M382625 五、新型說明： 【新型所屬之技術領域】 本創作涉及-種電連接器及其導電端子，尤其涉及以電性連接 晶片模組與電路板之電連接器及其導電端子。 【先前技術】 與本創作相關之電連接器及其導電端子，用以電性連接晶片模組與電 路板’如美國專利公告第7264486號所揭示。該電連接器包括絕緣本體及 . 複數容設於絕緣本體中之導電端子。絕緣本體通常係由液晶聚合物(Liquid • CiyStal P〇lymer，LCP)材料製成，其上設有複數收容導電端子之端子收容 槽。導電端子包括板狀固持部、由固持部上端向上延伸設置之彈性臂及由 固持部下端向ff折延伸設置並呈水平板麟造之焊接部。焊接部與固持 部呈「J」型設置’其底部可與錫球焊接。彈性臂末端設有可與晶片模組 導接之接觸部。電連接器可藉設於彈性臂末端之接觸部與晶片模組導接， 藉錫球將導電端子之焊接部焊接於電路板上，實現晶片模組與電路板之電 性連接。 上述電連接器雖藉導電端子之焊接部焊接於電路板上實現與電路板 之電性導通，惟，導電端子之焊接部係由固持部向下延伸設置會造成導 電端子之整體高度較高，無法滿足電連接n之低高度發展趨勢；另，電連 接器之絕緣本趙係由LCP材料製成，而電路板通常採用纖維樹脂製成， .#將^接器焊接於電路板上時會S絕緣本趙受熱向上_程度大於電 路板受熱向上料程度’而造成縣本體㈣處導電端子未與電路板焊接 現象即空焊，進而影響電連接純電路板之間電性連接。 鑒於此確有必要提供一改進之電連接器及其導電端子，以克服先前 技術存在之缺陷。 【新型内容】 本創作之目的係提供一種電連接器及其導電端子，可確保電連接器盘 電路板處於良好電性連接，且滿足電連接器低高度發展之趨勢。 5 M382625 本創作之電連接器藉以下技術方案實現：一種電連接器，用以電性連 接晶f模組與電路板，其包括縣本體及複數收容於絕緣本體中之導電端 :。絕緣本體上設有複數端子收容孔。導電舒收容於絕緣本體之端子收 合孔中’其包括基部、由基部之兩侧向上延伸設置之—細持部由基部 向上彎折延伸設置之彈性臂及由基部向下延伸設置之一對倒鉤。土。 本創作之導電端子藉以下技術方案實現：一種導電端子，包括基部、 由基部兩側向上延伸設置之一對固持部、由基部向上彎折延伸設置^彈性 臂及由基部向下延伸設置之一對倒釣。 相較於先前技術，本創作之電連接器藉由導電端子之基部向下延伸設 置之倒鉤卡扣於絕緣本體上，將導電端子固持於絕緣本體上，並可藉倒鉤 焊接於電路板上實現電連接器與電路板間電性導通，且可降低導電端子高 度’使電連接器滿足低高度發展趨勢》 【實施方式】 請參閱第一圖至第七圖所示，本創作為一種電連接器1〇〇，用以電性 連接晶片模組(未圖示)與電路板3，其包括絕緣本體1及複數收容於絕緣 本體1申之導電端子2。 请重點參閱第一圖至第五圖所示，絕緣本體丨大致呈矩形薄板狀構 造，係由具有導電層之玻纖板製成，其受熱翹曲程度與電路板3之受熱翹 曲程度接近。絕緣本體1設有複數傾斜排列之端子收容孔1〇，用於收容導 電端子2。端子收容孔1〇大致呈「τ」型構造，係沿絕絕緣本體對角線 方向設置，其包括狭長狀固持槽1〇1及與固持槽101 一側相连通之收容槽 102。固持槽ιοί係貫穿絕緣本體1之上、下表面設置，用以將導電端子2 固持於絕緣本體1中。收容槽102係由絕緣本體1之上表面向下凹陷形成， 其底面1020高於絕緣本體1之下表面’用於承接導電端子2之相應部位。所 述固持槽101與收容槽102呈台階狀設置，固持槽ι〇1位於收容槽1〇2之底面 1020所在平面下之内壁上鍍設有金屬層1〇3。絕緣本體丨之下表面還向下凸 伸設有複數半圓形墊片104。墊片1〇4設於收容槽102之正下方，其上鍍設 6 M38^625 有金屬層103，可與錫球4焊接。墊片i〇4之矩形橫截面1040朝向固持槽101 設置。所述絕緣本體1之下表面位於固持槽1〇1附近區域均鍍設有金屬層 103。 請重點參閱第一圖至第三圖及第六圖所示，導電端子2係由金屬導電 材料製成’其包括板狀基部20、由基部20頂端中部向上弯折延伸設置之彈 性臂21、由基部20之頂端兩侧向上延伸設置之一對固持部22及設於基部2〇 兩旁側之倒刺23。彈性臂21收容於絕緣本體1之收容槽102中，包括由基部 20向上彎折延伸設置之第一臂部210及由第一臂部21〇斜向上延伸設置之 第二臂部211。第一臂部210大致呈「Ω」型狀構造，係由基部2〇之頂端先 朝遠離基部20所在豎直平面彎折後再朝向基部2〇所在豎直平面延伸設 置。第一臂部210可承接於絕緣本體1之收容槽102之底面1020上，以防止 導電端子2過度向下滑動脫離絕緣本體1。第二臂部211之末端設有接觸部 24 ’可與晶片模組(未圖示)之導電片接觸。固持部22係由基部2〇之兩側豎 直向上延伸設置，可收容於絕緣本體1之固持槽1〇1中。所述固持部22位於 所述彈性臂21之兩側。倒刺23係設於基部20靠近下端之兩側位置處，可與 絕缘本體1之固持槽101之相應壁面干涉配合，以將導電端子2固定於絕緣 本體1中。導電端子還包括由基部20之底端兩側豎直向下延伸設置之一對 倒鉤25。所述倒鉤25位於固持部22之正下方，可卡扣於絕緣本體i之下表 面上，用以將導電端子2穩定固持於絕緣本體1上，防止導電端子2於端子 料帶折斷時脫出絕緣本體1。所述倒鉤25具有傾斜之導引面25〇，可引導導 電端子2卡扣於絕緣本體1之下表面上。所述基部2〇、固持部22及倒鉤25 均位於同一豎直平面内。 組裝時，首先將導電端子2自上而下組入絕緣本體1之端子收容孔1〇 中。此時，導電端子2之彈性臂21收容於絕緣本體丨之收容槽1〇2中，導電 端子2之第一臂部210承接於收容槽1〇2之底面1〇2〇上。導電端子2之接觸部 24伸出絕緣本體1之上表面外。導電端子2之固持部22收容於絕緣本體1之 固持槽101中，倒刺23干涉卡固於絕緣本體1之固持槽1〇1之相應壁面上， 倒鉤25於導引面250之引導下卡固於絕緣本體丨之下表面上。同時，倒鉤25 7 M382625 之一側面抵接於墊片104之橫截面1040上’用以於錫球4受熱溶化時便於錫 流入倒鉤25附近與金屬層1〇3區域，使導電端子2與金屬層1〇3相互焊接達 到固持導電端子之目的。接著將錫球4焊接於絕緣本體丨之墊片1〇4上。 組装好後，電連接器100可藉伸出絕緣本體丨上表面之導電端子2之接 觸部24與晶片模組(未圖示)之導電另導接，藉設於絕緣本體i之塾片1〇4上 之锡球4將導電端子2之倒釣25焊接於電路板3上，實現晶片模組(未圖示) 與電路板3之電性連接。 本創作藉導電端子2之倒鉤2將導電端子2固持於絕緣本體1上，無需由 基部20向下彎折延伸「j」型焊接部，可降低導電端子2之高度進而降低 • 冑連接器1GG之高度，使電連接器1⑻献低高度發展之趨勢；且倒鉤25 卡扣於絕緣本體1之下表面上，可防止導電端子2於料帶崎時脫出絕緣本 體1。電連接器100還可藉設於絕緣本體i上之收容槽1〇2承接導電端子2之 第-臂部211，將導電端子2定位於絕緣本體lt，防止導電端子2過度下滑 脫離絕緣本體1 H緣本奶制具有導電狀玻製成，其受熱勉 曲程度與電路板3之受熱赵曲程度接近，可防止絕緣本體又與電路板阳麵 曲變形程度過大引起導電端子2出現空焊現象，進而保證電連接器ι〇〇與電 路板3處於良好電性連接狀態。 綜上所述，本創作符合新型專利要件，爰依法提出專利申請。惟以 • i所述者僅為本創作之較佳實施例，本創作之範圍並不以上述實施例為 限’舉凡熟習本案技藝之人士援依本解之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第一圖係本創作之電連接器與錫球之立體組合圖； 第二圖係本創作電連接器與錫球之另一視角之立體組合圖； 第三圖係第一圖所示之電連接器之立體分解圖； 第四圊係本創作電連接器之絕緣本體之立體圖； 第五圖係本創作電連接器之絕緣本體之另-視角立體圖； 8 M382625 第六圖係本創作之電連接器之導電端子之立體圖； 第七圖係本創作之電連接器與電路板受熱後之局部剖面示意圖。 【主要元件符號說明】M382625 V. New description: [New technical field] This creation involves a kind of electrical connector and its conductive terminal, especially the electrical connector and its conductive terminal for electrically connecting the chip module and the circuit board. [Prior Art] The electrical connector and its conductive terminals associated with the present invention are used to electrically connect the chip module to the circuit board as disclosed in U.S. Patent No. 7,264,486. The electrical connector includes an insulative housing and a plurality of electrically conductive terminals received in the insulative housing. The insulating body is usually made of a liquid crystal polymer (LCP) material, and is provided with a plurality of terminal receiving grooves for accommodating the conductive terminals. The conductive terminal comprises a plate-shaped holding portion, an elastic arm extending upward from the upper end of the holding portion, and a welded portion extending from the lower end of the holding portion to the ff and formed in a horizontal plate. The welded portion and the holding portion are arranged in a "J" shape, and the bottom portion thereof can be welded to the solder ball. The end of the elastic arm is provided with a contact portion that can be guided to the wafer module. The electrical connector can be connected to the wafer module through a contact portion at the end of the elastic arm, and the soldering portion of the conductive terminal is soldered to the circuit board by the solder ball to electrically connect the chip module and the circuit board. The electrical connector is electrically connected to the circuit board by soldering the soldering portion of the conductive terminal, but the soldering portion of the conductive terminal is extended downward from the holding portion, so that the overall height of the conductive terminal is high. The low-level development trend of the electrical connection n cannot be satisfied; in addition, the insulation of the electrical connector is made of LCP material, and the circuit board is usually made of fiber resin, and the soldering of the connector is performed on the circuit board. S insulation Ben Zhao is heated up _ degree is greater than the degree of heat transfer of the circuit board', resulting in the welding of the conductive terminals of the county body (4) is not soldered, which affects the electrical connection between the pure circuit boards. In view of this it is indeed necessary to provide an improved electrical connector and its conductive terminals to overcome the deficiencies of the prior art. [New content] The purpose of this creation is to provide an electrical connector and its conductive terminals, which ensure that the electrical connector circuit board is in good electrical connection and meet the trend of low connector height development. 5 M382625 The electrical connector of the present invention is realized by the following technical solution: an electrical connector for electrically connecting the crystal module and the circuit board, which comprises a county body and a plurality of conductive ends received in the insulating body: A plurality of terminal receiving holes are formed on the insulating body. The conductive cover is received in the terminal folding hole of the insulative housing. The utility model comprises a base portion extending upward from both sides of the base portion. The elastic portion of the holding portion extending from the base portion and extending downwardly from the base portion Barb. earth. The conductive terminal of the present invention is realized by the following technical solution: a conductive terminal, comprising a base portion, a pair of extending portions extending upward from both sides of the base portion, a bending portion extending from the base portion, an elastic arm, and one of extending downward from the base portion Pair fishing. Compared with the prior art, the electrical connector of the present invention is fastened to the insulating body by a barb extending downward from the base of the conductive terminal, and the conductive terminal is fixed on the insulating body, and can be soldered to the circuit board by barbs. The electrical connection between the electrical connector and the circuit board is realized, and the height of the conductive terminal can be reduced to make the electrical connector meet the trend of low height. [Embodiment] Referring to the first to seventh figures, the present invention is a The electrical connector 1 is configured to electrically connect the chip module (not shown) and the circuit board 3, and includes an insulative housing 1 and a plurality of conductive terminals 2 received in the insulative housing 1 . Please refer to the first to fifth figures, the insulating body 丨 is generally in the shape of a rectangular thin plate, which is made of a fiberglass plate with a conductive layer, and the degree of warpage of the insulating body is close to the degree of thermal warpage of the circuit board 3. . The insulative housing 1 is provided with a plurality of terminal receiving holes 1〇 arranged obliquely for receiving the conductive terminals 2. The terminal receiving hole 1 has a substantially "τ" type structure and is disposed along the diagonal direction of the insulating body. The terminal receiving hole 1 includes an elongated holding groove 1〇1 and a receiving groove 102 communicating with the holding groove 101 side. The holding groove ιοί is disposed through the upper surface and the lower surface of the insulating body 1 for holding the conductive terminal 2 in the insulating body 1. The receiving groove 102 is formed by recessing the upper surface of the insulating body 1 , and the bottom surface 1020 is higher than the lower surface of the insulating body 1 for receiving the corresponding portion of the conductive terminal 2 . The holding groove 101 and the receiving groove 102 are arranged in a stepped manner, and the inner wall of the holding groove ι1 located under the plane of the bottom surface 1020 of the receiving groove 1〇2 is plated with a metal layer 1〇3. A plurality of semicircular spacers 104 are also protruded downwardly from the lower surface of the insulating body. The spacer 1〇4 is disposed directly under the receiving groove 102, and is plated with a metal layer 103 of 6 M38^625, which can be soldered to the solder ball 4. The rectangular cross section 1040 of the spacer i〇4 is disposed toward the holding groove 101. A metal layer 103 is plated on the lower surface of the insulating body 1 in the vicinity of the holding groove 1〇1. Referring to the first to third and sixth figures, the conductive terminal 2 is made of a metal conductive material, which includes a plate-like base 20, and an elastic arm 21 which is bent upwardly from the top end of the base 20 and is extended upward. One of the pair of holding portions 22 and the barbs 23 provided on both sides of the base portion 2 are extended upward from both sides of the top end of the base portion 20. The elastic arm 21 is received in the receiving groove 102 of the insulative housing 1 and includes a first arm portion 210 extending upwardly from the base portion 20 and a second arm portion 211 extending obliquely upward from the first arm portion 21. The first arm portion 210 has a substantially "Ω"-shaped configuration, and the tip end of the base portion 2 is first bent away from the vertical plane of the base portion 20 and then extended toward the vertical plane of the base portion 2''. The first arm portion 210 can be received on the bottom surface 1020 of the receiving slot 102 of the insulative housing 1 to prevent the conductive terminal 2 from sliding excessively downward from the insulative housing 1. The end of the second arm portion 211 is provided with a contact portion 24' which is in contact with a conductive sheet of a wafer module (not shown). The holding portion 22 is vertically extended from both sides of the base portion 2, and can be received in the holding groove 1〇1 of the insulative housing 1. The holding portion 22 is located on both sides of the elastic arm 21. The barbs 23 are disposed at positions on both sides of the base 20 near the lower end, and can interfere with the corresponding wall surfaces of the holding grooves 101 of the insulative housing 1 to fix the conductive terminals 2 in the insulating body 1. The conductive terminal also includes a pair of barbs 25 extending vertically downward from opposite sides of the bottom end of the base 20. The barbs 25 are located directly under the holding portion 22 and can be fastened to the lower surface of the insulative housing i for stably holding the conductive terminals 2 on the insulative housing 1 to prevent the conductive terminals 2 from being taken off when the terminal strips are broken. The insulating body 1 is taken out. The barb 25 has an inclined guiding surface 25A for guiding the conductive terminal 2 to be buckled on the lower surface of the insulative housing 1. The base 2〇, the retaining portion 22 and the barbs 25 are all located in the same vertical plane. When assembling, the conductive terminals 2 are first assembled into the terminal receiving holes 1 of the insulative housing 1 from top to bottom. At this time, the elastic arm 21 of the conductive terminal 2 is received in the receiving groove 1〇2 of the insulating body, and the first arm portion 210 of the conductive terminal 2 is received on the bottom surface 1〇2 of the receiving groove 1〇2. The contact portion 24 of the conductive terminal 2 protrudes beyond the upper surface of the insulative housing 1. The holding portion 22 of the conductive terminal 2 is received in the holding slot 101 of the insulative housing 1 , and the barbs 23 interfere with the corresponding wall surface of the holding slot 1 〇 1 of the insulative housing 1 , and the barbs 25 are guided by the guiding surface 250 . The card is fastened to the lower surface of the insulating body. At the same time, one side of the barb 25 7 M382625 abuts on the cross section 1040 of the spacer 104 for facilitating the flow of tin into the vicinity of the barb 25 and the metal layer 1〇3 when the solder ball 4 is heated and melted, so that the conductive terminal 2 The metal layer 1〇3 is soldered to each other to achieve the purpose of holding the conductive terminals. Next, the solder ball 4 is soldered to the spacer 1〇4 of the insulating body. After being assembled, the electrical connector 100 can be electrically connected to the chip module (not shown) through the contact portion 24 of the conductive terminal 2 on the upper surface of the insulating body, and the semiconductor device 100 can be attached to the insulating body i. The solder balls 4 on the first and fourth sides are soldered to the circuit board 3 by the solder balls 25 of the conductive terminals 2 to electrically connect the chip modules (not shown) to the circuit board 3. The present invention holds the conductive terminal 2 on the insulative housing 1 by the barbs 2 of the conductive terminal 2, and does not need to be bent downwardly from the base portion 20 to extend the "j" type soldering portion, thereby reducing the height of the conductive terminal 2 and thereby reducing the connector. The height of 1GG makes the electrical connector 1 (8) have a tendency to develop at a low height; and the barbs 25 are snapped onto the lower surface of the insulative housing 1 to prevent the conductive terminal 2 from coming out of the insulative housing 1 when the strip is in the strip. The electrical connector 100 can also receive the first arm portion 211 of the conductive terminal 2 through the receiving slot 1 2 on the insulative housing i, and position the conductive terminal 2 on the insulating body lt to prevent the conductive terminal 2 from sliding excessively off the insulating body 1 The H-edge milk system is made of conductive glass, and the degree of heat distortion is close to the degree of heat distortion of the circuit board 3, which can prevent the insulation body from being deformed too much with the positive surface of the circuit board, causing the welding of the conductive terminal 2 In turn, the electrical connector ι is in good electrical connection with the circuit board 3. In summary, this creation is in line with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and the equivalent modifications or changes made by those who are familiar with the skill of the present invention in accordance with the spirit of the present solution are All should be covered by the following patent application. [Simple diagram of the diagram] The first diagram is a three-dimensional combination diagram of the electrical connector and the solder ball of the present invention; the second diagram is a three-dimensional combination diagram of the other perspective of the present electrical connector and the solder ball; An exploded perspective view of the electrical connector shown in the figure; a fourth perspective view of the insulative body of the present electrical connector; and a fifth perspective view of the insulative body of the present electrical connector; 8 M382625 The figure is a perspective view of the conductive terminal of the electrical connector of the present invention; the seventh figure is a partial cross-sectional view of the electrical connector and the circuit board of the present invention after being heated. [Main component symbol description]
電連接器 100 絕緣本體 1 端子收容孔 10 固持槽 101 收容槽 102 底面 1020 金屬層 103 墊片 104 橫截面 1040 導電端子 2 基部 20 彈性臂 21 第一臂部 210 第二臂部 211 固持部 22 9 M382.625 倒刺 23 接觸部 24 倒鉤 25 導引面 250 電路板 3 4 錫球Electrical connector 100 Insulating body 1 Terminal receiving hole 10 Holding groove 101 Receiving groove 102 Bottom surface 1020 Metal layer 103 Gasket 104 Cross section 1040 Conductive terminal 2 Base 20 Elastic arm 21 First arm 210 Second arm 211 Holding portion 22 9 M382.625 Barbs 23 Contact 24 Barbs 25 Guide surface 250 Circuit board 3 4 Tin ball