M250220M250220
五、創作說明Q) (新型所屬之技術領域 ) 立^創作係有關一種散熱結構之改良，尤指一種可形成 雙‘散熱效果及面積，使散熱效率提高之散熱結構。 (先前技術） …V. Creation Description Q) (Technical Field to which the New Type belongs) The creation is related to the improvement of a heat dissipation structure, especially a heat dissipation structure that can form a double 'heat dissipation effect and area to improve heat dissipation efficiency. (Prior art) ...
按；一般之電腦所使用之CPU或於工作中會產生溫 升之電子元件’通常係設有一散熱結構，將溫升予以散發 2保持其工作之穩定並防止因過度之高溫而損壞，習知之 政熱結構通常係設有一散熱片，於散熱片上方置以一風扇 i俾將散熱片固定於c P U或其他之電子元件，使溫升由 政熱片傳導後再經由風扇對流散發。此種習知之散熱結構 由於溫升僅藉由散熱片傳導再經由風扇散發，因此散熱效 果並不理想’尤其對於處理速度愈來愈快之C P u，當大 量溫升出現時，即產生散熱過慢之問題，而基於體積、空 間的考量又無法加大散熱片及風扇，實也為當今業者所面 臨的一大問題。 現今解決之方法，係藉由熱導管將熱量由散熱片底部 傳^上方’再由風扇對整體散熱片散熱，惟由於熱導管傳 至散熱片上方的熱量與散熱片本身傳導至上部的熱量差異 不大，因此所增加之效果不彰。 而另一種方法，係設有兩個散熱片，散熱片之間有斷 熱處理，藉由熱導管將熱量由下方散熱片傳至的上方散熱 片’再由風扇對流對整體散熱片散熱，由於使用兩組散熱 片’因此增加整組散熱器的體積與重量。 (新型内容）Press; general CPUs used by computers or electronic components that generate temperature rise during work are usually provided with a heat dissipation structure that radiates the temperature rise 2 to maintain the stability of its work and prevent damage due to excessive high temperature. The political heat structure is usually provided with a heat sink. A fan i 俾 is placed above the heat sink to fix the heat sink to the cPU or other electronic components, so that the temperature rise is conducted by the political heat sheet and then circulated through the fan. This conventional heat dissipation structure is not ideal because the temperature rise is only conducted by the heat sink and then dissipated by the fan. Especially for CP u, which has a faster and faster processing speed, when a large amount of temperature rise occurs, heat dissipation occurs. The problem of slowness, and the inability to increase the heat sink and fan based on volume and space considerations, is also a major problem facing industry players today. The current solution is to use a heat pipe to transfer heat from the bottom of the heat sink to the top of the heat sink, and then the fan to dissipate the overall heat sink. However, due to the difference between the heat transmitted by the heat pipe above the heat sink and the heat conducted by the heat sink itself to the upper part Small, so the added effect is not great. In another method, there are two heat sinks, and there is an interrupted heat treatment between the heat sinks. The heat pipe transmits heat from the lower heat sink to the upper heat sink ', and then the convection of the fan is used to dissipate heat to the overall heat sink. The two sets of heat sinks' therefore increase the volume and weight of the entire set of heat sinks. (New content)
第5頁 M250220 五、創作說明（2) 本創作之主要目 使散熱效率得以提高 他電子元件之散熱問 前述之散熱結構 中’該散熱片係設有 稱之套槽，兩側則設 管則分別設有一水平 彎折，俾將該熱導管 兩端分別穿設固定於 散熱裝置，使其固定 管將散熱片的熱量導 面積散熱再下降，以 高散熱之效率。 (實施方式） 的，即在提供一種散熱結構之改 β，以應對處理速度日增之cpu】f 題。 \冉 ，主要包含一散熱片及兩導埶 一固定座，於固定座表面中；：；有： 有間隔排列之多數缺κ ^ °又有對 ^ 丄， 歎，片而该兩導埶 奴，由水平段兩端分別向上呈連芦;; ϊίΤ段置於散熱片之套槽後，ί复 政熱片落之固定位孔，以k 於CPU或复4M構成 '、他電子元件，藉由埶導 向其兩端上升後’再 框： 形成雙倍之散熱效果及散熱 及 定 側 兩熱 座1 則分 該 端分別 該3 1 藉 置於 孔 U吋爹阅第一、二圖，本創 導管2、-風扇3，其中，該螂卜含一散熱片1 1，於固定座1 1表面設有f; 1，、、、片1係設有-固 別设有間隔並排之多數鰭片工^套槽1 1 1，兩 兩熱導管2係分別設有一水 M連縯彎折後，使末端呈向上：2 1 ’由水平段兩 風扇3係為鉋製材質，其四個角 ， 角落分別設有固定位 由前述構件的組合，該兩熱 政熱片1之套槽1 1 1 “X以係以其水平段2 者固定），並使其兩Page 5 M250220 5. Creation instructions (2) The main purpose of this creation is to improve the heat dissipation efficiency of other electronic components. In the aforementioned heat dissipation structure, 'the heat sink is provided with a sleeve, and the two sides are provided with pipe rules. A horizontal bend is respectively provided, and the two ends of the heat pipe are respectively fixed and fixed to the heat dissipation device, so that the fixing pipe can reduce the heat conduction area of the heat sink and then reduce it to achieve high heat dissipation efficiency. (Embodiment), that is, to provide a modification of the heat dissipation structure β in order to cope with the increasing CPU processing speed. \ Ran, which mainly includes a heat sink and two guides and a fixed seat in the surface of the fixed seat ;: Yes: There are most of the gaps ^ ^ ° and there are pairs ^ 丄, sigh, and the two guides , The two ends of the horizontal section are upwards, respectively; ϊίΤ section is placed in the slot of the heat sink, the fixed hole of the Fuzheng heat film is formed by k in the CPU or Fu 4M, and other electronic components, borrow After rising from both ends to the two ends, the frame will be doubled: it will double the heat dissipation effect and heat dissipation, and the two hot seats on the fixed side will be divided into 3 at the end respectively. Wound duct 2, fan 3, wherein the beetle includes a heat sink 11, and f is provided on the surface of the fixed base 11; 1 ,,, and 1 are provided-a plurality of fins are arranged side by side in a fixed manner. The workman's slot 1 1 1, two pairs of heat pipes 2 are respectively provided with a water M continuous bending, so that the end is upward: 2 1 'from the horizontal section two fans 3 series are planed material, its four corners The corners are respectively provided with a combination of fixed positions and the aforementioned components, and the two grooves of the two thermal management plates 1 1 1 "X are fixed by the horizontal section 2), and the two
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M250220 五、創作說明（3)M250220 V. Creation Instructions (3)
端之垂 與散熱 u或電 升後再 熱效果 請 置於散 於散熱 於風扇 或電子 的熱量 以形成 的效率 因高溫 罝权穿 片1疊 子元件 經由風 及散熱 參閱第 熱片1 片1之 3之固 元件之 向兩端 雙倍之 ，使高 而受損 設固定於 置固定， ，藉由熱 扇鋁框表 面積，俾 三圖，本 上方，而 套槽1 1 定位孔3 溫升時， 上升後， 散熱效果 溫升之電 風扇3之 俾於使用 導管將散 面積散熱 提高散熱 創作於組 其中之熱 1 ，兩端 1 ，如此 其熱溫將 經由風扇 及散熱面 子元件保 固定孔 時將散 熱片的 再下降 之效率 合後， 導管2 之垂直 ’當散 由熱導 鋁框表 積，相 持動作 位3 χ 熱片1 熱量導 ’以形 該風屬 則以水 段則分 熱片1 管2中 面積散 對的， 之穩定 ’使風扇3 平置於C P 向其兩端上 成雙倍之散 3係固定疊 平段2 1置 別穿設固定 吸收C P U 央將散熱片 熱再下降， 提南了散熱 ，且防止其 執妹综上所述，本創作以熱導管結合散熱片及風扇，使散 ^構之散熱效果及面積雙倍提升，為一實用之設計，誠 、一俱新賴性之創作，爰依法提出專利申請，祈鈞局予 以審查，早曰賜准專利，至感德便。 M250220 圖式簡單說明 第一圖係本創作之立體圖。 第二圖係本創作之立體分解圖。 第三圖係本創作之部份剖面圖。 (圖號） 1·散熱片 2·導熱管 3 2 1 ·水平段 3 1 ·固定孔位 1 1 2 ·鰭片 扇 風 座 底 槽 套The effect of the vertical drop and heat dissipation u or electric reheating should be placed on the heat dissipated by the fan or electrons to form the efficiency due to high temperature. Right through the sheet 1 stack of elements through the wind and heat dissipation see the first heat sheet 1 sheet 1 The fixed component of 3 is doubled to the two ends, so that the high and damaged device is fixed to the fixed position. With the surface area of the aluminum frame of the hot fan, the third figure is above the top, and the slot 1 1 positioning hole 3 temperature rise When the temperature rises, the heat dissipation effect of the electric fan 3 that rises in temperature is to use a duct to dissipate the heat from the scattered area to improve heat dissipation. The heat created in the group is 1 and the ends are 1 so that the heat temperature will be maintained by the fan and the heat dissipation surface element fixing holes When the efficiency of the heat sink's lowering is combined again, the vertical of the duct 2 is formed by the heat conduction aluminum frame, and the holding action position is 3 χ The heat fin 1 is the heat conduction '. The wind is divided by the water section. Fan 1 in tube 2 is staggered in area and stable, so that fan 3 is placed flat on the CP and it is doubled on both ends. 3 series of fixed and flattened sections 2 1 is installed and fixed to absorb the heat of the CPU Drop again, tinan radiates heat, To prevent his executive sister from summarizing the above, this creation uses a heat pipe combined with a heat sink and a fan to double the heat dissipation effect and area of the diffuser structure. It is a practical design, a sincere and new creation. The patent application was submitted in accordance with the law, and the Qijun Bureau examined it, and granted the patent as early as possible. M250220 Schematic description The first picture is a perspective view of this creation. The second picture is a three-dimensional exploded view of this creation. The third picture is a partial section view of this creation. (Picture No.) 1 · Heat sink 2 · Heat pipe 3 2 1 · Horizontal section 3 1 · Fixed hole position 1 1 2 · Fin Fan Base Seat Sleeve
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