TWI845840B - Substrate processing device and method for installing an ejector - Google Patents

Abstract

A technique for suppressing the tilting of an ejector is provided. The present invention discloses a substrate processing device in one aspect, which comprises: a processing container having a substantially cylindrical shape; an ejector extending in a vertical direction along the inner side of an inner wall of the processing container; and a holding portion for holding the ejector by pressing it against the inner side of the inner wall.

Description

Substrate processing device and method for installing an ejector

The present disclosure relates to a substrate processing device and an installation method of an injector.

A substrate processing device is known, which includes a processing container for accommodating a wafer boat carrying a substrate, and an injector extending in a vertical direction along an inner wall of the processing container near the processing container and having a plurality of gas holes in a longitudinal direction (for example, see Patent Document 1). In the substrate processing device, the gas holes are arranged to face the inner wall near the processing container.

Patent document 1: Japanese Patent Application Publication No. 2019-186335

The present disclosure provides a technology for suppressing ejector tilt.

The substrate processing device of one aspect of the present disclosure comprises: a processing container having a substantially cylindrical shape; an ejector extending in a vertical direction along the inner side of an inner wall of the processing container; and a holding portion for holding the ejector by pressing it against the inner side of the inner wall.

According to the present invention, the ejector can be restrained from tilting.

The following non-limiting exemplary embodiments of the present disclosure are described with reference to the drawings. The same or corresponding reference symbols are given to the same or corresponding components or parts in all drawings to omit repeated descriptions.

[Substrate processing device] An example of a substrate processing device in an implementation form is described with reference to FIGS. 1 to 6. FIG. 1 is a schematic diagram showing an example of a substrate processing device in an implementation form. FIG. 2 is a perspective view showing an enlarged portion of the upper portion of the substrate processing device in FIG. 1. FIG. 3 is a cross-sectional view showing an enlarged portion of the upper portion of the substrate processing device in FIG. 1, showing a cross-section cut on a horizontal plane passing through an inner tube at a height above the ejector. FIG. 4 is a cross-sectional view showing an enlarged portion of the upper portion of the substrate processing device in FIG. 1, showing a cross-section cut on a horizontal plane passing through the ejector. FIG. 5 is a perspective view showing an enlarged portion of the lower portion of the substrate processing device in FIG. 1. FIG. 6 is an enlarged view of area A in FIG. 5.

The substrate processing apparatus 1 includes a processing container 10 , a gas supply unit 20 , an exhaust unit 30 , a heating unit 40 , a holding unit 100 , and a control unit 90 .

The processing container 10 will accommodate a wafer boat (not shown). The wafer boat will hold multiple substrates in a predetermined interval in the height direction. The substrate can be, for example, a semiconductor wafer. The processing container 10 has an inner tube 11 and an outer tube 12. The inner tube 11 is also called an inner tube, and is formed into a roughly cylindrical shape with an open lower end and a top. The top of the inner tube 11 is, for example, formed to be flat. The outer tube 12 is also called an outer tube, and is formed into a roughly cylindrical shape with an open lower end and a top that covers the outer side of the inner tube 11. That is, the upper part of the outer tube 12 is closed. The inner tube 11 and the outer tube 12 are coaxially arranged to form a double tube structure. The inner tube 11 and the outer tube 12 are formed by heat-resistant materials such as quartz.

An ejector housing portion 13 for housing the ejector along its long side direction (in the lead vertical direction) is formed on one side of the inner tube 11. For example, as shown in FIG. 2 , the ejector housing portion 13 is formed by making a portion of the side wall of the inner tube 11 protrude outward to form a convex portion 14, and the ejector housing portion 13 is formed inside the convex portion 14. A rectangular opening portion (not shown) is formed along its long side direction (in the lead vertical direction) on the side wall opposite to the ejector housing portion 13. The opening portion is formed as a gas exhaust port for exhausting the gas in the inner tube 11. The lead vertical length of the opening portion is the same as the lead vertical length of the wafer boat, or is formed in a manner that extends longer in the lead vertical direction than the length of the wafer boat.

The side wall of the outer tube 12 is formed with a gas outlet 15. The opening 16 at the lower end of the outer tube 12 is installed with a cover (not shown) through a sealing member such as an O-ring. The cover can open and close the opening 16 and seal the opening 16 by plugging it airtightly.

The gas supply unit 20 includes a plurality of gas supply sources (not shown) and a plurality of (eg, seven) injectors 21 to 27 .

The plurality of gas supply sources supply various process gases to the plurality of injectors 21 to 27. The various process gases include, for example, a film forming gas for forming a film, an etching gas for etching and removing the film, a cleaning gas for cleaning the processing container 10, and a purge gas for purging the processing container 10.

The injectors 21 to 27 are arranged in an injector housing 13 on the inner side of the inner wall of the inner tube 11 in a row and spaced apart from each other along the circumferential direction. Each injector 21 to 27 is formed by a quartz tube with a circular cross section, and injects various processing gases supplied by multiple gas supply sources into the inner tube 11. Each injector 21 to 27 is arranged on the inner side of the inner wall of the inner tube 11 along the long side direction (vertical direction) of the inner tube 11. Each injector 21 to 27 is bent into an L shape at the lower part, penetrates the side wall of the outer tube 12, and extends toward the corresponding gas supply source. Each injector 21 to 27 is folded back into a U shape at the upper part and then extends downward. That is, each of the ejectors 21 to 27 is configured as a folding ejector. Hereinafter, in each of the ejectors 21 to 27, the portion arranged along the long side direction of the inner tube 11 is referred to as the introduction portion 21a to 27a, and the portion extending downward after being folded back is referred to as the ejection portion 21b to 27b. In addition, the portion connecting the introduction portion 21a to 27a and the ejection portion 21b to 27b is referred to as the bending portion 21c to 27c, and the portion arranged in the horizontal direction and passing through the outer tube 12 is referred to as the horizontal portion 21d to 27d.

The ejectors 21-27 include ejectors having different lengths in the vertical direction.

The lead-in parts 21a~23a, 27a of the injectors 21~23, 27 have the same length in the lead direction. In addition, the lead-out parts 21b~23b, 27b of the injectors 21~23, 27 also have the same length in the lead direction. The lead-out length of the injectors 21b~23b, 27b is the same as the lead-out length of the wafer boat, or is formed in a manner that extends longer in the lead direction than the length of the wafer boat. The injectors 21b~23b, 27b are provided with a plurality of gas holes at predetermined intervals along the long side direction, so as to supply various processing gases to all areas in the lead-out direction of the wafer boat.

In the injectors 24-26, the vertical length of the introduction parts 24a-26a is gradually increased, and the ejection parts 24b-26b are respectively arranged at the lower part, the middle part and the upper part of the processing container 10. The ejection parts 24b-26b are provided with a plurality of gas holes at predetermined intervals along the longitudinal direction, and are configured to supply various processing gases to the lower part, the middle part and the upper part of the processing container 10. In addition, the vertical length of each injector 21-27 is not limited thereto.

The plurality of gas holes are arranged to face the inner wall side near the inner tube 11. Each of the ejection parts 21b to 27b ejects various processing gases horizontally through the gas holes toward the inner wall side near the inner tube 11. After being reflected by the inner wall near the inner tube 11, the ejected processing gases are supplied while diffusing horizontally toward the center side (substrate side) of the inner tube 11.

Here, the orientation angle of the gas hole 22h opened in the ejection part 22b of the ejector 22 is explained with reference to FIG4. As shown in FIG4, the gas hole 22h is arranged in a manner that an angle θ is added to the side of the introduction part 22a relative to the radial line L4 passing through the center of the inner tube 11 and the center C of the ejection part 22b of the ejector 22 when the substrate processing apparatus 1 is viewed from above. Thereby, various processing gases ejected in the horizontal direction through the gas hole 22h are reflected by the inner wall of the inner tube 11, and then are supplied while diffusing in the horizontal direction toward the center side of the inner tube 11. In addition, the various processing gases ejected in the horizontal direction through the gas hole 22h are further reflected by the injector 22 itself or the adjacent injectors 21, 23, etc. after being reflected by the inner wall of the inner tube 11, and are supplied while diffusing in the horizontal direction toward the center side of the inner tube 11. The angle θ may be, for example, in the range of 0 to 60 degrees. In addition, the gas hole 22h may also be configured in a manner such that an angle is added to the opposite side of the introduction portion 22a relative to the radial line L4 when the substrate processing device 1 is viewed from above. The angle in this case may be, for example, in the range of 0 to 60 degrees. In addition, the gas holes opened in the ejection portions 21b, 23b to 26b of the injectors 21, 23 to 26 may have the same orientation angle as the gas hole 22h.

The exhaust part 30 has an exhaust passage 31, a pressure regulating valve 32, and a vacuum pump 33. The exhaust passage 31 is connected to the gas outlet 15. The pressure regulating valve 32 and the vacuum pump 33 are arranged in the exhaust passage 31, and the gas in the inner tube 11 discharged from the opening is discharged through the space between the inner tube 11 and the outer tube 12.

The heating unit 40 heats the substrate accommodated in the processing container 10. The heating unit 40 is formed in a substantially cylindrical shape, for example, on the outer circumference of the outer tube 12 to cover the outer tube 12. From the viewpoint of being able to independently control the temperature in the vertical direction, the heating unit 40 preferably includes a plurality of heaters divided in the vertical direction. However, the heating unit 40 may also be composed of a single heater that is not divided.

The holding portion 100 is provided corresponding to each of the injectors 21 to 27, and suppresses the inclination of each of the injectors 21 to 27 by holding each of the injectors 21 to 27. The details of the holding portion 100 will be described later.

The control unit 90 controls the overall operation of the substrate processing device 1. The control unit 90 has a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The CPU executes the desired heat treatment according to the program library stored in the memory area such as the RAM. The program library is set with control information of the device relative to the program conditions. The control information may be, for example, gas flow, pressure, temperature, and program time. In addition, the program library and the program used by the control unit 90 may also be stored in, for example, a hard disk or a semiconductor memory. In addition, the program library, etc. may also be stored in a portable and computer-readable storage medium such as a CD-ROM or DVD and installed at a predetermined location for reading. In addition, the control unit 90 may also be set in other devices other than the substrate processing device 1.

[Holding unit] An example of a holding unit provided in the substrate processing apparatus 1 for holding each of the injectors 21 to 27 will be described with reference to FIGS. 2 to 6 .

The holding part 100 is provided at each of the plurality of injectors 21 to 27. The holding part 100 presses each of the injectors 21 to 27 to the inner wall side near the inner tube 11 to hold the injectors. The holding part 100 includes a restricting part 110, a protruding part 120, and a pressing part 130.

The limiting portion 110 is disposed at a first height position, and limits the movement of the injectors 21-27 relative to the processing container 10. For example, as shown in FIG. 2 , the first height position may be the upper portion of the processing container 10. The limiting portion 110 includes a first hook 111 and a locking portion 112.

The first hook 111 has an L-shape extending from the inner wall near the inner tube 11 toward the center of the inner tube 11 at the first height and bending toward the ejectors 21 to 27 (ejection parts 21b to 27b) at the center side. The first hook 111 is made of the same material as the inner tube 11, such as quartz, and is welded to the inner wall near the inner tube 11.

The engaging portion 112 is arranged to extend from the ejector 21 to 27 to the first hook 111 side at the first height position and can engage with the first hook 111. As shown in FIG. 3 and FIG. 4, the engaging portion 112 has a tapered surface 112a, which is tilted in a manner that it enters the L-shaped inner side of the first hook 111 as it approaches the first hook 111 side. Thereby, when the ejector 21 to 27 is pressed to the first hook 111 side, the engaging portion 112 is engaged with the first hook 111, so that the ejector 21 to 27 is pressed to the inner wall side near the inner tube 11 and the protrusion 120 described later contacts the inner wall near the inner tube 11. In this way, since the inner tube 11 and the ejector 21-27 are in contact at two locations, namely, the contact portion P1 between the first hook 111 and the engaging portion 112 and the contact portion P2 between the inner wall near the inner tube 11 and the protruding portion 120, the movement of the ejector 21-27 can be restricted. As a result, the ejector 21-27 can be restrained from tilting due to the reaction force generated when the gas holes opened on the ejection portions 21b-27b of the ejector 21-27 eject gas, the rotation due to the weight of the ejector 21-27 itself, and the like.

The protrusion 120 is provided at a position higher than the first height position, for example, on the inner wall side near the inner tube 11 on the curved portions 21c~27c of the ejectors 21~27. However, the protrusion 120 may be provided at, for example, the first height position, or may be provided at a position lower than the first height position. In this case, the protrusion 120 may be provided at the introduction portion 21a~27a, or at the ejection portion 21b~27b, or at both the introduction portion 21a~27a and the ejection portion 21b~27b. The protrusion 120 has a hemispherical shape that protrudes from the surface of the ejectors 21~27, and contacts the inner wall near the inner tube 11. When the engaging portion 112 is engaged with the first hook 111 and the ejector 21 to 27 is pressed to the inner wall side near the inner tube 11, the protrusion 120 contacts the inner wall near the inner tube 11. For example, the bending angle of the L-shaped portion (the connecting portion between the introduction portion 21a to 27a and the horizontal portion 21d to 27d) at the lower end of the ejector 21 to 27 is formed to be slightly smaller than 90 degrees (sharp angle). In addition, by fixing the horizontal portion 21d to 27d with a nut or the like while the protrusion 120 is in contact with the inner wall near the inner tube 11, the ejector 21 to 27 can be installed in the inner tube 11. In this way, the ejector 21 to 27 is fixed at two points, so that the ejector 21 to 27 can be suppressed from tilting. In addition, by providing the protrusion 120, the ejectors 21 to 27 and the inner tube 11 form point contact, thereby preventing the ejectors 21 to 27 and the inner tube 11 from being attached to each other due to film formation. On the other hand, if the protrusion 120 is not provided, the ejectors 21 to 27 and the inner tube 11 form line or surface contact, and the ejectors 21 to 27 may be attached to the inner tube 11 due to film formation.

The pressing part 130 is disposed at a second height position lower than the first height position, and presses the ejectors 21-27 in a direction in which the restricting part 110 restricts the ejectors 21-27 from moving relative to the processing container 10. The pressing part 130 includes a second hook 131 and a stopper 132.

The second hook 131 has an L-shape extending from the inner wall near the inner tube 11 toward the center of the inner tube 11 at the second height position and bending toward the ejectors 21 to 27 (introduction parts 21a to 27a) at the center side. The second hook 131 is made of the same material as the inner tube 11, such as quartz, and is welded and fixed to the inner wall near the inner tube 11. The second hook 131 is arranged on the opposite side of the first hook 111 in the circumferential direction of the inner tube 11, sandwiching the ejectors 21 to 27, and the bending direction of the second hook 131 is opposite to the bending direction of the first hook 111.

The brake member 132 is inserted between the ejectors 21-27 (introduction parts 21a-27a) and the second hook 131 to press the ejectors 21-27 in a direction away from the second hook 131. As shown in FIG6 , the brake member 132 includes a wide portion 132a, a narrow portion 132b, and a tapered portion 132c.

The width portion 132a is formed to have a fixed width W61. The width W61 of the width portion 132a is longer than the length L6 between the injectors 21-27 and the inner side of the L-shape of the second hook 131 when the injectors 21-27 are installed in the processing container 10.

The narrow portion 132b is formed to have a fixed width W62. The width W62 of the narrow portion 132b is shorter than the length L6 between the injectors 21-27 and the inner side of the L-shape of the second hook 131 when the injectors 21-27 are installed in the processing container 10.

The tapered portion 132c is formed between the wide portion 132a and the narrow portion 132b. The tapered portion 132c is formed so that the width is continuously reduced from the width W61 of the wide portion 132a to the width W62 of the narrow portion 132b. In other words, the tapered portion 132c is formed so that the front end is tapered from the top to the bottom.

When the relevant brake 132 is inserted between the ejectors 21-27 and the second hook 131 from the upper side to the lower side at the second height position, a force in the direction of leaving the second hook 131 is applied to the ejectors 21-27. As a result, the engaging portion 112 is engaged with the first hook 111 at the first height position. In addition, FIG. 5 and FIG. 6 show the state where the brake 132 is inserted between the ejectors 21-23, 26, 27 and the second hook 131, and the brake 132 is not inserted between the ejectors 24, 25 and the second hook 131.

As described above, the substrate processing apparatus 1 according to the embodiment includes the holding portion 100 including the limiting portion 110 and the pressing portion 130. The limiting portion 110 is disposed at a first height position to limit the movement of the injectors 21 to 27 relative to the processing container 10. The pressing portion 130 is disposed at a second height position lower than the first height position to press the injectors 21 to 27 in the direction in which the limiting portion 110 limits the movement of the injectors 21 to 27 relative to the processing container 10. Thus, by pressing the ejector 21-27 in the direction in which the restricting portion 110 restricts the movement of the ejector 21-27 relative to the processing container 10, the restricting portion 110 can restrict the movement of the ejector 21-27 relative to the processing container 10. As a result, the ejector 21-27 can be restrained from tilting due to the reaction force generated by the gas holes opened on the ejection portions 21b-27b of the ejector 21-27 when ejecting gas, the rotation caused by the weight of the ejector 21-27 itself, etc.

Referring to FIG. 7 and FIG. 8 , a variation of the pressing portion is described. FIG. 7 is a diagram showing a variation of the pressing portion. FIG. 8 is a diagram showing an example of the action of the pressing portion of FIG. 7 .

The pressing part 230 is disposed at a second height position lower than the first height position, and presses the ejectors 21 to 27 in a direction in which the limiting part 110 limits the movement of the ejectors 21 to 27 relative to the processing container 10. The pressing part 230 includes a second hook 231 and a brake 232.

The second hook 231 has an L-shape extending from the inner wall near the inner tube 11 toward the center of the inner tube 11 at the second height position and bending toward the ejectors 21 to 27 (introduction parts 21a to 27a) at the center side. The second hook 231 is made of the same material as the inner tube 11, such as quartz, and is welded and fixed to the inner wall near the inner tube 11. The second hook 231 is arranged on the opposite side of the first hook 111, sandwiching the ejectors 21 to 27 in the circumferential direction of the inner tube 11, and the bending direction of the second hook 231 is opposite to the bending direction of the first hook 111.

The brake 232 is inserted between the ejector 21~27 (introduction part 21a~27a) and the second hook 231 and presses the ejector 21~27 in the direction away from the second hook 231. The brake 232 includes a conical part 232a, a narrow part 232b, a notch part 232c, and a fall prevention part 232d. As shown in FIG8(a), when the brake 232 is inserted between the ejector 21~27 and the second hook 231, the center of gravity G is located below the lower end of the second hook 231, such as the narrow part 232b.

The tapered portion 232a is formed so that the width continuously decreases from the first width W81 to the second width W82. In other words, the tapered portion 232a is formed so that the front end becomes thinner from the top to the bottom. The first width W81 is longer than the first length L81, which is the length between the injectors 21 to 27 and the inner side of the L shape of the second hook 231 when the injectors 21 to 27 are installed in the processing container 10. The second width W82 is shorter than the first length L81.

The narrow width portion 232b is formed continuously with the tapered portion 232a below the tapered portion 232a. The narrow width portion 232b is formed to have a fixed width W82.

The notch 232c is formed continuously with the narrow width portion 232b below the narrow width portion 232b. The notch 232c is formed to have a fixed width W83. The width W83 of the notch 232c is shorter than the second length L82 of the length between the injectors 21-27 and the inner side of the L-shape of the second hook 231 when the injectors 21-27 are installed in the processing container 10. The height H83 of the notch 232c is higher than the height H81 of the second hook 231. 8 (b), by raising the notch portion 232c to a height position overlapping the second hook 231, the second hook 231 can be moved forward (toward the center side of the inner tube 11), and the brake member 232 can be disassembled.

The drop prevention portion 232d is formed continuously with the notch portion 232c below the notch portion 232c. The drop prevention portion 232d is formed to have a fixed width W84. The width W84 of the drop prevention portion 232d is shorter than the first length L81 and longer than the second length L82. As shown in FIG8(c), when the brake member 232 is raised to the upper limit position, the second hook 231 and the drop prevention portion 232d overlap when viewed from the center side of the inner tube 11, thereby restricting the brake member 232 from moving toward the center side of the inner tube 11. Therefore, when the substrate processing apparatus 1 is performing processing, even if the brake member 232 is lifted to the upper limit position due to the flow of gas, etc., the brake member 232 can be prevented from being separated from the center side of the inner tube 11 and falling.

When the brake member 232 is inserted between the ejector 21-27 and the second hook 231 from above the second height position to below, a force in a direction away from the second hook 231 is applied to the ejector 21-27. Thus, the engaging portion 112 is engaged with the first hook 111 at the first height position.

The embodiments disclosed in this specification are illustrative in all aspects and are not intended to be limiting. The embodiments described above may be omitted, replaced, or modified in various forms without departing from the scope of the patent application and its gist.

In the above-mentioned embodiment, although the case where each ejector 21-27 is a return ejector is cited as an example for explanation, the present disclosure is not limited thereto. For example, a part or all of the ejectors 21-27 may also be non-return ejectors that are not returned at the upper part.

In the above embodiment, although a substrate processing apparatus 1 having seven injectors 21 to 27 is used as an example for explanation, the present disclosure is not limited thereto. For example, a substrate processing apparatus having only one injector may be used. In addition, a substrate processing apparatus having 2 to 6 or more injectors may be used.

1: substrate processing device 10: processing container 21~27: injector 100: holding part 110: limiting part 111: first hook 112: engaging part 112a: conical surface 130: pressing part 131: second hook 132: brake part 132c: conical part 231: second hook 232: brake part 232a: conical part 232d: falling prevention part

FIG. 1 is a schematic diagram showing an example of a substrate processing device of an implementation form. FIG. 2 is a perspective view showing a portion of the upper part of the substrate processing device of FIG. 1 in an enlarged manner. FIG. 3 is a cross-sectional view (1) showing a portion of the upper part of the substrate processing device of FIG. 1 in an enlarged manner. FIG. 4 is a cross-sectional view (2) showing a portion of the upper part of the substrate processing device of FIG. 1 in an enlarged manner. FIG. 5 is a perspective view showing a portion of the lower part of the substrate processing device of FIG. 1 in an enlarged manner. FIG. 6 is a view showing an enlarged view of area A of FIG. 5. FIG. 7 is a view showing a modified example of a pressing portion. FIG. 8 is a view showing an example of the action of the pressing portion of FIG. 7.

1: Substrate processing equipment

10: Processing container

11: Inner tube

12: External pipe

13: Injector storage unit

14: convex part

15: Gas outlet

16: Opening

20: Gas supply unit

21~27: Injector

30: Exhaust section

31: Exhaust channel

32: Pressure regulating valve

33: Vacuum pump

40: Heating section

90: Control Department

100:Maintenance Department

110: Restriction Department

130: Pressing part

Claims (8)

A substrate processing device comprises: a processing container having a substantially cylindrical shape; an ejector extending in a vertical direction along the inner side of an inner wall of the processing container; and a holding portion for holding the ejector by pressing the ejector against the inner side of the inner wall; the holding portion comprising: a limiting portion disposed at a first height position for limiting movement of the ejector relative to the processing container; and a pressing portion The second height position, which is set lower than the first height position, presses the ejector in the direction in which the movement of the ejector relative to the processing container is restricted by the restricting portion; the ejector is a return-type ejector that extends upward and then folds back at the upper portion and then extends downward; the restricting portion is set at the portion of the ejector extending downward; and the pressing portion is set at the portion of the ejector extending upward. For example, in the substrate processing device of item 1 of the patent application, the limiting part includes: an L-shaped first hook extending from the inner wall of the processing container toward the center of the processing container and bending toward the ejector at the center side; and a locking part extending from the ejector toward the side of the first hook and capable of locking with the first hook. For example, in the substrate processing device of item 2 of the patent application, the engaging portion has a conical surface that engages with the first hook. A substrate processing device according to any one of items 1 to 3 of the patent application, wherein the pressing portion comprises: An L-shaped second hook extending from the inner wall of the processing container toward the center of the processing container and bending toward the ejector at the center side; and a brake inserted between the ejector and the second hook to press the ejector in a direction away from the second hook. For example, in the substrate processing device of item 4 of the patent application, the brake member includes a cone whose front end tapers from top to bottom; the cone is inserted between the ejector and the second hook. For example, in the substrate processing device of item 5 of the patent application, the brake member includes a fall prevention portion below the conical portion that limits the movement of the brake member toward the center side of the processing container. A substrate processing device as claimed in any one of items 1 to 3 of the patent application, wherein the injector is formed with a plurality of gas holes opening along the long side direction; the plurality of gas holes are arranged to face the inner wall side near the processing container. A method for installing an injector is to install the injector in a processing container having a substantially cylindrical shape, comprising: a step of arranging the injector so as to extend in a vertical direction along an inner side of an inner wall of the processing container; and a step of pressing the injector against the inner side of the inner wall to hold the injector; the step of pressing the injector against the inner side of the inner wall to hold the injector comprises: a limiting step of limiting the injector at a first height position relative to the processing container; The container is moved; and a pressing process is to press the ejector at a second height position lower than the first height position in a direction in which the movement of the ejector relative to the processing container is restricted by the restricting process; the ejector is a return type ejector that extends upward and then folds back at the upper part and then extends downward; the first height position is located at the portion of the ejector extending downward; the second height position is located at the portion of the ejector extending upward.