TWI806265B - Package and method of manufacturing the same - Google Patents

Abstract

The present invention aims to provide a package and a manufacturing method thereof, which can prevent unnecessary large flow of solder to the side while ensuring the electrical connection between the top surface and the bottom surface. The metallization portion 200 includes: a sealing metallization layer 210 on the sealing surface SS, a bottom metallization layer 220 on the bottom surface P2 of the ceramic portion 100 , and a side metallization layer 230 on the side surface P3 of the ceramic portion 100 . The side metallization layer 230 has an upper portion 231 connected to the sealing metallization layer 210 , a lower portion 232 connected to the bottom metallization layer 220 , and a middle portion 233 connecting the upper portion 231 and the lower portion 232 to each other. The metal layer 300 is made of a metal material that has higher wettability to the solder 930 than the metallization material. The metal layer 300 covers the sealing metallization layer 210 of the metallization 200 , but does not cover the middle portion 233 of the side metallization layer 230 of the metallization 200 .

Description

Package body and manufacturing method thereof

The present invention relates to a package and a method for producing the same, and particularly relates to a package for electronic components and a method for producing the same.

Japanese Patent Application Laid-Open No. 2000-312060 (Patent Document 1) discloses a substrate for mounting electronic components for mounting electronic components such as crystal oscillators. The electronic component mounting substrate has a lower insulating layer and an upper insulating layer. The lower insulating layer has a mounting portion for mounting electronic components on the top surface, and from the mounting portion to the bottom surface, a plurality of metallized conductor layers for connecting the electrodes of the electronic components to the outside are covered and formed. The upper insulating layer has a frame shape, is laminated on the lower insulating layer so as to surround the mounting portion, and is coated with a sealing metallization layer for bonding the lid to the top surface thereof. A notch is formed on the outer peripheral surface of the upper insulating layer to vertically penetrate the upper insulating layer. A metallized conductor post for electrically connecting the metallized conductor layer and the sealing metallized layer is embedded in the notch so that the upper end surface thereof is flush with the top surface of the upper insulating layer.

According to the above configuration, the sealing metallization layer is electrically connected to the metallization conductor layer via the metallization conductor post. Thus, by connecting the metallized conductor layer to ground potential, the sealing metallization layer can also be connected to ground potential.

Also, the above publication discloses that the exposed surfaces of the metallized conductor layer, the metallized layer for sealing, and the metallized conductor post are coated with a metal having excellent wettability with solder, such as gold (Au), by electroplating. Furthermore, by this plating, the bonding between the metallization layer for sealing and the metal cover that penetrates the solder can be made strong. The solder is made of, for example, a gold-tin (Au—Sn) alloy. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-312060

[Problem to be solved by the invention]

According to the technique described in the above publication, a metal layer having excellent wettability with solder is provided so as to cover the exposed surfaces of the metallized conductor layer, the sealing metallized layer, and the metallized conductor post. Thereby, as described above, the joint through the solder between the sealing metallization layer and the metal cover can be strengthened. On the other hand, due to covering the metal layer with excellent wettability with the solder, the solder tends to flow out from the sealing metallization layer on the top surface to the metallized conductor post on the side, which is not effectively utilized. . In particular, since the content of expensive materials such as gold in solder is often high, in this case, a large amount of solder that is not effectively used will flow out, resulting in a significant increase in material cost.

The present invention is made to solve the above problems, and its purpose is to provide a package and its manufacturing method, which can prevent unnecessary flow of solder from the top surface to the side surface while ensuring the electrical connection between the top surface and the bottom surface. [Means to solve the problem]

One aspect of the package is for electronic parts, and a cover is mounted using solder. The package body has a ceramic part, a metallization part and a metal layer. The ceramic portion has an outer edge in plan view. The ceramic part has a top surface, a bottom surface opposite to the top surface, and a side surface disposed on the outer edge and connecting the top surface and the bottom surface in plan view. The top surface includes a sealing surface for supporting the cover, and a cavity for accommodating electronic components is provided inside the sealing surface. The metallization part is set on the ceramic part and is made of metallization material. The metallization part includes: a sealing metallization layer, which is arranged on the sealing surface; a bottom metallization layer, which is arranged on the bottom surface of the ceramic part; and a side metallization layer, which is arranged on the side of the ceramic part. The side metallization layer has: an upper part connected to the sealing metallization layer; a lower part connected to the bottom metallization layer; and a middle part connecting the upper part and the lower part to each other. The metal layer is made of a metal material that has higher wettability to solder than the metallization material. The metal layer covers the sealing metallization layer of the metallization, but does not cover the middle part of the side metallization layer of the metallization.

In addition, the metal material constituting the above-mentioned metal layer may be either a pure metal or an alloy. The metal layer can also cover the upper portion of the side metallization layer. The metal layer may also have end portions with tapering thickness. Viewed from above, the outer edge of the ceramic part has: a first corner, a second corner, and a side connecting the first corner and the second corner, and the side metallization layer can also be away from the first corner and the second corner. Take it aside. In the middle part of the side metallization layer, a surface oxide film composed of metallization material oxide can also be provided. The surface of the middle portion of the side metallization layer is a fractured surface. The outer edge may also include a recess configured with side metallization. In the height range of the middle portion provided with the side metallization layer, the recess can be completely filled by the side metallization layer. Within the height range of the middle portion where the side metallization layer is disposed, the concave portion can be completely filled with the side metallization layer and the filling portion made of ceramics facing the ceramic portion through the side metallization layer.

The method for manufacturing a package according to the above aspect includes the steps of: (a) forming a green laminated body having: a ceramic green part including a part to be a ceramic part; Part of the metallized green body portion, wherein the ceramic green body portion and the metallized green body portion each straddle an imaginary line that becomes at least a part of the outer edge of the ceramic portion; (b) along the imaginary line, in the The green laminated body forms a trench; (c) by calcining the green laminated body, a calcined body including a ceramic part and a metallized part is formed; (d) in order to form a metal layer, the metallized part of the calcined body is electroplating; and (e) after the step of electroplating the metallized part, cracks are formed on the calcined body starting from the ditch, thereby breaking the ceramic part and forming the middle part of the metallized layer on the side of the metallized part surface. [Invention effect]

According to the above-mentioned package, firstly, the metallization portion includes: a sealing metallization layer disposed on the sealing surface; a bottom metallization layer disposed on the bottom surface of the ceramic portion; and a side metallization layer disposed on the ceramic portion on the side of the head. Thereby, an electrical connection between the top surface provided with the sealing metallization layer and the bottom surface provided with the bottom surface metallization layer can be ensured. Second, the metal layer composed of a metal material with high wettability to the solder in the molten state does not cover the side metallization of the metallization even at the same time as covering the sealing metallization layer of the metallization middle part of the layer. Thereby, it is possible to prevent unnecessary large flow of solder from the top surface to the side. From the above, it can be seen that while ensuring the electrical connection between the top surface and the bottom surface, it is possible to prevent unnecessary large flow of solder from the top surface to the side surface.

The purpose, features, aspects and advantages of this invention can be more clearly understood by the following detailed description and attached drawings.

Hereinafter, an embodiment will be described based on the drawings.

＜Embodiment 1＞ FIG. 1 is a schematic plan view of the configuration of an electronic device 900 in the first embodiment. Fig. 2 is a schematic partial sectional view along line II-II in Fig. 1 . Electronic device 900 has package 801 , electronic component 910 , solder 930 , and cover 920 .

FIG. 3 is a schematic plan view of the structure of the package 801 . 4 and 5 are schematic partial cross-sectional views taken along line IV-IV and line V-V in FIG. 3 , respectively. The package 801 is used for the electronic component 910 , and has electrode pads 400 bonded to the electronic component 910 in this embodiment. As shown in FIGS. 1 and 2 , the cover 920 is mounted on the package 801 using solder 930 . The cover body 920 is preferably made of a metal having a thermal expansion coefficient similar to that of ceramics, specifically, it is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, for example, a Fe-Ni-Co (cobalt) alloy Or Fe-Ni alloy composition. The solder 930 preferably has Au as the main component, and an Au alloy is more preferable, typically an Au—Sn alloy. Moreover, the material of the solder 930 is not limited to these, For example, Ag (silver)-Cu (copper) alloy, Pb (lead)-Sn solder, or Pb-free solder may be sufficient. The shape of the cover body can also be flat.

The package 801 has a ceramic part 100 , a metallization part 200 provided on the ceramic part 100 , and a plating layer 300 (metal layer). The metallization 200 includes a sealing metallization layer 210 , a bottom metallization layer 220 , and a side metallization layer 230 . The electroplating layer 300 has an upper electroplating layer 310 and a lower electroplating layer 320 . The upper plating layer 310 and the lower plating layer 320 are separated from each other.

The ceramic part 100 is made of ceramics, such as alumina or aluminum nitride. In the case of ceramics made of alumina, 10 to 20 wt% of zirconia can also be added in order to improve the mechanical strength. As shown in FIG. 3 , the ceramic part 100 has an outer edge EO in plan view. Moreover, as shown in FIG. 4 , the ceramic part 100 has a top surface P1, a bottom surface P2 opposite to the top surface P1, and a side surface P3 connecting the top surface P1 and the bottom surface P2. The side P3 is arranged on the outer edge EO ( FIG. 3 ) in a plan view. The outer edge EO has a recess CC. In this embodiment, the concave portion CC is approximately semicircular. The top surface P1 includes a sealing surface SS for supporting the cover 920 ( FIG. 2 ) via the metallization portion 200 and the upper plating layer 310 . Moreover, the cavity CV for accommodating the electronic component 910 inside the sealing surface SS is provided in the top surface P1. The ceramic part 100 has a frame part surrounding the cavity CV in plan view (FIG. 3). In addition, internal wiring (not shown) connecting the inside and outside of the cavity CV is provided in the ceramic part 100 . The internal wiring connects, for example, the electrode pads 400 provided in the cavity CV and the electrode pads (not shown) provided on the bottom surface P2 to each other.

The metallization 200 consists of a metallization material. The main component of the metallization material is preferably a metal with a high melting point, such as W (tungsten), Mo (molybdenum), or a mixture of these metals. Alternatively, the main component of the metallization material may be an alloy composed of W and Mo. The sealing metallization layer 210 is disposed on the sealing surface SS. The bottom metallization layer 220 is disposed on the bottom surface P2 of the ceramic part 100 . The side metallization layer 230 is disposed on the side P3 of the ceramic part 100 . Specifically, the side metallization layer 230 is disposed on the concave portion CC of the outer edge EO. In this embodiment, within the height range of the middle portion 233 where the side metallization layer 230 is disposed, the recess CC is filled with the side metallization layer 230 ( FIG. 4 ). Here, the direction referred to in the above-mentioned "height range" refers to the thickness direction of the package body 801 (the vertical direction in FIG. 4 ). The side metallization layer 230 has an upper portion 231 connected to the sealing metallization layer 210 , a lower portion 232 connected to the bottom metallization layer 220 , and a middle portion 233 connecting the upper portion 231 and the lower portion 232 to each other. The surface of the middle part 233 of the side metallization layer 230 is not an as-fired surface, but a fracture surface (fracture surface) SF ( FIG. 18 ) formed by the breaking step described later.

In a plan view ( FIG. 3 ), the outer edge EO of the ceramic part 100 is a rectangular shape with four sides and four corners. Also, a square is a type of rectangle. Specifically, the outer edge EO has: a first corner N1 (the upper right corner in the figure), a second corner N2 (the lower right corner in the figure), and a side connecting the first corner N1 and the second corner N2 (the upper right corner in the figure). to the right). The side metallization layer 230 is away from the first corner N1 and the second corner N2 and connected to one side. Correspondingly, the concave portion CC is away from the first corner N1 and the second corner N2 and adjoins to one side. Moreover, in this embodiment, the side metallization layer 230 (and the concave portion CC disposed therein) is connected to the side opposite to the side, that is, the left side in the figure. Also, the number of side metallization layers (and the number of recesses CC) included in one package is arbitrary.

The upper electroplating layer 310 of the electroplating layer 300 covers the sealing metallization layer 210 of the metallization part 200 . On the other hand, the electroplating layer 300 does not cover the middle portion 233 of the side metallization layer 230 of the metallization portion 200 . In this embodiment, the upper electroplating layer 310 covers the upper portion 231 of the side metallization layer 230 . The interface between the upper portion 231 and the upper electroplating layer 310 may also include an inclined surface in the thickness direction (the longitudinal direction in FIG. 4 ). The interface may also be constituted only by the inclined surface. Moreover, the lower electroplating layer 320 of the electroplating layer 300 covers the bottom metallization layer 220 of the metallization part 200 . Moreover, the lower electroplating layer 320 of the electroplating layer 300 covers the lower part 232 of the side metallization layer 230 of the metallization part 200 .

The upper electroplating layer 310 of the electroplating layer 300 has an end portion (the right end portion in FIG. 4 ) whose thickness gradually decreases. Similarly, the lower electroplating layer 320 of the electroplating layer 300 has an end portion (the right end portion in FIG. 4 ) whose thickness gradually decreases.

Compared with the metallization material, the electroplating layer 300 is composed of a metal material with high wettability to the solder 930 in a molten state. In other words, the wettability of the metal material of the electroplating layer 300 is higher than the wettability of the metallized material. The metal material of the electroplating layer 300 is preferably Au as a main component, for example substantially Au.

In addition, in order to make the electroplating layer 300 difficult to peel off, it is preferable to form a base layer (not shown) composed of a conductor material different from the above metal materials between the electroplating layer 300 and the metallization part 200 . The base layer can also be an electroplating layer. The material of the base layer may be Ni as a main component, for example, may be Ni or a Ni—Co alloy.

Fig. 5 is a partial sectional view of a place where the recess CC is not provided.

Next, a method of collectively manufacturing the plurality of packages 801 will be described below with reference to FIGS. 6 to 18 . 6, FIG. 8, FIG. 10, FIG. 12, FIG. 14, and FIG. 16 are schematic partial plan views of the first to sixth steps, respectively. Moreover, Fig. 7, Fig. 9, Fig. 11, Fig. 13, Fig. 15 and Fig. 17 are respectively line VII-VII (Fig. 6), line IX-IX (Fig. 8), line XI-XI (Fig. 10), and line Schematic partial sectional views of lines XIII-XIII ( FIG. 12 ), lines XV-XV ( FIG. 14 ) and lines XVII-XVII ( FIG. 16 ). 18 is a schematic partial sectional view of the seventh step.

Referring to FIGS. 6 and 7 , a ceramic green part 100G is formed by laminating a plurality of green sheets. The ceramic green part 100G includes a portion that becomes the ceramic part 100 ( FIG. 4 ) in a firing step described later. Moreover, although illustration is omitted, a portion serving as internal wiring (not shown) of the ceramic part 100 may be provided in the ceramic green part 100G.

Referring to FIGS. 8 and 9 , through-holes HL extending in the thickness direction are formed in the ceramic green body portion 100G. The through hole HL straddles an imaginary line LV which becomes at least a part of the outer edge EO of the ceramic part 100 . The through hole HL includes a portion serving as the recessed portion CC ( FIG. 3 ). The through hole HL is formed by machining using a die. Also, as a modified example, the through hole HL may be formed by processing using laser light.

Referring to FIG. 10 and FIG. 11 , by printing metal paste, a metallization including a sealing metallization green layer 210G, a bottom metallization green layer 220G and a side metallization green layer 230G is formed on the ceramic green part 100G. Green part 200G. The metallized green part 200G includes a portion that becomes the metallized part 200 through a firing step described later. Specifically, the sealing metallization green layer 210G, the bottom metallization green layer 220G and the side metallization green layer 230G each include the sealing metallization layer 210, the bottom metallization layer 220 and the side part of the metallization layer 230 . As a result, a green laminated body 500G having a ceramic green part 100G including a portion to be the ceramic part 100 and a metallized green part 200G including a part to be the metallized part 200 is formed.

The ceramic green part 100G and the side metallized green layer 230G of the metallized green part 200G each straddle a virtual line LV ( FIG. 10 ) which becomes at least a part of the outer edge EO of the ceramic part 100 . Specifically, the ceramic green part 100G straddles the imaginary line LV outside the through-hole HL. In addition, the side metallized green layer 230G of the metallized green part 200G straddles the imaginary line LV in the through hole HL.

Referring to FIGS. 12 and 13 , a trench TR is formed in the green laminate 500G along the imaginary line LV ( FIG. 10 ). The step of forming the trench TR is performed by pressing the blade against the green laminate 500G along the imaginary line LV. Also, as a modified example, the step of forming the trench TR may be performed by irradiating the green laminate 500G with laser light along the imaginary line LV.

Next, the green laminated body 500G ( FIGS. 12 and 13 ) is calcined. Referring to FIGS. 14 and 15 , by this firing, a calcined body 500 including the ceramic part 100 and the metallized part 200 is formed. Referring to FIGS. 16 and 17 , the metallized portion 200 of the calcined body 500 is electroplated. Thereby, the plating layer 300 is formed.

Referring to FIG. 18 , after the above-mentioned electroplating treatment, cracks are generated in the calcined body 500 starting from the trench TR. Thereby, the surface (fracture surface SF) of the middle part 233 of the side metallization layer 230 of the metallization part 200 is formed while the ceramic part 100 is broken. Through the above method, a plurality of packages 801 are obtained.

FIG. 19 is a schematic partial cross-sectional view showing the configuration of an electronic device 990 in a comparative example. In this comparative example, unlike the electronic device 900 ( FIG. 2 ) in the embodiment, the plating layer 390 is provided on the entire side surface of the side metallization layer 230 . As a result, when the cover body 920 is mounted using the solder 930 , as shown by the arrow in the figure, the solder 930 tends to flow out from the top surface to the side in a large amount unnecessarily. Furthermore, adding a member for stopping the flow of the solder 930 as indicated by the arrow in the drawing will complicate the configuration and manufacturing method.

Also, although not shown, as another comparative example, in a top view similar to FIG. 3 , a through hole that is far away from any of the outer edge EO and the cavity CV can be formed in the frame portion of the ceramic part 100. hole, and a conductor member for electrically connecting the top surface P1 and the bottom surface P2 is formed in the through hole. In this case, the size of the through hole must be sufficiently smaller than the width of the frame portion. Therefore, when the width of the frame portion is small, the process of forming the through hole is difficult. For example, in the case of machining using a die having minute pins, the minute pins corresponding to the minute through-holes tend to bend. In the case of using laser light instead of molds, productivity is greatly reduced. Furthermore, even if fine through-holes can be formed, the process of filling them with conductor members is very difficult.

According to the package 801 of this embodiment, first, the metallization portion 200 ( FIG. 4 ) includes: a sealing metallization layer 210 disposed on the sealing surface SS; a bottom metallization layer 220 disposed on the bottom surface P2 of the ceramic portion 100 ; and a side metallization layer 230 disposed on the side P3 of the ceramic part 100 . Thereby, the electrical connection between the top surface P1 on which the sealing metallization layer 210 is disposed and the bottom surface P2 on which the bottom metallization layer 220 is disposed can be ensured. Second, the electroplating layer 300 made of a metal material with high wettability to the solder 930 ( FIG. 2 ) in a molten state covers the sealing metallization layer 210 of the metallization part 200 , but does not cover the metallization layer 300 . The middle portion 233 of the side metallization layer 230 of the metallization portion 200 . Thereby, unlike the comparative example (FIG. 19), it is possible to prevent unnecessary large flow of solder 930 from the top surface to the side surface. According to the above, the electrical connection between the top surface P1 and the bottom surface P2 can be ensured, and the solder 930 can be prevented from flowing out from the top surface to the side in large quantities unnecessarily.

The upper plating layer 310 ( FIG. 4 ) covers the upper portion 231 of the side metallization layer 230 . Thus, the range where the solder 930 ( FIG. 2 ) can easily flow out from the edge of the sealing metallization layer 210 is limited to the range of the upper portion 231 of the side metallization layer 230 . Therefore, by making the size of the upper portion 231 of the side metallization layer 230 very small, the amount of outflow of the solder 930 can be suppressed. Furthermore, by slightly spreading the solder 930 from the edge of the sealing metallization layer 210 , the solder 930 is more strongly bonded to the plating layer 300 . Also, the surface of the middle portion 233 of the side metallization layer 230 is formed by a breaking step ( FIG. 18 ) after the firing step, and the trench TR ( FIG. 12 ) defining the position of the breaking step is preformed before the firing step. In the case of formation, the formation of the plating layer 300 is efficiently performed by the plating step ( FIG. 17 ) after the firing step and before the breaking step. In this case, the portion of the electroplating layer 300 formed in the trench TR corresponds to the portion covering the upper portion 231 of the side metallization layer 230 . Therefore, by allowing the electroplating layer 300 to cover the upper portion 231 of the side metallization layer 230 , the electroplating layer 300 in this embodiment can be efficiently formed.

The upper electroplating layer 310 has an end portion (the right end portion in FIG. 4 ) whose thickness gradually decreases. Thereby, peeling of the plating layer 300 in the end portion can be suppressed. In addition, when the electroplating layer 300 is made of expensive Au, the cost of raw materials can be reduced. Also, the surface of the middle portion 233 of the side metallization layer 230 is formed by a breaking step ( FIG. 18 ) after the firing step, and the trench TR ( FIG. 12 ) defining the position of the breaking step is preformed before the firing step. In the case of formation, the formation of the plating layer 300 is efficiently performed by the plating step ( FIG. 17 ) after the firing step and before the breaking step. In this case, the end portion of the plating layer 300 included in the completed package 801 is located at the bottom of the trench TR at the time of the plating step. Since electroplating is gradually difficult to perform at the bottom of the trench TR, the electroplating layer 300 has an end portion whose thickness gradually becomes smaller. Therefore, the electroplating layer 300 in this embodiment can be efficiently formed by allowing the electroplating layer 300 to have an end portion whose thickness gradually becomes smaller.

Regarding the outer edge EO of the ceramic part 100 ( FIG. 3 ), the side metallization layer 230 is away from the first corner N1 and the second corner N2 and connected to one side of the outer edge EO. In the corners of the outer edge EO where peeling of the side metallization layer 230 is likely to occur, this configuration can suppress the peeling from occurring. In particular, compared with the case where the side metallization layer 230 is located at the corner of the outer edge EO, damage to the side metallization layer 230 caused by the breaking step ( FIG. 18 ) for forming the outer edge EO of the ceramic part 100 can be suppressed. damage. However, when this effect is not particularly necessary, that is, when the adhesion strength between the side metallization layer 230 and the ceramic part 100 is very high, the arrangement of the side metallization layer 230 is not limited to this, and the side metallization layer 230 can also Can be configured in corners.

The surface of the middle portion 233 of the side metallization layer 230 is the fracture surface SF (FIG. 18). Thereby, the surface can be formed by a breaking step.

The side metallization layer 230 is disposed in the concave portion CC of the outer edge EO ( FIG. 3 ). Thereby, the side metallization layer 230 can be prevented from protruding from the outer edge EO of the ceramic part 100 .

In the height range of the middle portion 233 ( FIG. 4 ) where the side metallization layer 230 is disposed, the recess CC ( FIG. 3 ) is completely filled by the side metallization layer 230 . Thereby, there is no need to form components other than the side metallization layer 230 as components for completely filling the recess CC. In addition, by completely filling the recess CC, it is possible to avoid the occurrence of poor sealing due to the reduction of the region where the lid 920 is joined due to the recess CC. Furthermore, since the rigidity becomes high, it is also possible to prevent the destruction of the frame portion surrounding the cavity CV starting from the concave portion CC. This is effective when the width dimension of the frame portion surrounding the cavity CV of the ceramic portion 100 is 100 μm or less even at a distance from the concave portion CC. In addition, especially in an ultra-small package having an outer edge EO as small as to be contained in a square area with each side of 1 mm, it is often required to set the width of the frame portion to 100 μm or less in terms of design. Typically, such an ultra-small package is required when the electronic component 910 ( FIG. 1 ) is an ultra-small crystal blank (with electrodes provided).

According to the method of manufacturing the package 801 of this embodiment, the package 801 can be manufactured in a simple manner. Specifically, the fracture surface SF ( FIG. 18 ) formed in the breaking step is used as a surface to suppress further flow of the solder 930 . Therefore, it is not necessary to form a special member to suppress the flow of the solder 930 . In addition, the through-hole HL ( FIGS. 8 and 9 ) is divided to form a concave portion CC ( FIG. 3 ) for the castellation electrode. Therefore, compared to the case of forming a through hole away from any of the outer edge EO and the cavity CV in the frame portion of the ceramic part 100 as a via electrode unlike the present embodiment, the through hole HL The diameter can be set larger. Therefore, the diameter of the pin of the mold for forming the through-hole HL can also be set large. Therefore, the through hole HL can be easily formed by machining using a mold. Thereby, compared with the case of using laser processing, productivity can be improved.

According to the manufacturing method of the electronic device 900 of this embodiment, first, the package body 801 is manufactured in the above manner. Next, the electronic component 910 is bonded to the electrode pad 400 of the package 801 . Next, the lid 920 is attached to the package 801 by brazing using solder 930 . Thereby, the electronic device 900 can be obtained. Brazing can be performed by a known method, and in this case, typically an Au alloy, especially an Au—Sn alloy is used as the solder 930 . However, the brazing bonding method is not limited thereto, and may be performed as follows, for example. First, a solder layer made of an Ag—Cu alloy is formed on one surface of the lid body 920 . Next, the lid body 920 provided with the solder layer is placed on the sealing metallization layer 210 so that the solder layer is in contact with the sealing metallization layer 210 . Next, the solder is melted by heating with electricity. In this way, an electronic device 900 is obtained.

Furthermore, electronic device 900 ( FIG. 2 ) is mounted on an external substrate (not shown) using electrode pads (not shown) provided on bottom surface P2 as described above. In this installation, the electrode pads are bonded to the external substrate using solder. In this solder joint, if the solder flows out unnecessarily from the bottom to the side, the joint between the electrode pad and the external substrate is likely to deteriorate. According to this embodiment, the electroplating layer 300 made of a metal material with high wettability to solder in a molten state covers the bottom metallization layer 220 of the metallization part 200, but does not cover the metallization part 200. The middle portion 233 of the side metallization layer 230 . Thereby, solder in a molten state can be prevented from flowing out unnecessarily from the bottom surface to the side surface.

＜Embodiment 2＞ Fig. 20 is a schematic plan view of the structure of a package 802 in the second embodiment. Fig. 21 is a schematic partial cross-sectional view along line XXI-XXI in Fig. 20 . In this embodiment, within the height range of the middle portion 233 where the side metallization layer 230 is disposed, the recess CC is completely buried by the side metallization layer 230 and the filling portion 150 . The filling part 150 faces the ceramic part 100 via the side metallization layer 230 and is made of ceramics. The main component of the material of the filling part 150 is preferably the same as that of the material of the ceramic part 100 . For example, both the filling part 150 and the ceramic part 100 may be made of alumina, or both the filling part 150 and the ceramic part 100 may be made of aluminum nitride. The surface of the filled portion 150 is not a calcined surface but a fractured surface SG. Also, the section shown in Figure 21 is along the line XXI-XXI (Figure 20), and the partial section (not shown) along the line A-A (Figure 20) is the same as Figure 4 (Embodiment 1) Much the same.

Next, a method of collectively manufacturing the plurality of packages 802 will be described below. In addition, since the first and second steps (FIG. 6 to FIG. 9) in the aforementioned first embodiment are also performed in common in this embodiment, the description thereof is omitted. Fig. 22, Fig. 24, Fig. 26, Fig. 28, Fig. 30 and Fig. 32 are schematic partial plan views of the third to eighth steps, respectively. Also, Fig. 23, Fig. 25, Fig. 27, Fig. 29, Fig. 31 and Fig. 33 are respectively along the line XXIII-XXIII (Fig. 22), the line XXV-XXV (Fig. 24), and the line XXVII-XXVII (Fig. 26) , a schematic partial sectional view of the line XXIX-XXIX (FIG. 28), the line XXXI-XXXI (FIG. 30) and the line XXXIII-XXXIII (FIG. 32). In addition, Fig. 34 is a schematic partial sectional view of the ninth step.

Referring to FIGS. 22 and 23 , by printing the metal paste, the side metallized green layer 230G is formed on the inner surface of the through hole HL of the ceramic green part 100G so that the through hole HL is only partially filled. Next, referring to FIG. 24 and FIG. 25 , the filling green part 150G is filled to the through hole HL via the side metallized green layer 230G by printing the ceramic paste so that the through hole HL is completely filled. Referring to FIG. 26 and FIG. 27 , by printing metal paste, a sealing metallized green layer 210G and a bottom metallized green layer 220G are formed on the ceramic green part 100G. As described above, the metallized green part 200G including the part to be the metallized part 200 is formed on the ceramic green part 100G through the steps of FIGS. 22 to 27 . As a result, a green laminated body 500G is formed, which has: a ceramic green part 100G including a portion to be the ceramic part 100; a metallized green part 200G including a part to be the metallized part 200; and The filling green part 150G includes a part to be the filling part 150 .

The ceramic green part 100G, the side metallized green layer 230G of the metallized green part 200G, and the filling green part 150G each straddle the imaginary line LV ( FIG. 26 ). Specifically, the ceramic green part 100G straddles the imaginary line LV outside the through-hole HL. In addition, the side metallized green layer 230G and the filled green portion 150G each straddle the imaginary line LV in the through hole HL.

Referring to FIGS. 28 and 29 , trenches TR are formed in the green laminated body 500G along the virtual line LV ( FIG. 26 ). The step of forming the trench TR is performed by pressing the blade against the green laminate 500G along the imaginary line LV. When the trench TR is formed using a knife edge, as shown in FIG. 29 , the sealing metallized green layer 210G easily extends to the side surface of the trench TR. This is because the sealing metallized green layer 210G is involved into the blade when the trench TR is formed. As a result, the plating layer 300 is easily formed also on the surface of the filled portion 150 made of ceramics in the plating step ( FIG. 32 and FIG. 33 ) described later.

Next, the green laminated body 500G ( FIGS. 28 and 29 ) is calcined. Referring to FIGS. 30 and 31 , by this calcination, a calcined body 500 including the ceramic part 100 and the metallized part 200 is formed.

Referring to FIGS. 32 and 33 , the metallized portion 200 of the calcined body 500 is electroplated. Thereby, the plating layer 300 is formed.

Referring to FIG. 34 , after the above electroplating, cracks are formed in the calcined body 500 starting from the trench TR. Thus, the surface of the middle portion 233 of the side metallization layer 230 of the metallization portion 200 is formed while the ceramic portion 100 and the filled portion 150 are broken (broken) (fracture surface SF in FIG. 20 ). Through the above method, a plurality of packages 802 are obtained.

In addition to the above description, since it is substantially the same as the above-mentioned first embodiment, the same symbols are assigned to the same or corresponding elements, and the description thereof will not be repeated.

According to the package 802 of this embodiment, within the height range of the middle portion 233 ( FIG. 21 ) where the side metallization layer 230 is disposed, the recess CC ( FIG. 20 ) is formed by the side metallization layer 230 , with the side metallization layer interposed therebetween. 230 and facing the ceramic part 100, the filling part 150 made of ceramics is completely buried. Accordingly, the side metallization layer 230 can be protected by the filling portion 150 . In addition, since the filling portion 150 ( FIG. 33 ) made of ceramics is formed in the through-hole HL including the portion to be the concave portion CC, the ratio of the material constituting the frame portion to ceramics is increased and the homogeneity is improved, so that the The cracks in the recesses CC are more stably generated in the breaking step ( FIG. 34 ).

According to the manufacturing method of the package 802 of this embodiment, the trench TR is formed using a knife edge (FIG. 29). Thereby, as described above, the sealing metallization green layer 210G easily extends to the side surface of the trench TR. The sealing metallization green layer 210G extends to the sides of the trench TR, so that the sealing metallization layer 210 of the package 802 also extends to the sides of the trench TR. Thereby, as in the case of FIG. 4 (Embodiment 1), an upper plating layer 310 ( FIG. 21 ) having an end portion whose thickness gradually decreases can be obtained on the side surface of the trench TR.

<Modification of Embodiment 2> FIG. 35 is a schematic partial cross-sectional view of a modified example of the step in FIG. 29 . In the step of FIG. 29 , the trench TR was formed using a blade, but in this modified example, the trench TR is formed by laser processing (that is, irradiation of laser light). In this case, unlike the case of FIG. 29 , the sealing metallization green layer 210G does not easily extend to the side surface of the trench TR. According to this modified example, the fine trench TR can be formed by using laser light instead of the blade.

＜Embodiment 3＞ Fig. 36 is a schematic partial sectional view showing the structure of a package 801M in the third embodiment. In this embodiment, a surface oxide film 233X made of metallization material oxide is provided on the middle portion 233 of the side metallization layer 230 . The surface oxide film 233X may be a natural oxide film of the middle portion 233 . In addition, since the configuration other than this is substantially the same as that of the first embodiment (FIG. 4), the same reference numerals are assigned to the same or corresponding elements, and the description thereof will not be repeated.

Also in this embodiment, substantially the same effect as that of the first embodiment can be obtained. Furthermore, according to this embodiment, the wettability of the middle portion 233 to the solder 930 can be further reduced by the surface oxide film 233X. In particular, when the surface oxide film 233X is a natural oxide film of the middle portion 233, the surface oxide film 233X can be easily formed.

＜Embodiment 4＞ Fig. 37 is a schematic plan view of the structure of a package 802M in the fourth embodiment. In this embodiment, a surface oxide film 233X made of metallization material oxide is provided on the middle portion 233 of the side metallization layer 230 . The surface oxide film 233X can be a natural oxide film of the middle part 233 . Also, the configurations other than this are substantially the same as those of the above-mentioned second embodiment, so the same or corresponding elements are given the same reference numerals, and the description thereof will not be repeated.

Also in this embodiment, substantially the same effects as those in Embodiment 2 can be obtained. Furthermore, according to the present embodiment as well, the same effect as the characteristic effect of the above-mentioned third embodiment can be obtained.

＜Embodiment 5＞ Fig. 38 is a schematic partial cross-sectional view showing the configuration of an electronic device 900M according to Embodiment 5 in a view corresponding to Fig. 2 (electronic device 900: Embodiment 1). The electronic device 900M further includes a metal frame 940 in addition to the components of the electronic device 900 . The shape of the metal frame 940 is substantially the same as the shape of the sealing metallization layer 210 in plan view. Therefore, the metal frame 940 surrounds the cavity CV in a plan view.

The metal frame 940 is preferably made of a metal having a thermal expansion coefficient similar to that of ceramics, specifically, it is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, for example, Fe-Ni-Co (cobalt) It is composed of alloy or Fe-Ni alloy.

Next, a method of manufacturing the electronic device 900M will be described. First, the package 801 described in the first embodiment is prepared. Next, solder 930 is used to mount the metal frame 940 on the sealing metallization layer 210 of the package 801 . In other words, the metal frame 940 is soldered to the sealing metallization layer 210 . The brazing method can also be the same as the method of brazing the cover 920 to the sealing metallization layer 210 in the first embodiment or its modified example. In particular, in this embodiment, the material of the solder 930 is preferably Ag—Cu alloy. Secondly, the cover 920 is installed on the metal frame 940 . This mounting is preferably done by brazing joints.

In this embodiment, the cover body 920 is mounted on the package body 801 using the solder 930 and the metal frame 940 bonded to the solder 930 by brazing. In other words, the package 801 is a package formed by using the solder 930 and the metal frame 940 bonded to the solder 930 by brazing and installing the cover 920 . Therefore, in this embodiment, the sealing surface SS of the package body 801 is used to support the sealing surface of the lid body 920 via the metal frame 940 .

Also, as a modified example, the package 801 in the electronic device 900M may be replaced with any one of the above-mentioned first to fourth embodiments and the modified examples other than the package 801 .

The above-described embodiments and modified examples can be freely combined with each other. Although this invention has been described in detail, the above description is illustrative in all respects, and this invention is not limited thereto. Innumerable modifications that have not been illustrated can be assumed without departing from the scope of this invention.

100:Ceramic Department 100G: Ceramic green body department 150: filling part 150G: filling the green part 200: metallization department 200G: Metallized green body department 210: sealing metallization layer 210G: sealed metallized green layer 220: bottom metallization layer 220G: bottom metallized green layer 230: side metallization layer 230G: side metallized green layer 231: upper part 232: the lower part 233: middle part 233X: surface oxide film 300: electroplating layer (metal layer) 310: upper electroplating layer 320: Electroplating layer below 390: Plating layer 400: electrode pad 500: calcined body 500G: green laminate 801, 801M, 802, 802M: packages 900, 900M, 990: electronic equipment 910:Electronic Parts 920: cover body 930: Solder 940: metal frame CC: Concave CV: cavity EO: outer edge HL: through hole LV: imaginary line N1, N2: 1st and 2nd corners P1: top surface P2: bottom surface P3: side SF: fracture surface SG: fracture surface SS: sealing surface TR: ditch

[FIG. 1] A schematic plan view showing the configuration of an electronic device in Embodiment 1. [FIG. [FIG. 2] A schematic partial sectional view taken along line II-II in FIG. 1. [FIG. 3] A schematic plan view of the structure of the package in Embodiment 1. [FIG. [ Fig. 4 ] A schematic partial cross-sectional view taken along line IV-IV in Fig. 3 . [FIG. 5] A schematic partial sectional view taken along the line V-V in FIG. 3. [FIG. [FIG. 6] A schematic partial plan view of the first step of the manufacturing method of the package in Embodiment 1. [FIG. [FIG. 7] A schematic partial sectional view taken along line VII-VII in FIG. 6. [FIG. [FIG. 8] A schematic partial plan view of the second step of the manufacturing method of the package in Embodiment 1. [FIG. [FIG. 9] A schematic partial sectional view taken along line IX-IX in FIG. 8. [FIG. [FIG. 10] A schematic partial plan view of the third step of the manufacturing method of the package in Embodiment 1. [FIG. [FIG. 11] A schematic partial sectional view taken along line XI-XI in FIG. 10. [FIG. [FIG. 12] A schematic partial plan view of the fourth step of the manufacturing method of the package in Embodiment 1. [FIG. [ Fig. 13 ] A schematic partial cross-sectional view along line XIII-XIII in Fig. 12 . [ Fig. 14 ] A schematic partial plan view of the fifth step of the manufacturing method of the package in the first embodiment. [FIG. 15] A schematic partial sectional view taken along line XV-XV in FIG. 14. [FIG. [FIG. 16] A schematic partial plan view of the sixth step of the manufacturing method of the package in Embodiment 1. [FIG. [FIG. 17] A schematic partial sectional view taken along line XVII-XVII in FIG. 16. [ Fig. 18 ] A schematic partial cross-sectional view of the seventh step of the manufacturing method of the package in the first embodiment. [ Fig. 19 ] A schematic partial cross-sectional view showing the configuration of an electronic device in a comparative example. [FIG. 20] A schematic plan view showing the structure of a package in Embodiment 2. [FIG. [FIG. 21] A schematic partial sectional view taken along line XXI-XXI in FIG. 20. [FIG. [ Fig. 22 ] A schematic partial plan view of the third step of the manufacturing method of the package in the second embodiment. [FIG. 23] A schematic partial sectional view taken along line XXIII-XXIII in FIG. 22. [FIG. 24] A schematic partial plan view of the fourth step of the manufacturing method of the package in Embodiment 2. [FIG. [FIG. 25] A schematic partial cross-sectional view taken along line XXV-XXV in FIG. 24. [FIG. [ Fig. 26 ] A schematic partial plan view of the fifth step of the manufacturing method of the package in the second embodiment. [FIG. 27] A schematic partial sectional view taken along line XXVII-XXVII in FIG. 26. [ Fig. 28 ] A schematic partial plan view of the sixth step of the manufacturing method of the package in the second embodiment. [ Fig. 29 ] A schematic partial cross-sectional view along line XXIX-XXIX in Fig. 28 . [ Fig. 30 ] A schematic partial plan view of the seventh step of the manufacturing method of the package in the second embodiment. [FIG. 31] A schematic partial sectional view taken along the line XXXI-XXXI in FIG. 30. [FIG. [ Fig. 32 ] A schematic partial plan view of the eighth step of the manufacturing method of the package in the second embodiment. [FIG. 33] A schematic partial sectional view taken along line XXXIII-XXXIII in FIG. 32. [ Fig. 34 ] A schematic partial sectional view of the ninth step of the manufacturing method of the package in the second embodiment. [FIG. 35] A schematic partial cross-sectional view of a modified example of the sixth step (FIG. 29) of the method of manufacturing a package in Embodiment 2. [FIG. [ Fig. 36 ] A schematic partial sectional view showing the structure of a package in Embodiment 3. [FIG. 37] A schematic plan view showing the structure of a package in Embodiment 4. [FIG. [FIG. 38] A schematic partial cross-sectional view showing the structure of an electronic device according to Embodiment 5 in a field of view corresponding to FIG. 2. [FIG.

900: Electronic equipment

910:Electronic Parts

920: cover body

930: Solder

CV: cavity

Claims (10)

A package, which is a package for electronic parts with a cover installed using solder; the package includes: a ceramic part having an outer edge in a plan view; the ceramic part has a top surface including a top surface for supporting the cover The sealing surface of the body, and a cavity for accommodating the electronic component is provided on the inner side of the sealing surface; the bottom surface is opposite to the top surface; and the side surface is arranged on the outer edge under the plan view, and the The top surface and the bottom surface are connected to each other; the package body further includes: a metallization portion disposed on the ceramic portion and made of a metallization material; the metallization portion includes: a sealing metallization layer disposed on the sealing surface a bottom metallization layer disposed on the bottom surface of the ceramic portion; a side metallization layer disposed on the side of the ceramic portion and having an upper portion connected to the sealing metallization layer, connected to the bottom metallization The lower portion of the layer, and the middle portion connecting the upper portion and the lower portion to each other; the package further includes: a metal layer made of a metal with higher wettability to the solder than the metallization material material; the metal layer covers the sealing metallization layer of the metallization portion, but does not cover the middle portion of the side metallization layer of the metallization portion; the metal layer covers the upper portion of the side metallization layer . The package according to claim 1, wherein the metal layer has an end portion whose thickness gradually decreases. The package according to claim 1, wherein, in the top view, the outer edge of the ceramic portion has a first angle, a second angle, and a side connecting the first angle and the second angle, and the side surface The metallization layer is away from the first corner and the second corner and connected to the side. The package according to claim 1, wherein a surface oxide film made of oxide of the metallization material is provided on the middle portion of the side metallization layer. The package according to claim 1, wherein the surface of the middle portion of the side metallization layer is a fractured surface. The package according to claim 1, wherein the outer edge includes a recess on which the side metallization layer is disposed. The package according to claim 6, wherein, within the height range of the middle portion where the side metallization layer is disposed, the recess is completely filled by the side metallization layer. The package according to claim 6, wherein, within the height range of the middle part where the side metallization layer is disposed, the recess is formed from the side metallization layer and facing the ceramic part through the side metallization layer And the filling part made of ceramics is completely filled. The package according to claim 1, wherein the package system uses the solder and the metal frame brazed to the solder to install the package of the cover, and the sealing surface is used to separate the metal frame And support the cover. A method of manufacturing a package, which is a method of manufacturing a package according to any one of Claims 1 to 9, comprising the following steps: (a) forming a green laminate, the green laminate having: comprising becoming the The ceramic green body part of the ceramic part, and the metallized green body part including the part that becomes the metallized part, wherein the ceramic green body part and the metallized green body part each straddle the part that becomes the ceramic part An imaginary line of at least a portion of the outer edge; (b) forming a trench in the green laminate along the imaginary line; (c) forming a ceramic portion comprising the ceramic portion by firing the green laminate. and the calcined body of the metallized portion; (d) electroplating the metallized portion of the calcined body in order to form the metal layer; and (e) electroplating the metallized portion with the trench Cracks are generated in the calcined body as a starting point, whereby the surface of the middle part of the side metallization layer of the metallization part is formed while breaking the ceramic part.

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