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TWM255639U - Heat sink assembly for power supply - Google Patents

Heat sink assembly for power supply Download PDF

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Publication number
TWM255639U
TWM255639U TW93203587U TW93203587U TWM255639U TW M255639 U TWM255639 U TW M255639U TW 93203587 U TW93203587 U TW 93203587U TW 93203587 U TW93203587 U TW 93203587U TW M255639 U TWM255639 U TW M255639U
Authority
TW
Taiwan
Prior art keywords
fan
power supply
heat dissipation
air
processing unit
Prior art date
Application number
TW93203587U
Other languages
Chinese (zh)
Inventor
Wan-Yuan Wang
Original Assignee
Best Power Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Best Power Solutions Inc filed Critical Best Power Solutions Inc
Priority to TW93203587U priority Critical patent/TWM255639U/en
Publication of TWM255639U publication Critical patent/TWM255639U/en

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Description

M255639 創作說明(1) 新型所屬之技術領域 尤指一種 本新型係有關一種^ ^ 將雷嗎枇龜突i抽γ电原供應為之散熱組成 將電源供應益中熱氣排出 流 【先前技術】 】風扇的设计 =的電源供應器如中華民國專利公告第5 593 〇〇號之 :別適用於尚功率輪出型電源供應器的散熱裝置」,前 二利之技術特徵主要係將電子電路中用以降壓整流等之 電子發熱兀件,定位裝置於導熱板内面,以及該導熱板外 側乃和電源供應器之側壁緊結,且電源供應器之前端乃設 有一風鼓,令該風鼓可汲取外界的冷空氣,並直接吹拂該 導熱板和電子發熱元件,復於其上方對應固設一蓋體後, 即可το成電源供應器接引電源,並經降壓整流而供電給電 腦使用時,該電子發熱元件會將其產生的熱量迅速的遞傳 至‘熱板,並由側壁和蓋體導引散出,以及該固設於其前 端之風鼓,乃同時汲取外界冷空氣進入,且以強烈的氣 流’直接吹拂該導熱板和電子發熱元件,復由後端之網孔 向外逸出,進而達到最佳的降溫和散熱效果。 事實上’前開專利在實際的散熱功效不彰,茲列明理 由如下: (1 )由於前開專利將風鼓置於電源供應器中的氣流 流入端(即電源供應器之後端),使電子發熱元件之輪出端 將無法採用金手指設計,而必須額外於電源供應器另外開 設出線孔,改以電源線方式製作輸出端,因此,該案完全 無法支援備援式電源供應器設計,對於現今電腦設備需求M255639 Creative Instructions (1) The technical field to which the new type belongs, especially one related to the new type, is that ^ ^ will be used to dissipate the γ-ray source of the ray 枇 turtle turtle i to provide heat dissipation, and the power supply will benefit the hot gas exhaust flow [previous technology]] The design of the fan = a power supply such as the Republic of China Patent Bulletin No. 5 593 〇: Do not apply to the heat sink of the power output power supply device. The technical characteristics of the former two benefits are mainly used in electronic circuits to reduce Electronic heating elements such as voltage rectifiers, the positioning device is located on the inner surface of the heat conduction plate, and the outer side of the heat conduction plate is tightly connected to the side wall of the power supply, and the front end of the power supply is provided with a wind drum, so that the wind drum can draw outside heat. When the cold air directly blows the heat-conducting plate and the electronic heating element, and a cover is fixedly fixed on the heat-conducting plate, a power supply can be connected to the power supply, and the power can be supplied to the computer through step-down rectification. The electronic heating element will quickly transfer the heat generated by it to the 'hot plate', and will be guided and dissipated by the side wall and the cover, and the wind drum fixed at the front end will simultaneously draw Cold air into the outside, and a strong air stream 'to direct cool the thermally conductive plate and the electronic heat-generating element, a mesh multiplexed escape outwardly of the rear end, so as to achieve optimum cooling and heat dissipation effect. In fact, the front-opening patent is not effective in actual heat dissipation, and the reasons are listed as follows: (1) Because the front-opening patent places the wind drum in the airflow inflow end of the power supply (that is, the rear end of the power supply), the electronic heats up. The output of the wheel of the component will not be able to adopt the golden finger design, but it is necessary to open an additional outlet hole for the power supply and use the power cable to make the output end. Therefore, the case cannot support the redundant power supply design. Computer equipment needs today

M255639 四、創作說明(2) 而言並不符合效益。 (2 )由於風鼓之吸風部為相對電源供應器呈縱向吸 風,若風鼓與電子發熱元件之間未架設有隔板區隔,風鼓 在吸取氣流時,將除了外部冷氣流外,連同已通過電子發 熱元件之高溫氣流亦會被回流吸回而造成熱氣回流,如此 將使實際對電子發熱元件吹拂之氣流溫度升高,並非完全 是吸自外部冷氣流,而使實際降溫散熱效果更加低落。 (3 )該專利在設計上必須額外安裝導熱板,增加產 品成本,而且在電子發熱元件配置上大幅的 符大=產,組化之需求,…之利用\】值又偏十低不 別、,:之種嚴重缺失皆為本新型所欲解決之重要課 j,因此’本創作人為了改善前述之缺失,經不斷田 申請。 釣局提出本新型之專利 【新型内容】 本新型的主要目的在提供一種電 成,可使熱氣不會迴、士 $丨 原供應态之散熱組 本新型之另d 進風部。 用金:指設:輸出電力。於使電力處理翠元之輸出端能採 -風扇座】,殼體分別結合一蓋板及 ;扇座係結合於風;::於=:里單元之上方位置,而 入的皆為外部的冷空===式的狀態,所吸 M255639 四、創作說明(3) --- 有關本新型的較佳實施例及詳細技術内容,茲配人 式說明如後。 " 【實施方式】 請參閱「第1圖」及「第2圖」所示,本新型之電源 供應器之散熱組成包括有: 一设體1 〇,為一盒狀結構,由一對稱之側板1 1及 一出風板1 2所組成,並於内部形成出一容置空間丄3 , 該容置空間1 3用以配置一電力處理單元1 4 ,所稱電力 處理單元1 4係將外部電力進行變壓整流等電力轉換處理 後’由電力處理單元14之輸出端1 41輸出電力,該輸 出端1 4 1係採用金手指的方式,免去接線之陋習,其中 電力處理單元1 4係會發熱,故須要對該電力處理單元工 4進行散熱,該殼體1 〇兩侧之對稱側板1 1非同一高 度,該側板1 1之形狀為一連續階級狀,而形成一高度上 之落差,該側板1 1上並設有複數個穿孔1 1 i ; & 一蓋板2〇,係蓋設於殼體1〇上方,靠近電力處理 單元1 4之一側,該蓋板2 0係呈一階級狀,俾使該蓋板 2 0之中間部位具有一散熱空間2 1 ,該散熱空間2 1之 一端為一斜面2 2,斜面2 2上並設有複數個螺孔22 1 ’而蓋板2 〇之四周圍亦設有複數個螺孔2 〇 1處, 相對於殼體1 〇之穿孔i ,當蓋板2 〇結合於二體^ 0上方時,透過螺絲5 〇將蓋板2 〇鎖固在殼體i 〇上· —風扇3〇,具有一進風部31及_出風部32,於 該風扇3 0之周緣設有複數個凸耳3 3,該 、、 M255639 g、創作說明(4) 設有螺孔3 3 一風扇座 方,5亥風扇座 相對於風扇3 口 4 1周緣設3 3 1相對應 4 0之下方, 相對於殼體1 起且具穿孔4 體1 0上方時 〇上,而蓋板 透過螺絲5 2 請再參閱 蓋板2 〇與風 2 〇與電力處 1 ,因此,當 再由出風部3 之出風板1 2 是’藉由蓋板 熱氣不會迴流 進風部3 1為 的冷空氣,不 會造成熱氣迴 請再參閱 1 ; 4 0 ’主要 4 〇之中間 0之進風部 有複數個彳 ,並透過螺 其中該風屬 0之穿孔i 4 1之結合 ’透過螺絲 2 0之斜面 將蓋板2 〇 「第3圖」 扇座4 〇上 理單元1 4 風屬3 〇由 2朝向電力 將熱氣排出 2 0與風扇:〜3〇 ΐ向外部開 =〜裝任何 =的現象。 第4圖」 係在搭 位置開 3 1上 孔4 2 絲5 1 座4 0 11, 面4 4 5 0將 2 2則 與風扇 所示, 下形成 之間具 進風部 處理單 ,達到 座4 0 之進風 放式的 隔板或 配於上 設有一 方,該 處,係 將風扇 之兩側 並於一 ,當風 風扇座 蓋設於 座4 0 透過殼 一落差 有相當 3 1將 元1 4 散熱之 之間的 部3 1 狀態, 變更設 述風扇3 進風口 4 風扇座4 與風扇3 3 0鎖固 亦設有螺 端面設有 扇座4 0 4 〇鎖固 結合面4 、结° 體1 0之 間距d , 足夠的散 外部的空 吹出,由 作用,最 落差間距 ,而且風 所吸入的 計即f達 0之上 1處,係 〇之進風 0之螺孔 於風扇座 孔4 3, 一斜向凸 結合於殼 在殼體1 4上,亦 階級狀, 而且蓋板 熱空間2 氣吸入, 殼體1 0 重要的 d,使得 扇3 0之 皆為外部 到完全不 所示,為本新型的電源供應器安M255639 Fourth, the creation description (2) is not effective. (2) Because the air suction part of the wind drum is longitudinally sucking relative to the power supply, if there is no partition between the wind drum and the electronic heating element, the air drum will draw the air in addition to the external cold air when it draws air. Together with the high-temperature airflow that has passed through the electronic heating element, it will also be sucked back by the backflow and cause the hot gas to return. This will increase the temperature of the airflow that is actually blown to the electronic heating element. It is not entirely drawn from the external cold airflow, which will actually cool down the heat. The effect is even lower. (3) The patent must be designed with an additional heat conduction plate to increase product costs, and the configuration of electronic heating components has a large value = production, organization requirements, and the use of \] value is too low. : The serious defects are all important lessons that the new model wants to solve. Therefore, in order to improve the aforementioned defects, the creator has applied continuously. Diaoyu Bureau proposed a patent for this new model. 【New content】 The main purpose of this new model is to provide an electrical system that can prevent hot air from returning to the original heat sink. With gold: refers to the setting: output power. In order to enable the output end of the electric power processing Cuiyuan to use a fan holder], the casing is combined with a cover and the fan holder respectively; the fan holder is connected to the wind; The state of the cold air === style, M255639 sucked IV. Creation instructions (3) --- For the preferred embodiment and detailed technical content of the new model, the description of the style is as follows. [Implementation] Please refer to "Figure 1" and "Figure 2", the heat dissipation composition of this new type of power supply includes: a body 10, a box-like structure, a symmetrical structure The side plate 11 and an air outlet plate 12 are formed, and an accommodating space 内部 3 is formed inside. The accommodating space 13 is used to configure a power processing unit 1 4. The so-called power processing unit 14 is After external power undergoes power conversion processing such as transformer rectification, power is output from the output end 1 41 of the power processing unit 14. The output end 1 4 1 uses a golden finger method to eliminate the bad practice of wiring. The power processing unit 1 4 The system will generate heat, so it is necessary to dissipate heat from the power processing unit. The symmetrical side plates 11 on both sides of the casing 10 are not the same height. The shape of the side plates 11 is a continuous step, forming a height There is a gap, and the side plate 11 is provided with a plurality of perforations 1 1 i; & a cover plate 20, which is arranged above the housing 10, close to one side of the power processing unit 14, and the cover plate 20 It is in a class shape, so that the middle part of the cover plate 20 has a cooling space. 2 1, one end of the heat dissipation space 2 1 is an inclined surface 2 2, a plurality of screw holes 22 1 ′ are provided on the inclined surface 2 2, and a plurality of screw holes 2 0 1 are also arranged around the cover plate 2 0 4. With respect to the perforation i of the housing 10, when the cover plate 2 is combined above the two bodies ^ 0, the cover plate 2 is fixed to the housing i through the screw 5 and the fan 3 is provided with a The air inlet section 31 and the _air outlet section 32 are provided with a plurality of lugs 3 3 on the periphery of the fan 30. This, M255639 g, creation instructions (4) are provided with screw holes 3 3 a fan seat square, 5 The fan base is opposite to the fan 3 port 4 1 The peripheral edge is set 3 3 1 corresponding to 40 below, relative to the housing 1 and has a perforated 4 body 10 above the 0, and the cover passes through the screw 5 2 Please refer to again The cover plate 2 〇 and the wind 2 〇 and the electric power section 1, so when the air outlet plate 1 2 from the air outlet 3 is cold air through the cover plate hot air will not return to the air inlet 31 For hot air return, please refer to 1 again; 4 0 'The main air inlet part of the middle 0 has a plurality of 彳, and through the screw where the wind belongs to the perforation of the i 4 1' through the screw 2 0 bevel The cover 2 〇 "Figure 3" Fan base 4 〇 Upper unit 1 4 Wind type 3 〇 From 2 to the electric power to discharge hot air 2 0 and fan: ~ 3〇 开 Open to the outside = ~ install any = phenomenon. Figure 4 "Opening 3 1 upper hole 4 2 wire 5 1 seat 4 0 11, face 4 4 50 0 2 2 and the fan as shown in the upper position, there is an air inlet processing sheet between the bottom to reach the seat The air inlet type partition of 40 can be equipped with one side. At this place, both sides of the fan are connected to one. When the fan fan cover is installed on the seat 40, there is a considerable drop of 3 1 through the shell. Yuan 1 4 The state of the part 3 1 between heat dissipation, change the design of the fan 3 air inlet 4 fan seat 4 and fan 3 3 0 lock is also provided with screw end face with fan seat 4 0 4 〇 lock joint surface 4, The distance d between the body 10 is enough to blow out the air from outside. The effect is the maximum drop distance, and the meter that the wind sucks in is f above 0, and the screw hole of the air inlet 0 is on the fan. The seat hole 4 3, which is obliquely bonded to the shell on the shell 14, is also step-like, and the cover heat space 2 is sucked in by air. The shell 1 0 is important d, so that all the fans 30 are external to complete. Not shown, for this new type of power supply

M255639 四、創作說明(5) 裝在電腦機殼6 0之使用狀態圖,透過殼體1 0之階級 狀,蓋板2 0與風扇座4 0上下形成一落差間距d,使風 扇座4 0與電腦機殼6 0之間也形成一進氣空間7 0,該 進氣空間7 0為外部的冷空氣受風扇3 0吸入,該風扇3 0再由進風部3 1將進氣空間7 0的冷空氣吸入,所以由 出風部3 2朝向電力處理單元1 4吹出的還是低溫的冷空 氣,故本新型的確能提升散熱之效果。M255639 IV. Creation instructions (5) The use state diagram installed in the computer case 60, through the class shape of the case 10, the cover 20 and the fan base 40 form a gap d up and down, so that the fan base 40 An air-intake space 70 is also formed between the computer case 60 and the air-intake space 70. The cold air outside is sucked in by the fan 30. The air-intake space 7 is taken in by the air-intake section 31. The cold air of 0 is sucked in, so the cold air is still blown out from the air outlet 32 toward the power processing unit 14, so the new model can indeed improve the heat dissipation effect.

惟以上所述者,僅為本新型之較佳實施例而已,當不 能以之限定本新型實施之範圍,即大凡依本新型申請專利 範圍所作之均等變化與修飾,皆應仍屬本新型專利涵蓋之 範圍内。However, the above are only the preferred embodiments of the new model. When the scope of implementation of the new model cannot be limited, that is, all equal changes and modifications made in accordance with the scope of the patent application for the new model shall still belong to the new model patent. Covered.

第9頁 M255639 圖式簡單說明 【圖式簡單說明】 第1圖,為本新型之立體分解圖。 第2圖,為本新型之立體外觀圖。 第3圖,為本新型之氣流走向狀態圖。 第4圖,為本新型之使用狀態圖。 【圖式符號說明】 10 ......................................................# 體 11 ......................................................側板 111 ................................................穿孔12 ................................................... ώ 才反 13 ................................................容置空間 14 ..........................................電力處理單元 14 1 .............................................輸出端 2 0 ......................................................蓋板 2 0 1 ................................................螺、1 2 1 …·· 2 2 …·· 2 2 1 3 0 …·· 3 1 …·· 3 2 …··Page 9 M255639 Schematic illustration [Schematic description] Figure 1 is a three-dimensional exploded view of the new model. Figure 2 is a three-dimensional appearance of the new model. Figure 3 is a state diagram of the airflow trend of the new model. Figure 4 is a diagram showing the use of the new model. [Illustration of Symbols] 10 ........................................... ........... # Body 11 .......................... ........ side plate 111 .................... ........ perforation 12 .............. ..................................................... 13 ......................... ............................................. 14 ......... Power Processing Unit 14 1 ............... ................... Output 2 0 ................. ................. cover 2 0 1 ........ .............. Screw, 1 2 1 ...... · 2 2 ...... · 2 2 1 3 0 ...... · · 3 1… ·· 3 2… ··

散熱空間 ......斜面 ......螺孔 ......風扇 …進風部 …出風部 ……凸耳 ……螺孔Cooling space ...... Slope ...... Screw hole ...... Fan ...... Air inlet ...... Air outlet ...... Luggage ...... Screw hole

4 0 風扇座4 0 fan holder

第10頁 M255639 圖式簡單說明 4 1 …·· 4 2…… 4 3…… 4 4 …·. 4 4 1 5 0 …·· 5 1…… 5 2 …·· 6 0 …·· 7 0 …·· …進風口 ......穿孔 ……螺孔 …結合面 ……穿孔 ……螺絲 ……螺絲 ......螺絲 電腦機殼 進氣空間 d 間距Page 10 M255639 Brief description of the diagram 4 1… · 4 2 …… 4 3 …… 4 4… · 4 4 1 5 0… · 5 1 …… 5 2 …… · 6 0… · 7 0 … ·…… Air inlet ... perforation ... thread hole ... combining surface ... perforation ... screw ... screw ... screw air inlet space of computer case d pitch

11B1I11B1I

Claims (1)

M255639 五、申請專利範圍 1 · 一種電源供應器之散熱組成,其包含: 一殼體内之一側設有一電力處理單元; 一蓋板,裝設於電力處理單元之上方形成一散熱空間, 該蓋板並與殼體結合; 一風扇,具有一進風部及一出風部,該風扇係位於電力 處理單元之鄰側,並使出風部朝向電力處理單元; 一風扇座,設有一進風口處相對於風扇之進風部,該風 扇座並結合於風扇之上方,該風扇座之兩側結合於殼體,且 風扇座之一端與蓋板結合,俾使蓋板與風扇座形成一高度差 距。 2 ·如申請專利範圍第1項所述之電源供應器之散熱組 成,其中殼體由一對稱之側板及一出風板所組成。 3 ·如申請專利範圍第2項所述之電源供應器之散熱組 成,其中側板之形狀為一連續階級狀,而形成一高度上之落 差。 4 ·如申請專利範圍第1項所述之電源供應器之散熱組 成,其中蓋板一端為一斜面。 5 ·如申請專利範圍第1項所述之電源供應器之散熱組 成,其中風扇座之一端設有一結合面。M255639 5. Scope of patent application 1. A heat dissipation component of a power supply, which includes: a power processing unit is disposed on one side of a housing; a cover plate is installed above the power processing unit to form a heat dissipation space, the The cover plate is combined with the casing; a fan having an air inlet portion and an air outlet portion, the fan is located adjacent to the power processing unit, and the air outlet portion faces the power processing unit; a fan base is provided with an inlet The air outlet is opposite to the air inlet of the fan. The fan holder is coupled to the fan. Both sides of the fan holder are connected to the casing. One end of the fan holder is combined with the cover plate. Height gap. 2 · The heat dissipation component of the power supply as described in item 1 of the scope of patent application, wherein the housing is composed of a symmetrical side plate and an air outlet plate. 3. The heat dissipation component of the power supply device as described in item 2 of the scope of the patent application, wherein the shape of the side plates is a continuous step shape, which forms a height difference. 4 · The heat dissipation component of the power supply as described in item 1 of the scope of the patent application, wherein one end of the cover plate is an inclined surface. 5 · The heat dissipation component of the power supply as described in item 1 of the patent application scope, wherein one end of the fan base is provided with a joint surface. 第12頁Page 12
TW93203587U 2004-03-10 2004-03-10 Heat sink assembly for power supply TWM255639U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7675749B2 (en) 2007-12-12 2010-03-09 Zippy Technology Corp. Heat dissipating structure of 1U power supply

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7675749B2 (en) 2007-12-12 2010-03-09 Zippy Technology Corp. Heat dissipating structure of 1U power supply

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