TWI799176B - Water cooling plate assembly - Google Patents
Water cooling plate assembly Download PDFInfo
- Publication number
- TWI799176B TWI799176B TW111108487A TW111108487A TWI799176B TW I799176 B TWI799176 B TW I799176B TW 111108487 A TW111108487 A TW 111108487A TW 111108487 A TW111108487 A TW 111108487A TW I799176 B TWI799176 B TW I799176B
- Authority
- TW
- Taiwan
- Prior art keywords
- water
- cover
- plate assembly
- cover body
- water inlet
- Prior art date
Links
Images
Landscapes
- Housings, Intake/Discharge, And Installation Of Fluid Heaters (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Table Devices Or Equipment (AREA)
- Secondary Cells (AREA)
Abstract
Description
本發明係關於一種散熱組件,特別是一種水冷板組件。 The present invention relates to a cooling assembly, in particular to a water cooling plate assembly.
一般來說,電腦主要具有機殼、電源供應器、主機板、中央處理器、顯示卡及擴充卡。電源供應器與主機板裝設於機殼內,且中央處理器、顯示卡及擴充卡裝設於主機板上。當電腦在運作時,中央處理器負責進行資料運算,顯示卡負責進行影像運算,兩者皆會產生大量的熱量。因此,電腦廠商一般會加裝風扇或水冷散熱器來對中央處理器或顯示卡進行散熱。 Generally speaking, a computer mainly includes a casing, a power supply, a motherboard, a central processing unit, a display card, and an expansion card. The power supply and the motherboard are installed in the casing, and the central processing unit, display card and expansion card are installed on the motherboard. When the computer is running, the central processing unit is responsible for data calculation, and the display card is responsible for image calculation, both of which will generate a lot of heat. Therefore, computer manufacturers generally install fans or water-cooling radiators to dissipate heat from the central processing unit or graphics card.
以水冷散熱器為例,水冷散熱器一般包含水冷頭、水冷排及泵浦。水冷頭熱接觸於中央處理器或顯示卡。水冷排用以進行散熱。水冷頭、水冷排及泵浦相連而構成一循環通道。循環通道內儲存有冷卻液。泵浦驅動冷卻液流過水冷頭與水冷排而構成一冷卻循環。當冷卻液進行冷卻循環時,冷卻液會將中央處理器或顯示卡所產生的熱量轉移至水冷排,並經由水冷排進行散熱。然而,目前的水冷散熱器對中央處理器、顯示卡等熱源的散熱效率仍有不足,因此,如何進一步提升水冷散 熱器對中央處理器、顯示卡等熱源的散熱效率,便成為設計上的一大課題。 Taking a water-cooled radiator as an example, a water-cooled radiator generally includes a water-cooled head, a water-cooled radiator, and a pump. The water block is in thermal contact with the CPU or graphics card. Water cooling radiators are used for heat dissipation. The water cooling head, the water cooling row and the pump are connected to form a circulation channel. Coolant is stored in the circulation channel. The pump drives the coolant to flow through the water-cooling head and the water-cooling row to form a cooling cycle. When the coolant is in the cooling cycle, the coolant will transfer the heat generated by the CPU or graphics card to the water cooling radiator, and dissipate heat through the water cooling radiator. However, the heat dissipation efficiency of the current water-cooled radiators for heat sources such as central processing units and display cards is still insufficient. Therefore, how to further improve the efficiency of water-cooled radiators The heat dissipation efficiency of the heat sink to heat sources such as the central processing unit and the graphics card has become a major design issue.
本發明在於提供一種水冷板組件,藉以提升水冷板組件對中央處理器等熱源的散熱效率。 The present invention is to provide a water-cooled plate assembly, so as to improve the heat dissipation efficiency of the water-cooled plate assembly to heat sources such as a central processing unit.
本發明之一實施例所揭露之水冷板組件包含一基座、一罩體、一入水接頭及一出水接頭。罩體裝設於基座,且罩體與基座共同圍繞出一液流空間。罩體具有一入水口及一出水口。在罩體之長邊方向上,入水口與出水口分別位於罩體之相對兩側。入水接頭裝設於罩體之入水口。出水接頭裝設於罩體之出水口。 A water-cooled plate assembly disclosed in an embodiment of the present invention includes a base, a cover, a water inlet joint and a water outlet joint. The cover body is installed on the base, and the cover body and the base jointly surround a liquid flow space. The cover has a water inlet and a water outlet. In the direction of the long side of the cover body, the water inlet and the water outlet are respectively located on opposite sides of the cover body. The water inlet joint is installed at the water inlet of the cover body. The water outlet connector is installed at the water outlet of the cover body.
根據上述實施例之水冷板組件,透過將入水口與出水口改分別位於罩體之相對兩側,以提升冷卻液對基座的散熱效果,進而提升水冷板組件的整體散熱效果。 According to the water-cooled plate assembly of the above-mentioned embodiment, by changing the water inlet and the water outlet to be respectively located on opposite sides of the cover body, the heat dissipation effect of the cooling liquid on the base is improved, thereby improving the overall heat dissipation effect of the water-cooled plate assembly.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.
10:水冷板組件 10: Water-cooled plate assembly
100:基座 100: base
110:載板 110: carrier board
120:鰭片 120: fins
121:第一鰭片組 121: The first fin group
122:第二鰭片組 122: The second fin group
200:罩體 200: cover body
210:覆蓋板 210: Overlay board
211:入水口 211: water inlet
212:出水口 212: water outlet
220:環形側板 220: ring side plate
230、240:擋流板 230, 240: Baffle
300:入水接頭 300: water inlet connector
400:出水接頭 400: Water outlet connector
500:組裝框 500: Assembly box
510:開槽 510: slotting
600:緊固件 600: Fasteners
C:通道 C: channel
S:液流空間 S: liquid flow space
W1、W2:寬度 W1, W2: Width
F1:長邊方向 F1: Long side direction
F2:短邊方向 F2: short side direction
E1:中央處 E1: Central Office
E2:端處 E2: end
H1、H2:高度 H1, H2: Height
圖1為根據本發明第一實施例所述之水冷板組件的立體示意圖。 FIG. 1 is a schematic perspective view of a water-cooled plate assembly according to a first embodiment of the present invention.
圖2為圖1的分解示意圖。 FIG. 2 is an exploded schematic diagram of FIG. 1 .
圖3為圖1的剖面示意圖。 FIG. 3 is a schematic cross-sectional view of FIG. 1 .
請參閱圖1至圖3。圖1為根據本發明第一實施例所述之水冷板組件10的立體示意圖。圖2為圖1的分解示意圖。圖3為圖1的剖面示意圖。
See Figures 1 through 3. FIG. 1 is a schematic perspective view of a water-cooled
本實施例之水冷板組件10包含一基座100、一罩體200、一入水接頭300及一出水接頭400。罩體200裝設於基座100,且罩體200與基座100共同圍繞出一液流空間S。液流空間S用以存放冷卻液。罩體200具有一入水口211及一出水口212,在罩體200之長邊方向F1上,入水口211與出水口212分別位於罩體200之相對兩側。
The water
詳細來說,基座100包含一載板110及多個鰭片120。這些鰭片120凸出於載板110,並位於液流空間S。這些鰭片120沿罩體200之長邊方向F1延伸。這些鰭片120包含一第一鰭片組121及二第二鰭片組122。第一鰭片組121介於二第二鰭片組122之間,且第一鰭片組121與二第二鰭片組122之間各保持一通道C。
In detail, the
在本實施例中,第一鰭片組121的寬度W1大於二第二鰭片組122的寬度W2,但並不以此為限。在其他實施例中,第一鰭片組的寬度亦可以小於二第二鰭片組的寬度。
In this embodiment, the width W1 of the
罩體200包含一覆蓋板210、一環形側板220及二擋流板230、240。入水口211與出水口212位於覆蓋板210。在罩體200之長邊方向F1上,入水口211與出水口212位於覆蓋板210的相對兩側處,以及在罩體200之短邊方向F2上,入水口211與出水口212位於覆蓋板210的
中央處E1。環形側板220連接於覆蓋板210之周緣。二擋流板230、240凸出於覆蓋板210,並位於液流空間S。二擋流板230、240沿罩體200的短邊方向F2延伸,且在罩體200之短邊方向F2上,二擋流板230、240凸出覆蓋板210的高度由兩側處朝中央處E1遞減。如此一來,在罩體200之短邊方向F2上,液流空間S於二擋流板230、240處的高度由兩端處E2朝中央處E1遞增。也就是說,於二擋流板230、240處,液流空間S之中央處E1的高度H1大於兩端處E2的高度H2。
The
入水接頭300裝設於罩體200之入水口211。出水接頭400裝設於罩體200之出水口212。也就是說,在罩體200之短邊方向F2上,入水接頭300與出水接頭400位於罩體200的中央處E1。
The water inlet joint 300 is installed at the
在本實施例中,水冷板組件10還可以包含一組裝框500及多個多個緊固件600。組裝框500具有一開槽510。組裝框500疊設於基座100之載板110,且罩體200與鰭片120位於開槽510,以令組裝框500將罩體200圍繞於內。緊固件600可轉動地裝設於組裝框500,以例如將組裝框500鎖附於主機板(未繪示)。此外,當緊固件600將組裝框500鎖附於主機板時,水冷板組件10之基座100例如熱接觸於中央處E1理器等熱源。
In this embodiment, the water-cooled
根據上述實施例之水冷板組件,透過將入水口與出水口改分別位於罩體之相對兩側,以提升冷卻液對基座的散熱效果,進而提升水冷板組件的整體散熱效果。 According to the water-cooled plate assembly of the above-mentioned embodiment, by changing the water inlet and the water outlet to be respectively located on opposite sides of the cover body, the heat dissipation effect of the cooling liquid on the base is improved, thereby improving the overall heat dissipation effect of the water-cooled plate assembly.
此外,透過擋流板之設計讓二擋流板處,液流空間之中央處的高度大於兩端處的高度,來讓冷卻液之流速調節成中央處流速最 大,且逐漸向兩端減小的趨勢,進而進一步提升冷卻液與水冷板組件的熱交換效果。 In addition, through the design of the baffle, the height of the center of the liquid flow space at the second baffle is greater than the height of the two ends, so that the flow rate of the coolant can be adjusted to the highest flow rate at the center. large, and gradually decreases toward both ends, thereby further improving the heat exchange effect between the cooling liquid and the water-cooled plate assembly.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.
10:水冷板組件 10: Water-cooled plate assembly
100:基座 100: base
110:載板 110: carrier board
120:鰭片 120: fins
121:第一鰭片組 121: The first fin group
122:第二鰭片組 122: The second fin group
200:罩體 200: cover body
210:覆蓋板 210: Overlay board
211:入水口 211: water inlet
212:出水口 212: water outlet
220:環形側板 220: ring side panel
230、240:擋流板 230, 240: Baffle
300:入水接頭 300: water inlet connector
400:出水接頭 400: Water outlet connector
500:組裝框 500: Assembly box
510:開槽 510: slotting
600:緊固件 600: Fasteners
C:通道 C: channel
W1、W2:寬度 W1, W2: Width
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111108487A TWI799176B (en) | 2022-03-09 | 2022-03-09 | Water cooling plate assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111108487A TWI799176B (en) | 2022-03-09 | 2022-03-09 | Water cooling plate assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI799176B true TWI799176B (en) | 2023-04-11 |
TW202336557A TW202336557A (en) | 2023-09-16 |
Family
ID=86948630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111108487A TWI799176B (en) | 2022-03-09 | 2022-03-09 | Water cooling plate assembly |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI799176B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060050483A1 (en) * | 2004-09-08 | 2006-03-09 | Wilson Michael J | Liquid cooled heat sink with cold plate retention mechanism |
TW201011508A (en) * | 2008-09-05 | 2010-03-16 | Ama Precision Inc | Water jacket |
TWM455153U (en) * | 2013-01-03 | 2013-06-11 | Enermax Technology Corp | Heat exchange module |
TWM616320U (en) * | 2021-03-17 | 2021-09-01 | 奇鋐科技股份有限公司 | Reinforced structure of water-cooling block |
CN214795861U (en) * | 2021-04-29 | 2021-11-19 | 上海热普电子科技有限公司 | Multi-platform CPU universal cold plate based on liquid cooling solution |
-
2022
- 2022-03-09 TW TW111108487A patent/TWI799176B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060050483A1 (en) * | 2004-09-08 | 2006-03-09 | Wilson Michael J | Liquid cooled heat sink with cold plate retention mechanism |
TW201011508A (en) * | 2008-09-05 | 2010-03-16 | Ama Precision Inc | Water jacket |
TWM455153U (en) * | 2013-01-03 | 2013-06-11 | Enermax Technology Corp | Heat exchange module |
TWM616320U (en) * | 2021-03-17 | 2021-09-01 | 奇鋐科技股份有限公司 | Reinforced structure of water-cooling block |
CN214795861U (en) * | 2021-04-29 | 2021-11-19 | 上海热普电子科技有限公司 | Multi-platform CPU universal cold plate based on liquid cooling solution |
Also Published As
Publication number | Publication date |
---|---|
TW202336557A (en) | 2023-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI817607B (en) | Liquid cooling device | |
US20120103576A1 (en) | Integrated liquid cooling system | |
CN211718842U (en) | Liquid cooling type heat dissipation device | |
TWI399165B (en) | System for efficiently cooling a processor | |
US11755079B2 (en) | Computer device, casing, and water cooling heat dissipation device | |
CN114518795A (en) | Water cooling plate assembly | |
JPH0832262A (en) | Cooling module for lsi | |
US20230328923A1 (en) | Heat dissipation device | |
TWI799176B (en) | Water cooling plate assembly | |
TWI777653B (en) | Water cooling device and electronic device | |
CN117130447A (en) | Liquid cooling plate components and servers | |
CN216291992U (en) | Service device and bearing shell | |
US11259442B2 (en) | Adjustment structure for computer water cooling | |
TW201511660A (en) | Server | |
CN112437590A (en) | Novel heat dissipation device | |
CN216901562U (en) | Water-cooling heat dissipation power supply and computer | |
CN101311879A (en) | Heat radiation module and electronic device with same | |
TWM576675U (en) | Water-cooling type interface card | |
TWI771054B (en) | Server deivce | |
CN216527048U (en) | An efficient water cooling device | |
CN219179891U (en) | Split type water-cooling heat dissipation device | |
WO2022105306A1 (en) | Novel cooling apparatus | |
CN218181465U (en) | Radiating plate for radiating computer CPU | |
JP7176643B2 (en) | Electronic device cooling device, water-cooled information processing device, and electronic device cooling method | |
WO2022105305A1 (en) | Heat dissipation apparatus |