M247923M247923
【新型所屬之技術領域】 本創作係提供一種均溫 種將導熱管埋設於導熱塊之 量均勻傳導到各導熱管上， 者。 ’ 熱導散熱體結構改良，尤指一 周緣面上，可使發熱元件之熱 以得到一均溫傳導之散熱效果 【先前技術】 隨著電腦資訊科技蓬勃發展，因 的設計亦隨著曰新月里，以付Φ日《< “ “电細相關領域 百々月呉，以彺電月自中央處理器（CPU )運作 速度緩忮，以鋁擠型或鰭片型散熱器加散熱風扇所構 散熱裝置，來做為散熱之設備即已足夠，但近來cpU之時 脈已突破1GHz，更有超過3GHz者，且時脈與熱量 = 關係，因此，上述之散熱裝置受限於機殼之空間限制，已 愈來愈難以跟隨CPU運作速度之提昇而有效解決散熱之問 題，故以與導熱管組成之散熱裝置，再度成為散熱課題\ 一解決方案。 請參閱第一圖所示，係為習知散熱裝置結構剖視圖， 其係包括有一導熱板l〇a、複數導熱管20a及一散熱器 30a ’其中熱板l〇a具有一平板狀之本體，該本體底面 係平貼於發熱元件（如：CPU)上’且其頂面開設有複數條相 互平行槽溝1 1 a，該等槽溝1 1 a係分別可供導熱管2 〇 a埋 設，該導熱管2 0 a内部具有毛細組織及工作流體，且形成 下端為一吸熱部及上端為一散熱部，該吸熱部與導熱塊 1 0 a緊密接觸並相應配合，另該散熱部則與散熱哭^ a ^ 結，以形成一散熱裝置之組合型態；藉此，當該發熱元件[Technical field to which the new type belongs] This creation is to provide a uniform temperature type that buryes the heat pipe in the heat conduction block to the heat pipe evenly. '' The structure of the heat conducting heat sink is improved, especially on the peripheral edge, so that the heat of the heating element can be obtained to achieve a uniform temperature conduction effect. [Previous technology] With the rapid development of computer information technology, the design of During the month, we will pay "<" "Electronics related fields for a hundred months, and the speed of the CPU from the CPU to slow down, with aluminum extrusion or fin-type radiators and cooling fans It is sufficient to construct a heat sink as a heat sink, but recently the clock of cpU has exceeded 1GHz, and more than 3GHz, and the clock and heat = relationship. Therefore, the above heat sink is limited to the case Due to space constraints, it has become increasingly difficult to effectively solve the problem of heat dissipation following the increase in the operating speed of the CPU. Therefore, the heat dissipation device composed of a heat pipe is once again a problem of heat dissipation \ a solution. Please refer to the first figure, which is a cross-sectional view of a conventional heat sink structure, which includes a heat conducting plate 10a, a plurality of heat conducting tubes 20a, and a heat sink 30a. The heat plate 10a has a flat plate-shaped body, The bottom surface of the body is flatly attached to a heating element (such as a CPU), and the top surface is provided with a plurality of mutually parallel grooves 1 1 a, and the grooves 1 1 a are respectively used for embedding the heat pipe 2 0a. The heat transfer tube 20a has capillary tissue and working fluid inside, and forms a heat absorption portion at the lower end and a heat dissipation portion at the upper end. The heat absorption portion is in close contact with the heat conduction block 10a and cooperates accordingly, and the heat dissipation portion is connected with heat dissipation. Cry ^ a ^ knot to form a combined type of heat sink; thereby, when the heating element
第5頁 M247923 五、創作說明（2) 運作時所產生之高熱量，可依熱傳導方式導引至導熱板 10a上，再由導熱管20a經散熱器30a而將熱量散發出去， 以達成散熱之作用。 然而’習知之散熱装置結構，基本上仍具有如下之問 題點：由於中央處理裔之發展趨勢係為體積愈小及執行速 度愈快，故其所產生之熱源相當集中且快速，其中中間兩 支$熱管20a與發熱元件之距離最短，該導熱管2〇3之吸熱 部旎快速吸收熱罝並使内部之工作流體蒸發，以能將熱量 迅速帶離熱源而傳導至散熱部，但該散熱部上方之散埶哭 3〇a來不及將熱量散發出去，使得工作流體無法產生冷卻@ /旋結再回流至吸熱部，以使導埶管 熱，；另者，位於兩側邊二熱°=?:::= 僂，源之熱？傳導路徑係t 發生電，當機或處理器ΐ i:: ί熱官20a上，因而極易 於是’本創作人有感於上述 之經驗，並針對可進行改善之…問m行業多年 有效改善上述問題點之本=提出- 結構改等熱導散熱體 ί傳傳熱二=同::熱 θ /皿傳導之散熱效果為目的者。 〈熱Page 5 M247923 V. Creation instructions (2) The high heat generated during operation can be guided to the heat conduction plate 10a by heat conduction, and then the heat is dissipated by the heat conduction tube 20a through the heat sink 30a to achieve heat dissipation. effect. However, the structure of the conventional heat sink still basically has the following problems: Because the development trend of the central processing system is that the volume is smaller and the execution speed is faster, the heat sources generated by it are quite concentrated and fast, of which the two in the middle The distance between the heat pipe 20a and the heating element is the shortest. The heat absorbing section of the heat pipe 203 quickly absorbs heat and evaporates the internal working fluid, so that the heat can be quickly removed from the heat source and transmitted to the heat sink. However, the heat sink It ’s too late to cry for 30a, so that the working fluid can't be cooled @ / 旋 结 and return to the heat absorption part, so that the duct is hot; In addition, it is located on both sides of the two degrees ° =? ::: = Alas, the source of heat? The conduction path is electrical when t occurs, and it crashes or the processor ΐ i :: ί thermal official 20a, so it is very easy to be 'the creator has felt the above experience, and aimed at what can be improved ... ask m industry to effectively improve for many years The essence of the above problem points = put forward-structural reformation and other heat conducting heat sinks, heat transfer and heat transfer = same as :: heat θ / dish conduction heat dissipation effect for the purpose. <heat
第6頁 M247923 五、創作說明（3) 為了達成上述之目 熱體結構改良，其係包 該導熱塊具有一凸出狀 互平行連結部，該等連 熱管内部具有毛細組織 及散熱部，該吸熱部係 該散熱部則可將熱量傳 【實施方式】 為了使貴審查委 技術内容，請參閱以下 所附圖式僅提供參考與 制者。 請參閱第二、三圖 一實施例之立體分解圖 作係提供一種均溫熱導 塊10及複數導熱管20， "亥^r熱塊10係以鋼 有一凸出狀之本體11， J(如第五圖）或其他幾 圓柱體/其上方周緣 〆’该等連結部1 2係可 係為一槽溝者。 該導熱管20係可為 體，於其内部具有毛細 ^本創作係提供一種均溫熱導散 枯一導熱塊及複數導熱管，其中， 之本體’於該本體上開設有複數相 結部係分別可供導熱管埋設，該導 及工作流體，且外部形成有吸熱部 與導熱塊緊密接觸並相應配合，另 導帶離，進而達成上述之目的。 員能更進一步暸解本創作之特徵及 有關本創作之詳細說明與附圖，而 說明用，並非用來對本創作加以限 及第四圖所示，係分別為本創作第 、組合示意圖及組合别視圖’本創 散熱體結構改良，其係包括一導熱 其中： 等導熱性良好之材質所製成’其具 該本體11係可為一半圓柱體、梯狀 何形狀之型態，本實施例係為一半 面開設有複數條相互平行之連結部 為一槽溝或圓孔之型態’本實施例 一長條狀或『U』字狀之圓形管 組織及工作流體，可利用該毛細組Page 6 M247923 V. Creation instructions (3) In order to achieve the above-mentioned objective, the structure of the heating body is improved. The heat-conducting block has a convex parallel connection portion, and the internal heat pipes have a capillary structure and a heat dissipation portion. The heat absorption part is the heat dissipation part, which can transfer heat. [Embodiment] In order to make your review committee technical content, please refer to the drawings below for reference and manufacture only. Please refer to the three-dimensional exploded view of the embodiment of FIGS. 2 and 3 to provide a uniform temperature heat conduction block 10 and a plurality of heat conducting tubes 20, " Hai ^ r heat block 10 is a steel body with a convex body 11, J (As shown in the fifth figure) or several other cylinders / the upper periphery of the cylinder 〆 'These connecting portions 12 may be a groove. The heat-conducting tube 20 can be a body with a capillary inside. The creative system provides a uniform temperature heat-dissipating heat-conducting block and a plurality of heat-conducting tubes. Among them, the body is provided with a plurality of phase knots on the body. The heat conducting tube can be buried respectively, the conducting and working fluid, and a heat absorbing part formed on the exterior is in close contact with the heat conducting block and correspondingly cooperates, and the other conducting strip is separated, thereby achieving the above purpose. Members can further understand the characteristics of this creation, as well as detailed descriptions and drawings of this creation, but the explanation is not intended to limit the creation and shown in the fourth figure, which are the first, combined schematic diagram, and combined category of this creation, respectively. View 'The structure of the original heat sink is improved, which includes a thermally conductive material: made of a material with good thermal conductivity.' It has a shape in which the body 11 can be a half-cylindrical, ladder-like shape. This embodiment is A plurality of parallel parallel connecting portions are formed as a groove or a round hole for a half face. In this embodiment, a long tube or a "U" -shaped circular tube structure and working fluid can be used.
織及工作流體之汽 熱量迅速帶離，另哕莫^ 傳機制，以將發熱源所產生之 散熱部22，言亥吸熱二：：2·0外部形成有-吸熱部21及-配合，以彳I 1 _二K塊1G之連結部12形狀相應 一 矛〗用邊專導熱管2 〇均勻埋役於導埶塊1 〇之用緣 面上，且依熱量傳導之杆丰# Ί埋汉於V熱塊10之周緣 承受相同之熱量：得：走；徑，可使各該導熱管20同時 太創你* 以仟到一均溫熱傳導之散熱效果。 於導埶管20卜結構更可包括一散熱器30，該散熱器30固設 = = :其係由多數之散熱縛片31連續堆疊所構 十八斑導埶塊&邛中間處開設有一容置口32，該容置口32 ϋ設有i數ΐ本體11形狀相應合’且於該容置口32之周 者，立鱼導埶ί接部33，該承接部33係可為—半圓槽型態 者二叉^ ί管20之散熱部22對應設置並相互配合。 :二第六圖及第七圖所示，係分別為本創作第三實 施例之組合示意圖’該導熱塊10之連結部12 係呈、孔狀，且該散熱器30之承接部33亦係呈一圓孔 狀，7刀，可供導熱管2 〇之吸熱部2丨及散熱部2 2穿設連鲈， 如此//Λ加導熱管20與導熱塊10及散熱器30之ΐ觸:面 和（如圖），另外亦可擴增散熱器30之散熱表面積（如 第七圖藉以提昇整體之散熱效率。 如上所述，依據本創作均溫熱導散熱體結構改良，至 少具有以下諸多之優點： 义 藉由本創作導熱塊之凸出狀本體設計，其係可依熱The steam heat of the weaving and working fluid is quickly removed, and the transmission mechanism is not used to transfer the heat radiating portion 22 generated by the heat source, and the heat absorbing portion 2: 2: 2 is formed outside with a -heat absorbing portion 21 and-彳 I 1 _The connection part 12 of the two K blocks 1G has a shape corresponding to the shape of the spear. The edge heat transfer tube 2 0 is evenly buried on the edge surface of the guide block 1 0, and it is guided by the heat of the rod. Bearing the same amount of heat on the periphery of the V heat block 10: get: walk; diameter, each of the heat pipes 20 can be too invasive for you at the same time * to achieve a uniform heat transfer heat dissipation effect. The structure of the guide tube 20 can further include a heat sink 30. The heat sink 30 is fixed. ==: It is formed by a continuous stack of eighteen spot guide blocks & The accommodating port 32 is provided with an i-shaped body 11 corresponding to the shape of the accommodating port 32. At the periphery of the accommodating port 32, a receiving portion 33 is provided, and the receiving portion 33 may be— The semi-circular groove type is a two-pronged heat sink 22 of the tube 20 correspondingly arranged and matched with each other. : The second and sixth figures and the seventh figure are respectively a combined schematic diagram of the third embodiment of the creation. The connecting portion 12 of the thermal block 10 is in the shape of a hole, and the receiving portion 33 of the heat sink 30 is also It has a round hole shape and 7 knives, which can be used to connect the heat absorption part 2 丨 and the heat dissipation part 22 of the heat pipe 200, so that // the contact between the heat pipe 20 and the heat block 10 and the heat sink 30: surface And (as shown in the figure), in addition, the heat dissipation surface area of the heat sink 30 can also be enlarged (as shown in the seventh figure to improve the overall heat dissipation efficiency. As mentioned above, according to the creation of the structure of the uniform heat conduction heat sink, the improvement has at least the following many Advantages: The projected body design of the thermal block created by Yiyi is based on heat.
M247923 創作說明（5) 量傳導之行走路徑，使各該導熱管同時承受相同之熱量， 以得到一均溫熱傳導之散熱效果。 2 ·由於該導熱管具反應迅速及熱阻小之高傳導性，可 將熱源所產生之熱量以最迅速的傳導方式，導引並帶離大 部份之熱量’避免瞬間溫昇而使電腦當機或處理器燒毀之 現象。 3 ·藉由本創作之導熱管均勻凸設於導熱塊上，可使固 設於上方之散熱器利於跨設及定位，進而提昇整體之散熱 效率。 綜上所述’當知本創作之均溫熱導散熱體結構改良已 具有產業利用性、新穎性與進步性，又本創作之創作構造 亦不曾見於同類產品及公開使用，申請前更未見於諸類刊 物上，完全符合新型專利申請要件。 惟以上所述僅為本創作之較佳可行實施例，並非因此 即拘：本創作之專利範圍，故舉凡運用本創作說明書及圖 式内谷所為之等效結構變化，或直接或間接 領域，均同理皆包含於本創作所涵蓋之範圍内，M247923 Creative Instructions (5) The walking path of the quantity conduction, so that each of the heat pipes can bear the same heat at the same time, in order to obtain a heat dissipation effect of uniform temperature heat conduction. 2 · Due to the high conductivity of the heat-conducting pipe with fast response and low thermal resistance, the heat generated by the heat source can be conducted in the fastest way to guide and take away most of the heat 'to avoid instant temperature rise and make the computer Crash or processor burnout. 3 · The heat pipe is evenly projected on the heat conduction block, which can make the radiator fixed on the top facilitate cross-over and positioning, and then improve the overall heat dissipation efficiency. In summary, 'When you know that the structure of the average temperature and heat conducting body of this creation has industrial applicability, novelty, and progress, and the creation structure of this creation has never been seen in similar products and public use, it was never seen before the application. All types of publications fully meet the requirements for new patent applications. However, the above is only a preferred and feasible embodiment of this creation, and it is not to be constrained by this: the scope of the patent for this creation, so for example, the use of equivalent structural changes made by this creation specification and drawings, or direct or indirect fields, All the same are included in the scope of this creation,
M247923 圖式簡單說明 【圖式簡單說明】 第一圖 係為習知散熱裝置結構剖視圖。 第二圖 係為本創作第一實施例之立體分解圖。 第三圖 係為本創作第一實施例之組合示意圖。 第四圖 係為本創作第一實施例之組合剖視圖。 第五圖 係為本創作第二實施例之組合剖視圖。 第六圖 係為本創作第三實施例之組合示意圖。 第七圖 係為本創作第四實施例之組合示意圖。 【元件代表符號】 【習知】M247923 Schematic illustration [Schematic description] The first figure is a sectional view of the structure of a conventional heat sink. The second figure is a three-dimensional exploded view of the first embodiment of the creation. The third figure is a schematic combination diagram of the first embodiment of the creation. The fourth figure is a combined sectional view of the first embodiment of the creation. The fifth figure is a combined sectional view of the second embodiment of the present invention. The sixth diagram is a combined diagram of the third embodiment of the present invention. The seventh diagram is a combined schematic diagram of the fourth embodiment of the creation. [Element Representative Symbol] [Knowledge]
第10頁 導熱板 10a 槽溝 1 la 導熱管 20a 散熱器 3 0a 【本創作】 導熱塊 10 本體 11 連接部 12 導熱管 20 吸熱部 21 散熱部 22 散熱器 30 散熱鰭片 31 容置口 32 承接部 33Page 10 Heat conducting plate 10a Slot 1 la Heat conducting tube 20a Radiator 3 0a [This creation] Heat conducting block 10 Body 11 Connection part 12 Heat conducting tube 20 Heat absorbing part 21 Radiating part 22 Radiator 30 Radiating fin 31 Receiving port 32 Receiving Part 33