TWI835560B - Thermal field element, single crystal furnace, liquid leakage detection device and method thereof - Google Patents
Thermal field element, single crystal furnace, liquid leakage detection device and method thereof Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本發明提供一種熱場元件、單晶爐、漏液檢測裝置及其方法,熱場元件包括:底加熱器,底加熱器包括相背設置的頂面和底面,底加熱器上設有貫穿頂面和底面的第一螺栓孔;呈托盤狀的底部蓋板,底部蓋板包括相背的頂盤面和底盤面,底加熱器設置於頂盤面且底面直接接觸頂盤面,底部蓋板採用絕緣且耐高溫材料製成,底部蓋板上設有與第一螺栓孔對應的第二螺栓孔;及底電極,底電極位於底盤面背離頂盤面的一側,且底電極通過穿設於第一螺栓孔和第二螺栓孔內的緊固螺栓直接連接至底加熱器上。The invention provides a thermal field element, a single crystal furnace, a liquid leakage detection device and a method. The thermal field element includes: a bottom heater. The bottom heater includes a top surface and a bottom surface arranged oppositely. The bottom heater is provided with a through-top heater. The first bolt holes on the surface and bottom surface; a tray-shaped bottom cover plate, the bottom cover plate includes an opposite top plate surface and a bottom plate surface, the bottom heater is set on the top plate surface and the bottom surface directly contacts the top plate surface, the bottom cover plate is insulated and Made of high temperature resistant material, the bottom cover is provided with a second bolt hole corresponding to the first bolt hole; and a bottom electrode, the bottom electrode is located on the side of the chassis surface away from the top disk surface, and the bottom electrode is passed through the first bolt hole and the fastening bolt in the second bolt hole directly connects to the base heater.
Description
本發明屬於拉晶技術領域,尤其是關於一種熱場元件、單晶爐、漏液檢測裝置及其方法。The invention belongs to the technical field of crystal pulling, and in particular relates to a thermal field element, a single crystal furnace, a liquid leakage detection device and a method thereof.
在相關技術中,用於生產積體電路等半導體電子元器件的矽片,主要通過將直拉(Czochralski,CZ)法拉製的單晶矽棒切片而製造出。直拉法包括使由石英製成的坩堝中的多晶矽熔化以獲得矽熔體,將單晶晶種浸入矽熔體中,以及連續地提升晶種移動離開矽熔體表面,由此在移動過程中在相介面處生長出單晶矽棒。矽單晶棒拉製過程中,有時會出現矽料洩露的異常情況,但是,相關技術中拉晶爐設備沒有稱重晶棒及剩餘矽料的功能,只能靠作業人員時刻關注爐內情況來發現矽液洩露。若不能及時發現矽料洩露,炙熱的矽料流入排氣管中時間過久會造成重大異常事故。In related technologies, silicon wafers used to produce semiconductor electronic components such as integrated circuits are mainly produced by slicing single crystal silicon rods drawn by the Czochralski (CZ) method. The Czochralski method involves melting polycrystalline silicon in a crucible made of quartz to obtain a silicon melt, immersing a single crystal seed crystal into the silicon melt, and continuously lifting the seed crystal to move away from the surface of the silicon melt, whereby during the movement Single crystal silicon rods grow at the phase interface. During the drawing process of silicon single crystal ingots, abnormal leakage of silicon material sometimes occurs. However, the crystal pulling furnace equipment in the related technology does not have the function of weighing the crystal ingot and remaining silicon material. The operator can only rely on the operator to pay attention to the furnace at all times. situation to discover silicone liquid leakage. If the silicon material leakage is not detected in time, the hot silicon material will flow into the exhaust pipe for too long and cause major abnormal accidents.
本發明實施例提供了一種熱場元件、單晶爐、漏液檢測裝置及其方法,能夠及時發現漏液。Embodiments of the present invention provide a thermal field element, a single crystal furnace, a liquid leakage detection device and a method thereof, which can detect liquid leakage in a timely manner.
本發明實施例所提供的技術方案如下: 第一方面,本發明實施例提供一種熱場元件,包括: 底加熱器,該底加熱器包括相背設置的頂面和底面,該底加熱器上設有貫穿該頂面和該底面的第一螺栓孔; 呈托盤狀的底部蓋板,該底部蓋板包括相背的頂盤面和底盤面,該底加熱器設置於該頂盤面且該底面直接接觸該頂盤面,該底部蓋板採用絕緣且耐高溫材料製成,該底部蓋板上設有與該第一螺栓孔對應的第二螺栓孔;及 底電極,該底電極位於該底盤面背離該頂盤面的一側,且該底電極通過穿設於該第一螺栓孔和該第二螺栓孔內的緊固螺栓直接連接至該底加熱器上。 The technical solutions provided by the embodiments of the present invention are as follows: In a first aspect, an embodiment of the present invention provides a thermal field element, including: A bottom heater, the bottom heater includes a top surface and a bottom surface arranged oppositely, and the bottom heater is provided with a first bolt hole penetrating the top surface and the bottom surface; The bottom cover is in the shape of a tray. The bottom cover includes a top surface and a bottom surface that are opposite to each other. The bottom heater is arranged on the top surface and the bottom surface is in direct contact with the top surface. The bottom cover is made of insulating and high-temperature resistant materials. Made, the bottom cover is provided with a second bolt hole corresponding to the first bolt hole; and The bottom electrode is located on the side of the chassis surface away from the top disk surface, and the bottom electrode is directly connected to the bottom heater through fastening bolts passed through the first bolt hole and the second bolt hole. .
示範性的,該底部蓋板的材質為耐高溫陶瓷材料。Exemplarily, the material of the bottom cover plate is a high temperature resistant ceramic material.
示範性的,該底部蓋板中心還設有貫穿該頂盤面與該底盤面的通孔。Exemplarily, the center of the bottom cover is also provided with a through hole penetrating the top surface and the bottom surface.
示範性的,該底加熱器圍繞在該通孔的週邊。Exemplarily, the bottom heater surrounds the periphery of the through hole.
第二方面,本發明實施例提供一種漏液檢測裝置,包括: 如上所述的熱場元件,該底加熱器、該底部蓋板和該底電極分別位於單晶爐內坩堝的下方; 電學檢測器,與該底加熱器連接,用於即時檢測該底加熱器的電學參數; 處理器,與該電學檢測器連接,用於根據來自該電學檢測器即時回饋的該電學參數,即時判斷該底加熱器上是否存在從該坩堝洩露的漏液; 報警器,與該處理器連接,用於當即時判斷結果為該底加熱器上存在漏液時進行報警。 In a second aspect, an embodiment of the present invention provides a liquid leakage detection device, including: As for the thermal field element as described above, the bottom heater, the bottom cover plate and the bottom electrode are respectively located below the crucible in the single crystal furnace; An electrical detector, connected to the bottom heater, is used to instantly detect the electrical parameters of the bottom heater; A processor, connected to the electrical detector, used to instantly determine whether there is leakage from the crucible on the bottom heater based on the electrical parameter instantaneously fed back from the electrical detector; The alarm is connected to the processor and is used to alarm when the immediate judgment result is that there is liquid leakage on the bottom heater.
示範性的,該電學參數包括該底加熱器的電阻值; 該處理器用於接收該電學檢測器所回饋的該底部加熱器的即時電阻值,並根據預定時間內所回饋的該即時電阻值的數值變化,判斷該底加熱器上是否存在從該坩堝洩露的漏液。 Exemplarily, the electrical parameter includes the resistance value of the bottom heater; The processor is used to receive the real-time resistance value of the bottom heater fed back by the electrical detector, and determine whether there is leakage from the crucible on the bottom heater based on the numerical change of the real-time resistance value fed back within a predetermined time. Leakage.
第三方面,本發明實施例提供一種單晶爐,該單晶爐包括: 爐體; 設置於該爐體內的坩堝;及 設置於該爐體內的如第二方面所述的漏液檢測裝置。 In a third aspect, embodiments of the present invention provide a single crystal furnace, which includes: furnace body; A crucible installed in the furnace body; and The liquid leakage detection device as described in the second aspect is provided in the furnace body.
第四方面,本發明實施例提供一種漏液檢測方法,應用於如上所述的漏液檢測裝置,該方法包括如下步驟: 通過該電學檢測器即時檢測該底加熱器的電學參數; 通過該處理器接收來自該電學檢測器即時回饋的該電學參數,並即時判斷該底加熱器上是否存在從該坩堝洩露的漏液。 In a fourth aspect, embodiments of the present invention provide a liquid leakage detection method, which is applied to the liquid leakage detection device as described above. The method includes the following steps: Instantly detect the electrical parameters of the bottom heater through the electrical detector; The processor receives the electrical parameter instantaneously fed back from the electrical detector, and immediately determines whether there is liquid leakage from the crucible on the bottom heater.
示範性的,該電學參數包括該底加熱器的電阻值時,該通過該處理器接收來自該電學檢測器即時回饋的該電學參數,並即時判斷該底加熱器上是否存在從該坩堝洩露的漏液,具體包括: 通過該處理器接收該電學檢測器所回饋的該底部加熱器的即時電阻值,並根據預定時間內所回饋的該即時電阻值的數值變化,判斷該底加熱器上是否存在從該坩堝洩露的漏液。 Exemplarily, when the electrical parameter includes the resistance value of the bottom heater, the processor receives the electrical parameter instantaneously fed back from the electrical detector, and immediately determines whether there is leakage from the crucible on the bottom heater. Liquid leakage, including: The processor receives the real-time resistance value of the bottom heater fed back by the electrical detector, and determines whether there is leakage from the crucible on the bottom heater based on the numerical change of the real-time resistance value fed back within a predetermined time. Leakage.
本發明實施例所帶來的優點如下: 上述方案中,對傳統的單晶爐熱場元件進行了結構優化,將底加熱器通過螺栓連接直接固定在底電極上,使得底加熱器的底面可直接接觸底部蓋板的頂盤面,而底部蓋板材質選用耐高溫絕緣材料,在底加熱器通電時底部蓋板是絕緣的,不會因底加熱器通電而發熱而影響底加熱器的電學參數,這樣,在拉晶過程中可通過持續監控底加熱器電學參數資料,在發生矽料洩露時,矽料會流到底加熱器上,底加熱器的電學參數發生變化,從而可通過監測底加熱器的電學參數來判斷底加熱器上是否存在漏液,以及時發現異常並及時採取措施,保障人員安全,降低損失。 The advantages brought by the embodiments of the present invention are as follows: In the above scheme, the structure of the traditional single crystal furnace thermal field element is optimized, and the bottom heater is directly fixed on the bottom electrode through bolt connection, so that the bottom surface of the bottom heater can directly contact the top plate surface of the bottom cover, and the bottom The cover plate material is made of high-temperature resistant insulating material. When the bottom heater is powered on, the bottom cover plate is insulated and will not affect the electrical parameters of the bottom heater due to the heat generated by the bottom heater when powered on. In this way, during the crystal pulling process, the bottom cover plate can be continuously Monitor the electrical parameter data of the bottom heater. When silicon material leaks, the silicon material will flow onto the bottom heater, and the electrical parameters of the bottom heater will change. Therefore, it can be judged whether the bottom heater is on the bottom heater by monitoring the electrical parameters of the bottom heater. If there is leakage, detect the abnormality in time and take timely measures to ensure personnel safety and reduce losses.
為使本發明實施例的目的、技術方案和優點更加清楚,下面將結合本發明實施例的附圖,對本發明實施例的技術方案進行清楚、完整地描述。顯然,所描述的實施例是本發明的一部分實施例,而不是全部的實施例。基於所描述的本發明的實施例,本技術領域的通常知識者在無需進步性勞動的前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without progressive labor fall within the scope of protection of the present invention.
除非另外定義,本發明使用的技術術語或者科學術語應當為本發明所屬領域內具有一般技能的人士所理解的通常意義。本發明中使用的「第一」、「第二」以及類似的詞語並不表示任何順序、數量或者重要性,而只是用來區分不同的組成部分。同樣,「一個」、「一」或者「該」等類似詞語也不表示數量限制,而是表示存在至少一個。「包括」或者「包含」等類似的詞語意指出現該詞前面的元件或者物件涵蓋出現在該詞後面列舉的元件或者物件及其等同,而不排除其他元件或者物件。「連接」或者「相連」等類似的詞語並非限定於物理的或者機械的連接,而是可以包括電性的連接,不管是直接的還是間接的。「上」、「下」、「左」、「右」等僅用於表示相對位置關係,當被描述物件的絕對位置改變後,則該相對位置關係也可能相應地改變。Unless otherwise defined, technical terms or scientific terms used in the present invention shall have the usual meaning understood by a person with ordinary skill in the field to which the present invention belongs. "First", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Likewise, similar words such as "a", "an" or "the" do not indicate a quantitative limit, but rather indicate the presence of at least one. Words such as "include" or "include" mean that the elements or things appearing before the word include the elements or things listed after the word and their equivalents, without excluding other elements or things. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to express relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
如圖1所示,本發明實施例提供的熱場元件包括:底加熱器10、底部蓋板20和底電極30,該底加熱器10包括相背設置的頂面和底面,該底加熱器10上設有貫穿該頂面和該底面的第一螺栓孔;該底部蓋板20呈托盤狀,其包括相背的頂盤面和底盤面,該底加熱器10設置於該頂盤面且該底面直接接觸該頂盤面,該底部蓋板20採用絕緣且耐高溫材料製成,以使該底加熱器10通電時該底部蓋板20不會加熱或影響該底加熱器10的電學參數;該底部蓋板20上設有與該第一螺栓孔對應的第二螺栓孔;該底電極30位於該底盤面背離該頂盤面的一側,且該底電極30通過穿設於該第一螺栓孔和該第二螺栓孔內的緊固螺栓40直接連接至該底加熱器10上。As shown in Figure 1, the thermal field element provided by the embodiment of the present invention includes: a bottom heater 10, a bottom cover plate 20 and a bottom electrode 30. The bottom heater 10 includes a top surface and a bottom surface arranged oppositely. The bottom heater 10 The bottom cover 20 is provided with a first bolt hole that penetrates the top surface and the bottom surface; the bottom cover 20 is tray-shaped and includes an opposite top surface and a bottom surface. The bottom heater 10 is disposed on the top surface and the bottom surface. Directly contacting the top plate surface, the bottom cover 20 is made of insulating and high-temperature resistant materials, so that when the bottom heater 10 is powered on, the bottom cover 20 will not heat or affect the electrical parameters of the bottom heater 10; the bottom The cover plate 20 is provided with a second bolt hole corresponding to the first bolt hole; the bottom electrode 30 is located on the side of the chassis surface away from the top surface, and the bottom electrode 30 is passed through the first bolt hole and The fastening bolt 40 in the second bolt hole is directly connected to the bottom heater 10 .
上述方案中,傳統的熱場元件中將底加熱器10通過底腳和螺絲固定在底電極30上且底部蓋板20由導電的石墨材料製成,而本發明中對傳統的單晶爐熱場元件進行了結構優化,將底加熱器10通過螺栓連接直接固定在底電極30上,使得底加熱器10的底面可直接接觸底部蓋板20的頂盤面,而底部蓋板20材質選用耐高溫絕緣材料,在底加熱器10通電時底部蓋板20是絕緣的,不會因底加熱器10通電而發熱而影響底加熱器10的電學參數,這樣,在拉晶過程中可通過持續監控底加熱器10電學參數資料,在發生矽料洩露時,矽料會流到底加熱器10上,底加熱器10的電學參數發生變化,從而可通過監測底加熱器10的電學參數來判斷底加熱器10上是否存在漏液,以及時發現異常並及時採取措施,保障人員安全,降低損失。In the above solution, in the traditional thermal field element, the bottom heater 10 is fixed on the bottom electrode 30 through bottom feet and screws, and the bottom cover 20 is made of conductive graphite material. However, in the present invention, the traditional single crystal furnace heat The structure of the field element is optimized, and the bottom heater 10 is directly fixed on the bottom electrode 30 through bolt connection, so that the bottom surface of the bottom heater 10 can directly contact the top surface of the bottom cover 20, and the material of the bottom cover 20 is selected to be high temperature resistant. Insulating material, the bottom cover 20 is insulated when the bottom heater 10 is powered on, and will not affect the electrical parameters of the bottom heater 10 due to the heat generated by the bottom heater 10 being powered on. In this way, the bottom cover 20 can be continuously monitored during the crystal pulling process. Electrical parameter data of the heater 10. When silicon material leaks, the silicon material will flow onto the bottom heater 10, and the electrical parameters of the bottom heater 10 will change. Therefore, the bottom heater can be judged by monitoring the electrical parameters of the bottom heater 10. 10. Check whether there is any leakage, detect abnormalities in time and take timely measures to ensure personnel safety and reduce losses.
作為一些示範性的實施例,該底部蓋板20的材質為耐高溫陶瓷材料。當然可以理解的是,該底部蓋板20的材質也可以選用例如雲母材料等其他任意合適的絕緣且耐高溫材料,並不局限於此。As some exemplary embodiments, the bottom cover 20 is made of high-temperature resistant ceramic material. Of course, it can be understood that the bottom cover 20 can also be made of any other suitable insulating and high-temperature-resistant material, such as mica material, and is not limited thereto.
此外,作為一些示範性的實施例,如圖1所示,該底部蓋板20中心還設有貫穿該頂盤面與該底盤面的通孔21,該底加熱器10圍繞在該通孔21週邊。In addition, as some exemplary embodiments, as shown in FIG. 1 , the center of the bottom cover 20 is also provided with a through hole 21 penetrating the top plate surface and the bottom plate surface, and the bottom heater 10 surrounds the through hole 21 .
在單晶爐中,本發明實施例所提供的熱場元件中該底加熱器10、該底部蓋板20和該底電極30位於該坩堝的下方,因此,當該坩堝中發生漏液時,洩露的矽液會落入該底部蓋板20和該底加熱器10上。In the single crystal furnace, in the thermal field element provided by the embodiment of the present invention, the bottom heater 10, the bottom cover plate 20 and the bottom electrode 30 are located below the crucible. Therefore, when liquid leakage occurs in the crucible, The leaked silicon liquid will fall onto the bottom cover 20 and the bottom heater 10 .
需要說明的是,如圖1所示,該底部蓋板20呈托盤狀,其四周週邊可設置有凸起的凸沿22,用於阻擋漏液從四周邊沿外泄,該底部蓋板20的中心的通孔21可以供坩堝軸穿過。It should be noted that, as shown in FIG. 1 , the bottom cover 20 is in the shape of a tray, and raised rims 22 can be provided around its periphery to prevent leakage from leaking out from the four peripheries. The central through hole 21 allows the crucible shaft to pass through.
更為具體的一種實施例中,如圖1所示,該底加熱器10可以是大致呈菱形,該電極可以有兩個,分別連接在該底加熱器10的菱形對角。當然可以理解的是,在實際應用中,該底加熱器10的具體結構並不限於此。In a more specific embodiment, as shown in FIG. 1 , the bottom heater 10 may be roughly rhombus-shaped, and the electrodes may be two, respectively connected to diagonal corners of the rhombus of the bottom heater 10 . Of course, it can be understood that in practical applications, the specific structure of the bottom heater 10 is not limited to this.
此外,還需要說明的是,本發明實施例所提供的熱場元件除了包括該底加熱器10之外,還可以包括主加熱器等,主加熱器可設置於坩堝的外周側,該底加熱器10可設置於坩堝的下方。對於該主加熱器的具體結構可選用常規熱場中的主加熱器,在此對此不再贅述。In addition, it should be noted that, in addition to the bottom heater 10, the thermal field element provided by the embodiment of the present invention may also include a main heater, etc. The main heater may be disposed on the outer peripheral side of the crucible, and the bottom heater may The device 10 can be arranged below the crucible. For the specific structure of the main heater, a main heater in a conventional thermal field can be used, which will not be described again here.
第二方面,如圖2所示,本發明實施例提供一種漏液檢測裝置,包括: 本發明實施例提供的熱場元件,該底加熱器10、該底部蓋板20和該底電極30分別位於單晶爐內坩堝的下方; 電學檢測器50,與該底加熱器10連接,用於即時檢測該底加熱器10的電學參數; 處理器60,與該電學檢測器50連接,用於根據來自該電學檢測器50即時回饋的該電學參數,即時判斷該底加熱器10上是否存在從該坩堝洩露的漏液; 報警器70,與該處理器60連接,用於當即時判斷結果為該底加熱器10上當前存在漏液時進行報警。 In a second aspect, as shown in Figure 2, an embodiment of the present invention provides a liquid leakage detection device, including: In the thermal field element provided by the embodiment of the present invention, the bottom heater 10, the bottom cover plate 20 and the bottom electrode 30 are respectively located below the crucible in the single crystal furnace; The electrical detector 50 is connected to the bottom heater 10 and is used to detect the electrical parameters of the bottom heater 10 in real time; The processor 60 is connected to the electrical detector 50 and is used to instantly determine whether there is liquid leakage from the crucible on the bottom heater 10 based on the electrical parameters immediately fed back from the electrical detector 50; The alarm 70 is connected to the processor 60 and is used to issue an alarm when the immediate judgment result is that there is currently liquid leakage on the bottom heater 10 .
在上述方案中,由於底加熱器10通過螺栓連接直接固定在底電極30上,使得底加熱器10的底面可直接接觸底部蓋板20的頂盤面,而底部蓋板20材質選用耐高溫絕緣材料,在底加熱器10通電時底部蓋板20是絕緣的,不會因底加熱器10通電而發熱而影響底加熱器10的電學參數,這樣,在拉晶過程中可通過持續監控底加熱器10電學參數資料,在發生矽料洩露時,矽料會流到底加熱器10上,底加熱器10的電學參數發生變化,從而可通過監測底加熱器10的電學參數來判斷底加熱器10上是否存在漏液,以及時發現異常並及時採取措施,保障人員安全,降低損失。In the above solution, since the bottom heater 10 is directly fixed on the bottom electrode 30 through bolt connection, the bottom surface of the bottom heater 10 can directly contact the top surface of the bottom cover 20, and the bottom cover 20 is made of high-temperature resistant insulating material. , when the bottom heater 10 is powered on, the bottom cover 20 is insulated, and will not affect the electrical parameters of the bottom heater 10 due to the heat generated by the bottom heater 10 being powered on. In this way, the bottom heater can be continuously monitored during the crystal pulling process. 10. Electrical parameter data. When silicon material leaks, the silicon material will flow onto the bottom heater 10, and the electrical parameters of the bottom heater 10 will change. Therefore, the electrical parameters of the bottom heater 10 can be monitored to determine whether the bottom heater 10 has sufficient electrical parameters. Whether there is leakage, detect abnormalities in time and take timely measures to ensure personnel safety and reduce losses.
示範性的,該電學參數包括該底加熱器10的電阻值;該處理器60用於接收該電學檢測器50所回饋的該底部加熱器的即時電阻值,並根據預定時間內所回饋的該即時電阻值的數值變化,判斷該底加熱器10上是否存在從該坩堝洩露的漏液。Exemplarily, the electrical parameter includes the resistance value of the bottom heater 10; the processor 60 is configured to receive the instantaneous resistance value of the bottom heater fed back by the electrical detector 50, and based on the feedback value within a predetermined time. The numerical value of the instantaneous resistance value changes to determine whether there is liquid leakage from the crucible on the bottom heater 10 .
採用上述方案,由於與該底加熱器10直接接觸的該底部蓋板20絕緣,在該底加熱器10通電後不會影響該底加熱器10的電阻,而漏液的存在會影響該底加熱器10的電阻值發生變化,因此在拉晶過程中持續監控底加熱器10電阻的資料,在發生矽料洩露時,矽料會流到底部加熱器上,底加熱器10電阻由原來的電阻值不變到現在電阻值發生變化,電阻值產生波動時可發生報警,以使得現場人員及時發現異常並及時採取措施。Using the above solution, since the bottom cover 20 in direct contact with the bottom heater 10 is insulated, the resistance of the bottom heater 10 will not be affected after the bottom heater 10 is powered on, while the presence of liquid leakage will affect the bottom heating. The resistance value of the bottom heater 10 changes, so the resistance data of the bottom heater 10 is continuously monitored during the crystal pulling process. When silicon leakage occurs, the silicon material will flow to the bottom heater, and the resistance of the bottom heater 10 changes from the original resistance. The resistance value has changed since the value remained unchanged. When the resistance value fluctuates, an alarm can occur, so that on-site personnel can detect abnormalities in time and take timely measures.
此外,本發明實施例中還提供一種單晶爐,該單晶爐包括: 爐體; 設置於該爐體內的坩堝;及 設置於該爐體內的本發明實施例提供的漏液檢測裝置,其中該底加熱器10、該底部蓋板20和該底電極30位於該坩堝的下方。 In addition, embodiments of the present invention also provide a single crystal furnace, which includes: furnace body; A crucible installed in the furnace body; and The liquid leakage detection device provided by the embodiment of the present invention is provided in the furnace body, wherein the bottom heater 10, the bottom cover 20 and the bottom electrode 30 are located below the crucible.
此外,本發明實施例提供一種漏液檢測方法,應用於如上所述的漏液檢測裝置,該方法包括如下步驟: 步驟S01、通過該電學檢測器50即時檢測該底加熱器10的電學參數; 步驟S02、通過該處理器60接收來自該電學檢測器50即時回饋的該電學參數,並即時判斷該底加熱器10上是否存在從該坩堝洩露的漏液。 In addition, embodiments of the present invention provide a liquid leakage detection method, which is applied to the liquid leakage detection device as described above. The method includes the following steps: Step S01: Instantly detect the electrical parameters of the bottom heater 10 through the electrical detector 50; Step S02: The processor 60 receives the electrical parameters immediately fed back from the electrical detector 50, and immediately determines whether there is liquid leakage from the crucible on the bottom heater 10.
示範性的,該電學參數包括該底加熱器10的電阻值時,步驟S02具體包括: 通過該處理器60接收該電學檢測器50所回饋的該底部加熱器的即時電阻值,並根據預定時間內所回饋的該即時電阻值的數值變化,判斷該底加熱器10上是否存在從該坩堝洩露的漏液。 Exemplarily, when the electrical parameter includes the resistance value of the bottom heater 10, step S02 specifically includes: The processor 60 receives the real-time resistance value of the bottom heater fed back by the electrical detector 50, and determines whether there is a defect on the bottom heater 10 based on the numerical change of the real-time resistance value fed back within a predetermined time. Leakage from the crucible.
有以下幾點需要說明: (1)本發明實施例附圖只關係到與本發明實施例揭示的結構,其他結構可參考通常設計; (2)為了清晰起見,在用於描述本發明的實施例的附圖中,層或區域的厚度被放大或縮小,即這些附圖並非按照實際的比例繪製,可以理解,當諸如層、膜、區域或基板之類的元件被稱作位於另一元件「上」或「下」時,該元件可以「直接」位於另一元件「上」或「下」或者可以存在中間元件; (3)在不衝突的情況下,本發明的實施例及實施例中的特徵可以相互組合以得到新的實施例。 The following points need to be explained: (1) The drawings of the embodiments of the present invention only relate to the structures disclosed in the embodiments of the present invention, and other structures may refer to common designs; (2) For the sake of clarity, in the drawings used to describe embodiments of the present invention, the thicknesses of layers or regions are exaggerated or reduced, that is, these drawings are not drawn according to actual scale. It can be understood that when such as layers, When an element such as a film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present; (3) If there is no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain new embodiments.
以上,僅為本發明的具體實施方式,但本發明的保護範圍並不局限於此,本發明的保護範圍應以申請專利範圍的保護範圍為準。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. The protection scope of the present invention should be subject to the protection scope of the patent application.
10:底加熱器 20:底部蓋板 21:通孔 22:凸沿 30:底電極 40:緊固螺栓 50:電學檢測器 60:處理器 70:報警器 10: Bottom heater 20:Bottom cover 21:Through hole 22:convex edge 30: Bottom electrode 40: Fastening bolts 50: Electrical detector 60: Processor 70:Alarm
圖1表示本發明實施例中提供的熱場元件的結構示意圖; 圖2表示本發明實施例中提供的漏液檢測裝置的結構示意圖。 Figure 1 shows a schematic structural diagram of a thermal field element provided in an embodiment of the present invention; Figure 2 shows a schematic structural diagram of a liquid leakage detection device provided in an embodiment of the present invention.
10:底加熱器 20:底部蓋板 21:通孔 22:凸沿 30:底電極 40:緊固螺栓 10: Bottom heater 20:Bottom cover 21:Through hole 22:convex edge 30: Bottom electrode 40: Fastening bolts
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CN1469779A (en) * | 2000-08-11 | 2004-01-21 | ����ɨ������˾ | Narrow strip fixtures for use in narrow strip inspection apparatus |
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