CN2935729Y - radiator structure - Google Patents

Abstract

A kind of heat sink structure, including the heat-dissipating structure, cover the fan casing above the heat-dissipating structure, and locate at the fan of one side of the fan casing; wherein, a plurality of inclination elevating pieces are arranged between the fan cover and the fan, the elevating pieces have at least two different heights, the higher one is arranged at the lower part between the fan cover and the fan, and the lower one is arranged at the upper part between the fan cover and the fan, so that the distance between the fan cover and the fan is in an inclined configuration with a narrow top and a wide bottom.

Description

radiator structure

technical field

The utility model relates to a heat sink structure, in particular to a heat sink structure which dissipates peripheral heat through a fan arranged at an inclined height.

Background technique

The importance of radiators to electronic heating components is directly proportional to the faster and faster computer computing speed. When the computer is used for a longer and longer time, the temperature generated by the central processing unit (CPU) is of course higher and higher. If the high temperature of the CPU is within the acceptable range, or the internal heat dissipation can be used to cool down to maintain the acceptable temperature, then this temperature factor is no longer the focus of the product. But this is often not the case, so most designers reduce the temperature rise of the processor through externally designed components to maintain the high temperature of the central processing unit within an acceptable value range, so that the computer can operate normally.

However, the most common way is to add a heat sink assembly to the electronic heating component, but the heat dissipation benefits of different forms of heat sink assembly are often different. As shown in Figure 1, in the prior art, the top of the central processing unit 3a is attached to the heat conduction seat 1a provided with cooling fins 10a, so as to transfer the heat generated by the central processing unit 3a to the cooling fins 10a, or pass through The heat pipes 11a of each heat dissipation fin 10a are arranged to assist in the heat conduction of the heat sink, and finally the fan 2a is arranged on one side of the heat dissipation fin 10a, and the fan 2a arranged laterally is used to forcefully blow cold air to achieve the effect of heat dissipation.

In addition, the problem that needs to be paid attention to is: the electronic components located around the radiator form another high heat source due to the heat energy of the central processing unit and itself. If the heat cannot be dissipated in real time, it may cause damage to the chip or the electronic heating component itself. In order to solve the heat dissipation problem of the central processing unit and peripheral components, many heat sink technologies have been developed. In the prior art, there is a "radiation device" disclosed, which includes a heat sink, a bearing seat and a fan. And the applied centrifugal fan blows cold air to the electronic parts and the cooling fins respectively to achieve the cooling effect. However, this type of cooling is implemented for notebook computers. In addition, one side of the fan is air-permeable, and only this side supplies air to the cooling fins. It is estimated that the traveling route of the airflow generated by this side cannot dissipate heat to all the cooling fins, which affects the heat dissipation efficiency.

In view of this, the invention of the utility model artificially improves and solves the above-mentioned defects. After painstaking research and application of theories, a utility model with reasonable design and effective improvement of the above-mentioned defects is finally proposed.

Utility model content

The main purpose of this utility model is to provide a heat sink structure, which can not only provide the basic heat dissipation requirements of the electronic heating components, but also can effectively reduce the ambient temperature around the electronic heating components, especially for the electronic heating components. Secondary heat sources such as transistors on the periphery of the heat-generating components dissipate heat.

In order to achieve the above purpose, the utility model provides a radiator structure, including a heat dissipation structure and a fan located on one side of the heat dissipation structure; wherein, a plurality of slope pads are arranged between the heat dissipation structure and the fan, The riser has at least two different heights, and the higher height is arranged at the lower part between the fan cover and the fan, while the lower one is arranged at the upper part between the fan cover and the fan, so that the fan The distance between the cover and the fan is inclined to be narrow at the top and wide at the bottom.

Description of drawings

Fig. 1 is a schematic diagram of the state of use of a radiator in the prior art;

Fig. 2 is a three-dimensional exploded view of the first embodiment of the utility model;

Fig. 3 is a three-dimensional exploded view of the application of the first embodiment of the utility model to the central processing unit;

Fig. 4 is a schematic diagram of the usage state of the first embodiment of the utility model applied to the central processing unit;

Fig. 5 is a three-dimensional exploded view of the second embodiment of the utility model;

Fig. 6 is a three-dimensional exploded view of the third embodiment of the present invention.

In the accompanying drawings, the list of parts represented by each label is as follows:

1a heat conduction seat 10a cooling fins

11a heat pipe 2a fan

3a central processing unit 1 cooling structure

10 heat conduction seat 100 heating surface

101 heat conduction surface 11 cooling fins

2 fan cover 20 cover space

21 Locking Department 3 Fans

30 locking components 4 slope heightening parts

40 first hollow column 41 second hollow column

40' first side strip 41' second side strip

42 lateral side strips 5 electronic heating components

50 transistors

Detailed ways

In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the accompanying drawings are only for reference and description, and are not intended to limit the present utility model.

Fig. 2 is a three-dimensional exploded view of the first embodiment of the utility model. The utility model provides a radiator structure, which includes a heat dissipation structure 1 , a fan cover 2 and a fan 3 .

The heat dissipation structure 1 can be an extruded aluminum heat sink (not shown) or the embodiment of the present invention, which includes a heat conduction seat 10 and a plurality of heat dissipation fins 11 vertically arranged in a horizontal direction. The heat conduction seat 10 is made of a material with good thermal conductivity, such as aluminum, copper, etc., and can be in the shape of a flat plate, and has a heating surface 100 (as shown in Figure 4 ) formed on its bottom surface, and a heating surface formed on its bottom surface. The top surface and the heat conduction surface 101 opposite to the heat receiving surface 100 . The heat receiving surface 100 is used to be flatly attached to electronic heating components 5 such as a central processing unit (CPU) (as shown in FIG. 4 ), and the heat conducting surface 101 can be attached to the above-mentioned cooling fins 11 .

The fan cover 2 is a "ㄇ"-shaped frame, and has a cover setting space 20 for the cooling fins 11 to be accommodated therein, so that the fan cover 2 is placed above the heat dissipation structure 1, and further the fan cover 2 It is locked on both sides of the heat conduction seat 10 . The fan 3 is located at one side opening of the housing space 20 of the fan housing 2 , and blows cold air toward each cooling fin 11 to help the cooling structure 1 dissipate heat.

The utility model is mainly characterized in that a plurality of slope raising parts 4 are arranged between the heat dissipation structure 1 and the fan 3, and the slope raising parts 4 have at least two different heights, and the higher heights are located in the heat dissipation structure. 1 and the fan 3 at the bottom, and the one with a lower height is set at the top between the heat dissipation structure 1 and the fan 3, so that the distance between the heat dissipation structure 1 and the fan 3 is inclined at the top narrow and wide at the bottom . In this embodiment, the gradient heightening member 4 includes two first hollow columns 40 and two second hollow columns 41 , and the height of the first hollow columns 40 is higher than that of the second hollow columns 41 . In this way, the two first hollow columns 40 can be respectively arranged at the two corners below the fan 3, and the other two second hollow columns 41 are respectively arranged at the two corners above the fan 3. The opening of one side of the cover space 20 of the cover 2 is provided with a locking part 21 opposite to each other. After the four corners of the fan 3 respectively pass through the first and second hollow columns 40 and 41 with a locking assembly 30 such as screws, the lock is further locked. Set on the locking part 21 of the fan cover 2 to complete the assembly.

Like this, as shown in Fig. 3 and Fig. 4, when the utility model is applied on the electronic heating components 5 such as central processing unit, owing to be provided with described first, second hollow column 40, 41, and these first and second hollow columns 40, 41 can make the fan 3 be inclined due to the arrangement of the height, so that the cold air flow blown by the fan 3 can be in the flow direction of an oblique angle, and blow from oblique upward Slant down to send the cold air to the heat-generating components such as transistors 50 on the periphery of the electronic heat-generating components 5 toward the heat-dissipating fins 11 to effectively help them dissipate heat.

In addition, FIG. 5 is a three-dimensional exploded view of the second embodiment of the present invention. In this embodiment, the gradient heightening member 4 includes a first side bar 40' and a second side bar 41', and the height of the first side bar 40' is higher than that of the second side bar 41', so the The first side strip 40' is arranged at the lower side of the fan 3, and the second side strip 41' is arranged at the upper side of the fan 3, so that the same purpose as the above-mentioned first embodiment can be achieved.

In addition, FIG. 6 is a three-dimensional exploded view of the third embodiment of the present invention. In this embodiment, the gradient heightening member 4 includes two lateral side strips 42. The height of the two sideways side strips 42 is arranged in an inclined configuration with the top down and the bottom high, and are arranged on the left and right sides of the fan 3 respectively. At the position, the fan 3 can be arranged obliquely by the height of the tilting.

According to the above structure composition, the radiator structure of the present utility model can be obtained.

The above descriptions are only preferred feasible embodiments of the present utility model, and the scope of the present utility model is not limited thereto. All equivalent structural changes made by using the description of the utility model and the contents of the accompanying drawings are all included in this utility model in the same way. new range.

Claims (8)

1. a heat spreader structures is characterized in that, comprising:

Radiator structure has heat conducting seat, and is provided with the radiating fin that a plurality of horizontal settings are arranged on described heat conducting seat; And

Fan is positioned at a side place of each radiating fin;

Wherein, between described radiator structure and fan, be provided with a plurality of gradient bed hedgehopping spares, so that described radiator structure and fan distance to each other is up-narrow and down-wide tilted configuration.

2. heat spreader structures as claimed in claim 1, it is characterized in that, a plurality of described gradient bed hedgehopping spares have two kinds of different height at least, and height the higher person is located at the below place between described radiator structure and the fan, and the height junior then is located at the place, top between described radiator structure and the fan.

3. heat spreader structures as claimed in claim 2 is characterized in that, a plurality of described gradient bed hedgehopping spares comprise two first hollow posts and two second hollow posts, and the height height of described second hollow posts of the aspect ratio of described first hollow posts.

4. heat spreader structures as claimed in claim 2 is characterized in that, a plurality of described gradient bed hedgehopping spares comprise one first edge strip and one second edge strip, and the height height of described second edge strip of the aspect ratio of described first edge strip.

5. heat spreader structures as claimed in claim 1, it is characterized in that, a plurality of described gradient bed hedgehopping spares comprise two side direction edge strips, and the height of described two side direction edge strips is presented low high tilted configuration, and are located at the and arranged on left and right sides place between described radiator structure and the fan respectively.

6. heat spreader structures as claimed in claim 1 is characterized in that, described radiator structure is the aluminium extruded type radiator.

7. heat spreader structures as claimed in claim 1 is characterized in that, further comprises fan guard, is located at described radiator structure top, and described fan guard has the space of being covered with, to hold each described radiating fin.

8. heat spreader structures as claimed in claim 7 is characterized in that, described fan guard is " ㄇ " shape framework.

Images