TWM445182U - Active type electrostatic detecting protection device - Google Patents

Description

Active electrostatic detection protection device

The present invention relates to an electrostatic detection device, and more particularly to an active electrostatic detection protection device disposed on a semiconductor wafer sorter.

The demand for related electronic products of semiconductors is increasing. Consumers are evolving into the pursuit of light, thin, short, and small, and the electronic components are continuously shrinking. The electronic packaging technology of semiconductor wafers is also innovating. Developed breakthroughs in existing technologies to meet the needs of electronic products on the market.

Furthermore, the manufacturing cost and added value of semiconductor products are both high, and the performance of the product will be the key to affect the function of the final electronic product. Therefore, each stage of the semiconductor wafer manufacturing process and each semiconductor wafer product have layers. Testing and testing are the key to the quality of the final electronic product.

Generally speaking, the semiconductor product testing process refers to the testing process for detecting the telecommunication function and appearance of the packaged wafer after the chip packaging. The semiconductor product testing process includes on-line preparation, test machine testing, electrical sampling, label scanning, manual or machine. The operation procedure of the foot inspection, the foot inspection and the bending foot dressing, packaging, etc., wherein the Handler in the test machine test mainly determines whether the semiconductor product to be tested has been destroyed or electrostatically destroyed in the process, so-called static electricity It refers to the effect of positive or negative electricity caused by the movement of negative ions when the object is in contact with and separated, so that the semiconductor product with small volume is rejected by ElectroStatic Discharge (ESD). Electrostatic protection has become one of the problems that the semiconductor industry needs to overcome in the event of breakdown, burnout, deterioration, destruction, etc., which are destroyed and failed.

The process environment in the semiconductor industry is mostly carried out in clean rooms, and the relative humidity of the clean room environment promotes the accumulation of static electricity, so static electricity is inevitable in the clean room. There are static grounding bracelets, antistatic work shoes, ion fans, static bars, etc. In the semiconductor product testing process, the operator needs to manually or machine the semiconductor wafer from the semiconductor to be used in the test process (such as semiconductor Tray). Move to the current test process machine, wait for the semiconductor products to be tested to be tested one by one, and then move the machine from the current test process to the semiconductor Tray disk, because different test processes will use different functions. The machine processes it, so the semiconductor product will be moved to a different machine and then proceed to the next test process, while the operator's static protection during the movement is caused by personal loss or damage caused by the device itself. Electrostatic contamination of semiconductor products for semiconductors that have completed dozens or even hundreds of processes The wafer will therefore be destroyed.

Because static electricity does not disappear into the environment without any reason, as long as static electricity is generated, it will cause damage, and often the damage caused by static electricity damage may be millions or tens of millions, in order to improve the reliability of the product. And to avoid the damage caused by electrostatic damage, it is necessary to improve the practice of excluding static electricity and equipment environment in the existing test process.

Therefore, the purpose of the present invention is to provide an active electrostatic detection protection device suitable for being disposed on a semiconductor wafer sorting machine and including A host, a detection chip, a comparison circuit, a first signal conversion circuit, and an alarm circuit.

The host includes a circuit board electrically connected to the host for detecting a static value. The comparison circuit is disposed on the circuit board and is preset with a reference electrostatic value for comparison. The first signal conversion circuit is electrically connected to the detecting piece, and the static electricity value detected in the environment detected by the detecting piece is converted into a detecting signal by the first signal converting circuit, and then transmitted to the comparison. Circuit. The alarm circuit is electrically connected to the comparison circuit. When the electrostatic value of the detection signal transmitted to the comparison circuit is greater than a reference electrostatic value reference value preset by the comparison circuit, the alarm circuit is activated.

It can be seen from the above description that the beneficial effect of the present invention is that the electrostatic value of the detection signal is compared with the reference electrostatic value preset by the comparison circuit, and the electrostatic value of the detection signal is greater than the advance. When the reference electrostatic value is set, the alarm circuit is activated to remind the user and further improve the reliability of the semiconductor wafer test classification. On the other hand, the user can also perform static electricity according to different products or semiconductor wafers of different goods. The numerical requirements require that the main action be set with different electrostatic values to meet the needs of customization.

The details of the related patents and the technical contents of the present invention will be clearly described in the following detailed description of the three preferred embodiments with reference to the drawings.

Before the detailed description, it should be noted that in the present embodiment, Similar elements are denoted by the same reference numerals.

Referring to Figures 1 and 2, a first preferred embodiment of the present active electrostatic detection protection device is shown. The active electrostatic detection device is disposed on a semiconductor wafer sorter 1 and includes a host 20, a detecting chip 21, a sensing bar 22, a comparing circuit 23, and a first signal converting circuit 24. An alarm voltage setting circuit 25, a second signal conversion circuit 26, an alarm circuit 27, a memory circuit 28, and a device control circuit 29.

It should be noted here that the test process of the semiconductor wafer includes test machine test, electrical sampling test, label scanning, aging test and the like, each process uses the corresponding machine, and the semiconductor wafer sorting machine 1 is one of the test machines, and the industry in the related art also calls the semiconductor wafer sorter 1 a semiconductor wafer test sorter.

The main circuit 20 includes a circuit board 201. In the preferred embodiment, the circuit board 201 is provided with an output end. The output end of the circuit board 201 is connected to the semiconductor wafer sorter 1 for data transmission or control. And the like, wherein the output terminal may be selected from the signal transmission interface RS232 or the input/output signal control interface GBIP.

It is worth mentioning that the host 20 can be separately disposed on the semiconductor wafer sorter 1, and the host 20 can be separately set for use in detecting static electricity values required for other environmental or test purposes.

The detection device 21 is electrically connected to the host 20 and is mainly used for detecting an electrostatic value in the environment. In the first preferred embodiment, the active electrostatic detection protection device further includes a sensing bar 22, The sensing rod 22 has a bottom plate 221 and an extending plate 222 extending upward from one end of the bottom plate 221, the detecting The sheet 21 is disposed on the bottom plate 221 of the sensing rod 22, and the extending plate 222 is provided with a long slot 223 through which the fixing member such as a common screw passes through the long slot 223 to cooperate with the semiconductor wafer sorting machine. 1 fixed together. It should be noted here that the sensing bar 22 can have different shapes and should not be limited to the first preferred embodiment.

At least one or more ion fans 11 are generally disposed in the conventional semiconductor wafer sorter 1. The ion fan 11 mainly generates ions by the principle of tip discharge, and the ion fan 11 has a plurality of electrodes with pointed ends. The electrode is connected to a high voltage, and ionizes air, moisture, dust, etc. near the tips to become positively and negatively charged ions, and static electricity in the environment is conducted by the ion fan 11 via the ionized air. To the earth, or to attract ions of opposite polarity in the ionized air to neutralize.

The active electrostatic detecting device of the present invention is fixed to the ion fan 11 in the semiconductor wafer sorting machine 1 by using the long slot 223 provided in the extension plate 222, and the detecting piece 21 can be fixedly located. In front of the ion fan 11, the purpose is to monitor whether the ion fan 11 can effectively neutralize static electricity in the environment, prevent the ion fan 11 from failing, and cause static electricity to damage the semiconductor wafer, thereby improving the reliability of the semiconductor wafer sorter 1.

It is to be noted that the active electrostatic detection protection device may be disposed in the semiconductor wafer sorter 1 and placed in the semiconductor device, in addition to being fixed to the ion fan 11 in the semiconductor wafer sorter 1. The periphery of the wafer is used to detect whether the electrostatic value of the environment in which the semiconductor wafer is located meets the standard.

The comparison circuit 23 is disposed on the circuit board 201, and is mainly responsible for command, operation comparison, coordination, and control of mutual operation and data transmission between components on the circuit board 201, for example, directing actions and operating procedures between components. Coordination and other work.

The first signal conversion circuit 24 is electrically connected to the detection chip 21 for converting the electrostatic value in the environment detected by the detection chip 21 to the detection signal A via the first signal conversion circuit 24, It is then transmitted to the comparison circuit 23. In the first preferred embodiment, the first signal conversion circuit 24 further includes a voltage display 241 for displaying the electrostatic value detected by the detection chip 21 and converted by the first signal conversion circuit 24, The voltage display 241 is disposed outside the host 20, and the user can conveniently read the detected electrostatic value from the voltage display 241.

The alarm voltage setting circuit 25 is disposed on the circuit board 201 and electrically connected to the second signal conversion circuit 26, and includes a setter 251 electrically connected to the circuit board 201 for externally setting the desired monitoring. The electrostatic value. The setter 251 has a plurality of input buttons, and the user can input the maximum allowable electrostatic value of each batch or different types of semiconductor chips through the simple operation setting of the setter 251 to meet the quality requirements of the customer.

Here, it should be noted that the comparison circuit 23 may also preset a reference electrostatic value for comparison. When the detection signal A transmitted to the comparison circuit 23 has a static value greater than that preset in the comparison circuit 23 When the electrostatic value (reference value) is referred to, the alarm circuit 27 is also driven to operate. Thus, the alarm voltage setting circuit 25 and the second signal conversion circuit are not required. 26, only, as a result, it is impossible to change the amount of static electricity to be monitored at any time, depending on the actual needs of the industry, and should not be limited to this.

The second signal conversion circuit 26 is electrically connected to the alarm voltage setting circuit 25, and the electrostatic value input by the user on the setter 251 is converted into a setting signal B via the second signal conversion circuit 26, and then transmitted to the In the comparison circuit 23, the comparison circuit 23 can be compared with the detection signal A converted by the first signal conversion circuit 24 by the electrostatic value detected by the detection slice 21 in the environment.

The alarm circuit 27 is disposed on the circuit board 201 and electrically connected to the comparison circuit 23. When the electrostatic value of the detection signal A transmitted to the comparison circuit 23 is greater than the electrostatic value of the setting signal B, the comparison circuit 23 The next command is given to the alarm circuit 27 to operate. It should be noted that the warning method issued by the alarm circuit 27 may be an audible buzzer or an illuminator capable of emitting a light source, and is not limited to the first preferred embodiment.

The memory circuit 28 is also disposed on the circuit board 201 and electrically connected to the comparison circuit 23. The electrostatic value transmitted to the comparison circuit 23 is recorded and stored in the memory circuit 28, and the user can It is required to obtain the electrostatic value of the detection signal A and the setting signal B by accessing the data stored in the memory circuit 28.

The device control circuit 29 is electrically connected to the comparison circuit 23 and can transmit a control signal to the semiconductor wafer sorter 1. When the electrostatic value of the detection signal A is greater than the electrostatic value of the setting signal B, the comparison circuit 23 sends a lower command to the device control circuit 29, and is controlled by the device control circuit 29. The connected semiconductor wafer sorter 1 is stopped to prevent excessive electrostatic values from damaging more semiconductor wafers entering the semiconductor wafer sorter 1.

It is worth mentioning that the user analyzes the activation of the control switch of the device control circuit 29 or the data stored in the memory circuit 28 to stop the actuation process, and the electrostatic value transmitted to the comparison circuit 23 and records and stores it. The data in the memory circuit 28 is compared and analyzed to calculate the electrostatic value data of the various semiconductor wafers of the semiconductor wafer sorting machine 1 to know the occurrence of the defective rate.

Referring to FIG. 3, a second preferred embodiment of the active electrostatic detection device of the present invention is substantially the same as the first preferred embodiment, and the details are not described herein again. The active electrostatic detection protection device further includes a network storage device 7.

In the second preferred embodiment, the network storage device 7 is electrically connected to the device control circuit 29 of the host 20, and the electrostatic value transmitted to the comparison circuit 23 is recorded and stored via the device control circuit 29. In the network storage device 7, the network storage device 7 can be a network attached storage (NAS), and the user does not need to limit the environment used, and the active device can be used through the network. The electrostatic value data of the electrostatic detection protection device is used for storage, reading, printing or sharing. At the same time, it should be noted that the network storage device 7 can also have other different aspects, such as a network server, and the like, and should not be limited to the second preferred embodiment.

In the second preferred embodiment, since the network storage is already available The device 7 can store the electrostatic value data. Therefore, the setting of the memory circuit 28 in the host 20 can be cancelled in actual implementation to save costs, depending on the use environment, and should not be limited thereto.

Referring to FIG. 4, a third preferred embodiment of the present invention is substantially the same as the first preferred embodiment, and the same is not described herein again. The semiconductor wafer sorter 1 has a memory storage unit 12.

In the third preferred embodiment, the memory storage unit 12 is electrically connected to the device control circuit 29 of the host 20 through the semiconductor wafer sorter 1, and the electrostatic value transmitted to the comparison circuit 23 is passed through the device. The control circuit 29 is recorded and stored in the memory storage unit 12 in the semiconductor wafer sorting machine 1. If the memory circuit 28 is damaged, the required electrostatic value data can be searched through the memory storage unit 12 to achieve completeness. The appeal of backup.

Similarly, in the third preferred embodiment, since the electrostatic value in the comparison circuit 23 is recorded and stored in the memory storage unit 12 in the semiconductor wafer sorter 1, the actual implementation can also cancel the The setting of the memory circuit 28 in the host 20 is cost-effective, depending on the usage environment, and should not be limited thereto.

In summary, the active electrostatic detection device of the present invention can be effectively improved on the semiconductor wafer sorting machine 1 by being disposed on the semiconductor wafer sorting machine 1 due to human error or electrostatic pollution caused by the device itself. Corrupted, and compared with the electrostatic value of the detection signal A transmitted to the comparison circuit 23 and the set signal B, it is possible to meet the needs of the customer. It is required to change the setting of the electrostatic value of the different semiconductor wafers. Further, the comparison circuit 23 controls the alarm circuit 27 to issue an alarm and the device control circuit 29 controls the semiconductor wafer sorter 1 to stop, and the semiconductor production status can be immediately controlled. In order to reduce the waste caused by the non-performing rate, it is more convenient to provide the memory circuit 28, the network storage device 7, and the memory storage unit 12, and the like, which can read and store the static value at any time. The user can do a good job of storage, so it is indeed possible to achieve the purpose of this new type.

However, the above is only the three preferred embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change made by the novel patent application scope and the new description content is Modifications are still within the scope of this new patent.

1‧‧‧Semiconductor wafer sorter

11‧‧‧Ion fan

12‧‧‧Memory storage unit

20‧‧‧Host

201‧‧‧ circuit board

21‧‧‧Detection

22‧‧‧Scepter

221‧‧‧floor

222‧‧‧ Extension board

223‧‧‧Long slot

23‧‧‧Comparative circuit

24‧‧‧First signal conversion circuit

241‧‧‧Voltage display

25‧‧‧Alarm voltage setting circuit

251‧‧‧Setter

26‧‧‧Second signal conversion circuit

27‧‧‧Alarm circuit

28‧‧‧ memory circuit

29‧‧‧Device Control Circuit

7‧‧‧Network storage devices

A‧‧‧Detection signal

B‧‧‧Set signal

1 is a block diagram showing a first preferred embodiment of the present active electrostatic detection protection device; FIG. 2 is a perspective view showing an ion fan, a detection sheet, and a semiconductor wafer sorter; FIG. 3 is a block diagram showing a second preferred embodiment of the active active electrostatic detection protection device; and FIG. 4 is a block diagram showing the active electrostatic detection of the present invention. A third preferred embodiment of the guard.

20‧‧‧Host

201‧‧‧ circuit board

21‧‧‧Detection

22‧‧‧Scepter

23‧‧‧Comparative circuit

24‧‧‧First signal conversion circuit

241‧‧‧Voltage display

25‧‧‧Alarm voltage setting circuit

251‧‧‧Setter

26‧‧‧Second signal conversion circuit

27‧‧‧Alarm circuit

28‧‧‧ memory circuit

29‧‧‧Device Control Circuit

A‧‧‧Detection signal

B‧‧‧Set signal

Claims (10)

An active electrostatic detection protection device is disposed on a semiconductor wafer sorting machine, and includes: a host, including a circuit board; and a detecting piece electrically connected to the host, for detecting static electricity values; a comparison circuit disposed on the circuit board; a first signal conversion circuit electrically connected to the detection chip and disposed on the circuit board, configured to detect static electricity in the environment by the detection chip The value is converted into a detection signal by the first signal conversion circuit, and then transmitted to the comparison circuit; an alarm circuit electrically connected to the comparison circuit and disposed on the circuit board, when transmitted to the comparison circuit The alarm circuit is activated when the measured signal static value is greater than the preset reference value. The active anti-detection protection device according to the first aspect of the invention, wherein the first signal conversion circuit has a voltage display for detecting the detection by the detection chip and passing through the first signal conversion circuit. The static value of the conversion. The active static electricity detecting device according to claim 2, further comprising a sensing bar having a bottom plate and an extending plate extending upward from an end of the bottom plate, wherein the extending plate is provided with a long groove a hole for fixing to the sorting machine, and the detecting piece is disposed on the bottom plate of the sensing rod. The active electrostatic detection protection device according to claim 3 of the patent application scope further includes a device control circuit, and the device control circuit is compared with the device The circuit is electrically connected to control the semiconductor wafer sorter to stop operating. The active electrostatic detection protection device according to claim 4, further comprising a memory circuit disposed on the circuit board, wherein the electrostatic value transmitted to the comparison circuit is recorded and stored in the memory Inside the circuit. The active electrostatic detection protection device according to claim 5, further comprising an alarm voltage setting circuit and a second signal conversion circuit, the alarm voltage setting circuit comprising a setter electrically connected to the circuit board The second signal conversion circuit is electrically connected to the setter, and the electrostatic value set by the setter is converted into a set signal by the second signal conversion circuit, and then transmitted to the The comparison circuit compares with the detection signal. The active static electricity detecting device according to claim 1 or 6 further includes a network storage device electrically connected to the host, and the electrostatic value transmitted to the comparing circuit is recorded and stored in The network storage device. The active electrostatic detection protection device according to claim 7, wherein the alarm circuit is a buzzer capable of emitting a warning sound. The active electrostatic detection protection device according to claim 8 , wherein the alarm circuit is an illuminator capable of emitting a light source. The active electrostatic detection protection device according to claim 1 or 6, wherein the semiconductor wafer sorter has a memory storage unit, and the electrostatic value transmitted to the comparison circuit is recorded and stored. In the memory storage unit.