M344028 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種電腦機箱，特別是指一種具有散 熱裝置的電腦機箱。 【先前技術】 電腦的功效日益強大，對性能的要求越來越高，所以 ' m腦的中央處理器以及—些如硬碟機、光碟機等相關零件 的效能也越來越高。但是，隨著效能提高而來的就是元件 > 產生的熱也越來越多 為達成散熱方面的需求，一般電腦主機的散熱方式是 以風扇將冷空氣帶入機殼中或將熱空氣帶離機殼，並搭配 虞。又於發熱元件上的散熱器加以散熱，利用空氣的強制對 流將熱帶出機殼。此外，機殼上也常設置有複數孔洞來增 加機殼内外的空氣對流。 上述的方式，由於發熱元件所產生的熱是藉由散熱器 .傳遞至機殼内的空氣中，之後才利用風扇所產生的強制對 流將熱排出機殼外，由於產生的熱會先存在於機殼内一段 時間，於是發熱元件所產生的熱將會使機殼内的空氣溫度 升高’影響中央處理器等元件之性能。 【新型内容】 因此’本新型之一目的，即在提供一種可以提高散熱 效能的電腦機箱。 本新型之另一目的，即在提供一種可以提高散熱效能 的散熱裝置。 5 M344028 於是’本新型具有散熱裝置的電腦機箱是包含一中空 機殼、一電路板及一散熱裝置。 該中空機殼之一側形成有一穿孔。該電路板裝設於該 機殼相反於該穿孔之一側的内側，且安裝有至少一發熱元 件。該散熱裝置包括一罩體、一導熱件及一風扇。 該罩體安裝於該機殼内，且界定出一開口面對該機殼 之穿孔的容置空間。該導熱件具有一與該發熱元件相接觸 的升溫部及一遠離該升溫部的降溫部，該降溫部穿置於該 容置空間且與該升溫部位於該罩體之二相反侧。該風扇設 置於該罩體的容置空間内，供吸入氣體且使氣體將經由該 導熱件傳導至該容置空間内的熱透過該穿孔帶出。 較佳地，該罩體具有一與該機殼形成有該穿孔之一側 相間隔的基壁，及一自該基壁外周緣向該穿孔方向延伸並 與該基壁相配合界定出該容置空間的外圍繞壁，該降溫部 穿設於該基壁.。 較佳地，該散熱裝置更包括一設置於該容置空間内的 散熱件，該散熱件具有一位於該外圍繞壁内侧且與該某壁 相連接的内圍繞壁，及複數連接於該内圍繞壁外側的·铸片 ，該降溫部設置於該内圍繞壁所圍繞界定出之空間内且與 該内圍繞壁内侧相接觸。 較佳地，該等鰭片自該内圍繞壁外側相間隔地朝該外 圍繞壁延伸。 較佳地，該風扇裝設於該内圍繞壁遠離該基壁之一端 6 M344028 教佳地，該散熱裝置更包括—覆蓋於該風扇遠離該内 繞壁之—端的端蓋’該端蓋形成有複數供該風扇進氣的 孔洞。 較佳地’該導熱件㈣巾空餘有導熱流體，且更具 ，一限制該導熱流體往單方向循環流動之單㈣、一高溫 部及-低溫部，該導熱件之升溫部、高溫部、降溫部與低 溫部沿循環方向依序㈣m部呈平板狀，且平貼接 觸該發熱元件。該降溫部呈螺旋狀。 較佳地，該導熱件亦可由易導熱的材質製成，且更具 有一連接該升溫部與該降溫部的傳導部。該升溫部、該傳 導部及該降溫部為一體成型的實心圓柱體。該導熱件更具 有一覆盍於該發熱元件的蓋體，該升溫部穿設於該蓋體而 與該發熱元件的中央部分相接觸。 而本新型政熱裝置即為該「具有散熱裝置的電腦機箱 」中的散熱裝置。 本新型之功效·藉由該罩體的隔絕設計，使其容置空 間只與外界相連通，加上該降溫部與該升溫部分別位於該 罩體之二相反側，使該發熱元件所產生的熱藉由該導熱件 導至該罩體的容置空間内之該等鰭片上，並由該風扇於該 谷置空間内造成的強制對流將熱散出。如此，可快速地將 該發熱元件所產生的熱導出電腦機箱外，提高散熱效能。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 M344028 清楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖1、圖2及圖3,本新型具有散熱裝置的電腦機 相之苐^一較佳實施例包含一中空機殼1、一電路板2及一散 熱裝置3。 ★ 機殼1包括位於二相反側的一第一侧板U與一第二側 Λ 板12，及一位於第一側板Η内側供散熱裝置3安裝的安裝 > 板13。第一侧板U及安裝板13彼此平行，其上分別形成 有孔徑約略相同且位於相對應位置的一穿孔ln及一穿孔 131。此外，第一側板U更形成有一自穿孔lu之内周緣向 内延伸至女I板13之穿孔131之内周緣的導緣112。電路 板2裝設於第二側板12的内側，且安裝有至少一運作時會 叙熱的發熱元件21，本實施例是以一中央處理器（cpu ) 舉例說明。 . 參閱圖2、圖3及圖4,散熱裝置3包括一罩體32、一 散熱件33、一導熱件31、一風扇、一端蓋35及一固定桿 36。在本實施例中，該風扇為一軸流風扇34。 罩體32位於機殼1内且安裝於安裝板13上。罩體 具有一與第一側板11相間隔的基壁322，及一自基壁322 外周緣向穿孔ill、穿孔131方向延伸並固定於穿孔131之 2周緣的外圍繞壁321。基壁322與外圍繞壁321相配合界 定出一開口面對該等穿孔m、131的容置空間323。藉由 罩體32的隔絕設計，使其容置空間323只與外界相連通， 8 M344028 並不與機殼1内的其他空間相連通。 散熱件33設置於容置空間323内，且具有一位於外圍 繞壁321内側的内圍繞壁331。内圍繞壁331具有一與罩體 32之基壁322相連接的環形固定部333，及一自固定部333 内周緣朝遠離該基壁322方向延伸的圓管狀接觸部334。兮 散熱件33更具有複數自接觸部334外周面336相間隔地朝 外圍繞壁321延伸的鰭片332。由垂直第一側板丨丨的方向 視之，該等鰭片332略呈圓弧狀。 導熱件31具有一與發熱元件21相接觸的升溫部3丨丨及 一遠離升溫部311的降溫部313。降溫部313與升溫部311 分別位於罩體32之二相反侧。 在本實施例中’降溫部313由罩體32之基壁322處穿 置於容置空間323、設置於内圍繞壁331之接觸部334的内 侧，且與接觸部334之内周面335相接觸。 導熱件31為中空的且内部有導熱流體流動。導熱件3 i 更具有一限制導熱流體往單方向循環流動之單向閥315、一 高溫部312及一低溫部314。導熱件31之升溫部311、高溫 部312、降溫部313與低溫部314沿循環方向依序排列且彼 此互相連通。升溫部3 11呈平板狀，並平貼接觸於發熱元件 21相反於電路板2的一面。 而溫部312具有一與降溫部313相連通且呈平板狀之 固定段317,及一連通升溫部311與固定段317之連接段 316。低溫部314亦具有一與降溫部313相連通且呈平板狀 之固定段319’及一連通升溫部311與固定段319之連接段 M344028 318。該等固定段317、319皆與基壁322平行，並固定於 基壁322相反於内圍繞壁311之固定部333之一側。該等固 定段317、319之板厚相等且於厚度方向彼此連接，但其内 部的導熱流體不互相流通。該等連接段316、318皆為軟管 〇 固定桿36位於内圍繞壁331之接觸部334内側，其外 形呈圓柱狀且一端固定於該等固定段317、319。降溫部 313呈螺旋狀地沿該固定桿36繞設，且與接觸部334之内 周面3 3 5相接觸。 軸流風扇34之氣體流動是軸方向直進直出。軸流風扇 34設置於容置空間323内，且裝設於内圍繞壁331之接觸 部334遠離罩體32之基壁322的一端。軸流風扇％具有 一接於内圍繞壁331之第一端341及一相反於第一端341 的第二端342。 端蓋35覆蓋於軸流風扇34之第二端342，且形成有複 數供軸流風扇34進氣的孔洞351。 *當電腦機箱内的發熱元件21 $生熱時，其熱可被流過 導熱件31之升溫部311的導熱流體帶走。升溫部3ιι呈平 板狀可增加與發熱元件21的接觸面積，提升傳導效果。 a導熱流體流過升溫部311|，其溫度提高，並經由高溫 二312流至降溫部313。由於降溫部313呈螺旋狀並與接觸 部334之内周面335相接觸，可將熱傳導至接觸部，進 而再傳導至該等鰭片332。 軸流風扇34由第二端342往第一端341將外界的氣體 10 M344028 帶入罩體32内部之該等鰭片332的間隙中，並在鄰近内圍 繞壁331之接觸部334處，往接近基壁322方向流動，待 流入之氣體往内碰觸至基壁322後轉變流動方向，改為鄰 近外圍繞壁321處，往遠離基壁322方向流動，直到流出 罩體32外。藉由該㈣片如的設置增加散熱面積，並配 合轴流風扇34造成的強制對流，使氣體於該等鰭片332的 間隙中流動，將熱帶走。M344028 VIII. New description: [New technical field] The present invention relates to a computer case, in particular to a computer case with a heat sink. [Prior Art] Computers are becoming more and more powerful and have higher performance requirements. Therefore, the central processor of 'm brain and some related parts such as hard disk drives and CD players are getting higher and higher. However, as the performance increases, the heat generated by the components is increasing. In order to achieve the heat dissipation, the heat dissipation of the computer mainframe is to bring the cold air into the casing or bring the hot air. Leave the case and match it. The heat sink on the heating element is then dissipated, and the convection of the air is used to force the tropics out of the casing. In addition, a plurality of holes are often provided in the casing to increase air convection inside and outside the casing. In the above manner, since the heat generated by the heating element is transmitted to the air in the casing by the radiator, the forced convection generated by the fan is used to discharge the heat outside the casing, since the generated heat will first exist in the casing. Inside the casing for a period of time, the heat generated by the heating element will cause the temperature of the air inside the casing to rise, which affects the performance of components such as the central processing unit. [New content] Therefore, one of the purposes of the present invention is to provide a computer case that can improve heat dissipation performance. Another object of the present invention is to provide a heat sink that can improve heat dissipation performance. 5 M344028 The computer case with the heat sink of the present invention comprises a hollow casing, a circuit board and a heat sink. A through hole is formed on one side of the hollow casing. The circuit board is mounted on an inner side of the casing opposite to one side of the perforation, and is mounted with at least one heat generating component. The heat sink comprises a cover, a heat conducting member and a fan. The cover is mounted in the casing and defines an accommodation space having an opening facing the perforation of the casing. The heat conducting member has a temperature rising portion that is in contact with the heat generating element and a temperature reducing portion that is away from the heat rising portion. The temperature reducing portion is disposed in the accommodating space and is opposite to the heat absorbing portion on the opposite side of the cover body. The fan is disposed in the accommodating space of the cover body for sucking in the gas and causing the gas to be conducted through the through hole through the heat conducted by the heat conducting member to the accommodating space. Preferably, the cover body has a base wall spaced from the side of the casing formed with one side of the perforation, and a space extending from the outer peripheral edge of the base wall toward the perforation direction and cooperating with the base wall defines the capacity The outer surrounding wall of the space is disposed, and the cooling portion is disposed on the base wall. Preferably, the heat dissipating device further includes a heat dissipating member disposed in the accommodating space, the heat dissipating member having an inner surrounding wall located inside the outer surrounding wall and connected to the certain wall, and connected in plurality The slab is wrapped around the outer wall of the wall, and the cooling portion is disposed in the space defined by the inner surrounding wall and is in contact with the inner side of the inner surrounding wall. Preferably, the fins extend from the outer surrounding wall to the outer surrounding wall. Preferably, the fan is mounted on the inner surrounding wall away from the one end of the base wall 6 M344028. The heat dissipating device further includes an end cap covering the end of the fan away from the inner winding wall. There are a plurality of holes for the fan to take in air. Preferably, the heat conducting member (four) towel has a heat-conducting fluid, and more preferably, a single (four), a high-temperature portion and a low-temperature portion that restrict the flow of the heat-conducting fluid in a single direction, and the temperature rising portion and the high-temperature portion of the heat conducting member. The cooling portion and the low temperature portion are in the form of a flat plate in the order of (4) m in the circulation direction, and are in flat contact with the heat generating element. The cooling portion has a spiral shape. Preferably, the heat conducting member is also made of a material that is easy to conduct heat, and further has a conducting portion connecting the temperature rising portion and the temperature reducing portion. The temperature rising portion, the guiding portion, and the temperature reducing portion are integrally formed solid cylinders. The heat conducting member further has a cover covering the heat generating component, and the temperature rising portion is disposed through the cover to be in contact with the central portion of the heat generating component. The new thermal device is the heat sink in the "computer case with heat sink". The effect of the present invention is that the housing is separated from the outside by the isolation design of the cover, and the cooling portion and the heating portion are respectively located on opposite sides of the cover, so that the heating element is generated. The heat is guided to the fins in the accommodating space of the hood by the heat conducting member, and the heat is dissipated by the forced convection caused by the fan in the valley space. In this way, the heat generated by the heating element can be quickly exported to the outside of the computer case to improve the heat dissipation performance. [Embodiment] The foregoing and other technical contents, features and effects of the present invention will be apparently described in the following detailed description of the two preferred embodiments of the reference drawings. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to Figures 1, 2 and 3, a preferred embodiment of the computer having a heat sink comprises a hollow casing 1, a circuit board 2 and a heat sink 3. ★ The casing 1 includes a first side panel U and a second side sill 12 on opposite sides of the second side, and a mounting board 13 on the inner side of the first side panel for mounting the heat sink 3. The first side plate U and the mounting plate 13 are parallel to each other, and a perforation ln and a through hole 131 having apertures which are approximately the same and located at corresponding positions are respectively formed. Further, the first side panel U is further formed with a leading edge 112 extending inwardly from the inner periphery of the perforation lu to the inner periphery of the perforation 131 of the female panel 13. The circuit board 2 is mounted on the inner side of the second side panel 12, and is mounted with at least one heat generating component 21 that is heated during operation. This embodiment is illustrated by a central processing unit (CPU). Referring to Figures 2, 3 and 4, the heat sink 3 includes a cover 32, a heat sink 33, a heat conducting member 31, a fan, an end cap 35 and a fixing rod 36. In this embodiment, the fan is an axial fan 34. The cover 32 is located inside the casing 1 and is mounted on the mounting plate 13. The cover has a base wall 322 spaced apart from the first side plate 11, and an outer surrounding wall 321 extending from the outer periphery of the base wall 322 toward the perforation ill and the perforation 131 and fixed to the periphery of the perforation 131. The base wall 322 cooperates with the outer surrounding wall 321 to define an accommodation space 323 whose opening faces the perforations m, 131. Due to the isolated design of the cover 32, the accommodating space 323 is only in communication with the outside, and the 8 M344028 is not in communication with other spaces in the casing 1. The heat dissipating member 33 is disposed in the accommodating space 323 and has an inner surrounding wall 331 located inside the peripheral surrounding wall 321 . The inner surrounding wall 331 has an annular fixing portion 333 connected to the base wall 322 of the cover 32, and a circular tubular contact portion 334 extending from the inner peripheral edge of the fixing portion 333 toward the base wall 322. The heat sink 33 further has a plurality of fins 332 extending from the outer peripheral surface 336 of the contact portion 334 outwardly around the wall 321 . The fins 332 are slightly arcuate in view of the direction perpendicular to the first side panel 丨丨. The heat transfer member 31 has a temperature rising portion 3A that is in contact with the heat generating element 21, and a temperature lowering portion 313 that is away from the temperature rising portion 311. The temperature lowering portion 313 and the temperature rising portion 311 are located on opposite sides of the cover 32, respectively. In the present embodiment, the cooling portion 313 is disposed on the inner side of the contact portion 334 of the inner surrounding wall 331 by the base wall 322 of the cover 32, and is adjacent to the inner peripheral surface 335 of the contact portion 334. contact. The heat conducting member 31 is hollow and has a heat transfer fluid flow inside. The heat conducting member 3 i further has a check valve 315 for restricting the flow of the heat transfer fluid in a single direction, a high temperature portion 312 and a low temperature portion 314. The temperature rising portion 311, the high temperature portion 312, the temperature reducing portion 313, and the low temperature portion 314 of the heat transfer member 31 are sequentially arranged in the circulation direction and communicate with each other. The temperature rising portion 3 11 has a flat shape and is in contact with one surface of the heat generating element 21 opposite to the circuit board 2. The temperature portion 312 has a fixed section 317 which is connected to the temperature reducing portion 313 and has a flat shape, and a connecting portion 316 which communicates the temperature rising portion 311 and the fixed portion 317. The low temperature portion 314 also has a flat portion 319' that communicates with the temperature reducing portion 313 and a connecting portion M344028 318 that communicates the temperature rising portion 311 with the fixed portion 319. The fixing sections 317, 319 are all parallel to the base wall 322 and are fixed to one side of the fixing portion 333 of the base surrounding wall 311 opposite to the inner wall 322. The fixing sections 317, 319 have the same plate thickness and are connected to each other in the thickness direction, but the heat transfer fluids inside thereof do not flow each other. The connecting portions 316, 318 are all inside the contact portion 334 of the inner surrounding wall 331 of the hose 固定 fixing rod 36, and the outer shape is cylindrical and one end is fixed to the fixing portions 317, 319. The temperature reducing portion 313 is spirally wound along the fixing rod 36 and is in contact with the inner peripheral surface 335 of the contact portion 334. The gas flow of the axial fan 34 is straight in and out of the axial direction. The axial fan 34 is disposed in the accommodating space 323 and is disposed at an end of the inner wall 322 of the cover 32 from the contact portion 334 of the inner surrounding wall 331. The axial fan % has a first end 341 connected to the inner surrounding wall 331 and a second end 342 opposite the first end 341. The end cap 35 covers the second end 342 of the axial fan 34 and is formed with a plurality of holes 351 for the intake of the axial fan 34. * When the heat generating component 21 in the computer case generates heat, its heat can be carried away by the heat transfer fluid flowing through the temperature rising portion 311 of the heat conducting member 31. The temperature rising portion 3 is in the form of a flat plate to increase the contact area with the heat generating element 21, thereby improving the conduction effect. a The heat transfer fluid flows through the temperature rising portion 311|, and the temperature thereof increases, and flows to the temperature lowering portion 313 via the high temperature two 312. Since the temperature reducing portion 313 is spirally shaped and brought into contact with the inner peripheral surface 335 of the contact portion 334, heat can be conducted to the contact portion and then conducted to the fins 332. The axial fan 34 carries the external gas 10 M344028 from the second end 342 to the first end 341 into the gap of the fins 332 inside the cover 32, and is adjacent to the contact portion 334 of the inner surrounding wall 331 The flow in the direction of the base wall 322 flows, and the gas to be inflow touches the base wall 322 to change the flow direction, and is changed to move away from the base wall 322 adjacent to the outer surrounding wall 321 until it flows out of the cover 32. By the arrangement of the (four) piece, the heat dissipation area is increased, and the forced convection caused by the axial fan 34 is matched to allow the gas to flow in the gap of the fins 332 to move the tropics.
流過降溫部313後，導熱流體的溫度降低，再經由低 /皿4 313重新流至升溫部311。如此不斷循環達成散熱的效 果0 因而使散熱裝置3 接結合於電腦機箱 備。 由於政熱裝置3的罩體32、散熱件33與軸流風扇34 的結構設計，使氣體的進人與氣體的排出皆位於同一侧， 之體積可較小。此外，散熱裝置3可直 ，使消費者易於裝配，且不需外置的設 /閱圖5與圖6，本新型具有散熱裝置的電腦機箱之第 :讀貫施例包含_中空機殼】、一電路板2及一散熱裝置 ^較佳實施例之中空機殼i及電路板2與第—較佳實 施例的對應部分相同。 月文熱裝置3’包括一導埶件p 守…忏W —罩體32，、一散熱件 、一風扇及一端蓋35,。在本實 扇34,。 尽灵施例中，該風扇為一鼓風 要的不同部分是導熱件 而本實施例之散熱件33, 本實施例與第一較佳實施例主 鼓風扇34,及罩體32,的設計。 11 37、 M344028 及端盍35’則分別與第—較佳實施例的對應部分略有尺 形的不同，但其功能相同。 相較於第一較佳實施例之軸流風扇34的氣體流動是軸 方向直進直出，在本實施例中，鼓風扇34，的氣體流動則是 由軸方向直進但由侧邊吹出。 相較於第—較佳實施例之罩體32為-件式，在本實施 例中’罩體32’為二件式的設計，即軍體Μ，之外圍结辟 / 分為彼此搭接的第一段咖，及第二段通，。外： 1之弟'^又32la’為一件，而外圍繞壁321，之第二段 32lb’與基壁322’為一體成型的另一件。 相較於第一較佳實施例有分別連通升溫部311與降溫部 313的高溫部312及低溫部314，且其内部有導熱流^動 。在本實施例中，導熱件37由易導熱的材質製成，具有一 與發熱元件21相接觸的升溫部37卜及一遠離升溫部Π 並穿置於罩體32,之容置空間323,的降溫部373。降溫部 ^ 373與升溫部371分別位於罩體32，之二相反側。此外，導 熱件37更具有一連接升溫部371與降溫部373的傳導部 372，及一覆蓋於發熱元件21的蓋體374。其中，升溫部 37卜傳導部372與降溫部373為—體成型的實心圓柱Z 在本實施例中，前述圓柱體之材質為銅。 升溫部371穿設於蓋體374而與發熱元件21的中央部 分相接觸，蓋體374的設計可防止發熱元件21未與升溫部 371相接觸部分的散熱能被限制於蓋體374内，而不會逸散 至機殼内部。 12 M344028 同樣地，當電腦機箱内的發熱元件21產生熱時，其熱 可被‘熱件37之升溫部371帶走，並經由傳導部372傳至 降溫部373，再傳導至散熱件33,，並由鼓風扇34，將外界的 氣體帶入罩體32’内部，造成強制對流，使氣體於散熱件 33之该等籍片332’的間隙中流動，將熱帶走。 綜上所述，藉由罩體32、32,的隔絕設計，使其容置空 間323、323’只與外界相連通，並不與機殼i内的其他空間 相連通，加上降溫部313、373與升溫部311、371分別位於 罩體32、32’二相反側，使發熱元件21所產生的熱藉由導 熱件31、37導至罩體32、32’的容置空間323、323,内之該 等鰭片332、332,上，並配合軸流風扇34、鼓風扇34，於容 置空間323、323,内造成的強制對流將熱散出。如此，發熱 兀件21所產生的熱可快速地導出電腦機箱外，降低對電腦 機箱内溫度的影響，並達成散熱效能的提高，所以確實能 達成本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 辜已圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明本新型具有散熱裝置的電腦機 箱之第一較佳實施例； 圖2是該第一較佳實施例的立體圖，其中一第一側板 被打開； 13 M344028 圖3是該第一較佳實施例的剖面示意圖； 圖4是該第一較佳實施例的立體分解圖； 圖5是一剖面示意圖，說明本新型具有散熱裝置的電 腦機箱之第二較佳實施例；及 圖6是該第二較佳實施例的立體分解圖。After flowing through the temperature lowering portion 313, the temperature of the heat transfer fluid is lowered, and the flow is again returned to the temperature rising portion 311 via the lower vessel 4 313. In this way, the effect of heat dissipation is continuously circulated so that the heat sink 3 is coupled to the computer case. Due to the structural design of the cover 32, the heat dissipating member 33 and the axial fan 34 of the thermal heating device 3, the gas entering and the gas are discharged on the same side, and the volume can be small. In addition, the heat dissipating device 3 can be straight, so that the consumer can be easily assembled, and there is no need to externally set/read FIG. 5 and FIG. 6. The second embodiment of the computer case with the heat dissipating device includes: a hollow casing] A circuit board 2 and a heat sink device The hollow case i and the circuit board 2 of the preferred embodiment are identical to the corresponding portions of the first preferred embodiment. The monthly heat device 3' includes a guide member p s... 忏 W - a cover 32, a heat sink, a fan and an end cover 35. In this real fan 34,. In the embodiment, the fan is a different part of the blast, which is a heat-conducting member, and the heat sink 33 of the embodiment, the first embodiment of the main drum fan 34, and the cover 32 are designed. . 11 37, M344028 and end turn 35' are respectively slightly different in size from the corresponding portions of the first preferred embodiment, but have the same function. The gas flow of the axial flow fan 34 in the first preferred embodiment is straight in and out in the axial direction. In the present embodiment, the gas flow of the blower fan 34 is straight in the axial direction but blown out from the side. Compared with the cover 32 of the first preferred embodiment, the cover 32 is a two-piece design, that is, the military body, and the peripherals are separated/divided into each other. The first paragraph of the coffee, and the second paragraph pass. Outside: 1 brother '^32la' is one piece, and the outer surrounding wall 321, the second section 32lb' and the base wall 322' are integrally formed. Compared with the first preferred embodiment, the high temperature portion 312 and the low temperature portion 314 of the temperature rising portion 311 and the temperature decreasing portion 313 are respectively connected to each other, and the inside thereof has a heat transfer flow. In this embodiment, the heat conducting member 37 is made of a material that is easy to conduct heat, has a temperature rising portion 37 that is in contact with the heat generating component 21, and a receiving space 323 that is away from the heat rising portion and is placed in the cover 32. Cooling section 373. The temperature lowering portion ^ 373 and the temperature rising portion 371 are located on the opposite sides of the cover 32, respectively. Further, the heat guiding member 37 further has a conducting portion 372 connecting the temperature rising portion 371 and the temperature reducing portion 373, and a cover 374 covering the heat generating element 21. The temperature rising portion 37 is a solid cylinder Z formed by the body portion 372 and the temperature reducing portion 373. In the present embodiment, the material of the cylinder is copper. The temperature rising portion 371 is disposed in the lid body 374 to be in contact with the central portion of the heat generating component 21, and the cover body 374 is designed to prevent heat dissipation of the portion of the heat generating component 21 not in contact with the temperature rising portion 371 from being limited to the lid body 374. Will not escape to the inside of the case. 12 M344028 Similarly, when the heat generating component 21 in the computer case generates heat, its heat can be taken away by the temperature rising portion 371 of the heat member 37, transmitted to the temperature reducing portion 373 via the conducting portion 372, and then conducted to the heat sink member 33. And by the blower fan 34, the outside air is brought into the inside of the cover 32', causing forced convection, causing the gas to flow in the gap of the pieces 332' of the heat sink 33 to move the tropics. In summary, the housings 32, 32 are separated from each other by the isolation design of the housings 32, 32, and are not connected to other spaces in the housing i, and the cooling portion 313 is added. And 373 and the temperature rising portions 311 and 371 are located on opposite sides of the cover bodies 32 and 32', respectively, so that the heat generated by the heat generating component 21 is guided to the accommodating spaces 323 and 323 of the cover bodies 32 and 32' by the heat conducting members 31 and 37. The fins 332, 332, and the axial fan 34 and the blower fan 34 are disposed in the accommodating spaces 323 and 323 to dissipate heat. In this way, the heat generated by the heating element 21 can be quickly exported outside the computer case, the influence on the temperature inside the computer case is reduced, and the heat dissipation performance is improved, so that the purpose of the present invention can be achieved. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change made by the new patent application and the new description content is Modifications are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a first preferred embodiment of a computer case having a heat sink; FIG. 2 is a perspective view of the first preferred embodiment, wherein a first side plate is opened; 13 is a cross-sectional view of the first preferred embodiment; FIG. 4 is an exploded perspective view of the first preferred embodiment; FIG. 5 is a cross-sectional view showing the second of the computer case having the heat sink Preferred Embodiments; and Figure 6 is an exploded perspective view of the second preferred embodiment.
14 M34402814 M344028
【主要元件符號說明】 1 ....... …機设 323… …·容置空間 11…… …第一側板 33…·· •…散熱件 m ···· …穿孔 331… •…内圍繞壁 112 ···· …&緣 332… 鱗片 12…… …第二側板 333… ····固定部 13…… 女t板 334… •…接觸部 131 ··.. …穿孔 335… ····内周面 2 ....... …電路板 336··· —外周面 21…… …·發熱元件 34•…· •…軸流風扇 3 ....... •…散熱裝置 34卜· •…第一端 31…… •…導熱件 342… …·第二端 311… •…升溫部 35…·. 知盖 312… •…高溫部 351… •…孔洞 313… •…降溫部 36••… •…固定桿 314… •…低溫部 3, ···.· …··散熱裝置 315… •…單向閥 32、··· …·罩體 316… •…連接段 321，·. —外圍繞壁 317… …·固定段 321a， —第一段 318… …·連接段 321b， •…第二段 319… …·固定段 322, ·· …·基壁 32…·· …·罩體 323, ·· •…容置空間 321… •…外圍繞壁 33，"·· …·散熱件 322… …·基壁 332, .· …·鰭片 15 M344028 34,… —5支風扇 372 ···. •…傳導部 35,… …·端蓋 373… •…降溫部 37••… •…導熱件 374… •…蓋體 371 ··· •…升溫部[Description of main component symbols] 1........................................................................................................................................................................................................................................................................................................................................................................................................................................................................................... Inner surrounding wall 112 ···· ...& edge 332... scale 12... ... second side plate 333... fixed part 13... female t plate 334... • contact portion 131 ··.. ...···· Inner circumferential surface 2............Circuit board 336···——Outer peripheral surface 21...··Heat element 34•...·•...Axial fan 3...... •...heat sink 34··...first end 31... •...heat conducting member 342...·second end 311... •...heating unit 35...·. knowing cover 312... •...high temperature part 351... •... hole 313 ... •...cooling unit 36••... •...fixing rod 314... •...low temperature unit 3, ········heat sink 315... •... check valve 32, ·····cover 316... ...connecting section 321 , ·. - outer surrounding wall 317 ... ... fixed section 321a, - first section 318 ... ... connecting section 321b, ... ... second section 319 ... ... fixed section 322, · · ... · base wall 32...· ... hood 323, ·· •... accommodating space 321... •... outer surrounding wall 33, "····heat sink 322...·basic wall 332, . . . ... fin 15 M344028 34,... 5 fans 372 ····•...conducting unit 35,...end cap 373...•...cooling unit 37••... •...heat conducting member 374... •...cover body 371 ··· •...heating unit
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