M322012 捌、新型說明 【新型所屬之技術領域】 本創作係關於一種電腦主機，特別是關於一種利用隔 板來增進散熱功效之電腦主機。 、 【先前技術】 一般而言，目前市面上所能購得的電腦主機架構大致 籲如下：一張主機板上裝設有必要的晶片（如CPU、顯示晶片 等），外部再包覆一機殼以避免主機板及晶片因沾附灰塵或 水滴而損毁。其中，為了避免晶片溫度過高而無法正常運 作，以CPU為例，其上乃裝設有散熱器來降低晶片因高速 運算而產生的高溫。同時，為能降低機殼内的溫度，一般 機殼上同時也多裝設有風扇來將内部的熱空氣帶離。此 外，機殼上亦常鑽設有孔洞來增加機殼内外的氣體對流， 藉此降低機殼内溫度，並維持電腦的正常運作。 • 從前述的主機架構中不難發現，晶片產生的熱係先傳 ^ 遞至散熱器上，再由散熱器傳遞至機殼内的空氣，之後才 由風扇將空氣抽出機殼時一併將熱帶離。由此可知，在該 種主機架構中，晶片所產生的熱必會先存在機殼内的空氣 中一段時間，然後才由風扇將空氣抽離主機，而此種散熱 機制，不免造成熱空氣的高溫對電腦元件產生不良影響。 有鑑於電腦運算能力日益倍增，使用者對於散熱效能 的要求亦越來越高，因此，有必要提出一種具有高散熱效 能的電腦主機架構。 5 M322012 【新型内容】 本創作之主要目的係在提供—種電腦主機’其主要包 括·機设、主機板、政熱器以及隔板，其中，主機板係事 設於該機殼内，且主機板上至少骏設有一發熱元件；散熱 裔主要包括接觸部、散熱部以及至少^一熱管，熱管之兩端 分別與接觸部及散熱部連接，且接觸部乃裝設於主機板上 的發熱元件上；隔板包括一主體部，而主體部上係形成有 一摟空部份，以使隔板能透過該摟空部份穿透熱管並裝設 於接觸部與散熱部之間。 為使前述之隔板得透過可抽換方式進行安裝，電腦主 機之機殼上可開設有狹縫，使隔板得以透過該狹縫將散熱 為之散熱部與主機板隔開’進而提高散熱效率。同時，為 使抽換更為便利，隔板上可設有與一主體部連結之握把， 方便使用者進行隔板之抽插。此外，由於該隔板上同時具 -有流道之設計，滴落至隔板上的液體可被導至主機板外， _並由機殼下方之排水孔洞流出，不至於直接滴落至主機板 上而造成電腦故障。 同時，本創作亦提供一種前述之隔板。在採用本創作 隔板的電腦主機架構下，晶片因高速運算所產生之熱將先 傳遞至散熱裔之接觸部’並由熱管傳遞至散熱部。因為隔 板的存在’帶有高溫的散熱部與主機板將被隔離在兩個不 同空間中。由於熱於產生後即被帶到散熱部上，且散熱部 與主機板係存在不同的空間中，熱空氣對於電腦運作所產 生的不良影響將得以降至最低。 6 M322012 由於本創作構造新穎，能提供產業上利用，且確有增 進功效，故依法申請新型專利。 【實施方式】 為能讓貴審查委員能更瞭解本創作之技術内容，特舉 較佳具體實施例說明如下。 、 請先參考圖1係本創作電腦主機10之分解圖。本創作之 電腦主機10主要包括以下部分：機殼11 ;裝設於該機殼11 胃内之主機板13，主機板13上並設有至少一發熱元件131(如 CPU、顯示晶片…等）；散熱器15，其包括接觸部151、散熱 部153以及至少一熱管155，熱管155之兩端分別與接觸部 151及散熱部153連接，且接觸部151係用以裝設於該發熱元 件131上；以及隔板17，其包括一主體部171，該主體部171 上係形成有一摟空部份171h。 如圖1所示，接觸部151及散熱部153之間具有一定之高 - 度差，因此可透過一分隔手段將接觸部151及散熱部153隔 • 離，避免散熱部153的熱透過氣體對流或其他手段傳遞至接 觸部151以及其週遭的其他電腦元件，進而使電腦主機10 具有較高的穩定性。其中，散熱部153上係具有複數鰭片 153f用以增加散熱部153與空氣接觸之面積，進而提高散熱 效率。 而為了提高使用者在拆裝隔板17時的便利性，機殼11 上亦可開設有狹縫11s。使用者於進行隔板17之抽換或拆裝 時，可直接將隔板17插入狹縫11s，或由狹縫11s直接將隔 板17取出，而無須將機殼11拆開，大大提高使用上的便利 7 M322012 十生 0 S —— ~t- f ,力^ ’製造商也可在不需重新更改整體機殼模具 下’生產具有本創作功效之產品，進而有效節省製 仏成本。、同時’隔板17上亦可設計有一握把173，供使用者 換或拆裝時握持，提高隔板Π的操作性，且該握把173 係較佳地以-體成型方式連結至主體部m。 應/主思的是，儘管隔板17可以可抽換方式進行安裝， 板17亦可以固定方式進行安裝。舉例來說，該隔板口 建於電腦主機1〇之内，藉由螺絲或其他固定手段將 於材，部份，隔板17並不限定於某些特定材料。舉例 =二，耐熱塑膠、金屬或合金等均可作為隔板17之 防水、防m限。藉由隔板17之安裝，可達到隔熱、 防塵、防電磁干擾(EMI)等功效。 -後請ΐ ”圖2係本創作電腦主機1G之部份剖面圖。於裝 二係透過該摟空部份171h穿透該熱管155並裝 汉於该接觸部151與該散熱部153 散熱部153散逸的熱因為受到隔板Π的隔離，接= 部151所在空間之電腦元件產生影響。因此， 機板13及大部分電腦元件之外避免= 板13與其上之電腦元件因受熱影響而不穩定。 應注意的是，儘管圖2所示者散熱部⑸ Μ 係呈上下關係，但本創作電腦主機1G並不限於 說，散熱部153與接觸部⑸#配置也可以是i右= =圖2中共有三根熱管155，但熱管15目 並不以此為限。 8 M322012 請再參照圖3係本創作電腦主機10之示意圖。儘管本 創作之電腦主機10不一定要將散熱器15、隔板17、主機 板13完全包覆於其内，然為了進一步增加防水、防塵之功 效並提升其安全性，於散熱部153之外側尚可再加設一片 上蓋隔板19。而為了讓上蓋隔板19不至於將大部分的熱 包覆於電腦主機10内，上蓋隔板19上並可穿設有複數之 孔洞19h。據此，本創作之電腦主機10可透過機殼11與 上蓋隔板19所提供的防護，讓内部的主機板13和其他電 • 腦元件不至於受到外部如水滴、灰塵等的影響。此外，由 於機殼11與上蓋隔板19同時具有防水、防塵及隔絕電磁 干擾的功效，配合散熱器15與隔板17的設計，其一來可 將熱隔絕在主機板13之外，另一方面，該主機13其亦可 在不需重新更改整體機殼11之情形下，有效達成防塵、防 水以及隔絕電磁干擾的功效。 應注意的是，上蓋隔板19上孔洞19h之穿設方式並不 限於圖式所示者，使用者亦可依其需求選擇較為適合的上 • 蓋隔板19。於材質部份，上蓋隔板19亦不限定於某些特 ’ 定材料。藉由上蓋隔板19之安裝，可進一步提升隔熱、防 水、防塵及防電磁干擾之功效。 最後，請參見圖4係關於本創作隔板17之示意圖。如 圖4所示，該隔板17主要包括一主體部171，主體部171 上係形成有摟空部份171h，且主體部171上亦連接有一握 把173。本創作之隔板17主要係用以裝設在電腦主機之内 部空間。大致上來說，此種電腦主機包括一散熱器，且該 散熱器包括一接觸部、一散熱部以及至少一熱管，該熱管 9 M322012 之兩端分別與該接觸部及該散熱部連接。於裝設時，該隔 板17係可透過該摟空部份171h穿透散熱器之熱管並裝設 於接觸部與散熱部之間。 為避免滴落到隔板Π上的水滴由摟空部份171h滑落 而滴至主機板上，本創作之隔板17更可包括有流道之設 計。如圖4所示，於隔板17之邊界係延伸有流道結構175， 該流道結構175可將滴落到隔板17上的水滴引導至隔板 17之兩側，使水滴由兩側滴落，進而避免水滴由摟空部份 —171h滑落而滴至主機板上。於大部分的情形下，該流道結 構175係與該主體部171採一體成型之方式製作，然而其 並不以此為限。舉例來說，該流道結構175也可以是另外 安裝於隔板17上。 綜上所陳，本創作無論就目的、手段及功效，在在均 顯示其迥異於習知技術之特徵，懇請貴審查委員明察， 早曰賜准專利，俾嘉惠社會，實感德便。惟應注意的是， 上述諸多實施例僅係為了便於說明而舉例而已，本創作所 • 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 【圖式簡單說明】 圖1係本創作電腦主機之分解圖。 圖2係本創作電腦主機之部份剖面圖。 圖3係本創作電腦主機之示意圖。 圖4係本創作隔板之示意圖。 M322012 【主要元件符號說明】 電腦主機 10 機殼11 主機板 13 發熱元件 131 散熱器15 接觸部 151 散熱部 153 熱管155 隔板17 主體部 171 摟空部份 171h 狹縫11s 流道結構 175 握把173 鰭片153f 孔洞19h 上蓋隔板 19 11M322012 捌, New Description [New Technology Area] This creation is about a computer mainframe, especially a computer host that uses a partition to improve heat dissipation. [Prior Art] Generally speaking, the computer host architecture currently available on the market is roughly as follows: a motherboard is equipped with necessary chips (such as CPU, display chip, etc.), and the outside is covered with a machine. The case prevents the motherboard and the wafer from being damaged by dust or water droplets. In order to prevent the wafer from being too hot to operate normally, the CPU is exemplified by a heat sink to reduce the high temperature of the wafer due to high-speed operation. At the same time, in order to reduce the temperature inside the casing, a fan is usually installed on the casing to carry the internal hot air away. In addition, holes are often drilled in the casing to increase gas convection inside and outside the casing, thereby reducing the temperature inside the casing and maintaining the normal operation of the computer. • It is not difficult to find from the above-mentioned host architecture that the heat generated by the wafer is transmitted to the heat sink and then transferred to the air inside the casing, and then the air is drawn out of the casing by the fan. Tropical away. It can be seen that in this kind of host architecture, the heat generated by the wafer must first exist in the air in the casing for a certain period of time, and then the air is pumped away from the host by the fan, and the heat dissipation mechanism inevitably causes hot air. High temperatures have an adverse effect on computer components. In view of the ever-increasing computing power of computers, users are increasingly demanding heat dissipation performance. Therefore, it is necessary to propose a computer host architecture with high heat dissipation performance. 5 M322012 [New Content] The main purpose of this creation is to provide a kind of computer mainframe, which mainly includes a machine, a motherboard, a political heater and a partition, wherein the motherboard is disposed in the casing, and At least a heat-generating component is disposed on the motherboard; the heat-dissipating body mainly includes a contact portion, a heat-dissipating portion, and at least one heat pipe, and the two ends of the heat pipe are respectively connected to the contact portion and the heat-dissipating portion, and the contact portion is heated on the motherboard. The partition plate includes a main body portion, and the hollow portion is formed on the main body portion so that the partition plate can penetrate the heat pipe through the hollow portion and be disposed between the contact portion and the heat dissipating portion. In order to enable the above-mentioned partition plate to be installed through the replaceable manner, a slit may be formed in the casing of the computer main body, so that the partition plate can dissipate heat from the heat dissipating portion and the main board through the slit, thereby improving heat dissipation. effectiveness. At the same time, in order to make the exchange more convenient, the spacer can be provided with a grip connected with a main body portion, which is convenient for the user to perform the insertion and removal of the partition. In addition, due to the design of the flow path on the partition, the liquid dripping onto the partition can be led to the outside of the main board, and is discharged from the drainage hole below the casing, so as not to drip directly to the host. The computer is malfunctioning on the board. At the same time, the present invention also provides a separator as described above. Under the computer host architecture using the creation of the partition, the heat generated by the high-speed operation of the wafer will be transferred to the contact portion of the heat sink and transferred to the heat sink by the heat pipe. Because of the presence of the spacer, the heat sink with high temperature and the motherboard will be isolated in two different spaces. Since heat is brought to the heat sink after it is generated, and the heat sink is in a different space from the motherboard, the adverse effects of hot air on the operation of the computer will be minimized. 6 M322012 Due to the novel construction of this creation, it can provide industrial use, and it has improved efficiency, so it applies for a new patent according to law. [Embodiment] In order to enable the reviewing committee to better understand the technical contents of the present creation, a preferred embodiment will be described below. Please refer to FIG. 1 for an exploded view of the host computer 10 of the present invention. The computer main body 10 of the present invention mainly comprises the following parts: a casing 11; a main board 13 installed in the stomach of the casing 11, and the main board 13 is provided with at least one heating element 131 (such as a CPU, a display chip, etc.). The heat sink 15 includes a contact portion 151, a heat dissipating portion 153, and at least one heat pipe 155. The two ends of the heat pipe 155 are respectively connected to the contact portion 151 and the heat dissipating portion 153, and the contact portion 151 is mounted on the heat generating component 131. And a partition plate 17 including a main body portion 171 having a hollow portion 171h formed thereon. As shown in FIG. 1, the contact portion 151 and the heat dissipating portion 153 have a certain height-difference difference, so that the contact portion 151 and the heat dissipating portion 153 can be separated by a separating means to prevent heat convection of the heat dissipating portion 153. Or other means are transmitted to the contact portion 151 and other computer components around it, thereby providing the computer host 10 with high stability. The heat dissipating portion 153 has a plurality of fins 153f for increasing the area of the heat dissipating portion 153 in contact with the air, thereby improving heat dissipation efficiency. In order to improve the convenience of the user when disassembling the partition 17, the slit 11s may be opened in the casing 11. When the user performs the replacement or disassembly of the partition plate 17, the partition plate 17 can be directly inserted into the slit 11s, or the partition plate 17 can be directly taken out by the slit 11s without disassembling the casing 11 and greatly improving the use. Convenience on the 7 M322012 Shisheng 0 S —— ~t- f, force ^ 'The manufacturer can also produce products with the creative effect without having to change the whole casing mold, thus saving the cost of manufacturing. At the same time, the spacer 17 can also be provided with a grip 173 for the user to hold or disassemble, to improve the operability of the spacer, and the grip 173 is preferably connected in a body-formed manner. Main body m. It should be noted that although the partition 17 can be installed in a removable manner, the plate 17 can be mounted in a fixed manner. For example, the partition port is built in the computer main body 1 by screws or other fixing means, and the partition plate 17 is not limited to a specific material. For example, two, heat-resistant plastic, metal or alloy can be used as the waterproof and anti-m limit of the separator 17. Through the installation of the partition 17, the effects of heat insulation, dustproof, and electromagnetic interference (EMI) can be achieved. - Figure 2 is a partial cross-sectional view of the computer main unit 1G. The second unit is inserted through the hollow portion 171h through the heat pipe 155 and mounted on the contact portion 151 and the heat dissipating portion 153. The 153 dissipated heat is affected by the separation of the partitions, and the computer components in the space where the portion 151 is located are affected. Therefore, the board 13 and most of the computer components are not allowed to be replaced by the board 13 and the computer components thereon. It should be noted that although the heat dissipating portion (5) shown in Fig. 2 is in a top-bottom relationship, the author computer host 1G is not limited to that the heat dissipating portion 153 and the contact portion (5) # configuration may be i right == There are three heat pipes 155 in 2, but the heat pipe 15 mesh is not limited to this. 8 M322012 Please refer to Figure 3 for a schematic diagram of the computer host 10 of the present invention. Although the computer host 10 of the present invention does not have to be a radiator 15 The board 17 and the main board 13 are completely covered therein. However, in order to further increase the waterproof and dustproof effect and improve the safety thereof, an upper cover partition 19 may be further disposed on the outer side of the heat radiating portion 153. Board 19 will not put most of the heat Covered in the computer main body 10, the upper cover partition 19 can be provided with a plurality of holes 19h. Accordingly, the computer main body 10 of the present invention can provide internal protection through the protection provided by the casing 11 and the upper cover partition 19. The plate 13 and other electric brain components are not affected by external water droplets, dust, etc. In addition, since the casing 11 and the upper cover partition 19 have the functions of waterproofing, dustproof and electromagnetic interference isolation, the heat sink 15 and the partition plate are provided. The design of 17 can isolate heat from the motherboard 13 on the other hand, and on the other hand, the host 13 can effectively achieve dustproof, waterproof and electromagnetic interference isolation without changing the overall casing 11. It should be noted that the manner of the hole 19h in the upper cover partition 19 is not limited to the one shown in the figure, and the user can also select a suitable upper cover plate 19 according to the needs. The upper cover partition 19 is also not limited to certain special materials. The installation of the upper cover partition 19 can further enhance the effects of heat insulation, waterproof, dustproof and electromagnetic interference. Finally, please refer to FIG. Creative partition As shown in Fig. 4, the partition plate 17 mainly includes a main body portion 171. The main body portion 171 is formed with a hollow portion 171h, and the main body portion 171 is also connected with a grip 173. The board 17 is mainly used to be installed in the internal space of the computer main body. Generally speaking, the computer main body includes a heat sink, and the heat sink includes a contact portion, a heat dissipating portion and at least one heat pipe, and the heat pipe 9 M322012 The two ends are respectively connected to the contact portion and the heat dissipating portion. When installed, the partition plate 17 can penetrate the heat pipe of the heat sink through the hollow portion 171h and be installed between the contact portion and the heat dissipating portion. The water droplets dripping onto the spacers are prevented from falling onto the main board by the hollow portion 171h, and the partition 17 of the present invention may further include a design of the flow path. As shown in FIG. 4, a flow path structure 175 is extended on the boundary of the partition plate 17, and the flow path structure 175 can guide water droplets dropped onto the partition plate 17 to both sides of the partition plate 17, so that the water droplets are separated from both sides. Drip, and then prevent the water droplets from falling from the hollow part - 171h to the motherboard. In most cases, the flow path structure 175 is formed integrally with the main body portion 171, but it is not limited thereto. For example, the runner structure 175 can also be additionally mounted to the spacer 17. In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics different from the well-known technology. You are kindly asked to review the examinations and give you a patent in advance, and you will feel the virtues. It is to be noted that the various embodiments described above are merely examples for the convenience of the description, and the scope of the claims of the present invention is subject to the scope of the patent application, and is not limited to the above embodiments. [Simple description of the diagram] Figure 1 is an exploded view of the computer host. Figure 2 is a partial cross-sectional view of the host computer of the author. Figure 3 is a schematic diagram of the host computer of the creation. Figure 4 is a schematic view of the creation of the partition. M322012 [Description of main components] Computer main unit 10 Enclosure 11 Main board 13 Heating element 131 Heat sink 15 Contact part 151 Heat sink 153 Heat pipe 155 Partition 17 Main body part 171 Hollow part 171h Slit 11s Flow path structure 175 Grip 173 fin 153f hole 19h upper cover partition 19 11