TWI845131B - Light emitting unit and backlight module including same - Google Patents
Light emitting unit and backlight module including same Download PDFInfo
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- TWI845131B TWI845131B TW112102614A TW112102614A TWI845131B TW I845131 B TWI845131 B TW I845131B TW 112102614 A TW112102614 A TW 112102614A TW 112102614 A TW112102614 A TW 112102614A TW I845131 B TWI845131 B TW I845131B
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/66—Details of globes or covers forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/69—Details of refractors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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Abstract
Description
本發明係關於一種發光單元、以及包含其之背光模組。具體而言,本發明係關於一種包含具透光性之壁體之發光單元、以及包含其之背光模組。The present invention relates to a light-emitting unit and a backlight module including the same. Specifically, the present invention relates to a light-emitting unit including a light-transmissive wall and a backlight module including the same.
為了更精細地調整顯示及發光,具有例如可局部調光之特性的發光單元的設計及佈置係逐漸受到人們重視。承上所述,發光單元可依據其設計而具有不同的光型或出光角度。為了進一步提升出光效率並改善廣視角的顯示,較佳為在預期可視範圍內,發光單元可具有較均勻的光型以及較廣的出光角度。因此,需要在確保結構之穩固性及可靠性下,開發可進一步改善光型均勻度及出光角度之發光單元。In order to adjust the display and light emission more precisely, the design and layout of light-emitting units with characteristics such as local dimming are gradually gaining attention. As mentioned above, the light-emitting unit can have different light patterns or light emission angles according to its design. In order to further improve the light emission efficiency and improve the display with a wide viewing angle, it is better that the light-emitting unit can have a more uniform light pattern and a wider light emission angle within the expected visual range. Therefore, it is necessary to develop a light-emitting unit that can further improve the uniformity of the light pattern and the light emission angle while ensuring the stability and reliability of the structure.
解決問題之技術手段Technical means to solve the problem
為解決上述問題,根據本發明之一實施例提出一種發光單元,其包含:底板,具有承載面;光源,設置於承載面上;壁體,圍繞光源設置於底板上,其中,壁體相對於光源所發出之光線具有至少部分之透光性,且其中,底板與壁體共同界定腔室,且腔室於光源上方具有開口;以及頂蓋,設置封堵於開口,且相對於光源所發出之光線具有至少部分透光性及部分反射性。其中,頂蓋之中央相較於邊緣端部具有較厚之厚度,且朝向腔室內部突出。另外,沿著垂直於承載面之虛擬截面,腔室之截面中由底板界定之下底大於由開口界定之上底。To solve the above problems, according to one embodiment of the present invention, a light-emitting unit is proposed, which includes: a bottom plate having a supporting surface; a light source disposed on the supporting surface; a wall body disposed on the bottom plate around the light source, wherein the wall body has at least partial light transmittance relative to the light emitted by the light source, and wherein the bottom plate and the wall body together define a chamber, and the chamber has an opening above the light source; and a top cover, which is disposed to block the opening and has at least partial light transmittance and partial reflectivity relative to the light emitted by the light source. The center of the top cover has a thicker thickness than the edge end, and protrudes toward the inside of the chamber. In addition, along a virtual cross section perpendicular to the supporting surface, the lower bottom defined by the bottom plate in the cross section of the chamber is larger than the upper bottom defined by the opening.
本發明之另一實施例提供一種背光模組,其包含:基板;以及複數個如上所述之發光單元,設置於基板上。Another embodiment of the present invention provides a backlight module, which includes: a substrate; and a plurality of light-emitting units as described above, which are disposed on the substrate.
對照先前技術之功效Comparison with the efficacy of previous technologies
依據本發明之各實施例所提供之發光單元及背光模組,可減少或避免非可視範圍內的出光浪費,並導引此些光線自可視範圍出光,進而提升偏向正向角度上的出光效率,並在確保發光單元之結構穩固性及可靠性下進一步增廣出光角度及均勻度。因此,根據本發明之各實施例所提供之發光單元及背光模組,可提供更加均勻的廣角光型,且可在電子裝置之薄化發展趨勢下確保發光單元本身結構的穩定度以及正向出光的強度。The light-emitting unit and backlight module provided in accordance with each embodiment of the present invention can reduce or avoid the waste of light in the non-visible range, and guide such light to be emitted from the visible range, thereby improving the light-emitting efficiency at the forward angle, and further increasing the light-emitting angle and uniformity while ensuring the structural stability and reliability of the light-emitting unit. Therefore, the light-emitting unit and backlight module provided in accordance with each embodiment of the present invention can provide a more uniform wide-angle light pattern, and can ensure the structural stability of the light-emitting unit itself and the intensity of the forward light under the trend of thinning of electronic devices.
下文中將描述各種實施例,且所屬技術領域中具有通常知識者在參照說明搭配圖式下,應可輕易理解本發明之精神與原則。然而,雖然在文中會具體說明一些特定實施例,這些實施例僅作為例示性,且於各方面而言皆非視為限制性或窮盡性意義。因此,對於所屬技術領域中具有通常知識者而言,在不脫離本發明之精神與原則下,對於本發明之各種變化及修改應為顯而易見且可輕易達成的。Various embodiments will be described below, and those with ordinary knowledge in the art should be able to easily understand the spirit and principles of the present invention by referring to the description with accompanying drawings. However, although some specific embodiments will be specifically described in the text, these embodiments are only exemplary and are not to be considered as limiting or exhaustive in all aspects. Therefore, for those with ordinary knowledge in the art, various changes and modifications of the present invention should be obvious and easily achievable without departing from the spirit and principles of the present invention.
參照圖1,根據本發明之一實施例提出一種發光單元10。承上,所述發光單元10可應用於各種裝置或設備中以供應光線。例如,如圖1所示,一顯示裝置DX可沿著一第三方向D3依序地堆疊具有背光模組1000、一或多層光學膜片1500、以及顯示面板2000。其中,該背光模組1000可包含基板800以及設置於基板800上之複數個發光單元10。例如,可具有複數個發光單元10在垂直於第三方向D3之第一方向D1及第二方向D2所界定之平面上排列。承上,藉由此配置之背光模組1000可基於發光單元10大致朝向第三方向D3通過光學膜片1500對顯示面板2000供應光線,並透過顯示面板2000進行預期圖像之顯示。然而,此配置複數個發光單元10作為直下式背光模組1000以供顯示裝置DX使用之態樣僅為示例,且根據本發明之各實施例之發光單元10可搭配之裝置、以及其設置之形式可不限於此。Referring to FIG. 1 , a light emitting unit 10 is provided according to an embodiment of the present invention. As mentioned above, the light emitting unit 10 can be applied to various devices or equipment to supply light. For example, as shown in FIG. 1 , a display device DX can have a backlight module 1000, one or more optical films 1500, and a display panel 2000 stacked in sequence along a third direction D3. The backlight module 1000 can include a substrate 800 and a plurality of light emitting units 10 disposed on the substrate 800. For example, a plurality of light emitting units 10 can be arranged on a plane defined by a first direction D1 and a second direction D2 perpendicular to the third direction D3. As mentioned above, the backlight module 1000 configured in this way can supply light to the display panel 2000 through the optical film 1500 based on the light-emitting unit 10 generally facing the third direction D3, and display the expected image through the display panel 2000. However, the configuration of a plurality of light-emitting units 10 as a direct-type backlight module 1000 for use in the display device DX is only an example, and the devices that can be matched with the light-emitting unit 10 according to each embodiment of the present invention and the form of its arrangement are not limited to this.
接著,下文中將參照沿著圖1之X-X’剖面線(例如垂直於圖1所示之第二方向D2)截取發光單元10之放大示意圖的圖2來具體說明根據本實施例之發光單元10。承上,所述發光單元10可包含:具有承載面110之底板100、設置於承載面110上之光源200、圍繞光源200設置於底板100上之壁體300、以及設置於壁體300上之頂蓋400。其中,所述底板100可與壁體300共同界定一腔室M,且腔室M於光源200上方可具有一開口OP連通腔室M與腔室M外的環境。承上,頂蓋400可設置封堵於開口OP,而使得腔室M不連通外界環境。Next, the light-emitting unit 10 according to the present embodiment will be specifically described below with reference to FIG. 2 which is an enlarged schematic diagram of the light-emitting unit 10 cut along the section line X-X' of FIG. 1 (e.g., perpendicular to the second direction D2 shown in FIG. 1). As mentioned above, the light-emitting unit 10 may include: a bottom plate 100 having a supporting surface 110, a light source 200 disposed on the supporting surface 110, a wall 300 disposed on the bottom plate 100 around the light source 200, and a top cover 400 disposed on the wall 300. The bottom plate 100 and the wall 300 may define a chamber M together, and the chamber M may have an opening OP above the light source 200 to connect the chamber M with the environment outside the chamber M. As mentioned above, the top cover 400 can be disposed to seal the opening OP so that the chamber M is not connected to the external environment.
如圖2所示,根據本實施例,頂蓋400之中央C相較於邊緣端部E可具有較厚之厚度Th1,且朝向腔室M內部突出。具體而言,根據本實施例,頂蓋400可具有朝向光源200凸出之凸面N。其中,頂蓋400於中央C可具有厚度Th1,且頂蓋400越靠近邊緣端部E之厚度Th2可越薄。另外,根據一些實施例,頂蓋400之邊緣端部E可近乎無厚度,且接著於壁體300之頂端上方而使得頂蓋400之邊緣端部E之至少一部分受到壁體300所支持。承上所述,根據本實施例,頂蓋400可由於壁體300之支持而更穩固地設置於光源200之上。As shown in FIG. 2 , according to the present embodiment, the center C of the top cover 400 may have a thicker thickness Th1 than the edge end E, and may protrude toward the inside of the chamber M. Specifically, according to the present embodiment, the top cover 400 may have a convex surface N protruding toward the light source 200. The top cover 400 may have a thickness Th1 at the center C, and the thickness Th2 of the top cover 400 may be thinner as it approaches the edge end E. In addition, according to some embodiments, the edge end E of the top cover 400 may have almost no thickness, and may be connected to the top of the wall 300 so that at least a portion of the edge end E of the top cover 400 is supported by the wall 300. As described above, according to this embodiment, the top cover 400 can be more stably disposed on the light source 200 due to the support of the wall 300.
根據本實施例之發光單元10,自光源200所發出之光線L可出射至抵達壁體300及頂蓋400。其中,壁體300相對於光源200所發出之光線L可具有至少部分之透光性,使得至少部分之光線L可穿透壁體300射出。另外,頂蓋400相對於光源200所發出之光線L則具有至少部分透光性及部分反射性,使得至少部分之光線L可穿透頂蓋400射出且至少部分之光線L可被頂蓋400反射。因此,根據此配置,原先射向頂蓋400之部分光線L可被頂蓋400反射而穿透壁體300出射。藉此,可進一步加強廣角度視角之光線,從而實現發光單元10較佳之廣視角出光。According to the light-emitting unit 10 of the present embodiment, the light L emitted from the light source 200 can be emitted to the wall 300 and the top cover 400. The wall 300 can have at least partial light transmittance relative to the light L emitted from the light source 200, so that at least part of the light L can be emitted through the wall 300. In addition, the top cover 400 has at least partial light transmittance and partial reflectivity relative to the light L emitted from the light source 200, so that at least part of the light L can be emitted through the top cover 400 and at least part of the light L can be reflected by the top cover 400. Therefore, according to this configuration, part of the light L originally emitted to the top cover 400 can be reflected by the top cover 400 and emitted through the wall 300. Thereby, the light with a wide viewing angle can be further enhanced, thereby achieving a better wide viewing angle light emission of the light emitting unit 10.
另外,根據本實施例,沿著垂直於承載面110之虛擬截面,腔室M之截面中由底板100界定之下底B1可大於由開口OP界定之上底B2。詳細而言,根據本實施例,底板100與壁體300可相夾一預定角度θm,且預定角度θm係為銳角。因此,整體發光單元10之腔室M可具有下底B1大於上底B2之梯形形狀。藉此角度及梯形結構設置,可在藉由壁體300具有透光性而保持廣視角之出光下,進一步將接近於平行於底板100(例如沿著或接近於沿著第一方向D1)之出光光線L導向較接近正向方向再出射(例如至少相較於第一方向D1之角度變大)。因此,根據本實施例,在保持廣視角之出光角度下,可進一步使得光線L的利用效率提升。特別是,可將可能平行於底板100或接近平行於底板100出射而較無法被應用或視察之出光光線L導回正向,而使整體發光單元10之出光效率提升。In addition, according to the present embodiment, along the virtual cross section perpendicular to the supporting surface 110, the lower bottom B1 defined by the bottom plate 100 in the cross section of the chamber M may be larger than the upper bottom B2 defined by the opening OP. In detail, according to the present embodiment, the bottom plate 100 and the wall 300 may be sandwiched by a predetermined angle θm, and the predetermined angle θm is an acute angle. Therefore, the chamber M of the overall light-emitting unit 10 may have a trapezoidal shape in which the lower bottom B1 is larger than the upper bottom B2. With this angle and the trapezoidal structure, the light ray L that is close to being parallel to the bottom plate 100 (for example, along or close to being along the first direction D1) can be further guided to a direction closer to the forward direction for re-emission (for example, at least the angle relative to the first direction D1 becomes larger) while maintaining a wide viewing angle by virtue of the light transmittance of the wall 300. Therefore, according to this embodiment, while maintaining a wide viewing angle, the utilization efficiency of the light L can be further improved. In particular, the light L that may be parallel to or nearly parallel to the bottom plate 100 and cannot be used or observed can be guided back to the forward direction, thereby improving the light extraction efficiency of the entire light emitting unit 10.
承上所述,根據本實施例之發光單元10,可例如但不限於應用於作為直下式背光模組1000的發光來源,且由於其廣視角出光之特性,可基於密度較小的配置實現較廣平面的均勻發光表現。然而,所述應用僅為示例,且本發明不限於此。承上,根據本發明之其他實施例,發光單元10亦可應用於其他裝置中以作為發光來源。另外,根據本實施例之發光單元10,亦可依據設計進一步與其他光學模造鏡片(Molding Lens)或光導板或光學組件組合搭配使用,以形成更多樣的出光變化。As mentioned above, the light-emitting unit 10 according to the present embodiment can be used, for example but not limited to, as a light source of a direct-type backlight module 1000, and due to its wide-angle light emission characteristics, a uniform light emission performance in a wider plane can be achieved based on a configuration with a lower density. However, the above application is only an example, and the present invention is not limited thereto. As mentioned above, according to other embodiments of the present invention, the light-emitting unit 10 can also be applied to other devices as a light source. In addition, the light-emitting unit 10 according to the present embodiment can also be used in combination with other optical molding lenses (Molding Lens) or light guide plates or optical components according to the design to form more diverse light emission changes.
進一步,根據一些實施例,為了更增進光線L之利用效率,特別是光源200為LED等360度角出射型光源之情況下,所述底板100之承載面110上可進一步開設有一凹陷區500,且光源200可設置於凹陷區500中。具體而言,凹陷區500在虛擬截面上可具有凹口R之截面。其中,該凹口R可由底面510及至少一壁面520所界定,且底面510與至少一壁面520可相夾鈍角之角度θr。因此,若光源200為LED等360度角出射型光源之情況下,背向頂蓋400所出射之光線L可被凹陷區500所反射而朝著背向底板100之正向方向出射。例如,光線L可被底面510或壁面520所反射而導向,從而朝著背向底板100之正向方向出射。然而,上述僅為示例,且根據本發明之其他實施例,在光源200並非360度角出射型光源之情況下,或者光源200本身具有足夠出光效率下,亦可能不設置凹陷區500於承載面110上。Furthermore, according to some embodiments, in order to further improve the utilization efficiency of the light L, especially when the light source 200 is a 360-degree emitting light source such as an LED, a recessed area 500 may be further provided on the supporting surface 110 of the bottom plate 100, and the light source 200 may be disposed in the recessed area 500. Specifically, the recessed area 500 may have a cross section of a notch R on a virtual cross section. The notch R may be defined by a bottom surface 510 and at least one wall surface 520, and the bottom surface 510 and at least one wall surface 520 may be at an angle θr of a blunt angle. Therefore, if the light source 200 is a 360-degree emitting light source such as an LED, the light L emitted from the back of the top cover 400 may be reflected by the recessed area 500 and emitted in a forward direction from the back of the bottom plate 100. For example, the light L may be reflected and directed by the bottom surface 510 or the wall surface 520, and thus emitted in the forward direction facing away from the bottom plate 100. However, the above is only an example, and according to other embodiments of the present invention, when the light source 200 is not a 360-degree emitting light source, or when the light source 200 itself has sufficient light emitting efficiency, the recessed area 500 may not be provided on the supporting surface 110.
接著,將參照圖3進一步說明根據本發明之一實施例之發光單元10之各部位組件之材料設置。Next, the material arrangement of each component of the light-emitting unit 10 according to an embodiment of the present invention will be further described with reference to FIG. 3 .
承上,根據一實施例,發光單元10之腔室M內可填充一基體600,且基體600與頂蓋400可皆包含具有預定透光性質之第一材料Q1。舉例而言,第一材料Q1可為矽膠,但不限於此。如上所述,基於同樣具有第一材料Q1,可進一步加強頂蓋400與基體600之間的附著性。因此,可進一步改善整體發光單元10之完整性及結構穩定性。As mentioned above, according to an embodiment, a substrate 600 may be filled in the chamber M of the light-emitting unit 10, and the substrate 600 and the top cover 400 may both include a first material Q1 having a predetermined light-transmitting property. For example, the first material Q1 may be silicone, but is not limited thereto. As described above, based on the same first material Q1, the adhesion between the top cover 400 and the substrate 600 may be further enhanced. Therefore, the integrity and structural stability of the overall light-emitting unit 10 may be further improved.
根據一些實施例,為了設置不同光學特性,頂蓋400除了第一材料Q1外可摻雜有一摻雜材料T1,而基體600除了第一材料Q1外可摻雜有一摻雜材料T2。承上所述,摻雜材料T1及摻雜材料T2可不同,使得頂蓋400和基體600具有不同光學特性。舉例而言,當第一材料Q1為矽膠下,基體600可進一步摻雜螢光粉作為摻雜材料T2,而頂蓋400可進一步摻雜TiO 2作為摻雜材料T1。藉此,通過基體600之螢光膠體(矽膠與螢光粉體)後,光線L可具有預定之光線顏色或其他光線特性,且頂蓋400可基於摻雜之TiO 2而具有預定之反射性及透光性,從而實現使部分光線L透過頂蓋400出射且部分光線L被頂蓋400反射之特性。然而,上述頂蓋400與基體600之材料皆僅為示例,且本發明之其他實施例不限於此。 According to some embodiments, in order to set different optical properties, the top cover 400 may be doped with a doping material T1 in addition to the first material Q1, and the base 600 may be doped with a doping material T2 in addition to the first material Q1. As mentioned above, the doping material T1 and the doping material T2 may be different, so that the top cover 400 and the base 600 have different optical properties. For example, when the first material Q1 is silica gel, the base 600 may be further doped with phosphor as the doping material T2, and the top cover 400 may be further doped with TiO 2 as the doping material T1. Thus, after passing through the fluorescent gel (silicone and fluorescent powder) of the substrate 600, the light L can have a predetermined light color or other light characteristics, and the top cover 400 can have a predetermined reflectivity and light transmittance based on the doped TiO2 , thereby achieving the characteristics of making part of the light L pass through the top cover 400 and part of the light L reflected by the top cover 400. However, the materials of the top cover 400 and the substrate 600 are only examples, and other embodiments of the present invention are not limited thereto.
另外,根據一些實施例,壁體300可由透光度大於第一材料Q1或基體600整體之第二材料Q2製成。例如,壁體300可由聚對苯二甲酸環己烷二甲酯(Poly Cyclohexylene dimethylene Terephthalate, PCT)所製成。藉此,可使壁體300之透光性大於基體600之透光性。因此,自光源200所出射之光線L在穿過基體600而賦予預定之光線顏色或其他光線特性後,可至少部分或完全地透過壁體300而出射。藉此,可在具有壁體300支撐基體600從而加強穩定性及可靠性之情況下,進一步加強相對應於正向廣角度上視角的出光。In addition, according to some embodiments, the wall 300 can be made of a second material Q2 having a greater light transmittance than the first material Q1 or the entire substrate 600. For example, the wall 300 can be made of Poly Cyclohexylene dimethylene Terephthalate (PCT). In this way, the light transmittance of the wall 300 can be greater than the light transmittance of the substrate 600. Therefore, after the light L emitted from the light source 200 passes through the substrate 600 and is given a predetermined light color or other light characteristics, it can be emitted at least partially or completely through the wall 300. In this way, the light output corresponding to the viewing angle at a wide angle in the forward direction can be further enhanced while the wall 300 supports the substrate 600 to enhance stability and reliability.
根據一些實施例,可藉由進一步摻雜有摻雜材料T3於壁體300並調整其濃度來調整壁體300所需的透光度。例如,摻雜材料T3可為TiO 2。因此,可在具有同樣之發光單元10之結構構型甚至尺寸下,進一步調整變化整體發光單元10之光型。 According to some embodiments, the required light transmittance of the wall 300 can be adjusted by further doping the wall 300 with a doping material T3 and adjusting its concentration. For example, the doping material T3 can be TiO 2 . Therefore, the light type of the entire light emitting unit 10 can be further adjusted and changed with the same structure and even size of the light emitting unit 10 .
承上所述,可基於固定的製作發光單元10之模具,進一步調整上述第一材料Q1、第二材料Q2、摻雜材料T1、摻雜材料T2及摻雜材料T3等,來進一步調整發光單元10可能之光型或出光效率。因此,具有具部分透光性之壁體300可在保持廣視角之出光角度下,使得整體發光單元10更為穩固及可靠,且可進一步基於此變化同樣模具下可生產之不同態樣。As mentioned above, the first material Q1, the second material Q2, the doped material T1, the doped material T2 and the doped material T3 can be further adjusted based on the fixed mold for manufacturing the light-emitting unit 10, so as to further adjust the possible light type or light extraction efficiency of the light-emitting unit 10. Therefore, the wall 300 with partial light transmittance can make the whole light-emitting unit 10 more stable and reliable while maintaining a wide viewing angle of light extraction, and different forms can be produced under the same mold based on this change.
具體而言,根據一些實施例,頂蓋400可設置以具有20%~60%的透光率。例如,該頂蓋400可具有30%~40%的透光率。另外,頂蓋400相對於光源200所發出之光線L之反射率可低於70%。例如,頂蓋400相對於光源200所發出之光線L之反射率可介於50~70%。藉此,可使預定程度的光線L可透過頂蓋400出射形成靠近法線上之正視光,且使預定程度的光線L可被頂蓋400反射導向壁體300後再出射形成較偏離法線之側向光。另外,上述壁體300可具有30%~100%的透光率,且根據一些實施例可具有高於頂蓋400之透光率,以提升廣角度視角上的出光效率。例如,壁體300可具有50%~60%的透光率。然而,上述僅為示例,且在具有穩固的結構之前提下,可盡量配置以使得壁體300具有較高之透光率。Specifically, according to some embodiments, the top cover 400 may be configured to have a light transmittance of 20% to 60%. For example, the top cover 400 may have a light transmittance of 30% to 40%. In addition, the reflectivity of the top cover 400 relative to the light L emitted by the light source 200 may be lower than 70%. For example, the reflectivity of the top cover 400 relative to the light L emitted by the light source 200 may be between 50% and 70%. Thereby, a predetermined degree of light L can be emitted through the top cover 400 to form a frontal light close to the normal line, and a predetermined degree of light L can be reflected by the top cover 400 and directed to the wall 300 and then emitted to form a side light that is relatively deviated from the normal line. In addition, the wall 300 may have a light transmittance of 30% to 100%, and according to some embodiments, may have a light transmittance higher than that of the top cover 400 to improve the light extraction efficiency at a wide viewing angle. For example, the wall 300 may have a light transmittance of 50% to 60%. However, the above is only an example, and under the premise of having a stable structure, the wall 300 may be configured as much as possible to have a higher light transmittance.
根據一些實施例,為了使頂蓋400具有預定之透光率及反射率,頂蓋400較佳可由非金屬材料所製成。According to some embodiments, in order to make the top cover 400 have a predetermined transmittance and reflectivity, the top cover 400 is preferably made of a non-metallic material.
下文中,將進一步參照圖4來說明上述各結構部件之具體尺寸細節。In the following, the specific size details of the above-mentioned structural components will be further explained with reference to FIG. 4.
承上,根據一實施例,發光單元10中如上所述可具有一上底B2及一下底B1。具體而言,上底B2對應於腔室M之上側邊,且下底B1對應於腔室M之下側邊。其中,上底B2可具有一上底寬度W2,且下底B1可具有一下底寬度W1。另外,腔室M對應於上底B2與下底B1之間可具有一腔室高度H。承上所述,根據一些實施例,沿著垂直於承載面110之虛擬截面,當該腔室M之一腔室高度H介於10 mm至0.6 mm之範圍內時,腔室高度H:腔室M之上底B2之上底寬度W2:腔室M之下底B1之下底寬度W1之比例可為1:1.9~1.1:2.7~1.9。此外,根據又一些實施例,沿著垂直於承載面110之虛擬截面,當腔室M之腔室高度H介於0.6 mm至0.1 mm之範圍內時,腔室高度H:腔室M之上底B2之上底寬度W2:腔室M之下底B1之下底寬度W1之比例為1:3.3~2.5:4.0~3.2。As mentioned above, according to one embodiment, the light-emitting unit 10 may have an upper base B2 and a lower base B1 as described above. Specifically, the upper base B2 corresponds to the upper side of the chamber M, and the lower base B1 corresponds to the lower side of the chamber M. The upper base B2 may have an upper base width W2, and the lower base B1 may have a lower base width W1. In addition, the chamber M may have a chamber height H corresponding to the upper base B2 and the lower base B1. As mentioned above, according to some embodiments, along a virtual cross section perpendicular to the supporting surface 110, when a chamber height H of the chamber M is in the range of 10 mm to 0.6 mm, the ratio of the chamber height H: the upper base width W2 of the upper base B2 of the chamber M: the lower base width W1 of the lower base B1 of the chamber M may be 1:1.9~1.1:2.7~1.9. In addition, according to some other embodiments, along a virtual cross-section perpendicular to the supporting surface 110, when the chamber height H of the chamber M is in the range of 0.6 mm to 0.1 mm, the ratio of the chamber height H: the upper bottom width W2 of the upper bottom B2 of the chamber M: the lower bottom width W1 of the lower bottom B1 of the chamber M is 1:3.3~2.5:4.0~3.2.
另外,根據一些實施例,頂蓋400沿著垂直於承載面110之方向上(亦即第三方向D3)最厚之頂蓋厚度Th1可介於30 µm至450 µm之間。例如,根據一些實施例,頂蓋厚度Th1可介於30 µm至100 µm之間。In addition, according to some embodiments, the thickest top cover thickness Th1 of the top cover 400 along the direction perpendicular to the supporting surface 110 (ie, the third direction D3) may be between 30 μm and 450 μm. For example, according to some embodiments, the top cover thickness Th1 may be between 30 μm and 100 μm.
繼續參照圖4,根據又一些實施例,發光單元10中圍繞界定腔室M之壁體300可具有朝向腔室M之內表面S1及背向腔室M之外表面S2。承上述,內表面S1與外表面S2之間平行於底板100之壁體厚度K可非固定的。具體而言,內表面S1與外表面S2之間平行於底板100 (亦即平行於第一方向D1)之壁體厚度K在靠近底板100處(例如壁體厚度K1)較遠離該底板100處(例如壁體厚度K2)為厚。藉此,可進一步抑制平行於底板100或接近於平行於底板100之出光光線L透過壁體300之出射率,進而使得整體光型更加均勻朝向可視範圍之正向角度。Continuing to refer to FIG. 4 , according to some other embodiments, the wall 300 surrounding and defining the chamber M in the light-emitting unit 10 may have an inner surface S1 facing the chamber M and an outer surface S2 facing away from the chamber M. Based on the above, the wall thickness K between the inner surface S1 and the outer surface S2 parallel to the bottom plate 100 may be non-fixed. Specifically, the wall thickness K between the inner surface S1 and the outer surface S2 parallel to the bottom plate 100 (i.e., parallel to the first direction D1) is thicker near the bottom plate 100 (e.g., wall thickness K1) than far from the bottom plate 100 (e.g., wall thickness K2). In this way, the emission rate of the light rays L parallel to or close to the bottom plate 100 passing through the wall 300 can be further suppressed, thereby making the overall light pattern more uniform toward the positive angle of the visible range.
承上,根據一些實施例,壁體厚度K可介於0.85 mm至0.09 mm之間。然而,此僅為示例,且在符合預期之透光度及支持性之情況下,根據本發明之各實施例之壁體厚度K係不限於此。另外,根據一些實施例,壁體厚度K可沿著第三方向D3漸進地變厚,但根據本發明之不同實施例則不限於此。As mentioned above, according to some embodiments, the wall thickness K may be between 0.85 mm and 0.09 mm. However, this is only an example, and the wall thickness K of each embodiment of the present invention is not limited thereto under the condition of meeting the expected light transmittance and support. In addition, according to some embodiments, the wall thickness K may gradually become thicker along the third direction D3, but different embodiments of the present invention are not limited thereto.
進一步,根據本發明之不同實施例,在符合頂蓋可具有中央較厚之結構之前提下,頂蓋可具有各種實施型態。舉例而言,頂蓋400可為上述參照圖1至圖4所示出之平凸球面形。另外,參照圖5,根據又一實施例之發光單元20,頂蓋400’亦可為角錐形。承上,頂蓋400’可同樣具有朝向光源200凸出之凸面N。Furthermore, according to different embodiments of the present invention, the top cover can have various embodiments under the premise that the top cover can have a structure with a thicker center. For example, the top cover 400 can be a plano-convex spherical shape as shown in the above-mentioned reference figures 1 to 4. In addition, referring to Figure 5, according to the light-emitting unit 20 of another embodiment, the top cover 400' can also be a pyramid. As above, the top cover 400' can also have a convex surface N protruding toward the light source 200.
承上所述,根據本發明之各實施例,頂蓋可具有各種態樣,且在腔室M具有下底B1大於上底B2之前提下,根據本發明之各實施例之腔室M亦可具有各種態樣。舉例而言,參照圖6A,根據本發明之一實施例,腔室M1可為平截一圓錐之頂部所形成之錐台形。另外,參照圖6B,根據本發明之又一實施例,腔室M2可為平截一稜錐之頂部所形成之錐台形。如上所述,在垂直於承載面110之截面具有下底大於上底之情況或者底板100與壁體300所相夾之角度為銳角之情況下,根據本發明之各實施例之發光單元所界定之腔室可具有各種態樣。As described above, according to various embodiments of the present invention, the top cover can have various forms, and under the premise that the chamber M has a lower bottom B1 larger than the upper bottom B2, the chamber M according to various embodiments of the present invention can also have various forms. For example, referring to FIG. 6A , according to one embodiment of the present invention, the chamber M1 can be a pyramidal shape formed by truncating the top of a cone. In addition, referring to FIG. 6B , according to another embodiment of the present invention, the chamber M2 can be a pyramidal shape formed by truncating the top of a ridged pyramid. As described above, when the cross section perpendicular to the supporting surface 110 has a lower bottom larger than the upper bottom or the angle between the bottom plate 100 and the wall 300 is a sharp angle, the chamber defined by the light-emitting unit according to each embodiment of the present invention can have various forms.
接下來,將參照圖7說明根據一例示性實施例之發光單元所生成之光型。Next, the light pattern generated by the light emitting unit according to an exemplary embodiment will be described with reference to FIG. 7 .
如上所述,根據一例示性實施例,在如上所述配置,且腔室M之腔室高度H為0.55 mm,下底B1之下底寬度W1為2 mm,上底B2之上底寬度W2為1.6 mm,且頂蓋400之頂蓋厚度Th1為0.1 mm之例示性發光單元之情況下,相對於垂直於承載面110之法線,可具有如圖7所示之傾角之光型。詳細而言,基於發光單元之壁體300具有透光性,自光源200發出之光線L可直接通過壁體300或先被頂蓋400反射後再通過壁體300出射,使得相對偏離法線0度之廣角度之出光提升。然而,由於頂蓋400本身亦具有一定透光性,因此接近於法線0度上的出光亦可保持。此外,根據本發明之各實施例,由於底板100與壁體300之相夾預定角度θm係低於90度,且使得接近於平行底板100 (例如,大約落於圖7所示之70度~90度角度)被出射之光線L可被導引而至少部分地沿著相對較正向的方向(例如,大約落於圖7所示之0度~80度角)出射。承上所述,此設置在保持廣視角出光下,使得過大之角度(例如越接近90度)且可能無法被利用之出光被導引回可利用的視角。因此,根據本發明之各實施例,可進一步在以壁體300保護腔室M下,保持廣視角之出光及接近法線上之正視出光,並可進一步導引並改善大角度無效光線的利用率。As described above, according to an exemplary embodiment, in the case of an exemplary light-emitting unit configured as described above, wherein the chamber height H of the chamber M is 0.55 mm, the lower bottom width W1 of the lower bottom B1 is 2 mm, the upper bottom width W2 of the upper bottom B2 is 1.6 mm, and the top cover thickness Th1 of the top cover 400 is 0.1 mm, a light pattern with an angle as shown in FIG. 7 may be provided relative to the normal line perpendicular to the supporting surface 110. In detail, based on the light transmittance of the wall 300 of the light-emitting unit, the light L emitted from the light source 200 may directly pass through the wall 300 or be reflected by the top cover 400 before being emitted through the wall 300, so that the light emission at a wide angle relative to 0 degrees from the normal line is enhanced. However, since the top cover 400 itself also has a certain light transmittance, the light output close to the normal 0 degree can also be maintained. In addition, according to each embodiment of the present invention, since the predetermined angle θm between the bottom plate 100 and the wall 300 is lower than 90 degrees, and the light L emitted close to parallel to the bottom plate 100 (for example, approximately falling at an angle of 70 degrees to 90 degrees as shown in Figure 7) can be guided and emitted at least partially along a relatively positive direction (for example, approximately falling at an angle of 0 degrees to 80 degrees as shown in Figure 7). As mentioned above, this arrangement maintains a wide viewing angle of light output, so that the light output at an excessively large angle (for example, the closer to 90 degrees) and that may not be used is guided back to a usable viewing angle. Therefore, according to various embodiments of the present invention, the light output at a wide viewing angle and the light output close to the normal line can be maintained while protecting the chamber M with the wall 300, and the utilization rate of ineffective light at a large angle can be further guided and improved.
接著,進一步參照圖8,如上述圖7之實施例基於不同數據所類似地配置之不同發光單元可具有類似的光型。承上所述,根據本發明之不同實施例之發光單元,透過壁體及頂蓋後出射之光型可具有接近倒三角形或者元寶型的形狀。詳細而言,由根據本發明之各實施例之發光單元所發出之光線之光型可接近倒三角形,且因此可減少在過大角度上的無效出光,並確保足夠之正視0度角出光,並改善介於可視範圍內之廣角度上的出光強度及均勻度。Next, further referring to FIG. 8 , different light-emitting units similarly configured based on different data as in the embodiment of FIG. 7 described above may have similar light patterns. As mentioned above, according to the light-emitting units of different embodiments of the present invention, the light pattern emitted after passing through the wall and the top cover may have a shape close to an inverted triangle or a gold ingot shape. In detail, the light pattern of the light emitted by the light-emitting units of each embodiment of the present invention may be close to an inverted triangle, and thus may reduce ineffective light emission at excessively large angles, ensure sufficient front-facing 0-degree angle light emission, and improve light emission intensity and uniformity at a wide angle within the visible range.
根據一些實施例,如上所述之發光單元在裝置薄化時亦可具有極佳的正向出光強度及廣角出光均勻性。承上,圖9A至圖9C係分別示出在OD10 (圖9A)、OD7 (圖9B)及OD5 (圖9C)下,配置如上所述實施例之複數個發光單元之出光表現之實際照片。如圖所示,可看出即便在薄化的OD5之情況下,根據本發明之實施例之發光單元之出光表現仍可具有相當的正向出光強度及廣角出光均勻性,且可保持整體發光的均勻性及完整性而減少或避免局部暗點缺陷產生。According to some embodiments, the light-emitting unit described above can also have excellent forward light intensity and wide-angle light uniformity when the device is thinned. Continuing from the above, Figures 9A to 9C are actual photos of the light output performance of multiple light-emitting units configured in the above embodiments at OD10 (Figure 9A), OD7 (Figure 9B) and OD5 (Figure 9C), respectively. As shown in the figure, it can be seen that even in the case of thinning OD5, the light output performance of the light-emitting unit according to the embodiment of the present invention can still have considerable forward light intensity and wide-angle light uniformity, and can maintain the uniformity and integrity of the overall light emission and reduce or avoid the generation of local dark spot defects.
承上所述,參照圖10,具有類似或相同於上述各實施例所揭示之發光單元之構造之發光單元30可出射光線L’。其中,根據一些實施例,當界定垂直於承載面110之法線為一基準線P時,發光單元30相對基準線P於30度~60度的出光強度可大於發光單元30相對基準線P於60度~90度的出光強度。詳細而言,由於由光源200所發出原先平行於底板100或接近於平行於底板100之光線L被發光單元30之結構所導引,且因此可朝向相對於基準線P較小角度之方向出射。因此,由發光單元30所發出之光線L’可減少或避免大角度非可視範圍(例如接近於90度)出光的浪費。此外,亦可藉由導引光線L’從可視範圍出光,從而進一步提升其他角度之出光強度。因此,根據本發明之實施例,可有效地提升整體發光單元30發光的效率,並且可進一步改善可視範圍的出光的均勻性及強度。As described above, referring to FIG. 10 , the light emitting unit 30 having a structure similar to or identical to the light emitting unit disclosed in the above-mentioned embodiments can emit light L’. According to some embodiments, when a normal line perpendicular to the supporting surface 110 is defined as a reference line P, the light intensity of the light emitting unit 30 at 30 to 60 degrees relative to the reference line P can be greater than the light intensity of the light emitting unit 30 at 60 to 90 degrees relative to the reference line P. In detail, the light L originally parallel to or nearly parallel to the bottom plate 100 emitted by the light source 200 is guided by the structure of the light emitting unit 30, and thus can be emitted in a direction with a smaller angle relative to the reference line P. Therefore, the light L' emitted by the light-emitting unit 30 can reduce or avoid the waste of light in a large non-visible range (e.g., close to 90 degrees). In addition, the light L' can be guided to emit light from the visible range, thereby further improving the light intensity at other angles. Therefore, according to the embodiment of the present invention, the efficiency of the light-emitting unit 30 can be effectively improved, and the uniformity and intensity of the light emitted in the visible range can be further improved.
接下來,將參照圖11至圖16說明根據本發明之一實施例製備具有相同或類似於上述構造之發光單元之例示性過程。然而,所屬技術領域中具有通常知識者應明瞭,此僅為示例,且在可實現相同構造下,根據本發明之其他實施例之製備方法不限於此。Next, an exemplary process of preparing a light-emitting unit having the same or similar structure as above according to one embodiment of the present invention will be described with reference to Figures 11 to 16. However, a person skilled in the art should understand that this is only an example, and the preparation method of other embodiments of the present invention is not limited thereto if the same structure can be achieved.
承上所述,如圖11所示,根據本發明之一實施例,發光單元之製作方法50依序包含步驟S100、步驟S200、步驟S300、及步驟S400。其中,連同圖11參照圖12,在步驟S100中,可先設置底板100及底板100上之壁體300以製作類似於杯體之主結構,並從而界定腔室M之空間以及對外連通之開口OP。如上所述,此處底板100及壁體300之間係以預定角度θm設置,且預定角度θm小於90度。此外,亦可事先於底板100上設置凹陷區500等選擇性構造。進一步,雖然於前文中的實施例並未具體示出,但在此步驟中亦可事先於底板100或壁體300上設置所需的穿孔G等構造,以供例如但不限於電性連接等用途使用。承上,此些內容應可被所屬技術領域中具有通常知識者所明瞭,且在此將不再贅述。As described above, as shown in FIG. 11, according to an embodiment of the present invention, the manufacturing method 50 of the light-emitting unit includes step S100, step S200, step S300, and step S400 in sequence. In particular, referring to FIG. 12 together with FIG. 11, in step S100, the bottom plate 100 and the wall 300 on the bottom plate 100 can be first set to make a main structure similar to a cup body, thereby defining the space of the chamber M and the opening OP connected to the outside. As described above, the bottom plate 100 and the wall 300 are set at a predetermined angle θm, and the predetermined angle θm is less than 90 degrees. In addition, optional structures such as a recessed area 500 can also be set on the bottom plate 100 in advance. Furthermore, although not specifically shown in the above embodiments, in this step, the required perforations G and other structures may be provided in advance on the bottom plate 100 or the wall 300 for purposes such as but not limited to electrical connection. As mentioned above, these contents should be understood by those with ordinary knowledge in the relevant technical field and will not be elaborated here.
承上,根據本實施例,連同圖11參照圖13,在建構腔室M後,可在步驟S200中進行黏晶製程(Die Bonding),以將光源200設置於腔室M中之底板100上而受到承載面110所承載。承上,光源200可為LED、micro LED、mini LED等可產生光線之來源,且不限於此所具體舉例的態樣。As mentioned above, according to the present embodiment, referring to FIG. 13 together with FIG. 11, after the chamber M is constructed, a die bonding process (die bonding) can be performed in step S200 to place the light source 200 on the bottom plate 100 in the chamber M and supported by the supporting surface 110. As mentioned above, the light source 200 can be a source that can generate light such as LED, micro LED, mini LED, etc., and is not limited to the specific examples given here.
接著,連同圖11參照圖14,在光源200設置完成後,可在步驟S300中相對應地進行打線接合製程(Wire bonding)以設置相關電路配置。承上,電線W等組件可例如但不限於對應於光源200進行連接配置,且可能相對應地使用到上述預先設置之穿孔G等構造。此些內容應可被所屬技術領域中具有通常知識者所明瞭,且在此將不再贅述。Next, referring to FIG. 14 together with FIG. 11, after the light source 200 is set, a wire bonding process may be performed in step S300 to set the relevant circuit configuration. As mentioned above, components such as wires W may be connected and configured corresponding to the light source 200, for example but not limited to, and the above-mentioned pre-set through-hole G and other structures may be used accordingly. These contents should be understood by those with ordinary knowledge in the relevant technical field, and will not be elaborated here.
進一步,連同圖11參照圖15,在完成上述設置後,可在步驟S400中在腔室M內充填基體600。具體而言,如圖15所示,可將作為基體600之具有可塑性之流體材料Q (例如可為前文中所述之第一材料Q1與摻雜材料T1之混合材料)通過開口OP注入腔室M。承上,基體600充填於腔室M中後,可被底板100及壁體300所支承,且基於腔室M之構型而於無支承的中央部分自然內聚下陷形成凹槽V。緊接著,可在基體600尚未完全定型以前,在步驟S400中將作為頂蓋400之具有可塑性之流體材料Q’(例如可為前文中所述之第一材料Q1與摻雜材料T2之混合材料)通過開口OP注入上述下陷之凹槽V中。藉此,可藉由上述自然內聚下陷的凹槽V形成頂蓋400之形狀,且可依據預設之尺寸設計,透過注入多少流體材料Q來設置預定尺寸構型之凹槽V,從而形成具有預設尺寸及構型之頂蓋400。另外,由於頂蓋400及基體600可選擇性地具有部分相同的材料,且在尚未定型固化前注入頂蓋400之流體材料Q’於基體600之流體材料Q上,故所形成之頂蓋400及基體600之接附性可進一步提升。承上,藉此方式所完成之頂蓋400及基體600可被壁體300所支承及保護,減少或避免了其直接與外界環境接觸的劣化可能,從而進一步提升其穩固性及完整性。Further, referring to FIG. 15 together with FIG. 11 , after the above configuration is completed, the matrix 600 may be filled in the chamber M in step S400. Specifically, as shown in FIG. 15 , a plastic fluid material Q (e.g., a mixed material of the first material Q1 and the doping material T1 described above) as the matrix 600 may be injected into the chamber M through the opening OP. As described above, after the matrix 600 is filled in the chamber M, it may be supported by the bottom plate 100 and the wall 300 , and based on the configuration of the chamber M, the unsupported central portion may naturally sink and cohere to form a groove V. Next, before the base 600 is completely formed, in step S400, a plastic fluid material Q' (for example, a mixed material of the first material Q1 and the doping material T2 described above) serving as the top cover 400 is injected into the above-mentioned sunken groove V through the opening OP. In this way, the shape of the top cover 400 can be formed by the above-mentioned naturally cohesive sunken groove V, and the groove V of a predetermined size and configuration can be set according to the preset size design by injecting a certain amount of fluid material Q, thereby forming a top cover 400 with a preset size and configuration. In addition, since the top cover 400 and the base 600 can selectively have part of the same material, and the fluid material Q' of the top cover 400 is injected onto the fluid material Q of the base 600 before being solidified, the adhesion of the formed top cover 400 and the base 600 can be further improved. In addition, the top cover 400 and the base 600 completed in this way can be supported and protected by the wall 300, reducing or avoiding the possibility of deterioration due to direct contact with the external environment, thereby further improving its stability and integrity.
另外,根據本實施例,由於頂蓋400及基體600之間的接附性提升,亦可進一步改善整體結構的完整性,且減少或避免頂蓋400及基體600之交界處剝離或脫落之缺陷之產生。特別是,在成品需要被另外移動時,可減少持取時頂蓋400及基體600之間的分離以及材料的剝落及損耗。In addition, according to the present embodiment, since the adhesion between the top cover 400 and the base 600 is improved, the integrity of the overall structure can be further improved, and the defects of peeling or falling off at the junction of the top cover 400 and the base 600 can be reduced or avoided. In particular, when the finished product needs to be moved separately, the separation between the top cover 400 and the base 600 during holding and the peeling and loss of materials can be reduced.
根據一些實施例,同時受到基體600及壁體300所支承之頂蓋400之最末端之邊緣端部可實際上近乎無厚度而直接接著於壁體300上。詳言之,增強頂蓋400及基體600之間的接附性,可相對應地減少所需設置之壁體300之頂端之寬度,且仍可穩固地接著及支承近乎無厚度之頂蓋400之最末端之邊緣端部,從而在確保對頂蓋400之支持性下減少或避免在壁體300上所需事先設置及佔據之頂蓋400之安裝空間。然而,此僅為示例,且本發明不限於此。According to some embodiments, the end edge of the top cover 400 supported by both the base 600 and the wall 300 can be directly connected to the wall 300 with almost no thickness. In detail, by enhancing the adhesion between the top cover 400 and the base 600, the width of the top of the wall 300 to be set can be correspondingly reduced, and the end edge of the top cover 400 with almost no thickness can still be stably connected and supported, thereby reducing or avoiding the installation space of the top cover 400 that needs to be set in advance and occupied on the wall 300 while ensuring the support of the top cover 400. However, this is only an example, and the present invention is not limited thereto.
最後,參照圖16,在完成上述步驟S100、S200、S300及S400之點膠成型後,可形成具有預定角度θm之腔室M充填有基體600且上部接附有頂蓋400之發光單元40。如上所述,頂蓋400具有反射性及透射性,而壁體300具有透射性,且由於腔室M可具有下底B1大於上底B2之構型,故發光單元40可藉此具有接近倒三角形之光型特色。具體而言,例如像是光源200所出射抵至頂蓋400之光線L1可一部分穿透頂蓋400出射為光線L1’,一部分被頂蓋400反射而為光線L2’。另外,例如像是光源200平行於底板100或接近於平行底板100所出射且抵至壁體300之光線L2可被至少部分導向較正向之角度而出射為光線L3’。承上,光線L3’可至少部分地偏離平行於底板100或接近於平行底板100之出射角度,以從其他的正向廣視角或甚至法線上的正向角度出射。Finally, referring to FIG. 16 , after the above-mentioned steps S100, S200, S300 and S400 of glue dispensing molding are completed, a light-emitting unit 40 having a predetermined angle θm filled with a base 600 and a top cover 400 attached to the top can be formed. As described above, the top cover 400 has reflectivity and transmittance, and the wall 300 has transmittance, and since the chamber M can have a configuration in which the lower bottom B1 is larger than the upper bottom B2, the light-emitting unit 40 can thereby have a light-shaped feature close to an inverted triangle. Specifically, for example, a portion of the light L1 emitted by the light source 200 to the top cover 400 can penetrate the top cover 400 and be emitted as light L1', and a portion can be reflected by the top cover 400 and be light L2'. In addition, for example, the light ray L2 emitted by the light source 200 parallel to or close to the bottom plate 100 and reaching the wall 300 can be at least partially directed to a more positive angle and emitted as the light ray L3'. As mentioned above, the light ray L3' can at least partially deviate from the emission angle parallel to or close to the bottom plate 100 to emit from other positive wide angles or even positive angles on the normal.
根據一些實施例,上述完成之發光單元40可再繼續進行其他習知製程,例如但不限於測試、封裝、轉移、佈置裝配於其他裝置等。承上,此些內容應為所屬技術領域中具有通常知識者所熟知,且在此將不再贅述。According to some embodiments, the light emitting unit 40 may be further processed by other known processes, such as but not limited to testing, packaging, transferring, arranging and assembling in other devices, etc. As mentioned above, these contents should be well known to those with ordinary knowledge in the relevant technical field and will not be elaborated here.
綜上所述,根據本發明之各實施例所提出之發光單元及應用其之裝置例如背光模組,可確保整體發光單元結構之完整性,且減少或避免發光單元各部件之間交界處之暴露及損耗剝落。特別是,根據本實施例所提出之發光單元,基於壁體的保護及支承,可減少或避免頂蓋之剝落分離或腔室之暴露和汙染。另外,由於藉由壁體界定而無須切割製程來界定腔室,根據本發明,可減少或避免腔室及其內容物於切割過程中所可能非預期形成之偏差、傷害及汙染。例如但不限於濕式切割之濕氣侵蝕及乾式切割之高速磨擦碳化。此外,基於本發明之各實施例之發光單元之腔室之構型及角度設計,可減少或避免接近平行光或平行光之光線無法於可視範圍中被利用的缺陷。承上,基於此結構以及頂蓋之預設反射性及透射性和壁體之預設透射性,根據本發明之各實施例所提出之發光單元及應用其之裝置可改善廣角度之出光光型及均勻性,同時確保法線上之正向出光之預定強度並減少或避免暈輪效應(Halo effect)。特別是,即便在裝置層薄化至OD5以下之情況下,根據本發明之各實施例所提出之發光單元及應用其之裝置仍可大幅地改善燈上正向出光暗點的可能缺陷。因此,根據本發明之各實施例所提出之發光單元及應用其之裝置,可在裝置層越趨薄化且布置密度較小下實現更均勻的廣視角出光及正向出光。承上所述,根據本發明之各實施例所提出之發光單元及應用其之裝置可改善出光的效率,且較為穩固可靠而可具有較高之壽命。In summary, the light-emitting unit and the device using the same, such as a backlight module, proposed in each embodiment of the present invention can ensure the integrity of the overall light-emitting unit structure and reduce or avoid the exposure and damage and peeling of the interfaces between the components of the light-emitting unit. In particular, the light-emitting unit proposed in the present embodiment can reduce or avoid the peeling and separation of the top cover or the exposure and contamination of the chamber based on the protection and support of the wall. In addition, since the chamber is defined by the wall without the need for a cutting process, according to the present invention, the chamber and its contents can be reduced or avoided. Unexpected deviations, damage and contamination during the cutting process can be reduced or avoided. For example, but not limited to wet gas erosion in wet cutting and high-speed friction carbonization in dry cutting. In addition, the configuration and angle design of the chamber of the light-emitting unit according to each embodiment of the present invention can reduce or avoid the defect that the light close to parallel light or parallel light cannot be used in the visible range. Continuing from the above, based on this structure and the preset reflectivity and transmittance of the top cover and the preset transmittance of the wall, the light-emitting unit and the device using the same according to each embodiment of the present invention can improve the light type and uniformity of the light output at a wide angle, while ensuring the predetermined intensity of the forward light output on the normal line and reducing or avoiding the halo effect. In particular, even when the device layer is thinned to below OD5, the light-emitting unit and the device using the same according to each embodiment of the present invention can still greatly improve the possible defect of the dark spot of the forward light output on the lamp. Therefore, the light-emitting unit and the device using the same according to the embodiments of the present invention can realize more uniform wide-angle light emission and forward light emission with thinner device layers and lower arrangement density. As mentioned above, the light-emitting unit and the device using the same according to the embodiments of the present invention can improve the efficiency of light emission, and are more stable and reliable and have a longer life.
上文中所述僅為本發明之一些較佳實施例。應注意的是,在不脫離本發明之精神與原則下,本發明可進行各種變化及修改。所屬技術領域中具有通常知識者應明瞭的是,本發明由所附申請專利範圍所界定,且在符合本發明之意旨下,各種可能置換、組合、修飾及轉用等變化皆不超出本發明由所附申請專利範圍所界定之範疇。The above descriptions are only some of the preferred embodiments of the present invention. It should be noted that the present invention can be subjected to various changes and modifications without departing from the spirit and principles of the present invention. A person with ordinary knowledge in the relevant technical field should understand that the present invention is defined by the scope of the attached patent application, and that various possible substitutions, combinations, modifications and conversions are within the scope of the present invention as defined by the scope of the attached patent application in accordance with the intent of the present invention.
10、20、30、40:發光單元10, 20, 30, 40: light emitting unit
50:製作方法50:Production method
100:底板100: Base plate
110:承載面110: Loading surface
200:光源200: Light source
300:壁體300: Wall
400、400’:頂蓋400, 400’: Top cover
500:凹陷區500: Depression
510:底面510: Bottom
520:壁面520: Wall
600:基體600: Base
800:基板800: Substrate
1000:背光模組1000:Backlight module
1500:光學膜片1500:Optical film
2000:顯示面板2000: Display Panel
B1:下底B1: Bottom
B2:上底B2: Upper bottom
C:中央C: Central
D1:第一方向D1: First direction
D2:第二方向D2: Second direction
D3:第三方向D3: Third direction
DX:顯示裝置DX: Display Device
E:邊緣端部E: Edge end
G:穿孔G: Perforation
H:腔室高度H: Chamber height
K、K1、K2:壁體厚度K, K1, K2: wall thickness
L、L’、L1、L2、L1’、L2’、L3’:光線L, L’, L1, L2, L1’, L2’, L3’: light
OP:開口OP: Open mouth
M、M1、M2:腔室M, M1, M2: Chamber
N:凸面N: Convex
P:基準線P: Baseline
Q、Q’:流體材料Q, Q’: fluid material
Q1:第一材料Q1: First Material
Q2:第二材料Q2: Second Material
R:凹口R: Notch
S1:內表面S1: Inner surface
S2:外表面S2: Outer surface
S100、S200、S300、S400:步驟S100, S200, S300, S400: Steps
T1、T2、T3:摻雜材料T1, T2, T3: mixed materials
Th1、Th2:厚度Th1, Th2: thickness
V:凹槽V: Groove
W:電線W:Wire
W1:下底寬度W1: bottom width
W2:上底寬度W2: Upper base width
θm:預定角度θm: Predetermined angle
θr:角度θr: Angle
圖1係為根據本發明之一實施例之具有發光單元之背光模組的顯示裝置之立體示意圖。FIG. 1 is a three-dimensional schematic diagram of a display device having a backlight module with a light-emitting unit according to an embodiment of the present invention.
圖2係為根據本發明之一實施例沿著圖1之X-X剖面線所截取之發光單元之剖面示意圖。FIG2 is a schematic cross-sectional view of a light-emitting unit taken along the X-X section line of FIG1 according to an embodiment of the present invention.
圖3係為根據本發明之一實施例之發光單元之各結構部位之材料特性之示意圖。FIG3 is a schematic diagram showing the material properties of various structural parts of a light-emitting unit according to an embodiment of the present invention.
圖4係為根據本發明之一實施例之發光單元之各結構部位之尺寸配置之示意圖。FIG4 is a schematic diagram showing the size configuration of each structural part of a light-emitting unit according to an embodiment of the present invention.
圖5係為根據本發明之另一實施例之發光單元之頂蓋之態樣之示意圖。FIG5 is a schematic diagram showing a top cover of a light-emitting unit according to another embodiment of the present invention.
圖6A及圖6B係為根據本發明之不同實施例之發光單元之腔室之態樣之示意圖。FIG. 6A and FIG. 6B are schematic diagrams showing the state of the chamber of the light-emitting unit according to different embodiments of the present invention.
圖7係為根據本發明之一實施例之發光單元所產生之光型之實例示意圖。FIG. 7 is a schematic diagram showing an example of a light pattern generated by a light-emitting unit according to an embodiment of the present invention.
圖8係為根據本發明之不同實施例之發光單元所產生之光型之實例示意圖。FIG8 is a schematic diagram showing examples of light patterns generated by light-emitting units according to different embodiments of the present invention.
圖9A至圖9C係為根據本發明之一實施例之複數個發光單元在不同OD配置下所產生之發光表現之實例照片圖。9A to 9C are example photographs of luminescence performance generated by a plurality of light-emitting units under different OD configurations according to an embodiment of the present invention.
圖10係為根據本發明之一實施例之發光單元所出射之光線於各角度範圍內的分布示意圖。FIG10 is a diagram showing the distribution of light emitted by a light-emitting unit in various angle ranges according to an embodiment of the present invention.
圖11係為根據本發明之一實施例製備發光單元之流程示意圖。FIG. 11 is a schematic diagram of a process for preparing a light-emitting unit according to an embodiment of the present invention.
圖12係為根據本發明之一實施例製備發光單元之主結構及由主結構所界定之腔室之示意圖。FIG. 12 is a schematic diagram showing a main structure of a light-emitting unit and a chamber defined by the main structure prepared according to an embodiment of the present invention.
圖13係為根據本發明之一實施例實行黏晶製程(Die Bonding)以設置光源之示意圖。FIG. 13 is a schematic diagram showing a die bonding process for setting a light source according to an embodiment of the present invention.
圖14係為根據本發明之一實施例實行打線接合製程(Wire bonding)以設置相關電路配置之示意圖。FIG. 14 is a schematic diagram showing a wire bonding process to set up a related circuit configuration according to an embodiment of the present invention.
圖15係為根據本發明之一實施例實行充填封裝製程(encapsulation)以設置基體及頂蓋之示意圖。FIG. 15 is a schematic diagram showing an encapsulation process for setting a base and a top cover according to an embodiment of the present invention.
圖16係為根據本發明之一實施例充填封裝後所製成的發光單元及其光線出射之示意圖。FIG16 is a schematic diagram of a light-emitting unit and its light emission after filling and packaging according to an embodiment of the present invention.
無without
10:發光單元 10: Light-emitting unit
100:底板 100: Base plate
110:承載面 110: Loading surface
200:光源 200: Light source
300:壁體 300: Wall
400:頂蓋 400: Top cover
500:凹陷區 500: Depression area
510:底面 510: Bottom
520:壁面 520: Wall
B1:下底 B1: Bottom
B2:上底 B2: Upper bottom
C:中央 C:Central
D1:第一方向 D1: First direction
D2:第二方向 D2: Second direction
D3:第三方向 D3: Third direction
E:邊緣端部 E: Edge end
L:光線 L: Light
OP:開口 OP: Open your mouth
M:腔室 M: Chamber
N:凸面 N: convex
R:凹口 R: Notch
Th1、Th2:厚度 Th1, Th2: thickness
θm:預定角度 θm: Predetermined angle
θr:角度 θr: angle
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JP2009245664A (en) * | 2008-03-28 | 2009-10-22 | Sharp Corp | Light-emitting unit, backlight and liquid crystal display apparatus |
CN102349168A (en) * | 2009-03-09 | 2012-02-08 | 赤多尼科詹纳斯多夫有限公司 | Led module with improved light output |
TW202046519A (en) * | 2018-10-31 | 2020-12-16 | 億光電子工業股份有限公司 | Lighting device and lighting module |
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CN114089565A (en) * | 2021-12-06 | 2022-02-25 | 武汉创维光显电子有限公司 | Light emitting assembly and backlight module |
TWI769064B (en) * | 2021-08-24 | 2022-06-21 | 隆達電子股份有限公司 | Light emitting device |
CN217280835U (en) * | 2022-02-21 | 2022-08-23 | 安徽锐拓电子有限公司 | LED device and backlight display module |
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JP2009245664A (en) * | 2008-03-28 | 2009-10-22 | Sharp Corp | Light-emitting unit, backlight and liquid crystal display apparatus |
CN102349168A (en) * | 2009-03-09 | 2012-02-08 | 赤多尼科詹纳斯多夫有限公司 | Led module with improved light output |
TW202046519A (en) * | 2018-10-31 | 2020-12-16 | 億光電子工業股份有限公司 | Lighting device and lighting module |
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