CN217280835U

CN217280835U - LED device and backlight display module

Info

Publication number: CN217280835U
Application number: CN202220354489.2U
Authority: CN
Inventors: 陈林; 陶贤文
Original assignee: Anhui Ruituo Electronics Co ltd
Current assignee: Anhui Ruituo Electronics Co ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2022-08-23
Anticipated expiration: 2032-02-21

Abstract

The utility model belongs to the technical field of backlight display, and discloses a LED device and a backlight display module, wherein the LED device comprises a transparent bracket, an LED chip, a packaging colloid and a reflective colloid; wherein, be equipped with the holding tank in the transparent support, the LED chip passes through the encapsulation colloid encapsulation in the holding tank, the encapsulation colloid is filled and is arranged in the holding tank, reflection of light colloid lays the upper surface of encapsulation colloid smoothly, the most part of light that the LED chip sent can be followed the lateral wall of the holding tank of transparent support and sent after the switch on, make LED device top light-emitting less strong, side light-emitting is great, thereby can increase the facula area of LED device, and then can reduce backlight display module's mixed light distance, realize the frivolousness of complete machine, can also reduce the quantity of LED device, and the production cost is reduced.

Description

LED device and backlight display module

Technical Field

The utility model belongs to the technical field of backlight display, concretely relates to LED device and backlight display module assembly.

Background

The existing mainstream LED backlight technology mainly adopts two schemes of a lateral type scheme and a direct type scheme. The direct-type scheme has outstanding advantages in image quality, energy conservation and the like, but is difficult to thin and light. The lateral approach scheme can be made thinner and lighter, but is inferior to the direct approach scheme in terms of image quality and energy saving.

Because the direct type has the advantages of image quality, energy conservation and the like, most LED backlight display module manufacturers select the direct type scheme, and the light and thin requirements for the LED backlight display module are increasingly shown.

Disclosure of Invention

An object of the utility model is to provide a LED device and backlight display module assembly can increase the facula area of LED device, and then can reduce backlight display module assembly's mixed light distance to realize the frivolousization of complete machine.

In order to achieve the above object, a first aspect of the present invention provides an LED device, including a transparent support, an LED chip, an encapsulation colloid, and a reflective colloid; the LED packaging structure comprises a transparent support, wherein a containing groove is formed in the transparent support, the LED chip is packaged in the containing groove through the packaging colloid, the packaging colloid is filled in the containing groove, and the reflective colloid is laid on the upper surface of the packaging colloid.

In some embodiments, the LED device further includes a conductive substrate disposed at the bottom of the accommodating groove, and the LED chip is disposed on the conductive substrate and electrically connected to the conductive substrate.

In some embodiments, the conductive substrate includes a positive substrate, a negative substrate, and an insulator, the positive substrate and the negative substrate are separated by the insulator, the positive electrode of the LED chip is connected to the positive substrate, and the negative electrode of the LED chip is connected to the negative substrate.

In some embodiments, an anode of the LED chip is connected to a first bonding wire, a cathode of the LED chip is connected to a second bonding wire, the anode of the LED chip is connected to the anode substrate through the first bonding wire, and the cathode of the LED chip is connected to the cathode substrate through the second bonding wire.

In some embodiments, the sidewall of the accommodating groove and the conductive substrate form a bowl-shaped structure, and the LED chip is encapsulated in the bowl-shaped structure by the encapsulant.

In some embodiments, the reflective colloid is a white colloid, and both the upper surface and the lower surface of the reflective colloid are provided with flat structures.

In some embodiments, the reflective colloid is formed by mixing silica gel and ceramic powder.

In some embodiments, the transparent support is formed by combining a transparent material and a metal material.

In some embodiments, the LED chip is an LED face-up chip or an LED flip chip.

The utility model discloses the second aspect provides a backlight display module assembly, including packaging substrate and a plurality of LED device as the first aspect relates to, it is a plurality of the LED device encapsulate in on the packaging substrate.

The utility model has the advantages that the provided LED device comprises a transparent bracket, an LED chip, a packaging colloid and a reflecting colloid; wherein, the transparent bracket is internally provided with a holding tank, the LED chip is encapsulated in the holding tank through the encapsulation colloid, the encapsulation colloid is filled in the holding tank, the reflective colloid is flatly laid on the upper surface of the encapsulation colloid, most of the light emitted by the LED chip can be emitted from the side wall of the holding tank of the transparent bracket after the power is switched on, the light emitted upwards by the LED chip is reflected to be emitted from the side wall of the containing groove after being blocked by the reflecting colloid, only a small part of the light is emitted from the upper part of the reflecting colloid, so that the light emitted from the upper part of the LED device is weaker, the light emitted from the side surface is larger, thereby increasing the light spot area of the LED devices, enabling the adjacent LED devices to realize the connection/superposition of the light spot area, therefore, the shadow caused by too small spot area is eliminated, the light mixing distance of the backlight display module can be further reduced, and the light and thin of the whole machine is realized. In addition, with the increase of the light spot area of the LED devices, the number of the LED devices can be reduced, and the production cost is reduced.

Drawings

Fig. 1 is a schematic cross-sectional view of an LED device according to an embodiment of the present invention;

fig. 2 is an exploded view of a structure of an LED device according to an embodiment of the present invention;

fig. 3 is a schematic view of a light emitting angle of an LED device according to an embodiment of the present invention;

fig. 4 is a schematic view of a light spot area of an LED device according to an embodiment of the present invention.

Description of reference numerals:

100. an LED device; 10. a transparent support; 11. accommodating grooves; 12. a side wall; 20. an LED chip; 21. a first bonding wire; 22. a second bonding wire; 30. packaging the colloid; 40. a light reflecting colloid; 50. a conductive substrate; 51. a positive electrode substrate; 52. a negative electrode substrate; 53. an insulating member; 60. and (5) solid crystal colloid.

Detailed Description

To facilitate understanding of the present invention, specific embodiments thereof will be described in more detail below with reference to the accompanying drawings.

As used herein, unless otherwise specified or defined, "first" and "second" … are used merely for name differentiation and do not denote any particular quantity or order.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items, unless specified or otherwise defined.

It should be noted that "fixed to" or "connected to" in this document may be directly fixed to or connected to one element or may be indirectly fixed to or connected to one element.

As shown in fig. 1 to 3, an embodiment of the present invention discloses an LED device such as an LED lamp bead, which includes a transparent support 10, an LED chip 20, an encapsulant 30, and a reflective encapsulant 40; wherein, be equipped with holding tank 11 in the transparent support 10, LED chip 20 encapsulates in holding tank 11 through encapsulation colloid 30, and encapsulation colloid 30 fills arranges in holding tank 11, and reflection of light colloid 40 lays in encapsulation colloid 30's upper surface.

Wherein, after the switch on, as shown in fig. 3, the vast majority of the light that LED chip 20 sent can be sent from the lateral wall of holding tank 11 of transparent support 10, and the light that LED chip 20 sent upwards meets reflecting colloid 40 and blocks the back and can reflect and send from holding tank 11's lateral wall 12, only a few part sends from reflecting colloid 40 top, make LED device top light-emitting weaker, side light-emitting is great, thereby can increase the facula area of LED device, the increase of facula area, can make adjacent LED device realize that facula area connects/coincides, thereby eliminate the shadow because of the too little production of facula area.

The LED chip 20 may be an existing blue chip with a horizontal structure or an existing blue chip with a vertical structure, so as to maximally utilize existing equipment materials, thereby reducing product cost.

The LED chip 20 is packaged by the packaging adhesive 30, so that moisture can be isolated and the LED chip 20 can be protected. The encapsulant 30 includes, but is not limited to, epoxy, silicone, etc.; of course, the encapsulant 30 may also be a phosphor layer formed by mixing transparent glue and phosphor powder and then curing the mixture.

In this embodiment, the LED device further includes a conductive substrate 50, the conductive substrate 50 is disposed at the bottom of the accommodating groove 11, and the LED chip 20 is located on the conductive substrate 50 and electrically connected to the conductive substrate 50.

The sidewall 12 of the accommodating groove 11 and the conductive substrate 50 form a bowl-shaped structure, the LED chip 20 is encapsulated in the bowl-shaped structure through the encapsulant 30, the encapsulant 30 is filled in the bowl-shaped structure, and the bowl-shaped structure can be filled with the encapsulant 30.

In this embodiment, the LED device further includes a die attach adhesive 60, and the LED chip 20 is fixed on the conductive substrate 50 through the die attach adhesive 60. The die bond colloid 60 includes a combination of silica gel and one or more other substances, such as silver gel and insulating gel.

The conductive substrate 50 may be a substrate made of various conductive materials, such as various metal conductive substrates, including but not limited to one of a copper substrate, an aluminum substrate, an iron substrate, and a silver substrate; the conductive substrate may be a mixed material conductive substrate containing a conductive material, such as conductive rubber, and the LED chip 20 can be fixed on the conductive substrate 50 by the die attach adhesive 60.

In this embodiment, the LED chip 20 is an LED chip, but it is not understood that the LED chip is useful only for LED chips, and it should be noted that the LED device can be used in other possible embodiments, such as LED flip chips or other LED products, without departing from the spirit of the present invention.

When the LED chip 20 is an LED normal chip, the LED chip 20 and the conductive substrate 50 can be electrically connected by a bonding wire; when the LED chip 20 is an LED flip chip, it can be electrically connected to the conductive substrate 50 through an eutectic process.

The conductive substrate 50 includes a positive substrate 51, a negative substrate 52 and an insulating member 53, the insulating member 53 is located between the positive substrate 51 and the negative substrate 52, the positive substrate 51 and the negative substrate 52 are insulated and isolated by the insulating member 53, the positive electrode of the LED chip 20 is connected to the positive substrate 51, and the negative electrode of the LED chip 20 is connected to the negative substrate 52.

In this embodiment, the positive electrode of the LED chip 20 is connected to the first bonding wire 21, the negative electrode of the LED chip 20 is connected to the second bonding wire 22, the positive electrode of the LED chip 20 is electrically connected to the positive substrate 51 through the first bonding wire 21, and the negative electrode of the LED chip 20 is electrically connected to the negative substrate 52 through the second bonding wire 22. The first bonding wire 21 and the second bonding wire 22 may be one or a combination of metal substances, such as a combination of gold and silver.

As shown in fig. 1, the LED chip 20 is bound on the conductive substrate 50 in the transparent support 10 through the die attach adhesive 60, and then connected to the positive and negative electrodes of the LED chip 20 through the first bonding wire 21 and the second bonding wire 22 and bound on the positive and negative electrodes of the conductive substrate 50, where the polarity needs to be positive to positive and negative to negative.

Then, the transparent support 10 is filled with the packaging colloid 30 to form a sealed space, the flat reflective colloid 40 covers the uncured packaging colloid 30 and is completely contacted with the packaging colloid 30, and finally, curing treatment is carried out to form an LED lamp bead whole body.

In this embodiment, the reflective colloid 40 is a white colloid, the upper surface (i.e., the surface away from the LED chip 20) and the lower surface (i.e., the surface close to the LED chip 20) of the reflective colloid 40 are both configured to be flat, and the thickness of the reflective colloid 40 is uniform.

The thickness and the regular degree of shape of reflection of light colloid 40 are higher, can come the customization according to the LED lamp pearl of unidimensional, and the convex ball design of more general traditional LED device has bigger luminous angle, and luminous angle can reach 180 degrees at most, and the uniformity of the luminous angle of each LED device is higher, makes the light spot area uniformity of each LED device higher, easily production operation.

The reflective colloid 40 is formed by mixing silica gel and ceramic powder. In other possible embodiments, the reflective colloid 40 is not limited to be formed by mixing silica gel and ceramic powder, but may be formed by mixing silica gel and other substances.

In the present embodiment, the transparent support 10 is formed by combining a transparent material and a metal material. Wherein, the transparent material comprises one or more combinations of materials such as silica gel and transparent plastic, and the metal material comprises one or more combinations of substances such as gold, copper, nickel, and the like.

The embodiment further provides a backlight display module, which can be applied to the field of backlight display, such as backlight modules of terminals of televisions, displays, mobile phones and the like. The backlight display module comprises a packaging substrate and a plurality of LED devices 100, wherein the LED devices 100 are packaged on the packaging substrate.

The backlight display module further includes a driving circuit, which is also disposed on the package substrate and electrically connected to the plurality of LED devices 100.

When a plurality of LED devices 100 are packaged on a package substrate, as shown in fig. 4, the shaded area around each LED device 100 is indicated as the light spot area. Because the light spot area of the LED device is large, the light spot areas between the adjacent LED devices 100 can be connected/overlapped, so that the light mixing distance of the backlight display module can be reduced, and the light and thin of the whole machine can be realized.

In addition, with the increase of the light spot area of the LED devices, the number of the LED devices can be reduced, and the production cost is reduced.

The above examples are not intended to be exhaustive list of the present invention, and there may be many other embodiments not listed. Any replacement and improvement made on the basis of not violating the conception of the utility model belong to the protection scope of the utility model.

Claims

1. The LED device is characterized by comprising a transparent support, an LED chip, a packaging colloid and a reflecting colloid; wherein, be equipped with the holding tank in the transparent support, the LED chip passes through the encapsulation colloid encapsulation is in the holding tank, the encapsulation colloid fills and arranges in the holding tank, reflection of light colloid lays in the upper surface of encapsulation colloid.

2. The LED device of claim 1, further comprising a conductive substrate disposed at the bottom of the receiving cavity, wherein the LED chip is disposed on the conductive substrate and electrically connected to the conductive substrate.

3. The LED device of claim 2, wherein the conductive substrate comprises a positive substrate, a negative substrate, and an insulator, the positive substrate and the negative substrate being separated by the insulator, the positive electrode of the LED chip being connected to the positive substrate, and the negative electrode of the LED chip being connected to the negative substrate.

4. The LED device according to claim 3, wherein an anode of the LED chip is connected to a first bonding wire, a cathode of the LED chip is connected to a second bonding wire, the anode of the LED chip is connected to the anode substrate through the first bonding wire, and the cathode of the LED chip is connected to the cathode substrate through the second bonding wire.

5. The LED device according to any one of claims 2 to 4, wherein the side walls of the accommodating groove and the conductive substrate form a bowl-shaped structure, and the LED chip is encapsulated in the bowl-shaped structure by the encapsulant.

6. The LED device of claim 1, wherein the reflective gel is a white gel, and both the top surface and the bottom surface of the reflective gel are disposed in a flat configuration.

7. The LED device of claim 1, wherein the LED chip is an LED face-up chip or an LED flip chip.

8. A backlight display module comprising a package substrate and a plurality of LED devices as claimed in any one of claims 1 to 7, wherein the plurality of LED devices are packaged on the package substrate.