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TWI799176B - Water cooling plate assembly - Google Patents

Water cooling plate assembly Download PDF

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Publication number
TWI799176B
TWI799176B TW111108487A TW111108487A TWI799176B TW I799176 B TWI799176 B TW I799176B TW 111108487 A TW111108487 A TW 111108487A TW 111108487 A TW111108487 A TW 111108487A TW I799176 B TWI799176 B TW I799176B
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Taiwan
Prior art keywords
water
cover
plate assembly
cover body
water inlet
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Application number
TW111108487A
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Chinese (zh)
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TW202336557A (en
Inventor
陳雪鋒
項品義
王立勝
季懿棟
施燕華
英揚
張小偉
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英業達股份有限公司
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Publication of TW202336557A publication Critical patent/TW202336557A/en

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Abstract

A water cooling plate assembly includes a base, a cover, a water inlet connector and a water outlet connector. The cover is installed on the base, and the cover and the base together surround a liquid flow space. The cover has a water inlet and a water outlet. In the longitudinal direction of the cover, the water inlet and the water outlet are respectively located on opposite sides of the cover. The water inlet joint is installed at the water inlet of the cover. The water outlet joint is installed on the water outlet of the cover.

Description

水冷板組件Water-cooled plate assembly

本發明係關於一種散熱組件,特別是一種水冷板組件。 The present invention relates to a cooling assembly, in particular to a water cooling plate assembly.

一般來說,電腦主要具有機殼、電源供應器、主機板、中央處理器、顯示卡及擴充卡。電源供應器與主機板裝設於機殼內,且中央處理器、顯示卡及擴充卡裝設於主機板上。當電腦在運作時,中央處理器負責進行資料運算,顯示卡負責進行影像運算,兩者皆會產生大量的熱量。因此,電腦廠商一般會加裝風扇或水冷散熱器來對中央處理器或顯示卡進行散熱。 Generally speaking, a computer mainly includes a casing, a power supply, a motherboard, a central processing unit, a display card, and an expansion card. The power supply and the motherboard are installed in the casing, and the central processing unit, display card and expansion card are installed on the motherboard. When the computer is running, the central processing unit is responsible for data calculation, and the display card is responsible for image calculation, both of which will generate a lot of heat. Therefore, computer manufacturers generally install fans or water-cooling radiators to dissipate heat from the central processing unit or graphics card.

以水冷散熱器為例,水冷散熱器一般包含水冷頭、水冷排及泵浦。水冷頭熱接觸於中央處理器或顯示卡。水冷排用以進行散熱。水冷頭、水冷排及泵浦相連而構成一循環通道。循環通道內儲存有冷卻液。泵浦驅動冷卻液流過水冷頭與水冷排而構成一冷卻循環。當冷卻液進行冷卻循環時,冷卻液會將中央處理器或顯示卡所產生的熱量轉移至水冷排,並經由水冷排進行散熱。然而,目前的水冷散熱器對中央處理器、顯示卡等熱源的散熱效率仍有不足,因此,如何進一步提升水冷散 熱器對中央處理器、顯示卡等熱源的散熱效率,便成為設計上的一大課題。 Taking a water-cooled radiator as an example, a water-cooled radiator generally includes a water-cooled head, a water-cooled radiator, and a pump. The water block is in thermal contact with the CPU or graphics card. Water cooling radiators are used for heat dissipation. The water cooling head, the water cooling row and the pump are connected to form a circulation channel. Coolant is stored in the circulation channel. The pump drives the coolant to flow through the water-cooling head and the water-cooling row to form a cooling cycle. When the coolant is in the cooling cycle, the coolant will transfer the heat generated by the CPU or graphics card to the water cooling radiator, and dissipate heat through the water cooling radiator. However, the heat dissipation efficiency of the current water-cooled radiators for heat sources such as central processing units and display cards is still insufficient. Therefore, how to further improve the efficiency of water-cooled radiators The heat dissipation efficiency of the heat sink to heat sources such as the central processing unit and the graphics card has become a major design issue.

本發明在於提供一種水冷板組件,藉以提升水冷板組件對中央處理器等熱源的散熱效率。 The present invention is to provide a water-cooled plate assembly, so as to improve the heat dissipation efficiency of the water-cooled plate assembly to heat sources such as a central processing unit.

本發明之一實施例所揭露之水冷板組件包含一基座、一罩體、一入水接頭及一出水接頭。罩體裝設於基座,且罩體與基座共同圍繞出一液流空間。罩體具有一入水口及一出水口。在罩體之長邊方向上,入水口與出水口分別位於罩體之相對兩側。入水接頭裝設於罩體之入水口。出水接頭裝設於罩體之出水口。 A water-cooled plate assembly disclosed in an embodiment of the present invention includes a base, a cover, a water inlet joint and a water outlet joint. The cover body is installed on the base, and the cover body and the base jointly surround a liquid flow space. The cover has a water inlet and a water outlet. In the direction of the long side of the cover body, the water inlet and the water outlet are respectively located on opposite sides of the cover body. The water inlet joint is installed at the water inlet of the cover body. The water outlet connector is installed at the water outlet of the cover body.

根據上述實施例之水冷板組件,透過將入水口與出水口改分別位於罩體之相對兩側,以提升冷卻液對基座的散熱效果,進而提升水冷板組件的整體散熱效果。 According to the water-cooled plate assembly of the above-mentioned embodiment, by changing the water inlet and the water outlet to be respectively located on opposite sides of the cover body, the heat dissipation effect of the cooling liquid on the base is improved, thereby improving the overall heat dissipation effect of the water-cooled plate assembly.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

10:水冷板組件 10: Water-cooled plate assembly

100:基座 100: base

110:載板 110: carrier board

120:鰭片 120: fins

121:第一鰭片組 121: The first fin group

122:第二鰭片組 122: The second fin group

200:罩體 200: cover body

210:覆蓋板 210: Overlay board

211:入水口 211: water inlet

212:出水口 212: water outlet

220:環形側板 220: ring side plate

230、240:擋流板 230, 240: Baffle

300:入水接頭 300: water inlet connector

400:出水接頭 400: Water outlet connector

500:組裝框 500: Assembly box

510:開槽 510: slotting

600:緊固件 600: Fasteners

C:通道 C: channel

S:液流空間 S: liquid flow space

W1、W2:寬度 W1, W2: Width

F1:長邊方向 F1: Long side direction

F2:短邊方向 F2: short side direction

E1:中央處 E1: Central Office

E2:端處 E2: end

H1、H2:高度 H1, H2: Height

圖1為根據本發明第一實施例所述之水冷板組件的立體示意圖。 FIG. 1 is a schematic perspective view of a water-cooled plate assembly according to a first embodiment of the present invention.

圖2為圖1的分解示意圖。 FIG. 2 is an exploded schematic diagram of FIG. 1 .

圖3為圖1的剖面示意圖。 FIG. 3 is a schematic cross-sectional view of FIG. 1 .

請參閱圖1至圖3。圖1為根據本發明第一實施例所述之水冷板組件10的立體示意圖。圖2為圖1的分解示意圖。圖3為圖1的剖面示意圖。 See Figures 1 through 3. FIG. 1 is a schematic perspective view of a water-cooled plate assembly 10 according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1 . FIG. 3 is a schematic cross-sectional view of FIG. 1 .

本實施例之水冷板組件10包含一基座100、一罩體200、一入水接頭300及一出水接頭400。罩體200裝設於基座100,且罩體200與基座100共同圍繞出一液流空間S。液流空間S用以存放冷卻液。罩體200具有一入水口211及一出水口212,在罩體200之長邊方向F1上,入水口211與出水口212分別位於罩體200之相對兩側。 The water cooling plate assembly 10 of this embodiment includes a base 100 , a cover 200 , a water inlet joint 300 and a water outlet joint 400 . The cover 200 is installed on the base 100 , and the cover 200 and the base 100 together surround a liquid flow space S. The liquid flow space S is used to store cooling liquid. The cover 200 has a water inlet 211 and a water outlet 212 , and the water inlet 211 and the water outlet 212 are respectively located on opposite sides of the cover 200 in the longitudinal direction F1 of the cover 200 .

詳細來說,基座100包含一載板110及多個鰭片120。這些鰭片120凸出於載板110,並位於液流空間S。這些鰭片120沿罩體200之長邊方向F1延伸。這些鰭片120包含一第一鰭片組121及二第二鰭片組122。第一鰭片組121介於二第二鰭片組122之間,且第一鰭片組121與二第二鰭片組122之間各保持一通道C。 In detail, the base 100 includes a carrier 110 and a plurality of fins 120 . These fins 120 protrude from the carrier plate 110 and are located in the liquid flow space S. As shown in FIG. These fins 120 extend along the longitudinal direction F1 of the cover body 200 . The fins 120 include a first fin group 121 and two second fin groups 122 . The first fin set 121 is located between the two second fin sets 122 , and a channel C is maintained between the first fin set 121 and the two second fin sets 122 .

在本實施例中,第一鰭片組121的寬度W1大於二第二鰭片組122的寬度W2,但並不以此為限。在其他實施例中,第一鰭片組的寬度亦可以小於二第二鰭片組的寬度。 In this embodiment, the width W1 of the first fin group 121 is greater than the width W2 of the second fin group 122 , but it is not limited thereto. In other embodiments, the width of the first fin group may also be smaller than the widths of the two second fin groups.

罩體200包含一覆蓋板210、一環形側板220及二擋流板230、240。入水口211與出水口212位於覆蓋板210。在罩體200之長邊方向F1上,入水口211與出水口212位於覆蓋板210的相對兩側處,以及在罩體200之短邊方向F2上,入水口211與出水口212位於覆蓋板210的 中央處E1。環形側板220連接於覆蓋板210之周緣。二擋流板230、240凸出於覆蓋板210,並位於液流空間S。二擋流板230、240沿罩體200的短邊方向F2延伸,且在罩體200之短邊方向F2上,二擋流板230、240凸出覆蓋板210的高度由兩側處朝中央處E1遞減。如此一來,在罩體200之短邊方向F2上,液流空間S於二擋流板230、240處的高度由兩端處E2朝中央處E1遞增。也就是說,於二擋流板230、240處,液流空間S之中央處E1的高度H1大於兩端處E2的高度H2。 The cover body 200 includes a cover plate 210 , an annular side plate 220 and two baffle plates 230 , 240 . The water inlet 211 and the water outlet 212 are located on the cover plate 210 . On the long side direction F1 of the cover 200, the water inlet 211 and the water outlet 212 are located on opposite sides of the cover plate 210, and on the short side direction F2 of the cover body 200, the water inlet 211 and the water outlet 212 are located on the cover plate 210's Central Office E1. The annular side plate 220 is connected to the periphery of the cover plate 210 . The two baffles 230 and 240 protrude from the cover plate 210 and are located in the liquid flow space S. As shown in FIG. The two baffles 230, 240 extend along the short side direction F2 of the cover body 200, and on the short side direction F2 of the cover body 200, the height of the two baffle plates 230, 240 protruding from the cover plate 210 is from both sides to the center. Decrease at E1. In this way, in the short side direction F2 of the cover body 200 , the height of the liquid flow space S at the two baffles 230 and 240 gradually increases from the two ends E2 to the center E1 . That is to say, at the two baffles 230 and 240 , the height H1 of the central part E1 of the liquid flow space S is greater than the height H2 of the two ends E2 .

入水接頭300裝設於罩體200之入水口211。出水接頭400裝設於罩體200之出水口212。也就是說,在罩體200之短邊方向F2上,入水接頭300與出水接頭400位於罩體200的中央處E1。 The water inlet joint 300 is installed at the water inlet 211 of the cover body 200 . The water outlet joint 400 is installed at the water outlet 212 of the cover body 200 . That is to say, in the short side direction F2 of the cover body 200 , the water inlet joint 300 and the water outlet joint 400 are located at the center E1 of the cover body 200 .

在本實施例中,水冷板組件10還可以包含一組裝框500及多個多個緊固件600。組裝框500具有一開槽510。組裝框500疊設於基座100之載板110,且罩體200與鰭片120位於開槽510,以令組裝框500將罩體200圍繞於內。緊固件600可轉動地裝設於組裝框500,以例如將組裝框500鎖附於主機板(未繪示)。此外,當緊固件600將組裝框500鎖附於主機板時,水冷板組件10之基座100例如熱接觸於中央處E1理器等熱源。 In this embodiment, the water-cooled plate assembly 10 may further include an assembly frame 500 and a plurality of fasteners 600 . The assembly frame 500 has a slot 510 . The assembly frame 500 is stacked on the carrier plate 110 of the base 100 , and the cover body 200 and the fins 120 are located in the slot 510 so that the assembly frame 500 surrounds the cover body 200 inside. The fastener 600 is rotatably mounted on the assembly frame 500 , for example, to lock the assembly frame 500 to the main board (not shown). In addition, when the fastener 600 locks the assembly frame 500 to the mainboard, the base 100 of the water-cooled plate assembly 10 is in thermal contact with heat sources such as the central processor E1 , for example.

根據上述實施例之水冷板組件,透過將入水口與出水口改分別位於罩體之相對兩側,以提升冷卻液對基座的散熱效果,進而提升水冷板組件的整體散熱效果。 According to the water-cooled plate assembly of the above-mentioned embodiment, by changing the water inlet and the water outlet to be respectively located on opposite sides of the cover body, the heat dissipation effect of the cooling liquid on the base is improved, thereby improving the overall heat dissipation effect of the water-cooled plate assembly.

此外,透過擋流板之設計讓二擋流板處,液流空間之中央處的高度大於兩端處的高度,來讓冷卻液之流速調節成中央處流速最 大,且逐漸向兩端減小的趨勢,進而進一步提升冷卻液與水冷板組件的熱交換效果。 In addition, through the design of the baffle, the height of the center of the liquid flow space at the second baffle is greater than the height of the two ends, so that the flow rate of the coolant can be adjusted to the highest flow rate at the center. large, and gradually decreases toward both ends, thereby further improving the heat exchange effect between the cooling liquid and the water-cooled plate assembly.

雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10:水冷板組件 10: Water-cooled plate assembly

100:基座 100: base

110:載板 110: carrier board

120:鰭片 120: fins

121:第一鰭片組 121: The first fin group

122:第二鰭片組 122: The second fin group

200:罩體 200: cover body

210:覆蓋板 210: Overlay board

211:入水口 211: water inlet

212:出水口 212: water outlet

220:環形側板 220: ring side panel

230、240:擋流板 230, 240: Baffle

300:入水接頭 300: water inlet connector

400:出水接頭 400: Water outlet connector

500:組裝框 500: Assembly box

510:開槽 510: slotting

600:緊固件 600: Fasteners

C:通道 C: channel

W1、W2:寬度 W1, W2: Width

Claims (9)

一種水冷板組件,包含:一基座;一罩體,裝設於該基座,且該罩體與該基座共同圍繞出一液流空間,該罩體具有一入水口及一出水口,在該罩體之長邊方向上,該入水口與該出水口分別位於該罩體之相對兩側;一入水接頭,裝設於該罩體之該入水口;以及一出水接頭,裝設於該罩體之該出水口;其中,在該罩體之短邊方向上,該液流空間部分的高度由兩端處朝中央處遞增。 A water-cooled plate assembly, comprising: a base; a cover installed on the base, and the cover and the base jointly surround a liquid flow space, the cover has a water inlet and a water outlet, In the long side direction of the cover body, the water inlet and the water outlet are respectively located on opposite sides of the cover body; a water inlet joint is installed at the water inlet of the cover body; and a water outlet joint is installed at the water inlet of the cover body The water outlet of the cover body; wherein, in the direction of the short side of the cover body, the height of the liquid flow space part gradually increases from the two ends to the center. 如請求項1所述之水冷板組件,更包含一組裝框,該組裝框疊設於該基座,並將該罩體圍繞於內。 The water-cooled plate assembly as described in claim 1 further includes an assembly frame, which is stacked on the base and surrounds the cover. 如請求項2所述之水冷板組件,更包含多個緊固件,可轉動地裝設於該組裝框。 The water-cooled plate assembly as described in claim 2 further includes a plurality of fasteners rotatably mounted on the assembly frame. 如請求項1所述之水冷板組件,其中該基座包含一載板及多個鰭片,該些鰭片凸出於該載板,並位於該液流空間。 The water-cooled plate assembly as claimed in claim 1, wherein the base includes a carrier plate and a plurality of fins, and the fins protrude from the carrier plate and are located in the liquid flow space. 如請求項4所述之水冷板組件,其中該些鰭片沿該罩體之長邊方向延伸。 The water-cooled plate assembly as claimed in claim 4, wherein the fins extend along the long side of the cover. 如請求項4所述之水冷板組件,其中該些鰭片包含一第一鰭片組及二第二鰭片組,該第一鰭片組介於該二第二鰭片組之間,且該第一鰭片組與該二第二鰭片組之間各保持一通道。 The water-cooled plate assembly as described in claim 4, wherein the fins include a first fin group and two second fin groups, the first fin group is between the two second fin groups, and A passage is maintained between the first fin group and the two second fin groups. 如請求項6所述之水冷板組件,其中該第一鰭片組的寬度大於該二第二鰭片組的寬度。 The water-cooled plate assembly as claimed in claim 6, wherein the width of the first fin group is greater than the width of the two second fin groups. 如請求項1所述之水冷板組件,其中在該罩體之短邊方向上,該入水接頭位於該罩體的中央處。 The water-cooled plate assembly as claimed in claim 1, wherein the water inlet joint is located at the center of the cover body in the direction of the short side of the cover body. 如請求項8所述之水冷板組件,其中在該罩體之短邊方向上,該出水接頭位於該罩體的中央處。 The water-cooled plate assembly as claimed in claim 8, wherein in the direction of the short side of the cover, the water outlet joint is located at the center of the cover.
TW111108487A 2022-03-09 2022-03-09 Water cooling plate assembly TWI799176B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060050483A1 (en) * 2004-09-08 2006-03-09 Wilson Michael J Liquid cooled heat sink with cold plate retention mechanism
TW201011508A (en) * 2008-09-05 2010-03-16 Ama Precision Inc Water jacket
TWM455153U (en) * 2013-01-03 2013-06-11 Enermax Technology Corp Heat exchange module
TWM616320U (en) * 2021-03-17 2021-09-01 奇鋐科技股份有限公司 Reinforced structure of water-cooling block
CN214795861U (en) * 2021-04-29 2021-11-19 上海热普电子科技有限公司 Multi-platform CPU universal cold plate based on liquid cooling solution

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060050483A1 (en) * 2004-09-08 2006-03-09 Wilson Michael J Liquid cooled heat sink with cold plate retention mechanism
TW201011508A (en) * 2008-09-05 2010-03-16 Ama Precision Inc Water jacket
TWM455153U (en) * 2013-01-03 2013-06-11 Enermax Technology Corp Heat exchange module
TWM616320U (en) * 2021-03-17 2021-09-01 奇鋐科技股份有限公司 Reinforced structure of water-cooling block
CN214795861U (en) * 2021-04-29 2021-11-19 上海热普电子科技有限公司 Multi-platform CPU universal cold plate based on liquid cooling solution

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