formed at the junction of the joint surface and the second arc surface, the second protrusion comprising a second a surface, the circuit layer is disposed on the second surface. The illuminating device of claim 7, further comprising two transparent substrates respectively disposed in a groove formed on the bearing surface and recessed toward the first arc surface, the illuminating diode crystals The particles are respectively disposed on the transparent substrate and electrically connected to the circuit layers disposed on the first surface and the second surface, and the encapsulant covers the transparent substrates. The illuminating device of claim 8, wherein each of the transparent substrates comprises a plate surface, wherein the plate surface of one of the transparent substrates faces the first curved surface, and the surface of the other transparent substrate faces the surface The second arc surface, the light emitting diode crystal grains are respectively disposed on the surface of the plate. The illuminating device of claim 1, further comprising a plurality of wires connecting the illuminating diode dies and the circuit layer. A light emitting device comprising: a transparent substrate comprising a first plate surface and a second plate surface opposite to the first plate surface; a circuit layer disposed on the first plate surface; a plurality of light emitting diode crystal grains Provided on the first board surface and electrically connected to the circuit layer; an encapsulant covering the illuminating diode dies; the semi-spherical carrier comprising a bearing surface and a connecting surface a curved surface, the hemispherical carrier is coupled to the transparent substrate such that the bearing surface is attached to the second plate surface; and the semi-spherical cover body includes a joint surface and a second curved surface connected to the joint surface. And a recess formed in the joint surface and recessed toward the second arc surface, the hemispherical cover body is combined with the transparent substrate and corresponds to the hemispherical carrier, and the joint surface is attached to the first plate surface The light emitting diode dies and the encapsulant are located in the recess. The illuminating device of claim 11, wherein the area of the first plate surface is larger than the area of the joint surface. The illuminating device of claim 11, further comprising a plurality of wires connecting the illuminating diode dies and the circuit layer.