TWI868354B - Substrate mounting method and substrate mounting mechanism - Google Patents

Abstract

Provided is a substrate mounting method and a substrate mounting mechanism for suppressing deformation of the substrate.

The substrate mounting method comprises: a first lifting pin disposed at a corner of a mounting area, a second lifting pin disposed at a center of a short side of the mounting area, a third lifting pin disposed at a center of a long side of the mounting area, and a fourth lifting pin disposed at a center of a surface of the mounting area, and the substrate mounting method comprises: at least in a state where the fourth lifting pin is higher than the third lifting pin and the second lifting pin is higher than the fourth lifting pin, The process of supporting the substrate with the first and fourth lifting pins; and after the process of supporting the substrate, the process of placing the substrate on the loading area by storing the first to fourth lifting pins on the loading table; the process of placing the substrate on the loading area is to place at least the center of the long side of the substrate on the loading surface, then place the center of the surface of the substrate on the loading surface, and then place the center of the short side of the substrate on the loading surface.

Description

Substrate mounting method and substrate mounting mechanism

This disclosure relates to a substrate mounting method and a substrate mounting mechanism.

Patent document 1 discloses a substrate receiving method, which is to receive the substrate onto a loading platform, wherein the loading platform is disposed in a processing chamber for performing plasma processing on the flexible substrate and is provided with an electrostatic chuck for adsorbing the substrate by electrostatic adsorption; the loading platform is provided with: a substrate loading surface for loading the substrate; a first lifting pin that can be retracted relative to the substrate loading surface and supports the peripheral portion of the substrate; and a second lifting pin that can be retracted relative to the substrate loading surface and supports the central portion of the substrate; the substrate receiving method comprises: causing the first lifting pin to be retracted relative to the substrate loading surface and support the central portion of the substrate; The substrate is supported by a first lifting pin and a second lifting pin located at a lower position than the first lifting pin to lower the substrate above the substrate mounting surface, and the substrate is placed on the substrate mounting surface from the center of the substrate; the substrate mounted on the substrate mounting surface is adsorbed by the electrostatic suction cup and the substrate is subjected to plasma treatment; and the substrate detachment process is performed by releasing the adsorption caused by the electrostatic suction cup after the plasma treatment is completed, and the first lifting pin and the second lifting pin are located at the same height to support the substrate so that the substrate is detached from the substrate mounting surface.

Patent document 1: Japanese Patent Publication No. 2013-33847

In one aspect, the present disclosure provides a substrate mounting method and a substrate mounting mechanism for suppressing deformation of a flexible substrate when the substrate is mounted on a mounting table.

In order to solve the above-mentioned problem, a substrate mounting method is provided according to one aspect, wherein the substrate is mounted on a mounting table, the mounting table having a mounting surface for mounting the flexible rectangular substrate; the mounting surface having a mounting area corresponding to the substrate; the mounting table having: a first lifting pin, which is retractably disposed at a corner of the mounting area; a second lifting pin, which is retractably disposed at a center of a short side of the mounting area; a third lifting pin, which is retractably disposed at a center of a long side of the mounting area; and a fourth lifting pin, which is retractably disposed at a center of the surface of the mounting area; the The substrate mounting method comprises: a process of supporting the substrate by the first to fourth lifting pins when at least the fourth lifting pin is higher than the third lifting pin and the second lifting pin is higher than the fourth lifting pin; and a process of accommodating the first to fourth lifting pins on the mounting table to mount the substrate on the mounting area after the process of supporting the substrate; the process of mounting the substrate on the mounting area comprises at least firstly mounting the central portion of the long side of the substrate on the mounting surface, then mounting the central portion of the surface of the substrate on the mounting surface, and then mounting the central portion of the short side of the substrate on the mounting surface.

According to one aspect, a substrate mounting method and a substrate mounting mechanism can be provided for suppressing deformation of a flexible substrate when the substrate is mounted on a mounting table.

G: Substrate

1: Substrate processing equipment

2: Chamber

4: Base (mounting table)

4a: Base material

4b: Insulation components

4c: Substrate mounting surface (mounting surface)

4d: Loading area

4e,4f: Centerline

7,7a~7d: Through hole

8: Lifting pin

8a: Lifting pin (1st lifting pin)

8b: Lifting pin (second lifting pin)

8c: Lifting pin (3rd lifting pin)

8d: Lifting pin (4th lifting pin)

9a~9d: Drive unit

31: Controller

40: Electrostatic suction cup

Figure 1 is an example of a schematic cross-sectional view of a substrate processing device.

Figure 2 is an example of a schematic cross-sectional view of a substrate processing device in the plane direction.

Figure 3 is an example of a block diagram showing the configuration of a driving mechanism that drives the lifting pin.

FIG4 is a flow chart illustrating an example of a substrate receiving and sending operation of a substrate processing device.

FIG5 is a timing diagram showing an example of the operation of the lifting and lowering pins during the substrate receiving and receiving operation of the substrate processing device.

Figure 6 is an example of a cross-sectional conceptual diagram of a substrate when it is received by a lifting pin.

FIG7 is a diagram illustrating an example of substrate bending.

Below, the form for implementing the present disclosure is described with reference to the drawings. In each drawing, the same components are given the same symbols to omit repeated descriptions.

<Substrate processing equipment>

The substrate processing device 1 of this embodiment is described using Figures 1 to 3. Figure 1 is an example of a schematic cross-sectional view of the substrate processing device 1. The substrate processing device 1 is a device that places a substrate G on a mounting table and applies a desired process (such as etching process, etc.) to the substrate G. In addition, the mounting table is configured to adjust (for example, cool) the temperature of the mounted substrate G. In addition, the horizontal direction is the X direction, the horizontal direction and the direction orthogonal to the X direction is the Y direction, and the height direction is the Z direction for description.

In addition, the substrate G processed in the substrate processing device 1, in other words, the substrate G placed on the mounting table is a rectangular and flexible substrate when viewed from above. The substrate G may be, for example, a flexible rectangular glass substrate. In addition, the substrate G may be, for example, a thin film glass substrate with a thickness of about 0.2 mm to several mm. In addition, the substrate G may have a plane size of at least about 1500 mm × 1800 mm for the 6th generation and about 3000 mm × 3400 mm for the 10.5th generation.

The substrate processing device 1 has a chamber 2 that accommodates the substrate G and serves as a processing container. The chamber 2 is made of aluminum whose surface has been anodized (anodized), for example, and is formed into a square tube shape corresponding to the shape of the substrate G.

The bottom wall of the chamber 2 is provided with a base 4 as a stage for placing the substrate G. The base 4 is formed into a square plate or a columnar shape corresponding to the shape of the substrate G. The base 4 has a base 4a made of a conductive material such as metal, and an insulating member 4b provided between the bottom of the base 4a and the bottom surface of the chamber 2. The base 4a is connected to a power supply line 23 for supplying high-frequency power. The power supply line 23 is connected to a high-frequency power source 25 through a matching device 24. The high-frequency power source 25 applies a high-frequency power of 13.56MHz to the base 4, for example. The matching device 24 matches the output impedance of the high-frequency power source 25 with the input impedance of the load side. Thereby, the base 4 is configured to have the function of a lower electrode.

In addition, the base 4 is provided with an electrostatic suction cup 40 that absorbs the placed substrate G by electrostatic adsorption. The electrostatic suction cup 40 is provided on the upper part of the substrate 4a. The electrostatic suction cup 40 has a dielectric 41 and an internal electrode 42 provided inside the dielectric 41. The internal electrode 42 is connected to a power supply line 43 for applying voltage. The power supply line 43 is connected to a power source 45 through a switch 44. The power source 45 applies voltage to the internal electrode 42. The switch 44 turns on/off the application of voltage.

In addition, the upper surface of the susceptor 4 (electrostatic suction cup 40) will become the substrate mounting surface 4c on which the substrate G is mounted. In addition, the substrate mounting surface 4c has an outer edge portion (not shown) that is in contact with the outer peripheral portion of the inner surface of the substrate G and a recessed portion (not shown) formed on the inner side of the outer edge portion. In addition, the recessed portion is configured to supply a heat-conducting gas such as He gas. By electrostatically adsorbing the substrate G by the electrostatic suction cup 40, the outer peripheral portion of the inner surface of the substrate G and the outer edge portion of the substrate mounting surface 4c are airtightly adsorbed. In addition, by supplying He gas to the space formed as a gap between the inner surface of the substrate G and the recessed portion of the substrate mounting surface 4c, it is possible to configure the substrate G mounted on the susceptor 4 to be cooled (temperature adjusted). In addition, a plurality of tiny protrusions may be provided in the concave portion, and the substrate G may be supported by the outer edge portion and the protrusions.

A shower head 11 is provided on the upper part or the upper wall of the chamber 2 so as to face the susceptor 4 and supply the processing gas into the chamber 2 and function as an upper electrode. The shower head 11 has a gas diffusion space 12 formed inside for diffusing the processing gas, and a plurality of spray holes 13 for spraying the processing gas are formed on the bottom or the surface facing the susceptor 4. The shower head 11 is grounded and forms a pair of parallel plate electrodes together with the susceptor 4. In addition, although this embodiment describes the case where the disclosure is applied to a substrate processing device that generates plasma by means of parallel plate electrodes, the disclosure can also be applied to a substrate processing device that generates plasma by means of inductive coupling, and of course the disclosure can also be applied to a substrate processing device that generates plasma by means of other methods.

The shower head 11 is provided with a gas inlet 14, and the gas inlet 14 is connected to a process gas supply pipe 15, and the process gas supply pipe 15 is connected to a process gas supply source 18 through a valve 16 and a mass flow controller 17. A process gas for etching, for example, is supplied from the process gas supply source 18. As the process gas, a gas generally used in the art, such as a halogen gas, _O2 gas, and Ar gas, can be used.

The bottom wall of the chamber 2 is connected to an exhaust pipe 19, which is connected to an exhaust device 20. The exhaust device 20 is a vacuum pump equipped with a turbomolecular pump, which can be configured to evacuate the chamber 2 to a predetermined decompression environment. The side wall of the chamber 2 is formed with a carry-in and carry-out port 21 for carrying in and out the substrate G and is provided with a gate valve 22 that opens and closes the carry-in and carry-out port 21. When the carry-in and carry-out port 21 is opened, the substrate G is supported from below by a carrying arm 50 (see FIG. 2 described later) as a carrying member and is carried between the carrying chambers that are adjacent to the carry-in and carry-out port 21 and the gate valve 22 and are not shown in the figure.

The bottom wall of the chamber 2 and the base 4 are formed with insertion holes 7 at the peripheral position and the central position (inside or near the center of the peripheral position) of the base 4. In the insertion holes 7, lifting pins 8 that support the substrate G from below and raise and lower it can be inserted so that they can be inserted and retracted relative to the substrate mounting surface 4c of the base 4. The lifting pins 8 are respectively arranged to abut against the peripheral part and the central part of the substrate G when protruding, and are inserted into the insertion holes 7 in a state where they are positioned in the radial or width direction by a positioning sleeve not shown.

The lower part of the lifting pin 8 protrudes from the outside of the chamber 2. The lower part of the lifting pin 8 is formed with a flange 26, and the flange 26 is connected to one end (lower end) of a bellows 27 that is configured to be retractable around the lifting pin 8, and the other end (upper end) of the bellows 27 is connected to the bottom wall of the chamber 2. Alternatively, the other end (upper end) of the bellows 27 can be connected to the bottom wall of the base 4. In this way, the bellows 27 will extend and retract following the lifting and lowering of the lifting pin 8, and the gap between the insertion hole 7 and the lifting pin 8 will be sealed.

Here, the configuration of the insertion hole 7 and the lifting pin 8 is further described using FIG. 2. FIG. 2 is an example of a schematic cross-sectional view of the substrate processing device 1 in the plane direction. In addition, FIG. 2 uses a two-point chain line to indicate the position of the conveying arm 50 and the substrate G when the substrate G held by the conveying arm 50 is configured above the loading area 4d.

As shown in FIG2 , the substrate G and the substrate mounting surface 4c of the base 4 on which the substrate G is mounted appear to be rectangular with short sides (Y direction) and long sides (X direction) when viewed from above. In addition, the substrate mounting surface 4c has a mounting area 4d corresponding to the substrate G (indicated by a dotted line in FIG2 ). When the substrate G is mounted on the base 4, the substrate G is mounted on the mounting area 4d. In addition, FIG2 uses a dot chain line to indicate the center line 4e (a line connecting the midpoint of the long side on one side with the midpoint of the long side on the other side) and the center line 4f (a line connecting the midpoint of the short side on one side with the midpoint of the short side on the other side) of the mounting area 4d. In addition, in FIG. 2 , although the dotted line representing the mounting area 4d is conveniently drawn inside the two-point chain representing the substrate G, it does not mean that the mounting area 4d will be limited to inside the outer periphery of the substrate G, but it is hoped that the mounting area 4d will have the same shape and area as the substrate G. In addition, the mounting area 4d can also be an area with a shape and area that encloses the substrate G.

The base 4 has insertion holes 7a to 7d as insertion holes 7. The insertion holes 7a to 7c are provided at the outer periphery of the mounting area 4d. The insertion hole 7d is provided at the center of the surface of the mounting area 4d surrounded by the outer periphery of the mounting area 4d. The insertion holes 7a to 7d are provided with lifting pins 8a to 8d as lifting pins 8.

The corners of the rectangular mounting area 4d are provided with insertion holes 7a. In the example shown in FIG. 2 , four insertion holes 7a are provided in the mounting area 4d with the center line 4e and the center line 4f as symmetric axes. Each insertion hole 7a is provided with a lifting pin 8a. Hereinafter, the four lifting pins 8a are referred to as the first group Gr.1.

The central part of the short side of the rectangular mounting area 4d (between the two left and right (Y direction) corners with the center line 4f as the symmetry axis) is provided with a through hole 7b. In the example shown in FIG2, the central part of the short side on one side is provided with two through holes 7b with the center line 4f as the symmetry axis. Similarly, the central part of the short side on the other side is provided with two through holes 7b with the center line 4f as the symmetry axis. There are four through holes 7b in the mounting area 4d. Each through hole 7b is respectively provided with a lifting pin 8b. Hereinafter, the four lifting pins 8b are referred to as the second group Gr.2.

The central part of the long side of the rectangular loading area 4d (between the front and rear (X direction) two corners with the center line 4e as the symmetry axis) is provided with a through hole 7c. In the example shown in FIG2, the central part of the long side on one side is provided with a through hole 7c on the center line 4e. Similarly, the central part of the long side on the other side is provided with a through hole 7c on the center line 4e. Two through holes 7c are provided in the loading area 4d. Each through hole 7c is respectively provided with a lifting pin 8c. Hereinafter, the two lifting pins 8c are referred to as the third group Gr.3.

A through hole 7d is provided in the center of the rectangular mounting area 4d. In the example shown in FIG. 2 , two through holes 7d are provided on the center line 4e and with the center line 4f as the axis of symmetry. Each through hole 7d is provided with a lifting pin 8d. Hereinafter, the two lifting pins 8d are referred to as the fourth group Gr.4.

FIG3 is an example of a block diagram showing the structure of a driving mechanism that drives the lifting pins 8a~8d.

The lifting pins 8a~8d are connected to the driving parts 9a~9d respectively. The lifting pins 8a~8d are configured to be lifted and lowered by the driving parts 9a~9d and protrude and sink relative to the substrate mounting surface 4c of the base 4. The driving parts 9a~9d are configured using stepping motors, for example. In addition, as shown in FIG. 3, although the lifting pins 8a~8d are configured to be driven individually, it is not limited to this, and each group (the first group Gr.1~the fourth group Gr.4) can be driven separately. According to this configuration, the number of driving parts (stepping motors) can be reduced.

The driving of the driving parts 9a~9d is controlled individually by a controller 31 having a microprocessor (computer), thereby the lifting pins 8a~8d are configured to be able to be lifted and lowered independently of each other. The controller 31 is connected to a user interface 32 and a memory unit 33. The user interface 32 is composed of a keyboard for inputting commands so that the process manager can manage the driving of the driving parts 9a~9d or a display for visualizing and displaying the driving status of the driving parts 9a~9d. The memory unit 33 stores a database that records the control program or driving condition data for realizing the driving of the driving parts 9a~9d under the control of the controller 31. In addition, by calling out any database from the memory unit 33 and executing it under the control of the controller 31, the drive units 9a to 9d can be driven and stopped under the control of the controller 31. The database can be stored in a computer-readable storage medium such as a CD-ROM, hard disk, flash memory, etc., or can be transmitted from other devices at any time through a dedicated line for example.

The controller 31, the user interface 32 and the memory unit 33 constitute a control unit that controls the lifting and lowering of the lifting pins 8a~8d caused by the driving units 9a~9d, and the base 4, the lifting pins 8a~8d, the driving units 9a~9d and the control unit constitute a substrate mounting mechanism.

Next, a substrate receiving and delivering method (loading method) for delivering the substrate G in the substrate processing device 1 to the base 4 is described using FIG. 4 and FIG. 5 .

FIG. 4 is a flow chart illustrating an example of the substrate receiving and receiving operation of the substrate processing device 1. FIG. 5 is a timing chart showing an example of the operation of the lifting and lowering pin 8 during the substrate receiving and receiving operation of the substrate processing device 1.

In step S101, the substrate G held by the transfer arm 50 is transferred to the lifting pins 8a to 8d. Specifically, the controller 31 opens the gate 22. Then, the controller 31 controls the transfer arm 50 to insert the transfer arm 50 holding the substrate G into the chamber 2 from the transfer entrance 21 so that the substrate G is transferred to the top of the susceptor 4. Then, the controller 31 controls the driving parts 9a to 9d to make the lifting pins 8a to 8d protrude higher than the transfer arm 50. In this way, the substrate G is transferred from the transfer arm 50 to the lifting pins 8a to 8d. In addition, as shown in FIG. 2, the lifting pins 8a to 8d are arranged so as not to contact the transfer arm 51. Then, the controller 31 controls the transfer arm 50 to withdraw the transfer arm 50 from the transfer entrance 21. Then, the controller 31 closes the valve 22.

Here, as shown in FIG. 5 , the heights of the lifting pins 8a to 8d of the supporting substrate G are offset in the manner of “the height of the lifting pin 8c of the third group Gr.3 < the height of the lifting pin 8d of the fourth group Gr.4 < the height of the lifting pin 8b of the second group Gr.2 < the height of the lifting pin 8a of the first group Gr.1”.

In addition, the lifting pins 8a~8d can also be lifted up in batches after forming an offset relationship between the lifting pins 8a~8d on the lower side of the conveying arm 50. In this way, the lifting pins 8a of the first group Gr.1, the lifting pins 8b of the second group Gr.2, the lifting pins 8d of the fourth group Gr.4, and the lifting pins 8c of the third group Gr.3 will contact the substrate G in this order.

Alternatively, the lifting pins 8a to 8d may be simultaneously lifted, and after the lifting pins 8a to 8d are stopped at predetermined heights to form an offset relationship between the lifting pins 8a to 8d, the substrate G is received and delivered to the lifting pins 8a to 8d from the transfer arm 50. In this way, the lifting pins 8a of the first group Gr.1, the lifting pins 8b of the second group Gr.2, the lifting pins 8c of the third group Gr.3, and the lifting pins 8d of the fourth group Gr.4 will contact the substrate G at the same time and then lift up again. Then, it will stop in the order of lifting pin 8c of the 3rd group Gr.3, lifting pin 8d of the 4th group Gr.4, lifting pin 8b of the 2nd group Gr.2, and lifting pin 8a of the 1st group Gr.1.

Here, FIG. 6 is used to explain the shape of the substrate G when it is received by the lifting pins 8a~8d. FIG. 6 is an example of a cross-sectional conceptual diagram of the substrate G when it is received by the lifting pins 8a~8d. FIG. 6 (A) is a diagram of the substrate G viewed from the short side, and FIG. 6 (B) is a diagram of the substrate G viewed from the long side. In addition, FIG. 6 exaggerates the deflection of the substrate G.

The cross-sectional conceptual diagram 201 of FIG6 (A) is a schematic diagram of the A-A cross section of the substrate G (refer to FIG2). In the A-A cross section, the substrate G is supported so that the center of the long side of the substrate G supported by the lifting pin 8c of the third group Gr.3 is lower than the center of the surface of the substrate G supported by the lifting pin 8d of the fourth group Gr.4. In other words, the substrate G is supported on the lifting pin 8 in a shape in which the center of the long side of one side of the substrate G is higher than the center of the long side on the line connecting the center of the long side of the long side of the substrate G and the center of the long side of the other side of the substrate G.

The cross-sectional conceptual diagram 202 of FIG6 (A) is a schematic diagram of the B-B cross-section of the substrate G (refer to FIG2). In the B-B cross-section, the substrate G is supported so that the center of the short side of the substrate G supported by the lifting pins 8b of the second group Gr.2 is lower than the corner of the substrate G supported by the lifting pins 8a of the first group Gr.1. In other words, the substrate G is supported on the lifting pins 8 in a shape in which the short side of the outer peripheral side of the substrate G becomes higher from the center of the short side toward the corner.

The cross-sectional conceptual diagram 203 of FIG6(B) is a schematic diagram of the C-C cross section of the substrate G (refer to FIG2). In the C-C cross section, the substrate G is supported so that the center of the long side of the substrate G supported by the lifting pins 8c of the third group Gr.3 is lower than the corner of the substrate G supported by the lifting pins 8a of the first group Gr.1. In other words, the substrate G is supported on the lifting pins 8 in a shape in which the long side of the outer peripheral side of the substrate G becomes higher from the center of the long side toward the corner.

The cross-sectional conceptual diagram 204 of FIG6(B) is a schematic diagram of the D-D cross section of the substrate G (refer to FIG2). In the D-D cross section, the substrate G is supported so that the center of the surface of the substrate G supported by the lifting pin 8d of the 4th group Gr.4 is lower than the center of the short side of the substrate G supported by the lifting pin 8b of the 2nd group Gr.2. In other words, the substrate G is supported on the lifting pin 8 in a shape that becomes higher from the center of the surface toward the center of the short side on the line connecting the center of the short side of one side of the substrate G and the center of the short side of the other side of the substrate G.

Returning to FIG. 4, in step S102, the controller 31 controls the driving parts 9a~9d to lower the lifting pins 8a~8d. Here, as shown in FIG6, the controller 31 lowers the lifting pins 8a~8d while maintaining the height offset of the lifting pins 8a~8d. Then, in step S103, the lifting pins 8c of the third group Gr.3 are accommodated in the insertion hole 7c according to the difference in the height offset of the lifting pins 8a~8d. In this way, the central part of the long side of the substrate G is first placed on the substrate placement surface 4c of the base 4.

In step S104, the controller 31 controls the driving part 9d to lower the lifting pin 8d. The lifting pin 8a and the lifting pin 8b will stop at the height in step S103 at this time. In addition, the lifting pin 8c will be stored in the insertion hole 7c and stop at the height in step S103. Then, in step S105, the lifting pin 8d of the 4th group Gr.4 will be stored in the insertion hole 7d. Thereby, the center part of the surface of the substrate G will be placed on the substrate mounting surface 4c of the base 4 in the second sequence.

In step S106, the controller 31 controls the driving parts 9a, 9b to lower the lifting pins 8a, 8b. Here, as shown in FIG6, the controller 31 lowers the lifting pins 8a, 8b while maintaining the height offset of the lifting pins 8a, 8b. In addition, the lifting pins 8c, 8d are respectively received in the insertion holes 7c, 7d and stop at the height in step S105. Then, in step S107, the lifting pins 8b of the second group Gr.2 are received in the insertion holes 7b according to the difference in the height offset of the lifting pins 8a, 8b. Thereby, the short side center of the substrate G is placed on the substrate mounting surface 4c of the base 4 in the third sequence.

In step S108, the controller 31 controls the driving part 9a to lower the lifting pin 8a. In addition, the lifting pins 8b~8d are respectively stored in the insertion holes 7b~7d and stop at the height in step S107. Then, in step S109, the lifting pin 8a of the first group Gr.1 is stored in the insertion hole 7a. In this way, the corner of the substrate G will finally be placed on the substrate mounting surface 4c of the base 4.

FIG7 is a diagram illustrating an example of the bending of substrate G. The upper section of FIG7 shows the bending of substrate G in a quarter area after substrate G is divided by center line 4e and center line 4f by using the density between contour lines. Here, the lower left is the center of substrate G. That is, the upper right corresponds to the corner of substrate G, the upper left corresponds to the center of the short side of substrate G, the lower right corresponds to the center of the long side of substrate G, and the lower left corresponds to the center of the surface of substrate G. In addition, the bending of substrate G is based on the height of lifting pin 8a as the reference (0), and the bending is thicker (the more dense the points) as it goes down, and the bending is thinner (the more sparse the points) as it goes up. In addition, the lower section of FIG7 schematically shows the state of substrate G in each state under the A-A section.

In addition, FIG. 7(A) shows the state where the substrate G is received and delivered to the lifting pin 8 (refer to step S101). FIG. 7(B) shows the state where the center of the long side of the substrate G is placed on the substrate placement surface 4c (refer to step S103). FIG. 7(C) shows the state where the center of the surface of the substrate G is placed on the substrate placement surface 4c (refer to step S105).

In step S101, the substrate G is supported by offsetting in the manner of "the height of the lifting pin 8c of the third group Gr.3 < the height of the lifting pin 8d of the fourth group Gr.4 < the height of the lifting pin 8b of the second group Gr.2 < the height of the lifting pin 8a of the first group Gr.1". Thus, as shown in FIG. 7 (A), the substrate G is maintained in a state of bending such as "the height of the center of the long side of the substrate G < the height of the center of the surface of the substrate G < the height of the center of the short side of the substrate G < the height of the corner of the substrate G".

In step S103, the central portion 301 of the long side of the substrate G is first placed. In this state, as shown in FIG7(B), the central portion of the surface of the substrate G will float.

In step S104, the lifting pins 8a of the first group Gr.1 and the lifting pins 8b of the second group Gr.2 are stopped, and the lifting pins 8d of the fourth group Gr.4 are lowered. As shown in FIG7(C), the floating of the surface center portion 302 of the substrate G can be released and the surface center portion 302 of the substrate G can be placed. As a result, the substrate G can be placed on the base 4 along the center line 4e (see FIG2) passing through the center of the long side of the substrate G.

Afterwards, by placing the substrate G on the base 4 in the order of the center of the short side and the corner of the substrate G, it is possible to prevent the substrate G from being placed in a convex shape.

As described above, according to the substrate processing device 1 having the substrate mounting mechanism related to the present embodiment, when the substrate G is mounted on the base 4, the convex deformation of the central portion of the long side of the substrate G, which may be deformed convexly, is suppressed by first mounting the central portion of the long side of the substrate G on the base 4. In addition, the convex deformation of the central portion of the short side of the substrate G can be suppressed by arranging the central portion of the short side of the substrate G before the corner portion of the substrate G. Thereby, the outer peripheral portion of the inner surface of the substrate G and the outer edge portion of the substrate mounting surface 4c of the base 4 are airtightly adsorbed. Thereby, when the He gas is supplied between the inner surface of the substrate G and the concave portion of the substrate mounting surface 4c, the leakage of the He gas can be prevented.

In addition, when the center of the surface of the substrate G is placed on the base 4, the lifting pins 8a of the first group Gr.1 and the lifting pins 8b of the second group Gr.2 are stopped, and the lifting pins 8d of the fourth group Gr.4 are lowered. In this way, the substrate G can be placed on the base 4 while suppressing the convex deformation of the center of the surface of the substrate G. In this way, the space volume between the inner surface of the substrate G and the concave portion of the substrate mounting surface 4c can be prevented from increasing.

Although the substrate processing device 1 has been described above, the present disclosure is not limited to the above-mentioned implementation forms, etc., and various modifications and improvements can be made within the scope of the present disclosure described in the scope of the patent application.

S101: Receive and transfer the substrate to the lifting pins and configure the pins (Gr.3<Gr.4<Gr.2<Gr.1)

S102: Gr.1~Gr.4 down

S103: Gr.3 completed storage (mounted in the middle of the long side)

S104: Only Gr.4 decreased

S105: Gr.4 completed storage (center of the loading surface)

S106: Gr.1, Gr.2 down

S107: Gr.2 completed storage (mounting the center of the short side)

S108: Gr.1 down

S109: Gr.1 completed storage (mounting corner)

Claims (6)

A substrate mounting method is to mount the substrate on a mounting table, the mounting table having a mounting surface for mounting the flexible rectangular substrate; the mounting surface having a mounting area corresponding to the substrate; the mounting table having: a first lifting pin, which is retractable and arranged at a corner of the mounting area; a second lifting pin, which is retractable and arranged at a central portion of a short side of the mounting area; a third lifting pin, which is retractable and arranged at a central portion of a long side of the mounting area; and a fourth lifting pin, which is retractable and arranged at a central portion of the surface of the mounting area; the substrate mounting method comprises: a first lifting pin, which is retractable and arranged at a corner of the mounting area; a second lifting pin, which is retractable and arranged at a central portion of a short side of the mounting area; a third lifting pin, which is retractable and arranged at a central portion of a long side of the mounting area; and a fourth lifting pin, which is retractable and arranged at a central portion of the surface of the mounting area. The process of supporting the substrate by the first to fourth lifting pins when the third lifting pin is higher, the second lifting pin is higher than the fourth lifting pin, and the first lifting pin is higher than the second lifting pin; and after the process of supporting the substrate, the process of placing the first to fourth lifting pins on the mounting table to mount the substrate on the mounting area; the process of mounting the substrate on the mounting area is to first mount at least the central part of the long side of the substrate on the mounting surface, then mount the central part of the surface of the substrate on the mounting surface, and then mount the central part of the short side of the substrate on the mounting surface. For example, in the substrate mounting method of item 1 of the patent application scope, the process of mounting the substrate on the mounting area is to mount the corner of the substrate on the mounting surface after the center of the short side of the substrate is mounted on the mounting surface. For example, in the process of placing the substrate on the placing area, after the center of the long side of the substrate is placed on the placing surface, when the center of the surface of the substrate is to be placed on the placing surface, the fourth lifting pin is lowered and the first lifting pin and the second lifting pin are stopped. For example, in the substrate mounting method of item 1 or 2 of the patent application scope, the first lifting pin, the second lifting pin, the third lifting pin, and the fourth lifting pin are driven independently of each other. For example, in the substrate mounting method of item 3 of the patent application scope, the first lifting pin, the second lifting pin, the third lifting pin, and the fourth lifting pin are driven independently of each other. A substrate mounting mechanism comprises: a mounting table having a mounting surface for mounting a flexible rectangular substrate, and lifting pins arranged to be retractable from the mounting surface; a driving unit for driving the lifting pins; and a control unit for controlling the driving unit; the mounting surface having a mounting area corresponding to the substrate; the lifting pins having a first lifting pin retractable at a corner of the mounting area, a second lifting pin retractable at a center of a short side of the mounting area, a third lifting pin retractable at a center of a long side of the mounting area, and a fourth lifting pin retractable at a center of a surface of the mounting area; the control unit controls the lifting pins; The drive unit performs the following steps: the step of supporting the substrate by the first to fourth lifting pins when the fourth lifting pin is higher than the third lifting pin, the second lifting pin is higher than the fourth lifting pin, and the first lifting pin is higher than the second lifting pin; and After the step of supporting the substrate, the first to fourth lifting pins are stored in the mounting table to mount the substrate on the mounting area; the step of mounting the substrate on the mounting area is to first mount the central portion of the long side of the substrate on the mounting surface, then mount the central portion of the surface of the substrate on the mounting surface, and then mount the central portion of the short side of the substrate on the mounting surface.

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