TWI802178B - Probe card - Google Patents

Abstract

A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to conduct to the circuit board through the flexible inorganic material layer.

Description

probe card

The present disclosure relates to a detection device, and in particular to a probe card.

When the integrated circuit is tested, the test machine contacts the integrated circuit through a probe card and sends a test signal to test whether its function meets expectations. A probe card usually contains several finely sized probes. When testing integrated circuits, the probes are used to contact the tiny contact points on the device under test (DUT) to transmit the test signal from the test machine, and cooperate with the control of the probe card and the test machine program to achieve the purpose of measuring integrated circuits.

Since the pinpoints of the probes on the probe card are designed according to the object to be tested, the structure of the probe card used to detect the miniaturized integrated circuit will vary with the current advanced semiconductor manufacturing process. change. However, in order to adapt to the structure of miniaturized integrated circuits, the needle width and spacing of the above-mentioned probes used to detect miniaturized integrated circuits will be reduced, resulting in poor strength of the probes, which are prone to permanent deformation due to force, which seriously affects The service life and test reliability of the probe card.

The probe card of the present disclosure includes a flexible inorganic material layer, a metal microstructure and a circuit board. The flexible inorganic material layer has opposite first and second surfaces. The metal microstructure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal microstructure. The test signal is adapted to be conducted through the metal microstructure to the circuit board. Wherein, the yield strength of the material of the flexible inorganic material layer is greater than 500 MPa or the Young's modulus of the material of the flexible inorganic material layer is greater than 50 GPa.

The probe card of the present disclosure includes a flexible inorganic material layer, a metal microstructure, a circuit board and at least two guide plates. The flexible inorganic material layer has multiple surfaces. The metal microstructure is disposed on at least one of the surfaces and has a connection end. Circuit board connection connector. The test signal is adapted to be conducted through the metal microstructure to the circuit board. Each guide plate has a plurality of through holes, and the flexible inorganic material layer and the metal microstructure pass through the through holes of each guide plate. The yield strength of the material of the flexible inorganic material layer is greater than 500 MPa or the Young's modulus of the material of the flexible inorganic material layer is greater than 50 GPa.

Based on the above, in the design of the probe card of the present disclosure, since the metal microstructure is arranged on the flexible inorganic material layer, and the test signal can be conducted to the circuit board through the metal microstructure, the metal microstructure can be used to test the object to be tested. Being supported by the flexible inorganic material layer, the probe has good strength and elasticity and is not easily deformed. Accordingly, compared with the probes made of metal in the prior art, which are prone to permanent deformation and failure due to force deformation when the pitch and pin width are reduced, the probes of the probe card disclosed in the present disclosure can be made of flexible inorganic The arrangement of the material layer enables the probe to still have good strength and elasticity, thereby increasing the service life of the probe card and improving the test reliability of the probe card.

In order to make the above-mentioned features and advantages of the present disclosure more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

The present disclosure provides a probe card, the probes of which have good strength through the flexible inorganic material layer.

The present disclosure provides a probe card, the probes of which have good strength through the flexible inorganic material layer.

FIG. 1 is a schematic side view of a probe card according to an embodiment of the present disclosure. FIG. 2 is a schematic perspective view of the flexible inorganic material layer, the metal microstructure and the bonding layer of the probe card shown in FIG. 1 . Here, it should be noted that the proportions of the flexible inorganic material layer 110, the metal microstructure 120, the circuit board 130, and the bonding layer 140 of the probe card 100 in the figure are for illustration purposes only, and do not represent actual details. The size and proportion of the structure. Moreover, the rectangular coordinates X-Y-Z are provided to facilitate the subsequent component description.

Please refer to FIG. 1 first. The probe card 100 includes a flexible inorganic material layer 110 , a metal microstructure 120 and a circuit board 130 . The probes of the probe card 100 in this embodiment are suitable for transmitting the test signal TS. Here, the probes of the probe card 100 are composed of a flexible inorganic material layer 110 and a metal microstructure 120 . In this embodiment, the material of the flexible inorganic material layer 110 is, for example, glass, ceramic or silicon wafer, but not limited thereto. In this embodiment, the material of the metal microstructure 120 is a material with high conductivity. The material of the metal microstructure 120 is, for example, copper, nickel, nickel-cobalt-phosphorus, nickel-cobalt, nickel-manganese or rhodium-ruthenium alloy, but not limited thereto. In this embodiment, the circuit board 130 includes a printed circuit board or a ceramic circuit board, but not limited thereto.

In detail, please refer to FIG. 1 , in this embodiment, the flexible inorganic material layer 110 has a first surface 111 and a second surface 112 opposite to each other. The metal microstructure 120 is disposed on the first surface 111 , and the circuit board 130 is disposed on the second surface 112 , and the circuit board 130 is electrically connected to the metal microstructure 120 . Since the material of the metal microstructure 120 is a material with high conductivity, the test signal TS is suitable to be conducted to the circuit board 130 through the metal microstructure 120 .

For example, in this embodiment, the metal microstructure 120 is suitable for contacting the object under test (not shown), so as to test the object under test (not shown), and the object under test (not shown) is, for example, a product Dies on bulk circuits or semiconductor wafers, but not limited thereto. The circuit board 130 is, for example, electrically connected to a testing machine (not shown) that generates the test signal TS, but not limited thereto. That is to say, in this embodiment, the probe card 100 is provided with the test signal TS by, for example, a testing machine (not shown), and a test object (not shown) is tested through the probe card 100, but not by This is the limit.

It is worth mentioning that, in this embodiment, since the metal microstructure 120 is disposed on the flexible inorganic material layer 110, the metal microstructure 120 can be supported by the flexible inorganic material layer 110, so that the probe of the probe card 100 The needle has good strength and elasticity and is not easily deformed. Accordingly, compared with the probes in the prior art that are only made of metal, which are prone to permanent deformation and failure due to force deformation when the pitch and needle width are reduced, the probes of the probe card 100 in this embodiment can be used Due to the arrangement of the flexible inorganic material layer 110 , the probes of the probe card 100 still have good strength and elasticity.

Generally, the metal material used to make the cantilever of the probe has a low yield strength (about 70 MPa~300 MPa), so after being made into a tiny cantilever probe, the cantilever is easy to bend due to the force of the probe. cause permanent deformation. In this embodiment, the material of the flexible inorganic material layer 110 has sufficient yield strength to support the metal microstructure 120 . In one embodiment, the yield strength of the material of the flexible inorganic material layer 110 is greater than 500 MPa, and the Young's modulus of the material of the flexible inorganic material layer 110 is greater than 50 GPa, but not necessarily limit. In an embodiment, the yield strength of the material of the flexible inorganic material layer 110 is, for example, 500 MPa to 1200 MPa, and the Young's modulus of the material of the flexible inorganic material layer 110 is, for example, 50 GPa to 400 GPa. Moreover, in terms of structural design, the thickness T1 of the flexible inorganic material layer 110 is, for example, between 30 micrometers and 300 micrometers. In one embodiment, the ratio of the length L1 to the thickness T1 of the flexible inorganic material layer 110 (ie, L1/T1 ) is, for example, between 9 and 30, but not limited thereto.

The probe card 100 of this embodiment will be further described below.

Please refer to FIG. 2. In this embodiment, the flexible inorganic material layer 110 includes a body portion 113 and a plurality of interdigitated portions 114, and the metal microstructure 120 includes a plurality of metal substructures corresponding to and connected to the plurality of interdigitated portions 114. Structure 121. A plurality of forked portions 114 are connected to one side of the main body portion 113 , and each metal substructure 121 is adapted to extend toward the main body portion 113 along a direction parallel to the X-axis with the corresponding forked portion 114 .

In detail, please refer to FIG. 1 and FIG. 2. In this embodiment, the body portion 113 of the flexible inorganic material layer 110 has a structure that penetrates between the first surface 111 and the second surface 112 and is connected to each metal substructure. 121 and the via hole 115 of the circuit board 130, and each metal substructure 121 is disposed on the first surface 111 and the via hole 115, that is, each metal substructure 121 moves toward the main body along the corresponding fork portion 114 After the portion 113 extends (along the direction parallel to the X-axis), it is adapted to extend along the via hole 115 to the circuit board 130 (along the direction parallel to the Y-axis). Accordingly, the circuit board 130 can be electrically connected to the metal sub-structure 121 through the via hole 115 .

In more detail, please refer to FIG. 1 and FIG. 2. In this embodiment, the metal microstructure 120 includes a plurality of protrusions 122, and each protrusion 122 is disposed corresponding to the metal substructure 121 and is located opposite on the third surface 123 of the first surface 111 . In detail, the protruding portion 122 is disposed at one end of the metal substructure 121 corresponding to the interdigitated portion 114 of the flexible inorganic material layer 110 , and protrudes from the third surface 123 . Thereby, the test signal TS is suitable to be conducted to the circuit board 130 through the metal substructure 121 and along the via hole 115 , and each protrusion 122 is suitable for contacting a contact point (not shown) of the object under test. In one embodiment, the material of each protrusion 122 includes nickel phosphorus, nickel cobalt, nickel manganese or rhodium ruthenium alloy, but not limited thereto.

Here, it should be noted that the method of manufacturing the probe card in this embodiment is, for example, to first make the inorganic material layer into a flexible inorganic material layer 110 by means of a laser modified etching process, and then use a photolithography process to make the inorganic material layer 110 In the same way as the electroplating process, the metal microstructure (including the protruding part) is made into a second-level metal structure on the inorganic material layer to form a probe card with wires, but this disclosure does not limit the above-mentioned method of making the probe card 100 and order.

In addition, please refer to FIG. 1 , in this embodiment, the probe card 100 further includes a bonding layer 140 between the flexible inorganic material layer 110 and the circuit board 130 . The material of the bonding layer 140 is, for example, ABF (Ajinomoto Build-up Film), tin, tin alloy and silver glue, but not limited thereto. In this way, the flexible inorganic material layer 110 can be bonded to the circuit board 130 through the bonding layer 140 . In one embodiment, the circuit board 130 further includes pads 133 . The metal microstructure 120 can be electrically connected to the pad 133 of the circuit board 130 through the bonding layer 140 .

It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 3 is a schematic side view of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 3 at the same time. The probe card 100A of this embodiment is similar to the probe card 100 in FIG. 1 , but it should be noted that the structure of the circuit board 130A in FIG. 3 has an inclined surface.

Please refer to FIG. 3 , in this embodiment, the circuit board 130A has opposite horizontal surfaces 131A and inclined surfaces 132A. The second surface 112 of the flexible inorganic material layer 110 is connected to the inclined surface 132A of the circuit board 130A through the bonding layer 140 . Here, the degree of inclination of the inclined surface 132A relative to the horizontal surface 131A is, for example, 1.5 degrees to 6 degrees, but not limited thereto.

In detail, in this embodiment, the flexible inorganic material layer 110 connected to the second surface 112 has opposite first ends E1 and second ends E2, and the protrusions 122 of the metal microstructures 120 can be arranged corresponding to The first end E1 of the flexible inorganic material layer 110 . Here, it should be noted that, in this embodiment, the difference between the vertical distance D1 from the first end E1 to the horizontal plane 131A and the vertical distance D2 from the second end E2 to the horizontal plane 131A is between 50 μm and 500 μm, But not limited to this.

That is to say, when the thickness T2 of the metal microstructure 120 is much smaller than the thickness T1 of the flexible inorganic material layer 110, the inclined structure of the above-mentioned circuit board 130A can make the flexible inorganic material layer 110 appear inclined (that is, the first One end E1 is closer to the object under test than the second end E2), so that the flexible inorganic material layer 110 does not contact the object under test (not shown) when the protruding portion 122 of the metal microstructure 120 touches the object under test (not shown). (not shown) resulting in structural interference.

FIG. 4 is a schematic side view of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 4 at the same time. The probe card 100B of this embodiment is similar to the probe card 100 in FIG. 1, but it should be noted that the probe card 100B in FIG. The inorganic material layer 110B does not have the via hole 115 , and the metal microstructure 120B completely covers the first surface 111 of the flexible inorganic material layer 110B.

Please refer to FIG. 4. In this embodiment, the flexible inorganic material layer 110B has a first side wall 116 and a second side wall 117 connected between the first surface 111 and the second surface 112, and is connected to the second surface 112 with a The opposite first end E1 and the second end E2. The first side wall 116 is located at the second end E2 and close to the circuit board 130 , and the second side wall 117 is located at the first end E1 and away from the circuit board 130 . The protruding portion 122 of the metal microstructure 120B may be disposed corresponding to the first end E1 of the flexible inorganic material layer 110B.

In this embodiment, the probe card 100B further includes a first wire layer 150 . The first wire layer 150 is disposed on the second surface 112 of the flexible inorganic material layer 110B and the first side wall 116 of the flexible inorganic material layer 110B close to the circuit board 130, and the first wire layer 150 connects the metal microstructure 120B and the circuit plate 130. Specifically, after the metal microstructure 120B extends from the first end E1 to the second end E2 (in a direction parallel to the X-axis) along the first surface 111 of the flexible inorganic material layer 110B, it is suitable for connecting the first wire layer 150 . The first wire layer 150 is adapted to extend toward the circuit board 130 along the first sidewall 116 (direction parallel to the Y axis), and finally extend along the second surface 112 of the flexible inorganic material layer 110B (direction parallel to the -X axis). Accordingly, the circuit board 130 can be electrically connected to the metal microstructure 120B through the first wire layer 150 .

Accordingly, the test signal TS is suitable to be conducted from the metal microstructure 120B to the circuit board 130 through the first wire layer 150 , so as to detect the object under test (not shown).

FIG. 5 is a schematic side view of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 4 and FIG. 5 at the same time. The probe card 100C of this embodiment is similar to the probe card 100B in FIG. 4 , but it should be noted that the probe card 100C in FIG. 150.

Please refer to FIG. 5. In this embodiment, the flexible inorganic material layer 110B has a first side wall 116 and a second side wall 117 connected between the first surface 111 and the second surface 112, and is connected to the second surface 112 with a The opposite first end E1 and the second end E2. The first side wall 116 is located at the second end E2 and close to the circuit board 130 , and the second side wall 117 is located at the first end E1 and away from the circuit board 130 . The protruding portion 122 of the metal microstructure 120C may be disposed corresponding to the first end E1 of the flexible inorganic material layer 110B.

In this embodiment, the probe card 100B further includes a second wire layer 160 . The second wire layer 160 is disposed on the second surface 112 of the flexible inorganic material layer 110B and the second side wall 117 of the flexible inorganic material layer 110B away from the circuit board 130, and the second wire layer 160 connects the metal microstructure 120C and the circuit board 130. Specifically, after the metal microstructure 120C extends from the first end E1 to the second side wall 117 along the first surface 111 of the flexible inorganic material layer 110B (parallel to the direction of the -X axis), it is suitable for connecting the second wire layer 160. The second wire layer 160 is adapted to extend along the second sidewall 117 (direction parallel to the Y-axis), and finally extend toward the circuit board 130 along the second surface 112 of the flexible inorganic material layer 110B (direction parallel to the X-axis). Accordingly, the circuit board 130 can be electrically connected to the metal microstructure 120C through the second wire layer 160 .

Accordingly, the test signal TS is suitable to be conducted from the metal microstructure 120C to the circuit board 130 through the second wire layer 160 , so as to detect the object under test (not shown).

FIG. 6 is a schematic side view of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 6 at the same time. The probe card 100D of this embodiment is similar to the probe card 100 of FIG.

Please refer to FIG. 6. In this embodiment, the flexible inorganic material layer 110 has a via hole 115 penetrating between the first surface 111 and the second surface 112, and has a connection between the first surface 111 and the second surface 112. Between the first side wall 116 and the second side wall 117 .

In this embodiment, the metal microstructure 120D includes a first microstructure 121D and a second microstructure 122D. The first microstructure 121D and the second microstructure 122D are disposed on the first surface 111 of the flexible inorganic material layer 110 . The second wire layer 160 is disposed on the second surface 112 of the flexible inorganic material layer 110 and the second side wall 117 of the flexible inorganic material layer 110 away from the circuit board 130, and the second wire layer 160 is connected to the first microstructure 121D and the circuit plate 130. The via hole 115 is connected to the second microstructure 122D and the circuit board 130 . The first microstructure 121D and the second microstructure 122D respectively have protrusions 123D on one side of the first surface 111 .

Specifically, in this embodiment, after the first microstructure 121D extends along the first surface 111 of the flexible inorganic material layer 110 to the second side wall 117 (parallel to the direction of the -X axis), it is suitable for connecting the second wire Layer 160. The second wire layer 160 is adapted to extend along the second sidewall 117 (direction parallel to the Y-axis), and finally extend toward the circuit board 130 along the second surface 112 of the flexible inorganic material layer 110B (direction parallel to the X-axis). After the second microstructure 122D extends along the first surface 111 of the flexible inorganic material layer 110 to the via hole 115 (parallel to the direction of the X-axis), it is suitable to extend along the via hole 115 to the circuit board 130 (parallel to the direction of the Y-axis). direction). Accordingly, the circuit board 130 can be electrically connected to the first microstructure 121D and the second microstructure 122D of the metal microstructure 120D respectively through the second wire layer 160 and the via hole 115 .

In this way, the test signal TS is suitable to be conducted from the metal microstructure 120D to the circuit board 130 through the via hole 115 and the second wire layer 160 respectively, and pass through the protrusion 123D of the first microstructure 121D and the second microstructure 122D at the same time. The object under test (not shown) is contacted, so that the object under test (not shown) with relatively close contact points can be detected.

FIG. 7 is a schematic side view of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 6 and FIG. 7 at the same time. The probe card 100E of this embodiment is similar to the probe card 100D in FIG. 6, but it should be noted that the probe card 100E in FIG. The inorganic material layer 110B does not have the via hole 115 .

Please refer to FIG. 7 , in this embodiment, the flexible inorganic material layer 110B has a first surface 111 and a second surface 112 opposite to each other, and has a first side wall 116 connected between the first surface 111 and the second surface 112 and the second side wall 117 .

In this embodiment, the probe card 100E further includes a first wire layer 150 , and the metal microstructure 120E includes a first microstructure 121E and a second microstructure 122E. The first microstructure 121E and the second microstructure 122E are disposed on the first surface 111 of the flexible inorganic material layer 110B. The first wire layer 150 is disposed on the second surface 112 of the flexible inorganic material layer 110B and the first side wall 116 of the flexible inorganic material layer 110B close to the circuit board 130, and the first wire layer 150 is connected to the second microstructure 122E and circuit board 130 . The second wire layer 160 is disposed on the second surface 112 of the flexible inorganic material layer 110B and the second side wall 117 of the flexible inorganic material layer 110 away from the circuit board 130, and the second wire layer 160 is connected to the first microstructure 121E and the circuit plate 130. The first microstructure 121E and the second microstructure 122E respectively have protrusions 123D on one side of the first surface 111 .

Specifically, in this embodiment, the first microstructure 121E is suitable for connecting the second Wire layer 160. The second wire layer 160 is adapted to extend along the second sidewall 117 (direction parallel to the Y-axis), and finally extend toward the circuit board 130 along the second surface 112 of the flexible inorganic material layer 110B (direction parallel to the X-axis). After the second microstructure 122E extends along the first surface 111 of the flexible inorganic material layer 110B toward the first sidewall 116 (in a direction parallel to the X-axis), it is suitable for connecting to the first wire layer 150 . The first wire layer 150 is adapted to extend toward the circuit board 130 along the first sidewall 116 (direction parallel to the Y axis), and finally extend along the second surface 112 of the flexible inorganic material layer 110B (direction parallel to the -X axis). Accordingly, the circuit board 130 can be electrically connected to the first microstructure 121E and the second microstructure 122E of the metal microstructure 120E respectively through the second wiring layer 160 and the first wiring layer 150 .

Thus, the test signal TS is suitable to conduct from the metal microstructure 120E to the circuit board 130 through the first wiring layer 150 and the second wiring layer 160, and pass through the protrusion 123D of the first microstructure 121E and the second microstructure 122E. At the same time, the object under test (not shown) is contacted, so that the object under test (not shown) with relatively close contact points can be detected.

FIG. 8A is a schematic side sectional view of a probe card according to another embodiment of the present disclosure. FIG. 8B is a partially enlarged schematic view of the probe card in FIG. 8A . Please refer to FIG. 1 and FIG. 8A at the same time. The probe card 100F of this embodiment is similar to the probe card 100 of FIG. 1, but it should be noted that the probe card 100F of FIG. The probe card 100 is a cantilever probe card.

Please refer to FIG. 8A and FIG. 8B , in this embodiment, the probe card 100F includes a flexible inorganic material layer 110F, a metal microstructure 120F and a circuit board 130F. Here, the probes of the probe card 100F are composed of a flexible inorganic material layer 110F and a metal microstructure 120F, which are suitable for transmitting the test signal TS.

In detail, please refer to FIG. 8B. In this embodiment, the flexible inorganic material layer 110F has multiple surfaces, and these surfaces include an upper surface 111F and a lower surface 112F opposite to each other, as well as a layer connected to the upper surface 111F and the lower surface 112F. The first side surface 113F and the second side surface 114F. The metal microstructure 120F is disposed and covered on the upper surface 111F, the lower surface 112F and the second side surface 114F, and has a connection end 121F. The circuit board 130F is connected to the connection terminal 121F along the direction parallel to the Z axis, and the test signal TS is suitable for conducting to the circuit board 130F through the metal microstructure 120F.

In more detail, please refer to FIG. 8A and FIG. 8B . In this embodiment, the probe card 100F further includes two guide plates 170 , and the metal microstructure 120F includes a protrusion 122F. Each guide plate 170 has a plurality of through holes 171 corresponding to the probes (ie, the flexible inorganic material layer 110F and the metal microstructure 120F), and the probes (ie, the flexible inorganic material layer 110F and the metal microstructure 120F) pass through The through holes 171 of each guide plate 170 . The protruding portion 122F of the metal microstructure 120F is located at an end opposite to the connecting end 121F, so as to contact the object under test 50 .

Here, it should be noted that in this embodiment, the two guide plates 170 are set in a misaligned position (not shown in the figure), because the through holes 171 of the two guide plates 170 can be used for the flexible inorganic material layer 110F and the metal The microstructure 120F passes through, and cooperates with the offset arrangement of the plurality of guide plates 170 to effectively fix the probe and adjust the contact direction of the probe.

Moreover, in this embodiment, the material of the flexible inorganic material layer 110F includes glass, ceramic or silicon wafer, but not limited thereto. In this embodiment, the material of the metal microstructure 120F includes copper, nickel, nickel-cobalt-phosphorus, nickel-cobalt, nickel-manganese or rhodium-ruthenium alloy, but not limited thereto. In this embodiment, the circuit board 130F includes a printed circuit board or a ceramic circuit board, but not limited thereto. In this embodiment, the material of each guide plate 170 is non-conductive, including plastic or ceramics, but not limited thereto. In this embodiment, the material of the protruding portion 122F of the metal microstructure 120F includes nickel-cobalt-phosphorus, nickel-cobalt, nickel-manganese or rhodium-ruthenium alloy, but not limited thereto. In other embodiments, the metal microstructure 120F may not include the protrusion 122F. When the metal microstructure 120F does not have the protrusion 122F, the material of the metal microstructure 120F includes nickel-cobalt, nickel-manganese or rhodium-ruthenium alloy, but not in the form of This is the limit.

For example, in this embodiment, the metal microstructure 120F is suitable for contacting the object under test 50 for testing the object under test 50, and the object under test 50 is, for example, an integrated circuit or a crystal grain on a semiconductor wafer, but This is not the limit. The circuit board 130F is, for example, electrically connected to a testing machine (not shown) that generates the test signal TS, but not limited thereto. That is to say, in this embodiment, the probe card 100F is, for example, provided by a testing machine (not shown) with a test signal TS to test an object under test 50 through the probe card 100F, but it is not limited thereto.

It is worth mentioning that, in this embodiment, since the metal microstructure 120F is disposed and covered on the upper surface 111F, the lower surface 112F, and the second side surface 114F of the flexible inorganic material layer 110F, the metal microstructure 120F can be subjected to The support of the flexible inorganic material layer 110F makes the probes of the probe card 100F have good strength and elasticity and are not easily deformed. Accordingly, compared with the prior art probes made of metal, which are prone to permanent deformation and failure due to force deformation when the pitch and needle width are reduced, the probes of the probe card 100F in this embodiment can be The arrangement of the inorganic material layer 110F enables the probes of the probe card 100F to still have good strength and elasticity.

Generally, the yield strength of metal materials used to make probes is low (about 70 MPa~300 MPa), so after being made into tiny vertical probes, it is easy to cause permanent deformation due to force bending of the probes . In this embodiment, the material of the flexible inorganic material layer 110F has sufficient yield strength to support the metal microstructure 120F. In one embodiment, the yield strength of the material of the flexible inorganic material layer 110F is greater than 500 MPa, and the Young's modulus of the material of the flexible inorganic material layer 110F is greater than 50 GPa, but not necessarily limit. In one embodiment, the yield strength of the material of the flexible inorganic material layer 110F is, for example, 500 MPa to 1200 MPa, and the Young's modulus of the material of the flexible inorganic material layer 110F is, for example, 50 GPa to 400 GPa.

FIG. 9 is a partially enlarged side cross-sectional schematic diagram of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 8B and FIG. 9 at the same time. The probe card 100G in this embodiment is similar to the probe card 100F in FIG. 8B , but it should be noted that the metal microstructure 120G in FIG. 9 .

Please refer to FIG. 9 , in this embodiment, the probe card 100G includes a flexible inorganic material layer 110F, a metal microstructure 120G and a circuit board 130F. Here, the probes of the probe card 100G are composed of the flexible inorganic material layer 110F and the metal microstructure 120G, which are suitable for transmitting the test signal TS.

In detail, in this embodiment, the metal microstructure 120G is disposed and covered on the upper surface 111F, the lower surface 112F, the first side surface 113F and the second side surface 114F of the flexible inorganic material layer 110F, and has a connection end 121G. The circuit board 130F is connected to the connection terminal 121G along the direction parallel to the Z axis, and the test signal TS is adapted to be conducted to the circuit board 130F through the metal microstructure 120G.

In this embodiment, the probe card 100G further includes a plurality of guide plates 170 , and the metal microstructure 120G includes a protrusion 122G. The design of the guide plate 170 and the protruding portion 122G is similar to that of the embodiment shown in FIG. 8B , and will not be repeated here.

In this embodiment, since the metal microstructure 120G is disposed and covered on the upper surface 111F, the lower surface 112F, the first side surface 113F, and the second side surface 114F of the flexible inorganic material layer 110F, the metal microstructure 120G can be subjected to The support of the flexible inorganic material layer 110F makes the probes of the probe card 100G have good strength and elasticity and are not easily deformed.

FIG. 10 is a partially enlarged side cross-sectional schematic view of a probe card according to another embodiment of the present disclosure. Please refer to FIG. 8B and FIG. 10 at the same time. The probe card 100H of this embodiment is similar to the probe card 100F in FIG. 8B , but it should be noted that the metal microstructure 120H in FIG. 10 .

Please refer to FIG. 10 , in this embodiment, the probe card 100H includes a flexible inorganic material layer 110F, a metal microstructure 120H and a circuit board 130F. Here, the probes of the probe card 100H are composed of the flexible inorganic material layer 110F and the metal microstructure 120H, which are suitable for transmitting the test signal TS.

In detail, in this embodiment, the metal microstructure 120H is disposed on the second side surface 114F of the flexible inorganic material layer 110F, and has a connection end 121H. The circuit board 130F is connected to the connection terminal 121H along the direction parallel to the Z axis, and the test signal TS is adapted to be conducted to the circuit board 130F through the metal microstructure 120H.

In this embodiment, the probe card 100H further includes a plurality of guide plates 170 , and the metal microstructure 120H includes a protrusion 122H. The design of the guide plate 170 and the protruding portion 122H is similar to that of the embodiment shown in FIG. 8B , and will not be repeated here.

In this embodiment, since the metal microstructure 120H is disposed on the second side surface 114F of the flexible inorganic material layer 110F, the metal microstructure 120H can be supported by the flexible inorganic material layer 110F, so that the probes of the probe card 100H It has good strength and elasticity and is not easy to deform.

To sum up, in the design of the probe card of the present disclosure, since the metal microstructure is arranged on the flexible inorganic material layer, and the test signal can be conducted to the circuit board along the metal microstructure, the metal microstructure is on the side to be tested. The object can be supported by the flexible inorganic material layer, so that the probe has good strength and elasticity and is not easy to deform. Accordingly, compared with the probes made of metal in the prior art, which are prone to permanent deformation and failure due to force deformation when the pitch and pin width are reduced, the probes of the probe card disclosed in the present disclosure can be made of flexible inorganic The arrangement of the material layer enables the probe to still have good strength and elasticity, thereby increasing the service life of the probe card and improving the test reliability of the probe card.

Although the present disclosure has been disclosed above with embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present disclosure. The scope of protection of this disclosure should be defined by the scope of the appended patent application.

50: The object to be tested

100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H: probe card

110, 110B, 110F: flexible inorganic material layer

111: first surface

112: second surface

113: Body Department

114: finger fork

115: via hole

116: first side wall

117: second side wall

111F: upper surface

112F: lower surface

113F: first side surface

114F: second side surface

120, 120B, 120C, 120D, 120E, 120F, 120G, 120H: metal microstructure

121:Metal substructure

122, 123D, 122F, 122G, 122H: protruding part

123: third surface

121D, 121E: the first microstructure

122D, 122E: second microstructure

121F, 121G, 121H: connection end

130, 130A, 130F: circuit board

131A: Horizontal plane

132A: inclined surface

133: Pad

140: bonding layer

150: the first wire layer

160: Second wire layer

170: guide plate

171: through hole

TS: test signal

T1, T2: Thickness

L1: length

D1, D2: distance

E1: first end

E2: second end

X-Y-Z: Cartesian coordinates

FIG. 1 is a schematic side view of a probe card according to an embodiment of the present disclosure. FIG. 2 is a schematic perspective view of the probe card in FIG. 1 . FIG. 3 is a schematic side view of a probe card according to another embodiment of the present disclosure. FIG. 4 is a schematic side view of a probe card according to another embodiment of the present disclosure. FIG. 5 is a schematic side view of a probe card according to another embodiment of the present disclosure. FIG. 6 is a schematic side view of a probe card according to another embodiment of the present disclosure. FIG. 7 is a schematic side view of a probe card according to another embodiment of the present disclosure. FIG. 8A is a schematic side sectional view of a probe card according to another embodiment of the present disclosure. FIG. 8B is a partially enlarged schematic view of the probe card in FIG. 8A . FIG. 9 is a partially enlarged side cross-sectional schematic diagram of a probe card according to another embodiment of the present disclosure. FIG. 10 is a partially enlarged side cross-sectional schematic view of a probe card according to another embodiment of the present disclosure.

100: probe card

110: flexible inorganic material layer

111: first surface

112: second surface

115: via hole

120:Metal microstructure

122: protruding part

123: third surface

130: circuit board

133: Pad

140: bonding layer

TS: test signal

T1: Thickness

L1: Length

X-Y-Z: Cartesian coordinates

Claims (17)

A probe card, comprising: a flexible inorganic material layer, having a first surface and a second surface opposite; a metal microstructure, arranged on the first surface; and a circuit board, arranged on the second surface On the surface, the circuit board is electrically connected to the metal microstructure, and a test signal is suitable for conduction to the circuit board through the metal microstructure; wherein, the yield strength of the material of the flexible inorganic material layer is greater than 500MPa or the flexible The Young's modulus of the material of the flexible inorganic material layer is greater than 50 GPa, wherein the material of the flexible inorganic material layer includes glass or ceramics, wherein the thickness of the flexible inorganic material layer is between 30 microns and 300 microns. The probe card as claimed in item 1, wherein the flexible inorganic material layer includes a body portion and a plurality of fork portions, the metal microstructure includes a plurality of metal substructures, and the metal substructures are corresponding to and connected to The prongs are connected to one side of the main body, and each metal substructure is adapted to extend toward the main body along a direction with the corresponding prongs. The probe card as claimed in claim 2, further comprising: a via hole, located at the body portion of the flexible inorganic material layer and passing through the first surface and the second surface, the via hole is connected to each of the metal sub-surfaces structure and the circuit board, and each of the metal substructures is disposed on the first surface and the via hole, and the test signal is conducted to the circuit board through the metal microstructure and along the via hole. The probe card as claimed in item 2, wherein the metal microstructure includes a plurality of protrusions, each of which is disposed on the corresponding metal substructure and is located at a first position relative to the first surface Three surfaces. The probe card according to claim 1, further comprising: a first wire layer disposed on the second surface of the flexible inorganic material layer and on a first side wall of the flexible inorganic material layer close to the circuit board , and the first wire layer connects the metal microstructure and the circuit board, wherein the test signal passes through the metal microstructure and conducts to the circuit board through the first wire layer. The probe card according to claim 1, further comprising: a second wire layer disposed on the second surface of the flexible inorganic material layer and a second side wall of the flexible inorganic material layer away from the circuit board and the second wire layer connects the metal microstructure and the circuit board, wherein the test signal passes through the metal microstructure and conducts to the circuit board through the second wire layer. The probe card as claimed in claim 1, wherein the metal microstructure includes a protrusion, and the protrusion is disposed corresponding to one end of the flexible inorganic material layer. The probe card according to claim 7, wherein the material of the protruding portion includes nickel-cobalt-phosphorus, nickel-cobalt, nickel-manganese or rhodium-ruthenium alloy. The probe card as claimed in item 1, wherein the circuit board has a horizontal surface and an inclined surface opposite to each other, the second surface of the flexible inorganic material layer is connected to the inclined surface of the circuit board, and the flexible inorganic material layer layer with respect to the second surface has an opposite A first end and a second end, and the difference between the vertical distance from the first end to the horizontal plane and the vertical distance from the second end to the horizontal plane is between 50 microns and 500 microns. The probe card according to claim 9, wherein the degree of inclination of the inclined surface relative to the horizontal plane is 1.5 degrees to 6 degrees. The probe card as described in claim 1 further includes a bonding layer between the flexible inorganic material layer and the circuit board, and the material of the bonding layer includes ABF (Ajinomoto Build-up Film), tin, tin alloy or silver glue. The probe card according to claim 1, wherein the ratio of the length of the flexible inorganic material layer to the thickness of the flexible inorganic material layer is between 9 and 30. A probe card, comprising: a flexible inorganic material layer having multiple surfaces; a metal microstructure disposed on at least one of the surfaces and having a connection end; a circuit board connected to the connection end, wherein A test signal is suitable for conducting to the circuit board through the metal microstructure; and at least two guide plates, each of which has a plurality of through holes, and the flexible inorganic material layer and the metal microstructure pass through each of the guide plates The through holes of the plate; wherein, the yield strength of the material of the flexible inorganic material layer is greater than 500MPa or the Young’s modulus of the material of the flexible inorganic material layer is greater than 50GPa, wherein the material of the flexible inorganic material layer includes glass or ceramics. The probe card as claimed in claim 13, wherein the metal microstructure includes a protrusion, and the protrusion is at an end opposite to the connecting end. The probe card as claimed in claim 14, wherein the material of the protrusion includes nickel-cobalt-phosphorus, nickel-cobalt, nickel-manganese or rhodium-ruthenium alloy. The probe card as claimed in claim 14, wherein the surfaces of the flexible inorganic material layer include: an upper surface and a lower surface opposite to each other, and a first side surface and a first side surface connected to the upper surface and the lower surface On the second side surface, the metal microstructure is arranged and covered on the upper surface, the lower surface and the second side surface. The probe card as claimed in claim 14, wherein the surfaces of the flexible inorganic material layer include: an upper surface and a lower surface opposite to each other, and a first side surface and a first side surface connected to the upper surface and the lower surface On the second side surface, the metal microstructure is arranged and covered on the upper surface, the lower surface, the first side surface and the second side surface.

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