CN216772178U - Projector mainboard cooling system - Google Patents
Projector mainboard cooling system Download PDFInfo
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- CN216772178U CN216772178U CN202123134842.0U CN202123134842U CN216772178U CN 216772178 U CN216772178 U CN 216772178U CN 202123134842 U CN202123134842 U CN 202123134842U CN 216772178 U CN216772178 U CN 216772178U
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- heat dissipation
- projector
- mainboard
- radiator
- substrate
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- 238000001816 cooling Methods 0.000 title claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 19
- 238000009423 ventilation Methods 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Projection Apparatus (AREA)
Abstract
The utility model discloses a projector mainboard cooling system which comprises a mainboard, a radiator, a vortex fan and a shell, wherein the radiator is arranged on the lower side of the mainboard, the vortex fan is fixed at the bottom of the shell, and the vortex fan is positioned between the radiator and the shell. The utility model has simple structure, convenient assembly and good heat dissipation effect, and effectively solves the problem that the heat dissipation of the projector mainboard is difficult under the condition that the mainboard radiator is far away from the vortex fan and the air duct is unfavorable.
Description
Technical Field
The utility model relates to the technical field of projector design, in particular to a projector mainboard cooling system.
Background
With the development of social economy, various types of projectors are very popular nowadays, and especially, miniature intelligent projectors enter a large number of ordinary people by virtue of small appearance and high cost performance. Because heating components such as an optical machine light source with huge heat productivity, a DMD chip, a mainboard chip and the like are arranged in a small space, how to reasonably and efficiently dissipate heat is a constant topic in the projector industry.
According to the appearance modeling and the functional layout of the corresponding whole machine, flexible and changeable heat dissipation measures need to be adopted, and one important task is how to efficiently and fully dissipate heat of chips on a mainboard.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a projector mainboard heat dissipation system, which effectively solves the problem that the projector mainboard is difficult to dissipate heat under the conditions that a mainboard radiator is far away from a vortex fan and an air duct is formed disadvantageously.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a projector mainboard heat dissipation system comprises a mainboard, a radiator, a vortex fan and a shell, wherein the radiator is arranged on the lower side of the mainboard, the vortex fan is fixed at the bottom of the shell, and the vortex fan is located between the radiator and the shell.
The utility model has novel structure and strong practicability. When the whole machine works, cold air at the airflow inlet of the shell can directly enter the air inlet of the radiator in sequence, then flows through the fins of the radiator and finally is converted into hot air through the air outlet of the radiator. The hot air is conveyed out of the whole machine through the negative pressure of the vortex fan. Thereby achieving the purpose of reducing the number of main board chips.
In some embodiments, the heat sink includes a substrate, the substrate is provided with a through air outlet, the substrate on two sides of the air outlet is respectively provided with a plurality of fins, a ventilation slot is formed between adjacent fins, one end of the ventilation slot is communicated with the air outlet, and the other end of the ventilation slot is communicated with the air inlet on two sides of the substrate.
In some embodiments, a plurality of platforms are distributed on the substrate around the air outlet, and the heat conducting rubber pads are adhered on the platforms. The other side of the heat-conducting rubber pad is closely attached to the mainboard chip, so that the heat of the mainboard chip is effectively and rapidly conducted to the radiator.
In some embodiments, the substrate is die cast from an aluminum alloy or copper.
In some embodiments, the fins are die cast from an aluminum alloy or copper.
In some embodiments, the air inlet of the vortex fan is opposite to the air outlet.
In some embodiments, the fins are equally spaced.
In some embodiments, the two sides of the housing are respectively provided with an airflow inlet, and the airflow inlet is arranged opposite to the air inlet.
The beneficial effects that may be brought by a projector main board heat dissipation system disclosed in the present application include but are not limited to:
the utility model has simple structure, convenient assembly and good heat dissipation effect, and effectively solves the problem that the heat dissipation of the projector mainboard is difficult under the conditions that the mainboard radiator is far away from the vortex fan and the air channel is formed disadvantageously.
Drawings
Fig. 1 is an exploded view of a heat dissipation system for a main board of a projector according to the present invention.
Fig. 2 is a schematic front view of the heat sink of the present invention.
Fig. 3 is a schematic view of the back of the heat sink of the present invention.
Fig. 4 is an assembly view of the present invention (with the rear of the housing being a partial plan view).
Illustration of the drawings:
1-main board, 2-radiator, 3-vortex fan, 4-shell, 201-air inlet, 202-platform, 203-fin, 204-air outlet, 205-substrate, and 401-air inlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
On the contrary, this application is intended to cover any alternatives, modifications, equivalents, and alternatives that may be included within the spirit and scope of the application as defined by the appended claims. Furthermore, in the following detailed description of the present application, certain specific details are set forth in order to provide a better understanding of the present application. It will be apparent to one skilled in the art that the present application may be practiced without these specific details.
A projector main board heat dissipation system according to an embodiment of the present application will be described in detail below with reference to fig. 1 to 4. It is to be noted that the following examples are only for explaining the present application and do not constitute a limitation to the present application.
In the embodiment of the present application, as shown in fig. 1 to 4, the projector motherboard heat dissipation system may include a motherboard 1, a heat sink 2, an eddy current fan 3, and a housing 4, wherein the heat sink 2 is locked to the lower side of the motherboard 1 by screws, the eddy current fan 3 is fixed to the bottom of the housing 4, and the eddy current fan 3 is located between the heat sink 2 and the housing 4.
In some embodiments, the heat sink 2 includes a substrate 205, the substrate 205 is provided with a through air outlet 204, the substrate 205 on two sides of the air outlet 204 is respectively provided with a plurality of fins 203, a ventilation slot is formed between adjacent fins 203, one end of the ventilation slot is communicated with the air outlet 204, and the other end of the ventilation slot is communicated with the air inlets 201 on two sides of the substrate 205. The heat sink 2 and the motherboard 1 are connected by a substrate 205. After the outer cold wind of casing 4 got into through air intake 201, can flow from air outlet 204 along the ventilation groove, can reduce the temperature of chip on mainboard 1 at this in-process, can take away the heat that transmits to on the heating panel again, and then reach the purpose that reduces mainboard 1 and chip temperature.
In some embodiments, a plurality of platforms 202 are further disposed on the substrate 205 around the air outlet 204, and a thermal conductive adhesive pad is adhered on the platforms 202. The other side of the heat-conducting rubber pad is closely attached to the chip of the mainboard 1, so that the heat of the chip of the mainboard 1 is effectively and rapidly conducted to the radiator 2. The heat transferred to the heat sink 2 is then removed by air cooling. Thereby achieving the purpose of reducing the heat of the mainboard 1.
In some embodiments, the fins 203 are die-cast from aluminum alloy or copper, and preferably the fins 203 are equally spaced. The aluminum alloy and the copper have good heat conduction effect and heat dissipation effect. As is well known, the heat sink 2 improves heat dissipation efficiency mainly by increasing a heat dissipation area. The arrangement of the fins 203 increases the surface area, and the fins 203 with a large amount of surface area are substantially enclosed between the main board 1 and the substrate 205, and the formed air channel, i.e. ventilation slot, is relatively sealed and complete.
In some embodiments, the air inlet of the vortex fan 3 is opposite to the air outlet 204. By the arrangement, when the vortex fan 3 works, the air inlet of the vortex fan 3 completely sucks away the air flow passing through the ventilation groove, namely, the air to be subjected to heat exchange is sucked away.
In some embodiments, the housing 4 is provided with an airflow inlet 401 on each of two sides thereof, and the airflow inlet 401 is disposed opposite to the air inlet 201.
The utility model has novel structure and strong practicability. When the whole machine works, cold air at the airflow inlet 401 of the shell 4 can directly enter the air inlet 201 of the radiator 2 in sequence, then flows through the fins 203 of the radiator 2, and finally is converted into hot air through the air outlet 204 of the radiator 2. The hot air is conveyed out of the whole machine through the negative pressure of the vortex fan 3. Thereby achieving the purpose of reducing the chips of the mainboard 1. The cold air can independently pass through the air channel formed between the radiator 2 and the main board 1, is finally converged and changed into hot air, and the hot air is sucked in through the negative pressure formed by the vortex fan 3 and finally flows out of the whole machine. The whole heat dissipation system basically has no air duct loss to carry out high-efficiency heat dissipation on the mainboard 1.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. The projector mainboard cooling system is characterized by comprising a mainboard (1), a radiator (2), a vortex fan (3) and a shell (4), wherein the radiator (2) is arranged on the lower side of the mainboard (1), the vortex fan (3) is fixed at the bottom of the shell (4), and the vortex fan (3) is positioned between the radiator (2) and the shell (4).
2. The heat dissipation system for the main board of the projector as claimed in claim 1, wherein the heat sink (2) includes a substrate (205), the substrate (205) is provided with a through air outlet (204), the substrate (205) on two sides of the air outlet (204) is respectively provided with a plurality of fins (203), a ventilation slot is formed between adjacent fins (203), one end of the ventilation slot is communicated with the air outlet (204), and the other end of the ventilation slot is communicated with the air inlet (201) on two sides of the substrate (205).
3. The heat dissipation system for a projector motherboard as recited in claim 2, wherein a plurality of platforms (202) are further disposed on the substrate (205) around the air outlet (204), and a heat conductive rubber pad is adhered on the platforms (202).
4. The heat dissipation system for main boards of projectors of claim 2, wherein the base board (205) is die-cast from aluminum alloy or copper.
5. A projector main board heat dissipation system as claimed in claim 2, wherein the fins (203) are die-cast from aluminum alloy or copper.
6. The heat dissipation system for main boards of projectors of claim 2, wherein the air inlet (201) of the vortex fan (3) is disposed opposite to the air outlet (204).
7. A projector main board heat dissipation system as claimed in claim 2, wherein the fins (203) are arranged at equal intervals.
8. The heat dissipation system for the main board of the projector as claimed in claim 2, wherein the housing (4) has airflow inlets (401) formed at two sides thereof, and the airflow inlets (401) are disposed opposite to the air inlets (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123134842.0U CN216772178U (en) | 2021-12-14 | 2021-12-14 | Projector mainboard cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123134842.0U CN216772178U (en) | 2021-12-14 | 2021-12-14 | Projector mainboard cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216772178U true CN216772178U (en) | 2022-06-17 |
Family
ID=81967861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123134842.0U Active CN216772178U (en) | 2021-12-14 | 2021-12-14 | Projector mainboard cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216772178U (en) |
-
2021
- 2021-12-14 CN CN202123134842.0U patent/CN216772178U/en active Active
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