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TWM490053U - Touch panels - Google Patents

Touch panels

Info

Publication number
TWM490053U
TWM490053U TW103209038U TW103209038U TWM490053U TW M490053 U TWM490053 U TW M490053U TW 103209038 U TW103209038 U TW 103209038U TW 103209038 U TW103209038 U TW 103209038U TW M490053 U TWM490053 U TW M490053U
Authority
TW
Taiwan
Prior art keywords
long side
short side
bonding pad
touch panels
short
Prior art date
Application number
TW103209038U
Other languages
English (en)
Inventor
Ya-Lu Lin
Jing Yu
Yun-Cong Su
Li Huang
Original Assignee
Tpk Touch Solutions Xiamen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tpk Touch Solutions Xiamen Inc filed Critical Tpk Touch Solutions Xiamen Inc
Publication of TWM490053U publication Critical patent/TWM490053U/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Position Input By Displaying (AREA)
  • Push-Button Switches (AREA)
  • Elimination Of Static Electricity (AREA)
TW103209038U 2013-06-08 2014-05-23 Touch panels TWM490053U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310228299.1A CN104238784B (zh) 2013-06-08 2013-06-08 触控面板

Publications (1)

Publication Number Publication Date
TWM490053U true TWM490053U (en) 2014-11-11

Family

ID=52227016

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103209038U TWM490053U (en) 2013-06-08 2014-05-23 Touch panels
TW103118021A TWI524231B (zh) 2013-06-08 2014-05-23 觸控面板

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103118021A TWI524231B (zh) 2013-06-08 2014-05-23 觸控面板

Country Status (3)

Country Link
US (1) US9383875B2 (zh)
CN (1) CN104238784B (zh)
TW (2) TWM490053U (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104765481B (zh) * 2014-01-06 2019-05-28 宸鸿科技(厦门)有限公司 触控面板及其制作方法
CN106293279A (zh) * 2015-05-15 2017-01-04 宝宸（厦门）光学科技有限公司 软性电路板及其应用之自电容式触控面板
KR101827464B1 (ko) * 2015-10-06 2018-02-08 동우 화인켐 주식회사 전극 접속부 및 이를 포함하는 터치 스크린 패널
KR101903984B1 (ko) * 2015-11-25 2018-10-04 동우 화인켐 주식회사 전극 접속부 및 이를 포함하는 터치 스크린 패널
KR102146272B1 (ko) * 2016-02-19 2020-08-20 동우 화인켐 주식회사 터치 센서 및 그 제조방법
KR101842176B1 (ko) * 2017-10-27 2018-03-26 동우 화인켐 주식회사 전극 접속 구조체 및 이를 포함하는 전자 소자
CN110322782B (zh) * 2018-03-28 2021-12-07 英属开曼群岛商镎创科技股份有限公司 显示基板与显示面板
KR102424172B1 (ko) * 2018-04-25 2022-07-25 삼성디스플레이 주식회사 전자 장치
KR20210052798A (ko) * 2019-10-31 2021-05-11 삼성디스플레이 주식회사 터치 센서 및 이를 포함하는 표시 장치
CN112015299B (zh) * 2020-08-27 2023-11-28 合肥鑫晟光电科技有限公司 触控基板和触控装置
TWI773207B (zh) * 2020-11-06 2022-08-01 友達光電股份有限公司 觸控顯示裝置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158008A (ja) * 2003-11-06 2005-06-16 Matsushita Electric Ind Co Ltd タッチパネルおよびこれを用いたタッチパネル付き液晶表示装置
DE102005016751B3 (de) * 2005-04-11 2006-12-14 Schott Ag Verfahren zur Herstellung gehäuster elektronischer Bauelemente
TWI374504B (en) * 2008-09-18 2012-10-11 Chimei Innolux Corp System for displaying images and fabricating method thereof
TWM375932U (en) * 2009-05-07 2010-03-11 Wintek Corp Structure of touch control panel
TWI412107B (zh) * 2009-10-02 2013-10-11 Ind Tech Res Inst 凸塊結構、晶片封裝結構及該凸塊結構之製備方法
KR101082162B1 (ko) * 2009-12-03 2011-11-09 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치
TWI442273B (zh) * 2010-01-26 2014-06-21 Innolux Corp 觸控顯示裝置的軟性電路板結合方法及觸控顯示裝置
US20140132861A1 (en) * 2010-05-31 2014-05-15 Wintek Corporation Touch panel and touch-sensitive display device
CN101907906A (zh) 2010-08-10 2010-12-08 常州紫寅电子电路有限公司 带保护膜的金手指
TWI412972B (zh) * 2010-08-17 2013-10-21 Au Optronics Corp 觸控面板及其周邊電路
KR101314779B1 (ko) * 2010-08-18 2013-10-08 엘지디스플레이 주식회사 정전용량 방식 터치 스크린 패널 및 그 제조방법
TWI423092B (zh) * 2010-10-04 2014-01-11 Au Optronics Corp 觸控面板及其修補方法
KR101744784B1 (ko) * 2010-11-18 2017-06-09 삼성디스플레이 주식회사 터치 스크린 패널 일체형 평판표시장치
TW201243663A (en) * 2011-04-20 2012-11-01 Wintek Corp Touch display panel
KR101475106B1 (ko) * 2011-08-23 2014-12-23 엘지디스플레이 주식회사 정전용량 방식 터치 스크린 패널 및 그 제조방법
US20140320761A1 (en) * 2011-09-02 2014-10-30 Sharp Kabushiki Kaisha Touch panel and display apparatus
TWI539336B (zh) * 2011-09-06 2016-06-21 友達光電股份有限公司 觸控面板
US20130140083A1 (en) * 2011-09-20 2013-06-06 Hitachi Chemical Company, Ltd. Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheet
CN106406594B (zh) * 2011-11-27 2019-07-16 宸鸿科技(厦门)有限公司 触控感测装置及其制造方法
US20130207922A1 (en) * 2012-02-09 2013-08-15 Simon Gillmore Preventing or reducing corrosion to conductive sensor traces
CN102722276B (zh) * 2012-03-27 2015-11-25 北京京东方光电科技有限公司 触摸传感器及其制作方法、以及触摸屏液晶显示器
CN103367947A (zh) * 2012-04-10 2013-10-23 宸鸿科技(厦门)有限公司 接合结构
TWI477851B (zh) * 2012-05-22 2015-03-21 Au Optronics Corp 觸控顯示面板與觸控液晶顯示面板
US8809996B2 (en) * 2012-06-29 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Package with passive devices and method of forming the same
CN103576952B (zh) * 2012-07-24 2017-04-19 宸鸿科技(厦门)有限公司 触控面板
US20140049892A1 (en) * 2012-08-15 2014-02-20 Wintek Corporation Touch panel and touch display panel
KR101341030B1 (ko) * 2012-08-29 2013-12-13 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
CN103677368B (zh) * 2012-09-20 2016-11-23 瀚宇彩晶股份有限公司 触控面板与软性电路板的接合结构
KR20140055001A (ko) * 2012-10-30 2014-05-09 삼성전기주식회사 터치 패널용 센서 패키지 및 그 제조방법
TWI450653B (zh) * 2012-12-06 2014-08-21 Wintek Corp 接墊結構
CN203480451U (zh) * 2013-06-08 2014-03-12 宸鸿科技(厦门)有限公司 触控面板

Also Published As

Publication number Publication date
US20150355747A1 (en) 2015-12-10
TWI524231B (zh) 2016-03-01
CN104238784A (zh) 2014-12-24
TW201447686A (zh) 2014-12-16
US9383875B2 (en) 2016-07-05
CN104238784B (zh) 2018-03-02

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