TWI792356B - Circuit board assembly and method for manufacturing the same - Google Patents

Abstract

A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat-conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate is disposed on the inner circuit substrate. the second outer circuit substrate is disposed on the inner circuit substrate away from the first outer circuit substrate. The heat-conducting block penetrates the inner circuit substrate and is connected to the first outer circuit substrate and the second outer circuit substrate. The heat-conducting block includes an accommodating groove with an opening facing the first outer circuit substrate, and the heat-conducting block is made of aluminum nitride. At least part of the electronic component is accommodated in the accommodating groove and is electrically connected to the first outer layer circuit substrate. The reinforcing plate is disposed on the second outer circuit substrate corresponding to the electronic component and away from the electronic component.

Description

Circuit board component and manufacturing method of circuit board component

The present application relates to the technical field of circuit boards, in particular to a circuit board component and a method for manufacturing the circuit board component.

With the increase of people's demand for various electronic products such as computers, consumer electronics and communications, and the diversification of functions of electronic products, the electronic components in electronic products are also becoming more and more centralized. Among them, the circuit board is used as a support and a carrier for the electrical connection of the electronic components, and the electronic components are partially buried in the circuit board to reduce the volume of the electronic product, but at the same time, it causes heat dissipation problems.

The heat dissipation of the electronic components on the traditional circuit board is usually carried out by heat conduction through the circuit board itself or the heat conduction of the metal reinforcing plate. However, the thermal resistance of the circuit board itself or the metal reinforcement board is large, and the contact area with the electronic components is small, resulting in poor heat dissipation; in addition, the heat conduction effect has a certain relationship with the thickness of the metal reinforcement board. The thinner the metal reinforcement board, the better the heat conduction effect. , but at the same time the reinforcing effect becomes worse.

Therefore, it is necessary to provide a circuit board component that satisfies good heat dissipation efficiency, good reinforcement effect and small volume at the same time, so as to solve the above problems.

A circuit board component, comprising an inner layer circuit substrate, a first outer layer circuit substrate, a second outer layer circuit substrate, a heat conduction block, an electronic component and a reinforcing plate; the first outer layer circuit substrate is located in the inner the surface of the first outer circuit substrate; the second outer circuit substrate is located on the surface of the inner circuit substrate away from the first outer circuit substrate; the heat conduction block penetrates the inner circuit substrate and connects with the first outer circuit substrate and the first outer circuit substrate The second outer layer circuit substrate is connected, the heat conduction block includes an accommodating groove with an opening facing the first outer layer circuit substrate, the material of the heat conduction block is aluminum nitride; at least part of the electronic components are accommodated in the accommodating groove and electrically connected to the first outer circuit substrate; the reinforcing plate is located on the surface of the second outer circuit substrate corresponding to the electronic component and away from the electronic component.

In some embodiments, the electronic component includes a first sub-component and a second sub-component, the first sub-component is accommodated in the accommodating groove and electrically connected to the first outer circuit substrate, the The second sub-element is located on the surface of the first outer circuit substrate, and the second sub-element is electrically connected to the first sub-element.

In some embodiments, the circuit board component further includes a thermally conductive filler, and the thermally conductive filler is located between the first subcomponent and the thermally conductive block.

The first outer circuit substrate includes a first outer circuit layer, the second outer circuit substrate includes a second outer circuit layer, and the heat conduction block faces the surface of the first outer circuit substrate and faces the second outer circuit layer. A metal layer is provided on the surface of the substrate, and the metal layer is respectively connected to the first outer circuit layer and the second outer circuit layer.

In some embodiments, the circuit board component further includes a connection block, the second outer layer circuit substrate includes a second outer layer dielectric layer and a second outer layer circuit layer stacked, and the connection block connects the heat conduction block and the Describe the second outer circuit layer.

A method for manufacturing a circuit board component, comprising the following steps: providing an inner layer circuit substrate including a through hole; placing a heat conduction block in the through hole, and the material of the heat conduction block is aluminum nitride; The opposite two surfaces of the substrate form a first outer layer circuit substrate and a second outer layer circuit substrate, and the first outer layer circuit substrate and the second outer layer circuit substrate cover the heat conduction block; The accommodating groove in which the heat conduction block is sunken; electronics are accommodated in the accommodating groove A component, at least part of the electronic component is accommodated in the accommodating groove; a reinforcement plate is formed on the surface of the second outer layer circuit substrate corresponding to the electronic component and facing away from the electronic component.

In some implementations, the first outer circuit substrate includes a first outer dielectric layer, the second outer circuit substrate includes a second outer dielectric layer, and both the first outer dielectric layer and the second outer dielectric layer Connect with the heat conduction block.

In some embodiments, the electronic component includes a first sub-component and a second sub-component, and the step of accommodating the electronic component in the accommodating groove includes: accommodating the first sub-component in the In the accommodating groove, the first subcomponent is electrically connected to the first outer circuit substrate; the second subcomponent is connected to the surface of the first outer circuit substrate, and the second subcomponent is connected to the first outer circuit substrate. A sub-element is electrically connected.

In some embodiments, before the step of accommodating the first subcomponent in the accommodating groove, it further includes: filling the accommodating groove with thermally conductive filler, the first subcomponent being accommodated in the accommodating When placed in the groove, the first sub-element is spaced apart from the heat conduction block.

In some embodiments, the second outer circuit substrate includes a second outer dielectric layer and a second outer circuit layer stacked; in the step of forming the second outer circuit substrate, it also includes forming a A connection block with the second outer circuit layer.

In some embodiments, the step of forming the reinforcing plate is after the step of forming the second outer circuit substrate.

In some embodiments, a metal layer is provided on the surface of the heat conduction block, the first outer circuit substrate includes a first outer circuit layer, the second outer circuit substrate includes a second outer circuit layer, and the first outer circuit layer and the second outer circuit layer are directly connected to the metal layer.

In the circuit board components provided by this application, the electronic components are partially embedded in the first outer layer circuit substrate and the inner layer circuit substrate, which can effectively reduce the volume of the circuit board components; by placing the electronic components in the aluminum nitride heat conduction block, The aluminum nitride material satisfies the characteristics of high thermal conductivity and high rigidity at the same time, and the electronic components It has multiple contact surfaces (including side walls and bottom walls) with the heat conduction block, which effectively improves the heat dissipation efficiency of the circuit board components; in addition, the joint action of the aluminum nitride heat conduction block and the reinforcing plate can play a role in the protection of the circuit board components. Reinforcing effect.

100: circuit board components

10: Inner circuit substrate

12: Inner dielectric layer

14: Inner circuit layer

16: Through hole

18: Insulation layer

20: Heat conduction block

22: side wall

24: bottom wall

26: metal layer

30: The first outer circuit substrate

32: The first outer dielectric layer

34: The first outer circuit layer

40: The second outer circuit substrate

42: Second outer dielectric layer

44: Second outer circuit layer

46: Connected blocks

50: Solder mask

60: storage tank

70: Electronic components

72: The first child element

74: The second child element

80a, 80b: thermally conductive filler

90: reinforcement plate

FIG. 1 is a schematic cross-sectional view of an inner circuit substrate provided by an embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of placing a heat conduction block in the through hole shown in FIG. 1 .

3 is a schematic cross-sectional view of forming a first outer circuit substrate and a second outer circuit substrate on opposite surfaces of the inner circuit substrate shown in FIG. 2 .

4 is a schematic cross-sectional view of removing the first outer circuit substrate and the second outer circuit substrate corresponding to the insulating layer shown in FIG. 3 to expose the insulating layer.

FIG. 5 is a schematic cross-sectional view of an accommodating groove formed through the first outer circuit substrate shown in FIG. 4 and recessed toward the heat-conducting block.

FIG. 6 is a schematic cross-sectional view of filling a thermally conductive filler and accommodating a first sub-component in the accommodating groove shown in FIG. 5 .

FIG. 7 is a schematic cross-sectional view of connecting a second sub-component on the surface of the first outer circuit substrate shown in FIG. 6 .

FIG. 8 is a schematic cross-sectional view of forming a reinforcing plate on the surface of the second outer circuit substrate shown in FIG. 7 corresponding to the first sub-component, thereby forming a circuit board component.

FIG. 9 is a schematic cross-sectional view of placing a heat conduction block with a metal layer on its surface in the through hole shown in FIG. 1 according to another embodiment.

FIG. 10 is a schematic cross-sectional view of a circuit board component formed in another embodiment.

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items.

In each embodiment of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the description of the patent application and the patent scope of the present application is not limited to physical or mechanical connection, whether direct or indirect of. "Up", "Down", "Above", "Bottom", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship is also corresponding Change.

Please refer to FIG. 1 to FIG. 8, the embodiment of the present application provides a method for manufacturing a circuit board component 100, including the following steps:

Step S1 : Referring to FIG. 1 , an inner circuit substrate 10 including through holes 16 is provided.

The inner circuit substrate 10 includes an inner dielectric layer 12 and an inner circuit layer 14 , and the inner dielectric layer 12 and the inner circuit layer 14 are stacked on each other. The number of the inner circuit layers 14 can be one or more layers, and when the number of the inner circuit layers 14 is multiple layers, the multilayer inner circuit layers 14 are electrically connected to each other. In this embodiment, the number of the inner dielectric layer 12 is one layer, and the inner layer wire The number of the circuit layer 14 is two layers, and the two layers of the inner circuit layer 14 are located on opposite surfaces of the inner dielectric layer 12 .

The material of the inner dielectric layer 12 can be selected from polyimide (polyimide, PI), liquid crystal polymer (liquid crystal polymer, LCP) and modified polyimide (modified polyimide, MPI) and other flexible materials. One of the hard materials, or one of hard materials such as polypropylene (Polypropylene, PP) and polytetrafluoroethylene (Polytetrafluoroethylene, PTFE). In this embodiment, the material of the inner dielectric layer 12 is polypropylene.

The through hole 16 penetrates through the inner dielectric layer 12 and the inner circuit layer 14 along the direction in which the inner dielectric layer 12 and the inner circuit layer 14 are stacked.

In some embodiments, the inner circuit substrate 10 may further include an insulating layer 18 located on two opposite surfaces of a partial area of the inner circuit substrate 10 .

Step S2: Referring to FIG. 2 , place a heat conduction block 20 in the through hole 16 .

The material of the heat conducting block 20 is aluminum nitride, the thermal conductivity of the aluminum nitride material is 320W/(m.K), and the modulus of elasticity is 320Gpa. Compared with the commonly used stainless steel material, the aluminum nitride material satisfies the characteristics of high thermal conductivity and high rigidity at the same time. The thermal conductivity of stainless steel is 12.3W/(m.K), and the modulus of elasticity is 190Gpa.

In some embodiments, the heat conduction block 20 is set apart from the sidewall forming the through hole 16 , that is, there is a certain gap between the heat conduction block 20 and the inner circuit substrate 10 .

Step S3: Please refer to FIG. 3 , forming a first outer circuit substrate 30 and a second outer circuit substrate 40 on opposite surfaces of the inner circuit substrate 10, the first outer circuit substrate 30 and the second outer circuit substrate The substrate 40 covers the heat conduction block 20 .

The first outer circuit substrate 30 includes a first outer dielectric layer 32 and a first outer circuit layer 34 . The second outer circuit substrate 40 includes a second outer dielectric layer 42 and a second outer circuit layer 44 . The first outer layer dielectric layer 32, the first outer layer circuit layer 34, the second outer layer dielectric layer 42 and the second outer layer wire The number of layers of the road layer 44 can be one or more layers. Both the first outer circuit substrate 30 and the second outer circuit substrate 40 are electrically connected to the inner circuit substrate 10 . The first outer dielectric layer 32 and the second outer dielectric layer 42 are connected to the heat conduction block 20 .

In some embodiments, during the process of forming the first outer circuit substrate 30 and the second outer circuit substrate 40, the first outer dielectric layer 32 and the second outer dielectric layer 42 are also filled with The gap between the heat conduction block 20 and the inner circuit substrate 10, the first outer dielectric layer 32 and/or the second outer dielectric layer 42 filled in the gap can function to fix the heat conduction block 20 role and buffering effect.

In some embodiments, the process of forming the second outer circuit substrate 40 further includes the step of forming a connection block 46 connecting the heat conduction block 20 and the second outer circuit layer 44 , the connection block 46 Through the second outer dielectric layer 42 , the second outer circuit layer 44 located on the second outer circuit substrate 40 away from the heat conduction block 20 is connected to the heat conduction block 20 .

In some embodiments, the first outer circuit substrate 30 and the second outer circuit substrate 40 also cover the insulating layer 18 .

In some embodiments, a solder resist layer 50 may also be formed on the surface of the first outer circuit substrate 30 and the second outer circuit substrate 40 away from the inner circuit substrate 10 to protect the first outer circuit substrate. layer 34 and the second outer circuit layer 44 .

Step S4 : Referring to FIG. 4 , remove the first outer circuit substrate 30 and the second outer circuit substrate 40 corresponding to the insulating layer 18 to expose the insulating layer 18 , thereby forming a flexure region.

In some implementations, step S4 can be omitted.

Step S5 : Please refer to FIG. 5 , forming an accommodating groove 60 penetrating through the first outer circuit substrate 30 and recessed toward the heat conducting block 20 .

The accommodating groove 60 is formed along the stacking direction of the first outer circuit substrate 30 , the inner circuit substrate 10 and the second outer circuit substrate 40 . In the process of forming the accommodating groove 60 In this process, the first outer layer circuit substrate 30 is first penetrated, and then a part of the heat conduction block 20 is removed to form the accommodation groove 60, that is, the accommodation groove 60 penetrates the first outer layer circuit substrate 30 but Without penetrating through the heat conduction block 20 , a heat conduction block 20 having a side wall 22 and a bottom wall 24 is formed.

Step S6 : Please refer to FIG. 6 and FIG. 7 , accommodate the electronic component 70 in the accommodating groove 60 , and at least part of the electronic component 70 is accommodated in the accommodating groove 60 .

The electronic component 70 is electrically connected to the first outer circuit substrate 30 .

The electronic component 70 may be an integral structure, or may include at least one first sub-component 72 and at least one second sub-component 74 .

In this embodiment, taking the electronic component 70 including a first sub-component 72 and a second sub-component 74 as an example, the electronic component 70 is a lens module, the first sub-component 72 is a chip, and the second sub-component 74 is a lens module. The second sub-element 74 is a lens. In other embodiments, the electronic component 70 is not limited to a lens module.

The specific steps for accommodating the electronic component 70 in the accommodating groove 60 include:

Step S601 : Please refer to FIG. 6 , fill the accommodating tank 60 with a thermally conductive filler 80 a.

The thermally conductive filler 80a may be a thermally conductive adhesive, which has both a bonding effect and a thermally conductive effect.

The thermally conductive filler 80 a is filled in the accommodating groove 60 of the thermally conductive block 20 , and the thermally conductive filler 80 a is connected to the side wall 22 and the bottom wall 24 .

Step S602: Referring to FIG. 6 again, place the first subcomponent 72 in the thermally conductive filler 80a, so that the thermally conductive filler 80a covers the periphery of the first subcomponent 72, so that the first subcomponent The element 72 is spaced apart from the heat conduction block 20 . Wherein, the portion of the first sub-component 72 used for electrical connection is exposed to the thermally conductive filler 80a.

The thermally conductive filler 80a connects the first subcomponent 72 and the thermally conductive block 20, so that the heat generated by the first subcomponent 72 can be quickly transferred to the thermally conductive block 20; the thermally conductive filler 80a It can also play a buffering role, preventing the first sub-component 72 from being damaged due to rigid contact with the heat conduction block 20 .

In some embodiments, the distance between the first sub-element 72 and the heat conduction block 20 may be 0.1mm-0.7mm. In a specific embodiment, the distance between the first sub-element 72 and the heat conduction block 20 is 0.3 mm.

Step S603 : Referring to FIG. 7 , a second sub-component 74 is connected to the surface of the first outer circuit substrate 30 , and the second sub-component 74 is electrically connected to the first sub-component 72 .

Step S7 : Please refer to FIG. 8 , forming a reinforcing plate 90 on the surface of the second outer circuit substrate 40 corresponding to the electronic component 70 and facing away from the electronic component 70 , thereby forming the circuit board component 100 .

The reinforcing plate 90 can be selected from stainless steel, red copper, aluminum nitride, graphene and other materials with high thermal conductivity and certain hardness.

The reinforcing plate 90 may be connected to the second outer circuit substrate 40 through the thermally conductive filler 80b. The thermally conductive filler 80b can be a thermally conductive adhesive, which has both bonding and thermal conductivity functions.

The step of forming the reinforcing plate 90 is any step after forming the second outer circuit substrate 40, that is, the step of forming the reinforcing plate 90 may be before the step of forming the accommodating groove 60 or the electronic component 70 .

In other embodiments, in step S2, please refer to FIG. 9 , a metal layer 26 may also be provided on the surface of the heat conduction block 20, the material of the metal layer 26 includes but not limited to copper, silver, etc., the metal layer 26 is at least located on the heat conduction block 20 approximately parallel to the extending direction of the inner circuit substrate 10 . In step S3, during the process of forming the first outer circuit substrate 30 and the second outer circuit substrate 40, the first outer circuit layer 34 and the second outer circuit layer 44 are in direct contact with the metal layer 26, In the subsequently formed circuit board component 100 (see FIG. 10 ), the heat generated by the electronic component 70 passes through the heat conducting block 20 The heat is quickly transferred to the first outer circuit layer 34 and the second outer circuit layer 44 through the metal layer 26 to increase the rate of heat transfer. It can be understood that in this embodiment, there is no need to set the connecting block 46 .

Please refer to FIG. 8 again. The present application also provides a circuit board component 100, which includes an inner circuit substrate 10, a first outer circuit substrate 30, a second outer circuit substrate 40, an electronic component 70, and a heat conduction block 20. and a reinforcing plate 90 .

The inner circuit substrate 10 , the first outer circuit substrate 30 and the second outer circuit substrate 40 may be flexible boards, rigid boards or rigid-flex boards.

The inner circuit substrate 10 includes an inner dielectric layer 12 and an inner circuit layer 14 stacked on top of each other. The first outer circuit substrate 30 includes a first outer dielectric layer 32 and a first outer circuit layer 34 stacked on top of each other. The second outer circuit substrate 40 includes a second outer dielectric layer 42 and a second outer dielectric layer 44 stacked on top of each other.

The first outer circuit substrate 30 and the second outer circuit substrate 40 are respectively located on opposite surfaces of the inner circuit substrate 10 . The inner circuit substrate 10 , the first outer circuit substrate 30 and the second outer circuit substrate 40 may be single-layer circuit substrates or multi-layer circuit substrates, respectively. The inner circuit substrate 10 , the first outer circuit substrate 30 and the second outer circuit substrate 40 are electrically connected to each other.

The heat conduction block 20 runs through the inner circuit substrate 10 , and the first outer circuit substrate 30 and the second outer circuit substrate 40 cover the heat conduction block 20 . The heat conduction block 20 is connected to the inner circuit substrate 10 through the first outer dielectric layer 32 and/or the second outer dielectric layer 42, which can avoid rigid contact between the heat conduction block 20 and the inner circuit layer 14 .

The heat conduction block 20 has an accommodating groove 60 opening toward the first outer circuit substrate 30 , the heat conduction block includes a side wall 22 and a bottom wall 24 , the side wall 22 surrounds the bottom wall 24 , and the electronic At least part of the component 70 is accommodated in the accommodation groove 60 formed by the side wall 22 and the bottom wall 24 .

In some embodiments, the electronic component 70 includes a first sub-component 72 and a second sub-component 74 , the first sub-component 72 may be a wafer, and the second sub-component 74 may be a lens. The first sub-component 72 is accommodated in the accommodating groove 60 , and the second sub-component 74 is located on the surface of the first outer circuit substrate 30 and is electrically connected to the first sub-component 72 .

In some embodiments, a thermally conductive filler 80 a is further filled between the first sub-component 72 and the thermally conductive block 20 . On the one hand, multiple surfaces of the first sub-component 72 are in direct contact with the thermally conductive filler 80a, and the thermally conductive filler 80a is in direct contact with the thermally conductive block 20, with a large contact area, and the thermally conductive filler 80a can The heat generated by the first sub-element 72 is quickly transferred to the heat conduction block 20; on the other hand, since the heat conduction block 20 has a high rigidity, the heat conduction filler 80a can prevent the first sub-element 72 from contacting the heat conduction block 20. The thermally conductive filler 80 a rigidly contacts to damage the first sub-component 72 , while the rigidity of the thermally conductive block 20 is sufficient to support the first sub-component 72 to prevent the first sub-component 72 from being deformed and damaged.

In some embodiments, the circuit board component 100 further includes a solder resist layer 50, and the solder resist layer 50 is located on the first outer circuit substrate 30 and the second outer circuit substrate 40 away from the inner circuit substrate. 10 surfaces.

The reinforcing plate 90 is located on the surface of the second outer circuit substrate 40 corresponding to the electronic component 70 and facing away from the electronic component 70 , and the reinforcing plate 90 and the second outer circuit substrate 40 can pass through The thermally conductive filler 80b is connected.

In some embodiments, the second outer layer circuit substrate 40 is also connected to the heat conduction block 20 through a connection block 46 . Specifically, the second outer layer circuit substrate 40 includes a second outer layer dielectric layer 42 and a second outer layer circuit layer 44 stacked, and the communication block 46 passes through the second outer layer dielectric layer 42 to connect the second outer layer circuit layer 44 with the thermal block 20 .

Further, the connection block 46 is connected to the second outer circuit layer 44 located on the second outer circuit substrate 40 away from the heat conduction block 20 , so as to quickly transfer the heat generated by the electronic component 70 to the outside of the circuit board component 100 .

Please refer to FIG. 10 again. In some embodiments, the surface of the heat conduction block 20 facing the first outer circuit substrate 30 and the surface facing the second outer circuit substrate 40 are both provided with a metal layer 26 , and the The metal layer 26 is directly connected to the first outer circuit layer 34 and the second outer circuit layer 44 to conduct heat quickly.

In the circuit board component 100 provided by the present application, the electronic component 70 is partially embedded in the first outer layer circuit substrate 30 and the inner layer circuit substrate 10, which can effectively reduce the volume of the circuit board component 100; by accommodating the electronic component 70 in nitrogen In the heat conduction block 20 made of aluminum nitride, because the material of aluminum nitride satisfies the characteristics of high heat conduction efficiency and high rigidity at the same time, the electronic component 70 and the heat conduction block 20 have multiple contact surfaces (including the side wall 22 and the bottom wall 24), effectively improving the circuit The heat dissipation efficiency of the board component 100 ; in addition, the joint effect of the aluminum nitride heat conduction block 20 and the reinforcing plate 90 can play a reinforcing role on the circuit board component 100 .

The above embodiments are only used to illustrate the technical solutions of the present application without limitation. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced All should not deviate from the spirit and scope of the technical solution of the present application.

100: circuit board components

10: Inner circuit substrate

12: Inner dielectric layer

14: Inner circuit layer

18: Insulation layer

20: Heat conduction block

22: side wall

24: bottom wall

30: The first outer circuit substrate

32: The first outer dielectric layer

34: The first outer circuit layer

40: The second outer circuit substrate

42: Second outer dielectric layer

44: Second outer circuit layer

46: Connected blocks

50: Solder mask

70: Electronic components

72: The first child element

74: The second child element

80a, 80b: thermally conductive filler

90: reinforcement plate

Claims (10)

A circuit board component, the improvement of which includes: an inner circuit substrate; a first outer circuit substrate located on the surface of the inner circuit substrate; a second outer circuit substrate located on the inner circuit substrate away from the first The surface of the outer circuit substrate; a thermal conduction block, which penetrates the inner circuit substrate and is connected with the first outer circuit substrate and the second outer circuit substrate, and the heat conduction block includes an opening facing the first outer circuit substrate The accommodating tank, the material of the heat conduction block is aluminum nitride; the electronic component includes a first sub-component, and the first sub-component is accommodated in the accommodating tank and electrically connected to the first outer layer circuit substrate ; a thermally conductive filler, the thermally conductive filler is located between the first sub-component and the thermally conductive block; and a reinforcing plate is located on the surface of the second outer layer circuit substrate corresponding to the electronic component and facing away from the electronic component . The circuit board component as claimed in item 1, wherein the electronic component further includes a second sub-component, the second sub-component is located on the surface of the first outer layer circuit substrate, the second sub-component and the first sub-component A sub-element is electrically connected. The circuit board component according to claim 1, wherein the first outer circuit substrate includes a first outer circuit layer, the second outer circuit substrate includes a second outer circuit layer, and the heat conduction block faces the first outer layer A metal layer is provided on the surface of the circuit substrate and the surface facing the second outer circuit substrate, and the metal layer is respectively connected to the first outer circuit layer and the second outer circuit layer. The circuit board component according to claim 1, wherein the circuit board component further includes a connection block, the second outer layer circuit substrate includes a stacked second outer layer dielectric layer and a second outer layer circuit layer, and the connection block is connected The heat conduction block and the second outer circuit layer. A method for manufacturing a circuit board component, the improvement of which includes the following steps: providing an inner layer circuit substrate including a through hole; placing a heat conducting block in the through hole, and the material of the heat conducting block is aluminum nitride; The opposite two surfaces of the inner circuit substrate form a first outer circuit substrate and a second outer circuit substrate, and the first outer circuit substrate and the second outer circuit substrate cover the heat conduction block; The accommodating groove of the circuit substrate and sunken toward the heat-conducting block; filling the accommodating groove with thermally conductive filler; accommodating electronic components in the accommodating groove, the electronic component including a first sub-component, the The first sub-component is accommodated in the thermally conductive filler, the first sub-component is spaced apart from the heat-conducting block, and the first sub-component is electrically connected to the first outer circuit substrate; and the first sub-component is electrically connected to the first outer circuit substrate; The surface of the second outer circuit substrate corresponding to the electronic component and facing away from the electronic component forms a reinforcing plate. The method for manufacturing a circuit board component according to claim 5, wherein the first outer circuit substrate includes a first outer dielectric layer, the second outer circuit substrate includes a second outer dielectric layer, and the first outer dielectric layer and the second outer dielectric layer are connected to the heat conduction block. The manufacturing method of circuit board components according to claim 5, wherein the electronic components further include a second sub-component, and the step of accommodating the electronic components in the accommodating grooves further includes: The surface of the circuit substrate is connected to the second sub-element, and the second sub-element is electrically connected to the first sub-element. The manufacturing method of circuit board components as claimed in item 5, wherein the second outer layer circuit substrate includes a second outer layer dielectric layer and a second outer layer circuit layer stacked; The step of the outer circuit substrate further includes forming a connection block connecting the heat conduction block and the second outer circuit layer. The method for manufacturing a circuit board component as claimed in claim 5, wherein the step of forming the reinforcing plate is after the step of forming the second outer circuit substrate. The method for manufacturing a circuit board component according to claim 5, wherein a metal layer is provided on the surface of the heat conduction block, the first outer circuit substrate includes a first outer circuit layer, and the second outer circuit substrate includes a second outer layer The wiring layer, the first outer wiring layer and the second outer wiring layer are directly connected to the metal layer.

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