TW202336557A - Water cooling plate assembly - Google Patents
Water cooling plate assembly Download PDFInfo
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- TW202336557A TW202336557A TW111108487A TW111108487A TW202336557A TW 202336557 A TW202336557 A TW 202336557A TW 111108487 A TW111108487 A TW 111108487A TW 111108487 A TW111108487 A TW 111108487A TW 202336557 A TW202336557 A TW 202336557A
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- plate assembly
- cooling plate
- water inlet
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 239000002826 coolant Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- Housings, Intake/Discharge, And Installation Of Fluid Heaters (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
本發明係關於一種散熱組件,特別是一種水冷板組件。The invention relates to a heat dissipation component, in particular to a water-cooling plate component.
一般來說,電腦主要具有機殼、電源供應器、主機板、中央處理器、顯示卡及擴充卡。電源供應器與主機板裝設於機殼內,且中央處理器、顯示卡及擴充卡裝設於主機板上。當電腦在運作時,中央處理器負責進行資料運算,顯示卡負責進行影像運算,兩者皆會產生大量的熱量。因此,電腦廠商一般會加裝風扇或水冷散熱器來對中央處理器或顯示卡進行散熱。Generally speaking, a computer mainly has a chassis, power supply, motherboard, central processing unit, graphics card and expansion card. The power supply and the motherboard are installed in the casing, and the central processor, graphics card and expansion card are installed on the motherboard. When the computer is running, the central processing unit is responsible for data calculations and the graphics card is responsible for image calculations, both of which generate a large amount of heat. Therefore, computer manufacturers generally install fans or water-cooling radiators to dissipate heat from the CPU or graphics card.
以水冷散熱器為例,水冷散熱器一般包含水冷頭、水冷排及泵浦。水冷頭熱接觸於中央處理器或顯示卡。水冷排用以進行散熱。水冷頭、水冷排及泵浦相連而構成一循環通道。循環通道內儲存有冷卻液。泵浦驅動冷卻液流過水冷頭與水冷排而構成一冷卻循環。當冷卻液進行冷卻循環時,冷卻液會將中央處理器或顯示卡所產生的熱量轉移至水冷排,並經由水冷排進行散熱。然而,目前的水冷散熱器對中央處理器、顯示卡等熱源的散熱效率仍有不足,因此,如何進一步提升水冷散熱器對中央處理器、顯示卡等熱源的散熱效率,便成為設計上的一大課題。Taking water-cooled radiators as an example, water-cooled radiators generally include water-cooled heads, water-cooled radiators and pumps. The water block is in thermal contact with the CPU or graphics card. Water cooling radiator is used for heat dissipation. The water-cooling head, water-cooling radiator and pump are connected to form a circulation channel. Coolant is stored in the circulation channel. The pump drives the coolant to flow through the water-cooled head and water-cooled radiator to form a cooling cycle. When the coolant circulates, the coolant transfers the heat generated by the CPU or graphics card to the water-cooling radiator, where it is dissipated through the water-cooling radiator. However, the current water-cooling radiator's heat dissipation efficiency for heat sources such as CPUs and graphics cards is still insufficient. Therefore, how to further improve the heat dissipation efficiency of water-cooling radiators for heat sources such as CPUs and graphics cards has become a design issue. Big topic.
本發明在於提供一種水冷板組件,藉以提升水冷板組件對中央處理器等熱源的散熱效率。The present invention provides a water-cooling plate assembly, thereby improving the heat dissipation efficiency of the water-cooling plate assembly for heat sources such as central processing units.
本發明之一實施例所揭露之水冷板組件包含一基座、一罩體、一入水接頭及一出水接頭。罩體裝設於基座,且罩體與基座共同圍繞出一液流空間。罩體具有一入水口及一出水口。在罩體之長邊方向上,入水口與出水口分別位於罩體之相對兩側。入水接頭裝設於罩體之入水口。出水接頭裝設於罩體之出水口。A water-cooling plate assembly disclosed in one embodiment of the present invention includes a base, a cover, a water inlet connector and a water outlet connector. The cover body is installed on the base, and the cover body and the base together form a liquid flow space. The cover body has a water inlet and a water outlet. In the longitudinal direction of the cover body, the water inlet and the water outlet are respectively located on opposite sides of the cover body. The water inlet connector is installed at the water inlet of the cover body. The water outlet joint is installed at the water outlet of the cover body.
根據上述實施例之水冷板組件,透過將入水口與出水口改分別位於罩體之相對兩側,以提升冷卻液對基座的散熱效果,進而提升水冷板組件的整體散熱效果。According to the water-cooling plate assembly of the above embodiment, by locating the water inlet and the water outlet at opposite sides of the cover body, the heat dissipation effect of the coolant on the base is improved, thereby improving the overall heat dissipation effect of the water-cooling plate assembly.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the patent application scope of the present invention.
請參閱圖1至圖3。圖1為根據本發明第一實施例所述之水冷板組件10的立體示意圖。圖2為圖1的分解示意圖。圖3為圖1的剖面示意圖。See Figure 1 to Figure 3. FIG. 1 is a schematic three-dimensional view of a water-cooling plate assembly 10 according to a first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Figure 3 is a schematic cross-sectional view of Figure 1.
本實施例之水冷板組件10包含一基座100、一罩體200、一入水接頭300及一出水接頭400。罩體200裝設於基座100,且罩體200與基座100共同圍繞出一液流空間S。液流空間S用以存放冷卻液。罩體200具有一入水口211及一出水口212,在罩體200之長邊方向F1上,入水口211與出水口212分別位於罩體200之相對兩側。The water-cooling plate assembly 10 of this embodiment includes a base 100, a cover 200, a water inlet connector 300 and a water outlet connector 400. The cover 200 is installed on the base 100, and the cover 200 and the base 100 together surround a liquid flow space S. The liquid flow space S is used to store coolant. The cover body 200 has a water inlet 211 and a water outlet 212. In the longitudinal direction F1 of the cover body 200, the water inlet 211 and the water outlet 212 are respectively located on opposite sides of the cover body 200.
詳細來說,基座100包含一載板110及多個鰭片120。這些鰭片120凸出於載板110,並位於液流空間S。這些鰭片120沿罩體200之長邊方向F1延伸。這些鰭片120包含一第一鰭片組121及二第二鰭片組122。第一鰭片組121介於二第二鰭片組122之間,且第一鰭片組121與二第二鰭片組122之間各保持一通道C。Specifically, the base 100 includes a carrier board 110 and a plurality of fins 120 . These fins 120 protrude from the carrier plate 110 and are located in the liquid flow space S. These fins 120 extend along the longitudinal direction F1 of the cover body 200 . These fins 120 include a first fin set 121 and two second fin sets 122 . The first fin group 121 is between the two second fin groups 122 , and a channel C is maintained between the first fin group 121 and the two second fin groups 122 .
在本實施例中,第一鰭片組121的寬度W1大於二第二鰭片組122的寬度W2,但並不以此為限。在其他實施例中,第一鰭片組的寬度亦可以小於二第二鰭片組的寬度。In this embodiment, the width W1 of the first fin group 121 is greater than the width W2 of the second fin group 122, but it is not limited to this. In other embodiments, the width of the first fin group may be smaller than the width of the second fin group.
罩體200包含一覆蓋板210、一環形側板220及二擋流板230、240。入水口211與出水口212位於覆蓋板210。在罩體200之長邊方向F1上,入水口211與出水口212位於覆蓋板210的相對兩側處,以及在罩體200之短邊方向F2上,入水口211與出水口212位於覆蓋板210的中央處E1。環形側板220連接於覆蓋板210之周緣。二擋流板230、240凸出於覆蓋板210,並位於液流空間S。二擋流板230、240沿罩體200的短邊方向F2延伸,且在罩體200之短邊方向F2上,二擋流板230、240凸出覆蓋板210的高度由兩側處朝中央處E1遞減。如此一來,在罩體200之短邊方向F2上,液流空間S於二擋流板230、240處的高度由兩端處E2朝中央處E1遞增。也就是說,於二擋流板230、240處,液流空間S之中央處E1E1的高度H1大於兩端處E2E2的高度H2。The cover body 200 includes a cover plate 210, an annular side plate 220 and two baffles 230 and 240. The water inlet 211 and the water outlet 212 are located on the cover plate 210 . In the long side direction F1 of the cover body 200, the water inlet 211 and the water outlet 212 are located on opposite sides of the covering plate 210, and in the short side direction F2 of the cover body 200, the water inlet 211 and the water outlet 212 are located on the covering plate. E1 in the center of 210. The annular side plate 220 is connected to the periphery of the cover plate 210 . The two baffles 230 and 240 protrude from the cover plate 210 and are located in the liquid flow space S. The two baffles 230 and 240 extend along the short side direction F2 of the cover body 200, and in the short side direction F2 of the cover body 200, the height of the two baffles 230 and 240 protrudes from the covering plate 210 from both sides toward the center. E1 decreases. As a result, in the short side direction F2 of the cover body 200, the height of the liquid flow space S at the two baffles 230 and 240 increases from the two ends E2 toward the center E1. That is to say, at the two baffles 230 and 240, the height H1 of E1E1 at the center of the liquid flow space S is greater than the height H2 of E2E2 at both ends.
入水接頭300裝設於罩體200之入水口211。出水接頭400裝設於罩體200之出水口212。也就是說,在罩體200之短邊方向F2上,入水接頭300與出水接頭400位於罩體200的中央處E1。The water inlet connector 300 is installed at the water inlet 211 of the cover body 200 . The water outlet connector 400 is installed at the water outlet 212 of the cover body 200 . That is to say, in the short side direction F2 of the cover 200 , the water inlet connector 300 and the water outlet connector 400 are located at the center E1 of the cover 200 .
在本實施例中,水冷板組件10還可以包含一組裝框500及多個多個緊固件600。組裝框500具有一開槽510。組裝框500疊設於基座100之載板110,且罩體200與鰭片120位於開槽510,以令組裝框500將罩體200圍繞於內。緊固件600可轉動地裝設於組裝框500,以例如將組裝框500鎖附於主機板(未繪示)。此外,當緊固件600將組裝框500鎖附於主機板時,水冷板組件10之基座100例如熱接觸於中央處E1理器等熱源。In this embodiment, the water-cooling plate assembly 10 may also include an assembly frame 500 and a plurality of fasteners 600 . The assembly frame 500 has a slot 510 . The assembly frame 500 is stacked on the carrier plate 110 of the base 100, and the cover 200 and the fins 120 are located in the slots 510, so that the assembly frame 500 surrounds the cover 200 inside. The fastener 600 is rotatably mounted on the assembly frame 500, for example, to lock the assembly frame 500 to a motherboard (not shown). In addition, when the fasteners 600 fasten the assembly frame 500 to the motherboard, the base 100 of the water cooling plate assembly 10 is in thermal contact with a heat source such as the central processor E1.
根據上述實施例之水冷板組件,透過將入水口與出水口改分別位於罩體之相對兩側,以提升冷卻液對基座的散熱效果,進而提升水冷板組件的整體散熱效果。According to the water-cooling plate assembly of the above embodiment, by locating the water inlet and the water outlet at opposite sides of the cover body, the heat dissipation effect of the coolant on the base is improved, thereby improving the overall heat dissipation effect of the water-cooling plate assembly.
此外,透過擋流板之設計讓二擋流板處,液流空間之中央處的高度大於兩端處的高度,來讓冷卻液之流速調節成中央處流速最大,且逐漸向兩端減小的趨勢,進而進一步提升冷卻液與水冷板組件的熱交換效果。In addition, through the design of the baffles, the height of the center of the liquid flow space between the two baffles is greater than the height of the two ends, so that the flow rate of the coolant is adjusted to the maximum flow rate in the center and gradually decreases toward both ends. trend, thereby further improving the heat exchange effect between the coolant and the water-cooled plate assembly.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.
10:水冷板組件 100:基座 110:載板 120:鰭片 121:第一鰭片組 122:第二鰭片組 200:罩體 210:覆蓋板 211:入水口 212:出水口 220:環形側板 230、240:擋流板 300:入水接頭 400:出水接頭 500:組裝框 510:開槽 600:緊固件 C:通道 S:液流空間 W1、W2:寬度 F1:長邊方向 F2:短邊方向 E1:中央處 E2:端處 H1、H2:高度 10:Water cooling plate assembly 100: base 110: Carrier board 120:fins 121:First fin group 122:Second fin group 200: cover body 210: Covering board 211:Water inlet 212:Water outlet 220: Ring side plate 230, 240: baffle 300: Water inlet connector 400:Water outlet connector 500:Assembly box 510: Grooving 600: Fasteners C:Channel S: Liquid flow space W1, W2: Width F1: Long side direction F2: Short side direction E1: Central Office E2: end H1, H2: height
圖1為根據本發明第一實施例所述之水冷板組件的立體示意圖。 圖2為圖1的分解示意圖。 圖3為圖1的剖面示意圖。 FIG. 1 is a schematic three-dimensional view of a water-cooling plate assembly according to a first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Figure 3 is a schematic cross-sectional view of Figure 1.
10:水冷板組件 10:Water cooling plate assembly
100:基座 100: base
110:載板 110: Carrier board
120:鰭片 120:fins
121:第一鰭片組 121:First fin group
122:第二鰭片組 122:Second fin group
200:罩體 200: cover body
210:覆蓋板 210: Covering board
211:入水口 211:Water inlet
212:出水口 212:Water outlet
220:環形側板 220: Ring side plate
230、240:擋流板 230, 240: baffle
300:入水接頭 300: Water inlet connector
400:出水接頭 400:Water outlet connector
500:組裝框 500:Assembly box
510:開槽 510: Grooving
600:緊固件 600: Fasteners
C:通道 C:Channel
W1、W2:寬度 W1, W2: Width
Claims (10)
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TW111108487A TWI799176B (en) | 2022-03-09 | 2022-03-09 | Water cooling plate assembly |
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TW111108487A TWI799176B (en) | 2022-03-09 | 2022-03-09 | Water cooling plate assembly |
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TWI799176B TWI799176B (en) | 2023-04-11 |
TW202336557A true TW202336557A (en) | 2023-09-16 |
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US7149087B2 (en) * | 2004-09-08 | 2006-12-12 | Thermal Corp. | Liquid cooled heat sink with cold plate retention mechanism |
TW201011508A (en) * | 2008-09-05 | 2010-03-16 | Ama Precision Inc | Water jacket |
TWM455153U (en) * | 2013-01-03 | 2013-06-11 | Enermax Technology Corp | Heat exchange module |
TWM616320U (en) * | 2021-03-17 | 2021-09-01 | 奇鋐科技股份有限公司 | Reinforced structure of water-cooling block |
CN214795861U (en) * | 2021-04-29 | 2021-11-19 | 上海热普电子科技有限公司 | Multi-platform CPU universal cold plate based on liquid cooling solution |
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