TWI788210B - Substrate processing equipment - Google Patents

Abstract

The present invention provides a substrate processing device capable of improving the quality of a substrate. An embodiment is a substrate processing apparatus for processing a substrate having warpage, and the substrate processing apparatus includes a plurality of conveyance rollers, two of which are spaced apart in a width direction perpendicular to a conveyance direction of the substrate. As a set, a plurality of sets are provided along the conveyance direction, and the concave side is supported and rotated about the axis to convey the substrate; the first axis is two sets spaced apart in the width direction as a set, along the A plurality of groups are provided in the conveying direction, and conveying rollers are installed; and a fluid supply part supplies fluid to the concave surface of the substrate, and the fluid supply part supplies fluid to the concave surface of the substrate from between the conveying rollers of each set separated in the width direction.

Description

Substrate processing equipment

Embodiments of the present invention relate to a substrate processing apparatus.

A substrate processing apparatus for processing substrates such as glass substrates and semiconductor substrates is used in manufacturing steps of liquid crystal display devices, semiconductor elements, and the like. As substrate processing, there are, for example, resist coating processing, resist stripping processing, etching processing, cleaning processing, and drying processing. A substrate processing apparatus processes a substrate by supplying a processing fluid such as a processing liquid or a drying gas from a supply tool to the substrate while conveying the substrate by a plurality of conveying rollers. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 11-10096

[Problem to be Solved by the Invention] The substrate to be conveyed is usually a flat substrate, but there are also substrates with warpage. For example, when a substrate as thin as about 1 mm is used as a substrate to be processed and a film is formed on one surface of the substrate, the substrate may warp due to the stress of the film. Therefore, one of the surfaces of the substrate may be concave and the other surface may be convex. When the warped substrate is transported with the concave surface facing upward by a plurality of transport rollers in a state where the warpage is maintained, the processing fluid from the supply tool will stagnate in the center of the concave surface, thereby affecting the substrate. Substrate processing can become inadequate or uneven. Therefore, for example, processing unevenness such as uneven coating, uneven peeling, uneven etching, uneven cleaning, and uneven drying may occur, thereby deteriorating the quality of the substrate.

The problem to be solved by the present invention is to provide a substrate processing apparatus capable of improving the quality of a substrate. [Technical means to solve the problem]

An embodiment of the present invention is a substrate processing apparatus for processing a substrate having a warp, and the substrate processing apparatus includes: a conveying roller that separates two rollers that are spaced apart in a width direction perpendicular to the conveying direction of the substrate. As a group, a plurality of groups are provided along the conveying direction of the substrate, and the concave surface side of the substrate is supported to convey the substrate; the first shaft is two arranged at intervals in the width direction as One set, a plurality of sets are provided along the conveying direction of the substrate, and the conveying rollers are installed; and a fluid supply part supplies fluid to the concave surface of the substrate, and the fluid supply part is spaced apart from the substrate in the width direction. A fluid is supplied between the open conveying rollers to the concave surface of the substrate. [Effect of the invention]

According to the embodiments of the present invention, the quality of the substrate can be improved.

A substrate processing apparatus 10 according to the embodiment will be described with reference to FIGS. 1 to 4 . In addition, the dimensions and shapes of the drawings do not reflect the exact dimensions and shapes of the actual substrates and devices, and some are exaggerated for easy understanding. In addition, in the following description, the direction following gravity is referred to as "downward", and the direction resisting gravity is referred to as "upper". However, these directions do not limit the installation direction of the device.

[substrate] As shown in FIGS. 1 and 2 , in the present embodiment, the substrate W to be conveyed or processed has warpage. As the substrate W, for example, a rectangular thin substrate such as a glass substrate is used. In this embodiment, the thickness of the substrate W is about 0.5 mm to 1.1 mm, and the amount of warping of the substrate W is about 7 mm to 10 mm. In the figure, the short side direction of the board|substrate W is shown as a U-shape, but the warping of the board|substrate W of an actual rectangular shape exists in the periphery of the board|substrate W. Due to the warping, one surface of the substrate W shrinks and the other surface expands. Let the surface dented by contraction be the concave surface S1, and the surface raised by stretching be the convex surface S2. The substrate W of the present embodiment has the concave surface S1 as the processing surface. For example, a substrate W in which a circuit pattern P is formed on a processing surface such as a multilayer substrate is used. In addition, near the outer edge of the processed surface of the substrate W, there is a region where the pattern P is not formed. The area where the pattern P is formed on the treated surface is referred to as a "pattern formation area", and the area on the outer periphery of the pattern formation area where the pattern P is not formed is referred to as a "non-pattern formation area".

[basic structure] The substrate processing apparatus 10 of the present embodiment is an apparatus that processes the concave surface S1 as a processing surface while supporting the concave surface S1 side to transport the substrate W. When conveying with the concave surface S1 downward and the convex surface S2 upward as described above, basically, only by the support of the end portion of the substrate W, stable conveyance can be achieved. Furthermore, the substrate processing apparatus 10 processes the lower concave surface S1. The substrate processing apparatus 10 includes a processing chamber 21 , a substrate transfer device 30 , a fluid supply unit 40 , and a control unit 50 . The processing chamber 21 is a housing having a transport path T for transporting the substrate W inside, and is formed so that the substrate W can pass through the interior along the transport path T. As shown in FIG. The processing chamber 21 functions as a place for processing the substrate W moving on the transport path T. As shown in FIG. The processing of the substrate W is cleaning and drying in this embodiment. A discharge port (not shown) for discharging the processing liquid is formed on the bottom surface of the processing chamber 21 .

The substrate conveying device 30 has a plurality of conveying rollers 31 and a plurality of pressing rollers 32 . The substrate conveyance device 30 is installed throughout the processing chamber 21 , presses the convex surface S2 of the substrate W by the pressing rollers 32 , and conveys the substrate W by supporting the concave surface S1 side by the conveyance rollers 31 .

[Board transfer device] (Arrangement of conveying rollers and pressing rollers) The substrate conveyance device 30 conveys the substrate W with the concave surface S1 positioned downward as described above. The transport rollers 31 are arranged below the transport path T at predetermined intervals along the transport direction Td of the substrate W. As shown in FIG. The pressing rollers 32 are positioned above the conveyance path T so as to face the groups of the conveyance rollers 31 at intervals across the conveyance path T, and are conveyed along the conveyance rollers 31 at predetermined intervals equal to the predetermined intervals of the conveyance rollers 31 . The direction Td is aligned. These conveying rollers 31 and pressing rollers 32 are disposed in the processing chamber 21 so as to face each other in the vertical direction in FIG. . The conveying roller 31 rotates clockwise in FIG. 1 , and the pressing roller 32 rotates counterclockwise.

In the processing chamber 21 , a plurality of sets of conveying rollers 31 (in this embodiment, two in one set) and pressing rollers 32 arranged so as to face each other across the conveying path T are provided as a set. The separation distance H between the transport rollers 31 and the pressing rollers 32 is constant for each set in the processing chamber 21 . In the present embodiment, the separation distance H is a separation distance in a direction perpendicular to the conveyance path, for example, in a vertical direction. The fact that the separation distance H is constant means, for example, that the warpage of the substrate W is less than or equal to a predetermined distance at which the substrate can be conveyed. The amount of warpage refers to the maximum vertical separation distance between the plane on which the substrate W is placed and the upper surface of the substrate W placed on the plane.

(Specific structure of the transfer roller) As shown in FIG. 2 , the transport roller 31 supports the concave surface S1 side of the substrate W, and transports the substrate W by rotating about an axis a perpendicular to the transport direction Td of the substrate W in a horizontal plane. The conveyance roller 31 has the cylindrical part 31a and the flange-shaped part 31b which are located on the same axis a. The columnar portion 31a is in contact with the end portion of the substrate W on the concave surface S1 side to support the substrate W. As shown in FIG. The cylindrical portion 31a is, for example, a roller made of rubber or resin. The axis|shaft of the cylindrical part 31a is the width direction X orthogonal to conveyance direction Td. The conveying rollers 31 including the columnar portion 31 a are provided in pairs spaced apart in the width direction X as a set, and a plurality of sets are arranged along the conveying direction Td. The two cylindrical parts 31a of each set have the same diameter.

The separation distance H between the conveyance roller 31 and the pressing roller 32 is the distance between the portion in contact with the substrate W, and in this embodiment, the distance between the outer peripheral surface of the cylindrical portion 31 a and the outer peripheral surface of the pressing roller 32 . That is, the separation distance H between the conveyance roller 31 and the pressing roller 32 includes the case where the distance between a part of the conveyance roller 31 and the pressing roller 32 is included. In addition, the conveyance path T of this embodiment is located between the cylindrical part 31a of the conveyance roller 31, and the pressing roller 32. As shown in FIG.

The flange-shaped part 31b is a part provided so that diameter may become large in the opposite end part of the cylindrical part 31a among the two conveyance rollers 31. As shown in FIG. The flange-shaped portion 31b can be in contact with the end portion of the substrate W along the conveyance direction Td.

In addition, as shown in FIG. 3 , the separation distance D between the conveying rollers 31 of each set (the distance between the opposing surfaces of the columnar portions 31 a of each set) is constant. Assuming that the length of the warped substrate W in the width direction X in plan view is L, it is preferable that the separation distance D is D≦L. In addition, if d is the separation distance (distance between facing surfaces) of the flange-shaped portions 31 b of the conveyance rollers 31 of each set, it is preferable that d≧L. Thereby, the end part of the board|substrate W can be supported by the conveyance roller 31. As shown in FIG. Furthermore, as shown in FIG. 2 , assuming that the length in the width direction X of the pattern formation region of the substrate W in plan view is Lp, D>Lp is preferable. Thereby, the supply of the fluid supplied by the fluid supply part 40 mentioned later to the pattern P can be suppressed from being blocked by the conveyance roller 31. FIG. In addition, the axial length ax of the cylindrical part 31a is (d-D)/2.

Furthermore, the conveyance roller 31 is provided with the 1st shaft 31c coaxially. Two first shafts 31c are provided at intervals in the width direction X as one set, and a plurality of sets are provided along the conveyance direction Td, and the conveyance roller 31 is attached thereto. That is, the two conveyance rollers 31 of each set are spaced apart in the width direction X, and the two 1st shafts 31c are provided coaxially with each other. The diameter of the first shaft 31c is thinner than that of the cylindrical portion 31a, and is provided on opposite end surfaces of the two cylindrical portions 31a of each set. The plurality of first shafts 31 c are provided so as to be rotatable synchronously by, for example, a drive mechanism having a helical gear (helical gear) not shown in the figure. The two transport rollers 31 of each set are rotationally driven at the same peripheral speed.

When the first shaft 31c rotates, each columnar portion 31a attached to the first shaft 31c rotates around the first shaft 31c as an axis of rotation. The conveyance roller 31 supports the non-pattern formation area|region by the concave surface S1 side, or the edge part of the board|substrate W along the conveyance direction Td, and conveys it along the conveyance direction Td. As shown in FIG. 2 , in the lower part of the pattern formation region in the width direction X in the conveyed substrate W, the first shaft 31 c is absent.

(The specific structure of the pressing roller) The pressing roller 32 is a circle whose axis is the width direction X. As shown in FIG. 2 , the pressing roller 32 is above each conveying roller 31 and between two conveying rollers 31 in a group so as to be in contact with the center of the convex surface S2 of the substrate W. Centers in the width direction X in the space between are provided facing each other. The pressing roller 32 is coaxially provided with a second shaft 32a. The second shaft 32a is arranged parallel to the first shaft 31c. The diameter of the second shaft 32a is thinner than that of the pressing roller 32, and extends over a length exceeding the length in the width direction X of the substrate W. In the processing chamber 21, for example, a driving mechanism having a spur gear (spur gear) not shown is used. It can be arranged to rotate synchronously.

When the second shaft 32a rotates, the pressing roller 32 attached to the second shaft 32a rotates around the second shaft 32a as a rotation axis while contacting the convex surface S2. Both the conveying roller 31 and the pressing roller 32 are controlled to be rotationally driven at the same peripheral speed.

[Fluid Supply Unit] As shown in FIGS. 1 and 2 , a fluid supply unit 40 is provided in the processing chamber 21 . The fluid supply unit 40 supplies the substrate W with a fluid to the concave surface S1 of the substrate W from between the transport rollers 31 of each set spaced apart in the width direction X. The fluid supply unit 40 has a liquid ejection unit 41 and a gas blower unit 42 .

(Liquid Ejection Department) The liquid ejection unit 41 ejects and supplies the processing liquid to the processing surface of the substrate W moving on the transport path T. As shown in FIG. The liquid ejection unit 41 is provided to face the substrate W at a distance from the substrate W to be conveyed across the conveyance path T so as not to interfere with the conveyance of the substrate W by the substrate conveyance device 30 . In addition, no shafts, rollers, etc. are interposed between the liquid ejection unit 41 and the conveyance path T. As shown in FIG. When the processing liquid is sprayed onto the transport path T by the liquid ejection unit 41 , the processing liquid is supplied to the concave surface S1 of the substrate W moving on the transport path T. As shown in FIG. As the processing liquid, cleaning liquid, stripping liquid, developing liquid, rinse liquid (pure water, etc.) are applied for each target processing.

More specifically, as the liquid ejection unit 41 , for example, a shower pipe having a plurality of through holes or a pipe including a plurality of nozzles can be used. As shown in FIGS. 1 and 2 , the liquid ejection unit 41 of the present embodiment has a plurality of tubes 411 extending along the conveyance direction Td, and is configured by arranging the plurality of tubes 411 in a row in the width direction X. In this embodiment, as shown in FIG. One tube 411B is disposed at the center in the width direction X of the tube. Hereinafter, when the tube 411A, the tube 411B, and the tube 411C are not distinguished, they will be described as the tube 411 . A supply source of a treatment liquid including a pump and a tank not shown is connected to the pipe 411 .

In the pipe 411, a plurality of discharge parts 412 are provided in the width direction X. In the present embodiment, the discharge unit 412 is a nozzle for supplying the processing liquid in a shower form from the discharge port to the processing surface of the substrate W being conveyed. That is, the ejection unit 412 ejects the processing liquid onto the lower surface of the substrate W from below the substrate W. As shown in FIG. The ejection part 412 may also be a through hole. The discharge unit 412 provided in each of the tubes 411A, 411B, and 411C will be described as the discharge unit 412 without distinguishing them as 412A, 412B, and 412C.

The plurality of ejection units 412 arranged along the width direction X are set to be located farther from each group than the ejection units 412 located on one side of the two conveyance rollers 31 of each group, that is, on both ends of the width direction X. One side of the two conveying rollers 31 , that is, the discharge unit 412 positioned on the central side in the width direction X has a greater discharge amount of the treatment liquid per unit time (hereinafter, sometimes simply referred to as “discharge amount”). In this embodiment, the discharge amount of the discharge part 412B is larger than the discharge amounts of the discharge part 412A and the discharge part 412C. In order to set such a discharge amount, the flow rate per unit time of the treatment liquid to be discharged is variably set to each of the plurality of discharge units 412 arranged along the width direction X. More specifically, the control unit 50 adjusts the amount of the treatment liquid flowing through each of the tubes 411 by controlling a valve (not shown) provided on the piping connected to the tubes 411 .

(gas blowing part) The gas blowing unit 42 blows and supplies a drying gas such as air or nitrogen to the substrate W moving on the transport path T, for example. The gas blowing unit 42 is provided to face the substrate W at a distance from the substrate W to be conveyed across the conveyance path T so as not to interfere with the conveyance of the substrate W by the substrate conveyance device 30 . In addition, between the gas blowing part 42 and the conveyance path T, a shaft, a roller, etc. are not interposed. The gas blowing unit 42 blows gas at high pressure to the substrate W passing through the transport path T, blows away the processing liquid such as cleaning liquid adhering to the substrate W, and dries the processing surface of the substrate W.

For example, as shown in FIGS. 1 and 2 , the gas blowing unit 42 is an air knife having a slit-shaped blowing port 42 a longer than the width of the substrate W having warpage. The gas blowing unit 42 is provided so as to blow off the gas from the blowing port 42a to the upstream side in the conveyance direction Td, and blow off the liquid adhering to the substrate W. As shown in FIG.

[control department] As shown in FIG. 1 , the control unit 50 is a computer that controls each unit of the substrate processing apparatus 10 such as the substrate transfer device 30 and the fluid supply unit 40, and has a storage unit that stores various information and programs related to substrate transfer and substrate processing. , and a processor that executes various programs. As described above, the control unit 50 of the present embodiment adjusts the amount of the processing liquid flowing through the pipe 411 by controlling the valve, and the amount of the processing liquid that is close to the end of the two transport rollers 31 of each group, that is, the two sides in the width direction X, is adjusted. The ejection amount is larger on the center side of the two conveyance rollers 31 away from each group, that is, in the center and its vicinity in the width direction X, than on the end side.

[action] Next, the operation of the substrate processing apparatus 10 will be described. In addition, the following operation is an example of the operation of cleaning and drying the substrate W with the cleaning liquid. As described above, in the substrate processing apparatus 10, the respective conveying rollers 31 and the respective pressing rollers 32 of the substrate conveying device 30 rotate synchronously, and the substrate W is conveyed along The direction Td is transported, moves along the transport path T, and passes through the processing chamber 21 .

The processing chamber 21 is in a liquid supply state in which cleaning liquid is preliminarily supplied from the lower side of the transport path T by the discharge part 412 of each tube 411 . When the warped substrate W is transported through the region in the liquid supply state, the concave surface S1 of the substrate W is supplied with the cleaning liquid and cleaned. On the side of the concave surface S1 of the substrate W, there is no first shaft 31c, and the cleaning liquid supplied to the concave surface S1 of the substrate W is not blocked by the first shaft 31c and touches the pattern forming region. The cleaning liquid supplied to the substrate W flows toward the end of the substrate W, drops from the end, flows through the bottom surface of the processing chamber 21, and is discharged from the discharge port.

In addition, the concave surface S1 is inclined so as to descend from the center to both ends. Therefore, the cleaning liquid supplied from the discharge part 412A and the discharge part 412C close to the end of the substrate W does not reach the center, but falls from the end. On the other hand, in the present embodiment, by supplying the cleaning liquid from the ejection unit 412B to the center of the concave surface S1 of the substrate W, a flow for washing away contaminants from the center to the end is formed. Thereby, the contamination existing on the processing surface of the substrate W can be removed.

However, since the substrate W has warpage, when the distance between the center of the concave surface S1 and the ejection part 412 is longer than that at the end, if the arrangement height of the ejection part 412 is constant, if the central ejection part 412B If the flow rate of the cleaning liquid is set to be the same as the flow rates of the discharge parts 412A and 412C at both ends, it may not be possible to supply a sufficient flow rate of the cleaning liquid to the center of the concave surface S1. Then, the cleaning liquid stagnates or falls before reaching the end of the concave surface S1, which may cause re-adhesion due to stagnation of contaminants. In this embodiment, the discharge portion 412B in the center has a larger flow rate than the discharge portion 412A and 412C near the end, so that a sufficient flow rate of cleaning liquid is supplied to the center of the concave surface S1, and the flow rate from the center to the end can be formed. flow to remove pollutants.

In the processing chamber 21 , a drying gas is preliminarily supplied from below the transport path T through the gas blowing unit 42 . When the substrate W passes through the region in the gas supply state, the cleaning liquid attached to the concave surface S1 of the substrate W is blown away by the blowing of the gas, and the substrate W becomes dry. The cleaning liquid blown away from the substrate W flows through the bottom surface of the processing chamber 21 and is discharged from the discharge port.

[Effect of Embodiment] (1) The present embodiment is a substrate processing apparatus 10 for processing a substrate W having warpage, and the substrate processing apparatus 10 includes: a plurality of conveying rollers 31 that move the substrate W in a direction perpendicular to the conveying direction Td. Two sets spaced apart in the width direction X are used as a set, and a plurality of sets are provided along the conveying direction Td to support the concave surface S1 side and rotate around the axis, thereby conveying the substrate W; A pair of two spaced apart in the direction X is provided along the transport direction Td in multiple sets, and the transport roller 31 and the fluid supply unit 40 are provided to supply the fluid to the concave surface S1 of the substrate W.

Further, the fluid supply unit 40 supplies the fluid to the concave surface S1 of the substrate W from between the conveyance rollers 31 of each set separated in the width direction X. As shown in FIG.

If the substrate W is transported with the convex surface S2 below, the inclined surface on the convex surface S2 side will be supported, and the support will be unstable due to easy sliding. Therefore, it is necessary to add a member or mechanism to support the substrate W on the lower side. On the other hand, in this embodiment, by supporting the concave surface S1 side, basically only the end portion of the substrate W needs to be supported, and thus stable conveyance is possible.

In addition, if the shaft is provided over the entire width direction X of the substrate W, the fluid supplied from the fluid supply part 40 may hit the shaft or may not reach the substrate W. Efficient processing of substrate W. However, in this embodiment, since the conveying roller 31 and the first shaft 31c are spaced apart in the width direction X on the side of the concave surface S1, it is possible to prevent the fluid supplied from the fluid supply part 40 from being transported by the conveying roller 31 or the first shaft 31c. block. Therefore, since the fluid can be uniformly sprayed onto the processing surface, uniform processing can be realized, and degradation of the quality of the substrate W can be suppressed.

Furthermore, by supplying the fluid to the concave surface S1 of the substrate W from between the conveying rollers 31 of each set and the first shaft 31c, the flow from the center to the end is formed due to the inclination of the concave surface S1, so that the processing of the concave surface S1 can be prevented from becoming unstable. Insufficient, the quality of the substrate W can be improved.

(2) This embodiment includes the pressing roller 32 that presses the convex surface S2 of the substrate W, and the second shaft 32 a provided coaxially with the pressing roller 32 . Therefore, even if the pressure generated by the supply of the processing liquid is applied from the concave surface S1 side, the pressing roller 32 prevents the lifting, so the position of the substrate W is stabilized, and uniform processing can be maintained.

(3) The fluid supply part 40 has a plurality of ejection parts 412 in the width direction X, and is arranged on the central side in the width direction X compared with the ejection parts 412 arranged on the side closer to the two conveying rollers 31 of each group. The discharge amount of the treatment liquid from the discharge unit 412 is larger. Therefore, the discharge amount of the treatment liquid from the discharge unit located closer to the center than the end of the concave surface S1 is larger, and the flow from the center to the end is easily formed, thereby making the overall treatment uniform. For example, as shown in FIG. 2, when a plurality of ejection portions 412 are arranged at the same height, the ejection port of the central ejection portion 412B is separated from the substrate W by a longer distance than the other ejection portions 412A and 412C. Therefore, the ejected processing liquid is dispersed according to the ejection part 412A, the ejection part 412B, and the ejection part 412C, or the pressure of the processing liquid colliding with the center of the concave surface S1 of the substrate W is weakened. In this embodiment, by making the discharge volume of the discharge part 412B provided below the center of the concave surface S1 larger than that of the other discharge parts 412A and 412C, the flow rate of the processing liquid in the center can be ensured, and the flow rate from the center to the end can be ensured. flow. In addition, the pressure at which the processing liquid collides with the concave surface S1 can also be made uniform.

(4) The fluid supply part 40 has a plurality of discharge parts 412 in the width direction X, and the flow rate of the processing liquid to be discharged is variably set in each of the plurality of discharge parts 412 . Therefore, uniform processing can be realized by adjusting the flow rate of each discharge unit 412 according to the difference in the distance between the concave surface S1 and each discharge unit 412 caused by the warpage of the substrate W.

(5) The fluid supply unit 40 has a plurality of tubes 411 extending in a direction along the conveyance direction Td, the plurality of tubes 411 are arranged side by side in the width direction X, and the discharge unit 412 is provided on the tubes 411 . Therefore, by adjusting the flow rate of the treatment liquid in each tube 411 , the discharge amount of the treatment liquid from the plurality of discharge units 412 arranged along the width direction X can be adjusted.

[Other implementations] (1) It is not necessarily necessary to provide the flange-shaped portion 31 b on the conveyance roller 31 . For example, as shown in FIG. 4 , guide rollers 33 for guiding the movement of the substrate W may be provided between a plurality of first shafts 31 c arranged along the conveyance direction Td of the substrate W. In this case, assuming that the distance between a pair of opposing guide rollers 33 is e, it is preferable to set e≧L.

(2) In the above-described form, one pressing roller 32 is provided in the width direction X perpendicular to the conveyance direction Td, but it is not limited thereto, and a plurality of them may be provided. For example, one pressing roller 32 may be provided at a position facing each conveying roller 31 . The belt may be wound around the pressing roller 32 like a roller conveyor. By adopting such a configuration, the area in contact with the warpage of the substrate W increases compared with the case where only the pressing roller 32 is used, so that the substrate W can be conveyed more stably. Moreover, it may be set as a flat type (flat type) roll.

(3) A measuring unit for measuring the amount of warpage of the substrate W may be provided, and the discharge amount from the discharge unit 412 may be adjusted based on the amount of warpage of the substrate W measured by the measuring unit. For example, when the amount of warpage of the substrate W measured by the measuring unit is greater than a predetermined value, the discharge amount from the central discharge unit 412B may be increased.

(4) A measuring unit for measuring the warpage of the substrate W and a moving mechanism for raising and lowering each pressing roller 32 may be provided, and the conveying rollers 31 and pressing rollers of each group may be adjusted according to the warpage of the substrate W measured by the measuring unit. Roller 32 separation distance.

(5) In the above-mentioned form, it was exemplified that the cleaning treatment and the drying treatment were performed in a common chamber, but the present invention is not limited thereto. Washing and drying can also be performed in separate chambers.

(6) In the above form, the plurality of ejection units 412 is set so that each unit of the processing liquid on the side farther from the two transport rollers 31 of each set is compared with the side closer to the two transport rollers 31 of each set. Time spews more. At this time, when the diameters of the discharge holes of the respective discharge portions 412 are equal, the discharge portions on the side farther from the two conveyance rollers 31 of each group are more The spraying speed of the treatment liquid should be faster.

(7) In the above-described form, three pipes 411 are provided: pipe 411A, pipe 411B, and pipe 411C, but not limited to three, and three or more pipes may be provided. At this time, only one on the central side may have a larger discharge amount than the others, or the discharge amount may increase stepwise from the side closer to the conveyance roller 31 toward the center.

(8) The fluid supply unit 40 may be a water knife (aqua knife) or the like in addition to the above-mentioned nozzles and air knives that spray the treatment liquid in a shower, and as long as it is a tool that sprays fluid, the The tools used are not particularly limited. Furthermore, it is also possible to use the above-mentioned multiple tools in combination. In addition, the fluid supply part 40 may be installed above the conveyance path T of the substrate W, and may supply the processing fluid to the convex surface S2 of the substrate W (the non-pattern formation surface on which the pattern P is not formed), so that both surfaces of the substrate W may be treated. to process.

(9) In the above-mentioned form, the processing of washing and drying the substrate W was exemplified as the processing of the substrate processing apparatus 10 , but the processing is not limited thereto. In order to manufacture a liquid crystal substrate, a semiconductor substrate, a photomask, etc., a resist processing apparatus, an exposure processing apparatus, a development processing apparatus, an etching processing apparatus, and a peeling processing apparatus can also be used, for example. Accordingly, various chemical liquids can be used as the treatment liquid.

(10) In the above-mentioned form, the case where the substrate W is conveyed in a horizontal state was exemplified, but it is not limited to this, and the substrate W may be inclined to be conveyed in an inclined state. For example, the width direction X of the substrate W may also be The substrate W is transported obliquely with one end higher than the other end.

(11) In the above-mentioned form, the substrate W with warping around the circumference (substrate W with warping around the circumference) has been described as an object, but it is not limited thereto. The present invention can also be applied to warped substrates.

(12) Some embodiments of the present invention have been described above, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope or spirit of the invention, and are included in the inventions described in the claims for the invention and their equivalents.

10: Substrate processing device 21: Processing room 30: Substrate transfer device 31: Conveying roller 31a: Cylindrical part 31b: Flange-shaped part 31c: first axis 32: Press roller 32a: Second axis 33: guide roller 40: Fluid supply part 41: Liquid injection department 42: Gas blowing part 42a: outlet 50: Control Department 411, 411A, 411B, 411C: tube 412, 412A, 412B, 412C: ejection part a: axis ax, L, Lp: length D, e, H: separation distance d: separation distance (distance between facing faces) P: pattern S1: Concave S2: Convex T: transport path Td: Transport direction W: Substrate X: width direction

FIG. 1 is a side view showing a schematic configuration of a substrate processing apparatus according to an embodiment. Fig. 2 is a view AA' of Fig. 1 . 3 is a plan view showing a schematic configuration of the substrate processing apparatus of the embodiment shown in FIG. 1 . 4 is a plan view showing a schematic configuration of a substrate processing apparatus according to another embodiment.

10: Substrate processing device

21: Processing room

30: Substrate transfer device

31: Conveying roller

31a: Cylindrical part

31b: Flange-shaped part

31c: first axis

32: Press roller

32a: Second axis

40: Fluid supply part

41: Liquid injection department

42: Gas blowing part

42a: outlet

50: Control Department

411: Tube

412: ejection part

H: distance apart

T: transport path

Td: Transport direction

W: Substrate

Claims (10)

A substrate processing apparatus for processing a substrate having warpage, the substrate processing apparatus including: two transport rollers provided as a set at intervals in a width direction perpendicular to a transport direction of the substrate, along A plurality of sets are provided along the conveying direction of the substrate, and the concave side of the substrate is supported to convey the substrate; A plurality of sets are provided in the conveying direction of the substrate, and the conveying rollers are installed; and a fluid supply part supplies fluid to the concave surface of the substrate, and the fluid supply part is separated from the conveying rollers in the width direction. Fluid is supplied to the concave surface of the substrate. The substrate processing apparatus according to claim 1, wherein the concave surface of the substrate has a pattern forming region on which a pattern is formed, and a non-pattern forming region on an outer periphery of the pattern forming region, wherein In the width direction, the distance between the transport rollers of each set is longer than the width of the pattern forming region. The substrate processing device according to claim 1 or claim 2, characterized by comprising: a pressing roller pressing the convex surface of the substrate; and a second shaft on which the pressing roller is installed. The substrate processing apparatus according to claim 3, wherein the pressing rollers are arranged to face the groups of the conveying rollers at intervals across the conveying path of the substrate, A distance between the conveying rollers and the pressing rollers in the vertical direction is constant between groups of the conveying rollers. The substrate processing apparatus according to claim 1 or claim 2, wherein the fluid supply part has a plurality of ejection parts in the width direction, and the plurality of ejection parts are respectively variably arranged to be The flow rate of the sprayed treatment liquid. The substrate processing apparatus according to claim 3, wherein the fluid supply unit has a plurality of ejection units in the width direction, and the plurality of ejection units are individually and variably provided with the processing liquid to be ejected. traffic. The substrate processing apparatus according to claim 1 or claim 2, wherein the fluid supply unit has a plurality of ejection units in the width direction, and the fluid supply unit is arranged adjacent to the two transport rollers of each group. The discharge portion disposed on the central side in the width direction discharges a larger amount of treatment liquid than the discharge portion on one side. The substrate processing apparatus according to claim 3, wherein the fluid supply unit has a plurality of ejection units in the width direction, and is connected to all the ejection units arranged on one side of the two transport rollers of each group. The discharge amount of the treatment liquid is larger in the discharge unit arranged on the central side in the width direction than in the discharge unit. The substrate processing apparatus according to claim 5, wherein the fluid supply unit has a plurality of tubes extending in a direction along the transfer direction, and the plurality of tubes are arranged in the width direction. The discharge unit is arranged in the tube, and the flow rate of the treatment liquid sprayed from the discharge unit is increased by adjusting the flow rate of the treatment liquid flowing in the tube. The substrate processing apparatus according to claim 7, wherein the fluid supply unit has a plurality of tubes extending in a direction along the transfer direction, and the plurality of tubes are arranged in the width direction. The discharge unit is arranged in the tube, and the flow rate of the treatment liquid sprayed from the discharge unit is increased by adjusting the flow rate of the treatment liquid flowing in the tube.

Images